8-/6-/4-Channel DAS with 16-Bit, Bipolar
Input, Simultaneous Sampling ADC
Data Sheet
AD7606/AD7606-6/AD7606-4
Rev. F Document Feedback
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Technical Support www.analog.com
FEATURES
8/6/4 simultaneously sampled inputs
True bipolar analog input ranges: ±10 V, ±5 V
Pin to pin compatible with the state-of-the-art AD7606B
Single 5 V analog supply and 2.3 V to 5 V VDRIVE
Fully integrated data acquisition solution
Analog input clamp protection
Input buffer with 1 MΩ analog input impedance
Second-order antialiasing analog filter
On-chip accurate reference and reference buffer
16-bit ADC with 200 kSPS on all channels
Oversampling capability with digital filter
Flexible parallel/serial interface
SPI/QSPI™/MICROWIRE™/DSP compatible
Performance
7 kV ESD rating on analog input channels
95.5 dB SNR, −107 dB THD
±0.5 LSB INL, ±0.5 LSB DNL
Low power: 100 mW
Standby mode: 25 mW
Temperature range: −40°C to +85°C
64-lead LQFP package
APPLICATIONS
Power-line monitoring and protection systems
Multiphase motor control
Instrumentation and control systems
Multiaxis positioning systems
Data acquisition systems (DAS)
Table 1. High Resolution, Bipolar Input, Simultaneous
Sampling DAS Solutions
Resolution
Single-
Ended
Inputs
True
Differential
Inputs
Number of
Channels
18 Bits AD7608 AD7609 8
16 Bits AD7606B1 8
AD7606 8
AD7606-EP 8
AD7606-6 6
AD7606-4 4
AD7605-4 4
14 Bits AD7607 8
1 This state-of-the-art device is recommended for newer designs as an alternative
to the AD7606.
FUNCTIONAL BLOCK DIAGRAM
V1
V1GND
R
FB
1MΩ
1MΩ R
FB
CLAMP
CLAMP
SECOND-
ORDE R LPF
T/H
V2
V2GND
R
FB
1MΩ
1MΩ R
FB
CLAMP
CLAMP
SECOND-
ORDE R LPF
T/H
V3
V3GND
R
FB
1MΩ
1MΩ R
FB
CLAMP
CLAMP
SECOND-
ORDE R LPF
T/H
V4
V4GND
R
FB
1MΩ
1MΩ R
FB
CLAMP
CLAMP
SECOND-
ORDE R LPF
T/H
V5
V5GND
R
FB
1MΩ
1MΩ R
FB
CLAMP
CLAMP
SECOND-
ORDE R LPF
T/H
V6
V6GND
R
FB
1MΩ
1MΩ R
FB
CLAMP
CLAMP
SECOND-
ORDE R LPF
T/H
V7
V7GND
R
FB
1MΩ
1MΩ R
FB
CLAMP
CLAMP
SECOND-
ORDE R LPF
T/H
V8
V8GND
R
FB
1MΩ
1MΩ R
FB
CLAMP
CLAMP
SECOND-
ORDE R LPF
T/H
8:1
MUX
AGND
BUSY
FRSTDATA
CONVS T A CONVS T B RESET RANGE
CONTROL
INPUTS
CLK O SC
REFIN/REFOUT
REF SELECT
AGND
OS 2
OS 1
OS 0
D
OUT
A
D
OUT
B
RD/SCLK
CS
PAR/SER/ BYTE SEL
V
DRIVE
16-BIT
SAR DIGITAL
FILTER PARALLEL/
SERIAL
INTERFACE
2.5V
REF
REFCAPB REFCAPA
SERIAL
PARALLEL
REGCAP
2.5V
LDO
REGCAP
2.5V
LDO
AV
CC
AV
CC
DB[15:0]
AD7606
08479-001
Figure 1.
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 2 of 37
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ...................................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
General Description ......................................................................... 3
Specifications .................................................................................... 4
Timing Specifications .................................................................. 7
Absolute Maximum Ratings ......................................................... 11
Thermal Resistance .................................................................... 11
ESD Caution................................................................................ 11
Pin Configurations and Function Descriptions ......................... 12
Typical Performance Characteristics ........................................... 17
Terminology .................................................................................... 21
Theory of Operation ...................................................................... 22
Converter Details ....................................................................... 22
Analog Input ............................................................................... 22
ADC Transfer Function ............................................................ 23
Internal/External Reference ...................................................... 24
Typical Connection Diagram ................................................... 25
Power-Down Modes .................................................................. 25
Conversion Control ................................................................... 26
Digital Interface .............................................................................. 27
Parallel Interface (PAR/SER/BYTE SEL = 0) ......................... 27
Parallel Byte (PAR/SER/BYTE SEL = 1, DB15 = 1) .............. 27
Serial Interface (PAR/SER/BYTE SEL = 1) ............................ 27
Reading During Conversion ..................................................... 28
Digital Filter ................................................................................ 29
Layout Guidelines ...................................................................... 33
Outline Dimensions ....................................................................... 35
Ordering Guide .......................................................................... 35
REVISION HISTORY
4/2020—Rev. E to Rev. F
Change to Features Section ............................................................. 1
Changes to Table 1 ........................................................................... 1
5/2018—Rev. D to Rev. E
Changes to Patent Note, Note 1 ..................................................... 3
Changes to tCONV Parameter, Table 3 ............................................. 7
11/2017—Rev. C to Rev. D
Changes to Features Section ........................................................... 1
Changes to Specifications Table Summary ................................... 3
Deleted Endnote 1, Table 1; Renumbered Sequentially .............. 6
Change to Table 6 ........................................................................... 14
Changes to Typical Performance Characteristics Section ........ 17
Changes to Terminology Section ................................................. 21
Changes to Ordering Guide .......................................................... 34
1/2012—Rev. B to Rev. C
Changes to Analog Input Ranges Section ................................... 22
10/2011—Rev. A to Rev. B
Changes to Input High Voltage (VINH) and Input Low Voltage
(VINL) Parameters and Endnote 6, Table 2 ..................................... 4
Changes to Table 3 ............................................................................ 7
Changes to Table 4 ......................................................................... 11
Changes to Pin 32 Description, Table 6 ...................................... 13
Changes to Analog Input Clamp Protection Section ................ 22
Changes to Typical Connection Diagram Section .................... 25
8/2010—Rev. 0 to Rev. A
Changes to Note 1, Table 2 .............................................................. 6
5/2010—Revision 0: Initial Version
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 3 of 37
GENERAL DESCRIPTION
The AD76061/AD7606-6/AD7606-4 are 16-bit, simultaneous
sampling, analog-to-digital data acquisition systems (DAS)
with eight, six, and four channels, respectively. Each part
contains analog input clamp protection, a second-order
antialiasing filter, a track-and-hold amplifier, a 16-bit charge
redistribution successive approximation analog-to-digital
converter (ADC), a flexible digital filter, a 2.5 V reference and
reference buffer, and high speed serial and parallel interfaces.
The AD7606/AD7606-6/AD7606-4 operate from a single 5 V
supply and can accommodate ±10 V and ±5 V true bipolar input
signals while sampling at throughput rates up to 200 kSPS for
all channels. The input clamp protection circuitry can tolerate
voltages up to ±16.5 V. The AD7606 has 1 MΩ analog input
impedance regardless of sampling frequency. The single supply
operation, on-chip filtering, and high input impedance eliminate
the need for driver op amps and external bipolar supplies. The
AD7606/AD7606-6/AD7606-4 antialiasing filter has a 3 dB cutoff
frequency of 22 kHz and provides 40 dB antialias rejection when
sampling at 200 kSPS. The flexible digital filter is pin driven, yields
improvements in SNR, and reduces the 3 dB bandwidth.
1 Protected by US Patent Number 8,072,360.
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 4 of 37
SPECIFICATIONS
VREF = 2.5 V external/internal, AVCC = 4.75 V to 5.25 V, VDRIVE = 2.3 V to 5.25 V, fSAMPLE = 200 kSPS, TA = −40°C to +85°C, unless otherwise
noted.
Table 2.
Parameter Test Conditions/Comments Min Typ Max Unit
DYNAMIC PERFORMANCE fIN = 1 kHz sine wave unless otherwise noted
Signal-to-Noise Ratio (SNR)1, 2 Oversampling by 16; ±10 V range; fIN = 130 Hz 94 95.5 dB
Oversampling by 16; ±5 V range; fIN = 130 Hz 93 94.5 dB
No oversampling; ±10 V Range 88.5 90 dB
No oversampling; ±5 V range 87.5 89 dB
Signal-to-(Noise + Distortion) (SINAD)1 No oversampling; ±10 V range 88 90 dB
No oversampling; ±5 V range 87 89 dB
Dynamic Range No oversampling; ±10 V range 90.5 dB
No oversampling; ±5 V range 90 dB
Total Harmonic Distortion (THD)1 −107 −95 dB
Peak Harmonic or Spurious Noise (SFDR)1 −108 dB
Intermodulation Distortion (IMD)1 fa = 1 kHz, fb = 1.1 kHz
Second-Order Terms −110 dB
Third-Order Terms −106 dB
Channel-to-Channel Isolation1 fIN on unselected channels up to 160 kHz −95 dB
ANALOG INPUT FILTER
Full Power Bandwidth −3 dB, ±10 V range 23 kHz
−3 dB, ±5 V range 15 kHz
−0.1 dB, ±10 V range 10 kHz
−0.1 dB, ±5 V range 5 kHz
tGROUP DELAY ±10 V range 11 µs
±5 V range 15 µs
DC ACCURACY
Resolution No missing codes 16 Bits
Differential Nonlinearity1 ±0.5 ±0.99 LSB3
Integral Nonlinearity1 ±0.5 ±2 LSB
Total Unadjusted Error (TUE) ±10 V range ±6 LSB
±5 V range ±12 LSB
Positive Full-Scale Error1, 4 External reference ±8 ±32 LSB
Internal reference ±8 LSB
Positive Full-Scale Error Drift External reference ±2 ppm/°C
Internal reference ±7 ppm/°C
Positive Full-Scale Error Matching1 ±10 V range 5 32 LSB
±5 V range 16 40 LSB
Bipolar Zero Code Error1, 5 ±10 V range ±1 ±6 LSB
± 5 V range ±3 ±12 LSB
Bipolar Zero Code Error Drift ±10 V range 10 µV/°C
± 5 V range 5 µV/°C
Bipolar Zero Code Error Matching1 ±10 V range 1 8 LSB
±5 V range 6 22 LSB
Negative Full-Scale Error1, 4 External reference ±8 ±32 LSB
Internal reference ±8 LSB
Negative Full-Scale Error Drift External reference ±4 ppm/°C
Internal reference ±8 ppm/°C
Negative Full-Scale Error Matching1 ±10 V range 5 32 LSB
±5 V range 16 40 LSB
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 5 of 37
Parameter Test Conditions/Comments Min Typ Max Unit
ANALOG INPUT
Input Voltage Ranges RANGE = 1 ±10 V
RANGE = 0 ±5 V
Analog Input Current 10 V; see Figure 31 5.4 µA
5 V; see Figure 31 2.5 µA
Input Capacitance6 5 pF
Input Impedance See the Analog Input section 1 MΩ
REFERENCE INPUT/OUTPUT
Reference Input Voltage Range See the ADC Transfer Function section 2.475 2.5 2.525 V
DC Leakage Current ±1 µA
Input Capacitance6 REF SELECT = 1 7.5 pF
Reference Output Voltage REFIN/REFOUT 2.49/
2.505
V
Reference Temperature Coefficient ±10 ppm/°C
LOGIC INPUTS
Input High Voltage (VINH) 0.7 × VDRIVE V
Input Low Voltage (VINL) 0.3 × VDRIVE V
Input Current (IIN) ±2 µA
Input Capacitance (CIN)6 5 pF
LOGIC OUTPUTS
Output High Voltage (VOH) ISOURCE = 100 µA VDRIVE − 0.2 V
Output Low Voltage (VOL) ISINK = 100 µA 0.2 V
Floating-State Leakage Current ±1 ±20 µA
Floating-State Output Capacitance6 5 pF
Output Coding Twos complement
CONVERSION RATE
Conversion Time All eight channels included; see Table 3 4 µs
Track-and-Hold Acquisition Time 1 µs
Throughput Rate Per channel, all eight channels included 200 kSPS
POWER REQUIREMENTS
AVCC 4.75 5.25 V
VDRIVE 2.3 5.25 V
ITOTAL Digital inputs = 0 V or VDRIVE
Normal Mode (Static) AD7606 16 22 mA
AD7606-6 14 20 mA
AD7606-4 12 17 mA
Normal Mode (Operational)7 fSAMPLE = 200 kSPS
AD7606 20 27 mA
AD7606-6 18 24 mA
AD7606-4 15 21 mA
Standby Mode 5 8 mA
Shutdown Mode 2 6 µA
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 6 of 37
Parameter Test Conditions/Comments Min Typ Max Unit
Power Dissipation
Normal Mode (Static) AD7606 80 115.5 mW
Normal Mode (Operational)7 fSAMPLE = 200 kSPS
AD7606 100 142 mW
AD7606-6 90 126 mW
AD7606-4 75 111 mW
Standby Mode 25 42 mW
Shutdown Mode 10 31.5 µW
1See the Terminology section.
2 This specification applies when reading during a conversion or after a conversion. If reading during a conversion in parallel mode with VDRIVE = 5 V, SNR typically reduces by 1.5 dB
and THD by 3 dB.
3 LSB means least significant bit. With ±5 V input range, 1 LSB = 152.58 µV. With ±10 V input range, 1 LSB = 305.175 µV.
4 These specifications include the full temperature range variation and contribution from the internal reference buffer but do not include the error contribution from
the external reference.
5 Bipolar zero code error is calculated with respect to the analog input voltage. See the Analog Input Clamp Protection section.
6 Sample tested during initial release to ensure compliance.
7 Operational power/current figure includes contribution when running in oversampling mode.
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 7 of 37
TIMING SPECIFICATIONS
AVCC = 4.75 V to 5.25 V, VDRIVE = 2.3 V to 5.25 V, VREF = 2.5 V external reference/internal reference, TA = TMIN to TMAX, unless otherwise noted.1
Table 3.
Limit at TMIN, TMAX
(0.1 × VDRIVE and
0.9 × VDRIVE
Logic Input Levels)
Limit at TMIN, TMAX
(0.3 × VDRIVE and
0.7 × VDRIVE
Logic Input Levels)
Parameter Min Typ Max Min Typ Max Unit Description
PARALLEL/SERIAL/BYTE MODE
tCYCLE 1/throughput rate
5 5 µs Parallel mode, reading during or after conversion; or
serial mode: VDRIVE = 3.3 V to 5.25 V, reading during a
conversion using DOUTA and DOUTB lines
9.4 µs Serial mode reading after a conversion; VDRIVE = 2.7 V
9.7 10.7 µs Serial mode reading after a conversion; VDRIVE = 2.3 V,
DOUTA and DOUTB lines
tCONV2 Conversion time
3.45 4 4.2 3.45 4 4.2 µs Oversampling off; AD7606
3 3 µs Oversampling off; AD7606-6
2 2 µs Oversampling off; AD7606-4
7.87 9.1 7.87 9.1 µs Oversampling by 2; AD7606
16.05 18.8 16.05 18.8 µs Oversampling by 4; AD7606
33 39 33 39 µs Oversampling by 8; AD7606
66 78 66 78 µs Oversampling by 16; AD7606
133 158 133 158 µs Oversampling by 32; AD7606
257 315 257 315 µs Oversampling by 64; AD7606
tWAKE-UP STANDBY 100 100 µs STBY rising edge to CONVST x rising edge; power-up
time from standby mode
tWAKE-UP SHUTDOWN
Internal Reference 30 30 ms STBY rising edge to CONVST x rising edge; power-up
time from shutdown mode
External Reference 13 13 ms STBY rising edge to CONVST x rising edge; power-up
time from shutdown mode
tRESET 50 50 ns RESET high pulse width
tOS_SETUP 20 20 ns BUSY to OS x pin setup time
tOS_HOLD 20 20 ns BUSY to OS x pin hold time
t1 40 45 ns CONVST x high to BUSY high
t2 25 25 ns Minimum CONVST x low pulse
t3 25 25 ns Minimum CONVST x high pulse
t4 0 0 ns BUSY falling edge to CS falling edge setup time
t53 0.5 0.5 ms Maximum delay allowed between CONVST A, CONVST
B rising edges
t6 25 25 ns Maximum time between last CS rising edge and BUSY
falling edge
t7 25 25 ns Minimum delay between RESET low to CONVST x high
PARALLEL/BYTE READ
OPERATION
t8 0 0 ns CS to RD setup time
t9 0 0 ns CS to RD hold time
t10 RD low pulse width
16
19
ns
V
DRIVE
above 4.75 V
21 24 ns VDRIVE above 3.3 V
25 30 ns VDRIVE above 2.7 V
32 37 ns VDRIVE above 2.3 V
t11 15 15 ns RD high pulse width
t12 22 22 ns CS high pulse width (see Figure 5); CS and RD linked
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 8 of 37
Limit at TMIN, TMAX
(0.1 × VDRIVE and
0.9 × VDRIVE
Logic Input Levels)
Limit at TMIN, TMAX
(0.3 × VDRIVE and
0.7 × VDRIVE
Logic Input Levels)
Parameter Min Typ Max Min Typ Max Unit Description
t13 Delay from CS until DB[15:0] three-state disabled
16 19 ns VDRIVE above 4.75 V
20 24 ns VDRIVE above 3.3 V
25 30 ns VDRIVE above 2.7 V
30 37 ns VDRIVE above 2.3 V
t144 Data access time after RD falling edge
16 19 ns VDRIVE above 4.75 V
21 24 ns VDRIVE above 3.3 V
25 30 ns VDRIVE above 2.7 V
32 37 ns VDRIVE above 2.3 V
t15 6 6 ns Data hold time after RD falling edge
t16 6 6 ns CS to DB[15:0] hold time
t17 22 22 ns Delay from CS rising edge to DB[15:0] three-state
enabled
SERIAL READ OPERATION
fSCLK Frequency of serial read clock
23.5 20 MHz VDRIVE above 4.75 V
17 15 MHz VDRIVE above 3.3 V
14.5 12.5 MHz VDRIVE above 2.7 V
11.5
10
MHz
V
DRIVE
above 2.3 V
t18 Delay from CS until DOUTA/DOUTB three-state
disabled/delay from CS until MSB valid
15 18 ns VDRIVE above 4.75 V
20 23 ns VDRIVE above 3.3 V
30 35 ns VDRIVE = 2.3 V to 2.7 V
t194 Data access time after SCLK rising edge
17 20 ns VDRIVE above 4.75 V
23 26 ns VDRIVE above 3.3 V
27 32 ns VDRIVE above 2.7 V
34 39 ns VDRIVE above 2.3 V
t20 0.4 tSCLK 0.4 tSCLK ns SCLK low pulse width
t21 0.4 tSCLK 0.4 tSCLK ns SCLK high pulse width
t22 7 7 SCLK rising edge to DOUTA/DOUTB valid hold time
t23 22 22 ns CS rising edge to DOUTA/DOUTB three-state enabled
FRSTDATA OPERATION
t24 Delay from CS falling edge until FRSTDATA three-
state disabled
15 18 ns VDRIVE above 4.75 V
20 23 ns VDRIVE above 3.3 V
25 30 ns VDRIVE above 2.7 V
30 35 ns VDRIVE above 2.3 V
t25 ns Delay from CS falling edge until FRSTDATA high,
serial mode
15 18 ns VDRIVE above 4.75 V
20 23 ns VDRIVE above 3.3 V
25 30 ns VDRIVE above 2.7 V
30 35 ns VDRIVE above 2.3 V
t26 Delay from RD falling edge to FRSTDATA high
16 19 ns VDRIVE above 4.75 V
20 23 ns VDRIVE above 3.3 V
25 30 ns VDRIVE above 2.7 V
30 35 ns VDRIVE above 2.3 V
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 9 of 37
Limit at TMIN, TMAX
(0.1 × VDRIVE and
0.9 × VDRIVE
Logic Input Levels)
Limit at TMIN, TMAX
(0.3 × VDRIVE and
0.7 × VDRIVE
Logic Input Levels)
Parameter Min Typ Max Min Typ Max Unit Description
t27 Delay from RD falling edge to FRSTDATA low
19 22 ns VDRIVE = 3.3 V to 5.25V
24 29 ns VDRIVE = 2.3 V to 2.7V
t28 Delay from 16th SCLK falling edge to FRSTDATA low
17 20 ns VDRIVE = 3.3 V to 5.25V
22 27 ns VDRIVE = 2.3 V to 2.7V
t29 24 29 ns Delay from CS rising edge until FRSTDATA three-
state enabled
1 Sample tested during initial release to ensure compliance. All input signals are specified with tR = tF = 5 ns (10% to 90% of VDRIVE) and timed from a voltage level of 1.6 V.
2 In oversampling mode, typical tCONV for the AD7606-6 and AD7606-4 can be calculated using ((N × tCONV) + ((N − 1) × 1 µs)). N is the oversampling ratio. For the AD7606-6,
tCONV = 3 µs; and for the AD7606-4, tCONV = 2 µs.
3 The delay between the CONVST x signals was measured as the maximum time allowed while ensuring a <10 LSB performance matching between channel sets.
4 A buffer is used on the data output pins for these measurements, which is equivalent to a load of 20 pF on the output pins.
Timing Diagrams
t
CYCLE
t
3
t
5
t
2
t
4
t
1
t
7
t
RESET
t
CONV
CONVS T A,
CONVS T B
CONVS T A,
CONVS T B
BUSY
CS
RESET
08479-002
Figure 2. CONVST Timing—Reading After a Conversion
t
CYCLE
t
3
t
5
t
6
t
2
t
1
t
CONV
CONVS T A,
CONVS T B
CONVS T A,
CONVS T B
BUSY
CS
t
7
t
RESET
RESET
08479-003
Figure 3. CONVST Timing—Reading During a Conversion
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 10 of 37
DATA:
DB[15:0]
FRSTDATA
CS
RD
INVALID V1 V2 V3 V7 V8V4
t10
t8
t13
t24 t26 t27
t14
t11
t15
t9
t16
t17
t29
08479-004
Figure 4. Parallel Mode, Separate CS and RD Pulses
DATA:
DB[15:0]
FRSTDATA
CS AND RD
V1 V2 V3 V4 V5 V6 V7 V8
t12
t13 t16 t17
08479-005
Figure 5. CS and RD, Linked Parallel Mode
SCLK
D
OUT
A,
D
OUT
B
FRSTDATA
CS
DB15 DB14 DB13 DB1 DB0
t
18
t
19
t
21
t
20
t
22
t
23
t
29
t
28
t
25
08479-006
Figure 6. Serial Read Operation (Channel 1)
DATA: DB[ 7: 0]
FRSTDATA
CS
RD
INVALID HIGH
BYTE V1 LOW
BYTE V1 HIGH
BYTE V8 LOW
BYTE V8
t
8
t
13
t
14
t
24
t
26
t
27
t
11
t
17
t
29
t
16
t
9
t
15
t
10
08479-007
Figure 7. BYTE Mode Read Operation
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 11 of 37
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
AVCC to AGND −0.3 V to +7 V
VDRIVE to AGND −0.3 V to AVCC + 0.3 V
Analog Input Voltage to AGND1 ±16.5 V
Digital Input Voltage to AGND −0.3 V to VDRIVE + 0.3 V
Digital Output Voltage to AGND −0.3 V to VDRIVE + 0.3 V
REFIN to AGND −0.3 V to AVCC + 0.3 V
Input Current to Any Pin Except Supplies1 ±10 mA
Operating Temperature Range
B Version −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Pb/SN Temperature, Soldering
Reflow (10 sec to 30 sec) 240 (+0)°C
Pb-Free Temperature, Soldering Reflow 260 (+0)°C
ESD (All Pins Except Analog Inputs) 2 kV
ESD (Analog Input Pins Only) 7 kV
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the
operational section of this specification is not implied.
Operation beyond the maximum operating conditions for
extended periods may affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 5. Thermal Resistance
Package Type θJA θJC Unit
64-Lead LQFP
45
11
°C/W
ESD CAUTION
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 12 of 37
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
AD7606
TOP VIEW
(No t t o Scal e)
64 63 62 61 60 59 58 57
V1GND
56 55 54 53 52 51 50 49
V5
V4
V6
V3
V2
V1
PIN 1
V7
V8
V2GND
V3GND
V4GND
V5GND
V6GND
V7GND
V8GND
DB13
DB12
DB11
DB14/HBEN
V
DRIVE
DB1
17 18 19 20 21 22 23 24 25
AGND
26 27 28 29 30 31 32
DB2
DB3
DB4
DB5
DB6
DB7/DOUTA
DB9
DB10
DB8/DOUTB
AGND
AVCC 1
3
4
FRSTDATA
7
6
5
OS 2
2
8
9
10
12
13
14
15
16
11
DB0
BUSY
CONVS T B
CONVS T A
RANGE
RESET
RD/SCLK
CS
PAR/SER/BYTE SEL
OS 1
OS 0
STBY
DECOUP LI NG CAP P IN
DATA O UTPUT
POWER SUPPLY
ANALO G I NP UT
GRO UND P IN
DIGITAL OUTPUT
DIGITAL INPUT
REFE RE NCE INPUT/ OUT P UT
DB15/BYTE S E L
REFIN/REFOUT
48
46
45
42
43
44
47
41
40
39
37
36
35
34
33
38
AGND
AVCC
REFGND
REFCAPA
AGND
AGND
AGND
REFCAPB
REFGND
REGCAP
REGCAP
AVCC
AVCC
REF SELECT
08479-008
Figure 8. AD7606 Pin Configuration
AD7606-6
TOP VIEW
(No t t o Scal e)
64 63 62 61 60 59 58 57
V1GND
56 55 54 53 52 51 50 49
V4
AGND
V5
V3
V2
V1
PIN 1
V6
AGND
V2GND
V3GND
AGND
V4GND
V5GND
V6GND
AGND
DB13
DB12
DB11
DB14/HBEN
V
DRIVE
DB1
17 18 19 20 21 22 23 24 25
AGND
26 27 28 29 30 31 32
DB2
DB3
DB4
DB5
DB6
DB7/DOUTA
DB9
DB10
DB8/DOUTB
AGND
AVCC 1
3
4
FRSTDATA
7
6
5
OS 2
2
8
9
10
12
13
14
15
16
11
DB0
BUSY
CONVS T B
CONVS T A
RANGE
RESET
RD/SCLK
CS
PAR/SER/BYTE SEL
OS 1
OS 0
STBY
DECOUP LI NG CAP P IN
DATA O UTPUT
POWER SUPPLY
ANALO G I NP UT
GRO UND P IN
DIGITAL OUTPUT
DIGITAL INPUT
REFE RE NCE INPUT/ OUT P UT
DB15/BYTE S E L
REFIN/REFOUT
48
46
45
42
43
44
47
41
40
39
37
36
35
34
33
38
AGND
AVCC
REFGND
REFCAPA
AGND
AGND
AGND
REFCAPB
REFGND
REGCAP
REGCAP
AVCC
AVCC
REF SELECT
08479-009
Figure 9. AD7606-6 Pin Configuration
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 13 of 37
AD7606-4
TOP VIEW
(No t t o Scal e)
64 63 62 61 60 59 58 57
V1GND
56 55 54 53 52 51 50 49
V3
AGND
V4
AGND
V2
V1
PIN 1
AGND
AGND
V2GND
AGND
AGND
V3GND
V4GND
AGND
AGND
DB13
DB12
DB11
DB14/HBEN
VDRIVE
DB1
17 18 19 20 21 22 23 24 25
AGND
26 27 28 29 30 31 32
DB2
DB3
DB4
DB5
DB6
DB7/D
OUT
A
DB9
DB10
DB8/D
OUT
B
AGND
AV
CC 1
3
4
FRSTDATA
7
6
5
OS 2
2
8
9
10
12
13
14
15
16
11
DB0
BUSY
CONVS T B
CONVS T A
RANGE
RESET
RD/SCLK
CS
PAR/SER/BYTE SEL
OS 1
OS 0
STBY
DECOUP LI NG CAP P IN
DATA O UTPUT
POWER SUPPLY
ANALO G I NP UT
GRO UND P IN
DIGITAL OUTPUT
DIGITAL INPUT
REFE RE NCE INPUT/ OUT P UT
DB15/BYTE S E L
REFIN/REFOUT
48
46
45
42
43
44
47
41
40
39
37
36
35
34
33
38
AGND
AV
CC
REFGND
REFCAPA
AGND
AGND
AGND
REFCAPB
REFGND
REGCAP
REGCAP
AV
CC
AV
CC
REF SELECT
08479-010
Figure 10. AD7606-4 Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Type1
Mnemonic
Description AD7606 AD7606-6 AD7606-4
1, 37, 38,
48
P AVCC AVCC AVCC Analog Supply Voltage, 4.75 V to 5.25 V. This supply voltage is applied to
the internal front-end amplifiers and to the ADC core. These supply pins
should be decoupled to AGND.
2, 26, 35,
40, 41, 47
P AGND AGND AGND Analog Ground. These pins are the ground reference points for all analog
circuitry on the AD7606. All analog input signals and external reference
signals should be referred to these pins. All six of these AGND pins should
connect to the AGND plane of a system.
5, 4, 3 DI OS [2:0] OS [2:0] OS [2:0] Oversampling Mode Pins. Logic inputs. These inputs are used to select
the oversampling ratio. OS 2 is the MSB control bit, and OS 0 is the LSB
control bit. See the Digital Filter section for more details about the
oversampling mode of operation and Table 9 for oversampling bit
decoding.
6 DI PAR/SER/
BYTE SEL
PAR/SER/
BYTE SEL
PAR/SER/
BYTE SEL
Parallel/Serial/Byte Interface Selection Input. Logic input. If this pin is tied to
a logic low, the parallel interface is selected. If this pin is tied to a logic high,
the serial interface is selected. Parallel byte interface mode is selected when
this pin is logic high and DB15/BYTE SEL is logic high (see Table 8).
In serial mode, the RD/SCLK pin functions as the serial clock input. The
DB7/DOUTA pin and the DB8/DOUTB pin function as serial data outputs. When
the serial interface is selected, the DB[15:9] and DB[6:0] pins should be tied to
ground.
In byte mode, DB15, in conjunction with PAR/SER/BYTE SEL, is used to select
the parallel byte mode of operation (see Table 8). DB14 is used as the HBEN
pin. DB[7:0] transfer the 16-bit conversion results in two RD operations,
with DB0 as the LSB of the data transfers.
7 DI STBY STBY STBY Standby Mode Input. This pin is used to place the AD7606/AD7606-6/
AD7606-4 into one of two power-down modes: standby mode or shutdown
mode. The power-down mode entered depends on the state of the RANGE
pin, as shown in Table 7. When in standby mode, all circuitry, except the on-
chip reference, regulators, and regulator buffers, is powered down. When
in shutdown mode, all circuitry is powered down.
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 14 of 37
Pin No. Type1
Mnemonic
Description AD7606 AD7606-6 AD7606-4
8 DI RANGE RANGE RANGE Analog Input Range Selection. Logic input. The polarity on this pin deter-
mines the input range of the analog input channels. If this pin is tied to a
logic high, the analog input range is ±10 V for all channels. If this pin is tied to
a logic low, the analog input range is ±5 V for all channels. A logic change on
this pin has an immediate effect on the analog input range. Changing this
pin during a conversion is not recommended for fast throughput rate
applications. See the Analog Input section for more information.
9, 10 DI CONVST A,
CONVST B
CONVST A,
CONVST B
CONVST A,
CONVST B
Conversion Start Input A, Conversion Start Input B. Logic inputs. These
logic inputs are used to initiate conversions on the analog input channels.
For simultaneous sampling of all input channels, CONVST A and CONVST B
can be shorted together, and a single convert start signal can be applied.
Alternatively, CONVST A can be used to initiate simultaneous sampling: V1,
V2, V3, and V4 for the AD7606; V1, V2, and V3 for the AD7606-6; and V1
and V2 for the AD7606-4. CONVST B can be used to initiate simultaneous
sampling on the other analog inputs: V5, V6, V7, and V8 for the AD7606;
V4, V5, and V6 for the AD7606-6; and V3 and V4 for the AD7606-4. This is
possible only when oversampling is not switched on. When the CONVST A or
CONVST B pin transitions from low to high, the front-end track-and-hold
circuitry for the respective analog inputs is set to hold.
11 DI RESET RESET RESET Reset Input. When set to logic high, the rising edge of RESET resets the
AD7606/AD7606-6/AD7606-4. The device should receive a RESET pulse
directly after power-up. The RESET high pulse should typically be 50 ns
wide. If a RESET pulse is applied during a conversion, the conversion is
aborted. If a RESET pulse is applied during a read, the contents of the
output registers reset to all zeros.
12 DI RD/SCLK RD/SCLK RD/SCLK Parallel Data Read Control Input When the Parallel Interface Is Selected (RD)/
Serial Clock Input When the Serial Interface Is Selected (SCLK). When both
CS and RD are logic low in parallel mode, the output bus is enabled.
In serial mode, this pin acts as the serial clock input for data transfers.
The CS falling edge takes the DOUTA and DOUTB data output lines out
of three-state and clocks out the MSB of the conversion result. The rising
edge of SCLK clocks all subsequent data bits onto the DOUTA and DOUTB
serial data outputs. For more information, see the Conversion Control
section.
13 DI CS CS CS Chip Select. This active low logic input frames the data transfer. When
both CS and RD are logic low in parallel mode, the DB[15:0] output bus is
enabled and the conversion result is output on the parallel data bus lines.
In serial mode, CS is used to frame the serial read transfer and clock out
the MSB of the serial output data.
14 DO BUSY BUSY BUSY Busy Output. This pin transitions to a logic high after both CONVST A and
CONVST B rising edges and indicates that the conversion process has started.
The BUSY output remains high until the conversion process for all channels
is complete. The falling edge of BUSY signals that the conversion data is
being latched into the output data registers and is available to read after
a Time t4. Any data read while BUSY is high must be completed before the
falling edge of BUSY occurs. Rising edges on CONVST A or CONVST B have
no effect while the BUSY signal is high.
15 DO FRSTDATA FRSTDATA FRSTDATA Digital Output. The FRSTDATA output signal indicates when the first channel,
V1, is being read back on the parallel, byte, or serial interface. When the
CS input is high, the FRSTDATA output pin is in three-state. The falling
edge of CS takes FRSTDATA out of three-state. In parallel mode, the
falling edge of RD corresponding to the result of V1 then sets the
FRSTDATA pin high, indicating that the result from V1 is available on the
output data bus. The FRSTDATA output returns to a logic low following the
next falling edge of RD. In serial mode, FRSTDATA goes high on the falling
edge of CS because this clocks out the MSB of V1 on DOUTA. It returns low
on the 16th SCLK falling edge after the CS falling edge. See the Conversion
Control section for more details.
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 15 of 37
Pin No. Type1
Mnemonic
Description AD7606 AD7606-6 AD7606-4
22 to 16 DO DB[6:0] DB[6:0] DB[6:0] Parallel Output Data Bits, DB6 to DB0. When PAR/SER/BYTE SEL = 0, these
pins act as three-state parallel digital input/output pins. When CS and RD
are low, these pins are used to output DB6 to DB0 of the conversion result.
When PAR/SER/BYTE SEL = 1, these pins should be tied to AGND. When
operating in parallel byte interface mode, DB[7:0] outputs the 16-bit con-
version result in two RD operations. DB7 (Pin 24) is the MSB; DB0 is the LSB.
23 P VDRIVE VDRIVE VDRIVE Logic Power Supply Input. The voltage (2.3 V to 5.25 V) supplied at this
pin determines the operating voltage of the interface. This pin is nominally
at the same supply as the supply of the host interface (that is, DSP and FPGA).
24 DO DB7/DOUTA DB7/DOUTA DB7/DOUTA Parallel Output Data Bit 7 (DB7)/Serial Interface Data Output Pin (DOUTA).
When PAR/SER/BYTE SEL = 0, this pins acts as a three-state parallel digital
input/output pin. When CS and RD are low, this pin is used to output DB7
of the conversion result. When PAR/SER/BYTE SEL = 1, this pin functions
as DOUTA and outputs serial conversion data (see the Conversion Control
section for more details). When operating in parallel byte mode, DB7 is
the MSB of the byte.
25 DO DB8/DOUTB DB8/DOUTB DB8/DOUTB Parallel Output Data Bit 8 (DB8)/Serial Interface Data Output Pin (DOUTB).
When PAR/SER/BYTE SEL = 0, this pin acts as a three-state parallel digital
input/output pin. When CS and RD are low, this pin is used to output
DB8 of the conversion result. When PAR/SER/BYTE SEL = 1, this pin functions
as DOUTB and outputs serial conversion data (see the Conversion Control
section for more details).
31 to 27 DO DB[13:9] DB[13:9] DB[13:9] Parallel Output Data Bits, DB13 to DB9. When PAR/SER/BYTE SEL = 0,
these pins act as three-state parallel digital input/output pins. When CS
and RD are low, these pins are used to output DB13 to DB9 of the conversion
result. When PAR/SER/BYTE SEL = 1, these pins should be tied to AGND.
32 DO/DI DB14/
HBEN
DB14/
HBEN
DB14/
HBEN
Parallel Output Data Bit 14 (DB14)/High Byte Enable (HBEN). When PAR/
SER/BYTE SEL = 0, this pin acts as a three-state parallel digital output pin.
When CS and RD are low, this pin is used to output DB14 of the conversion
result. When PAR/SER/BYTE SEL = 1 and DB15/BYTE SEL = 1, the AD7606/
AD7606-6/AD7606-4 operate in parallel byte interface mode. In parallel
byte mode, the HBEN pin is used to select whether the most significant byte
(MSB) or the least significant byte (LSB) of the conversion result is output first.
When HBEN = 1, the MSB is output first, followed by the LSB.
When HBEN = 0, the LSB is output first, followed by the MSB.
In serial mode, this pin should be tied to GND.
33 DO/DI DB15/
BYTE SEL
DB15/
BYTE SEL
DB15/
BYTE SEL
Parallel Output Data Bit 15 (DB15)/Parallel Byte Mode Select (BYTE SEL).
When PAR/SER/BYTE SEL = 0, this pin acts as a three-state parallel digital
output pin. When CS and RD are low, this pin is used to output DB15 of the
conversion result. When PAR/SER/BYTE SEL = 1, the BYTE SEL pin is used
to select between serial interface mode and parallel byte interface mode
(see Table 8). When PAR/SER/BYTE SEL = 1 and DB15/BYTE SEL = 0, the
AD7606 operates in serial interface mode. When PAR/SER/BYTE SEL = 1
and DB15/BYTE SEL = 1, the AD7606 operates in parallel byte interface mode.
34 DI REF SELECT REF SELECT REF SELECT Internal/External Reference Selection Input. Logic input. If this pin is set to
logic high, the internal reference is selected and enabled. If this pin is set to
logic low, the internal reference is disabled and an external reference
voltage must be applied to the REFIN/REFOUT pin.
36, 39 P REGCAP REGCAP REGCAP Decoupling Capacitor Pin for Voltage Output from Internal Regulator.
These output pins should be decoupled separately to AGND using a 1 μF
capacitor. The voltage on these pins is in the range of 2.5 V to 2.7 V.
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 16 of 37
Pin No. Type1
Mnemonic
Description AD7606 AD7606-6 AD7606-4
42 REF REFIN/
REFOUT
REFIN/
REFOUT
REFIN/
REFOUT
Reference Input (REFIN)/Reference Output (REFOUT). The on-chip reference
of 2.5 V is available on this pin for external use if the REF SELECT pin is set to
logic high. Alternatively, the internal reference can be disabled by setting
the REF SELECT pin to logic low, and an external reference of 2.5 V can be
applied to this input (see the Internal/External Reference section).
Decoupling is required on this pin for both the internal and external
reference options. A 10 μF capacitor should be applied from this pin to
ground close to the REFGND pins.
43, 46 REF REFGND REFGND REFGND Reference Ground Pins. These pins should be connected to AGND.
44, 45 REF REFCAPA,
REFCAPB
REFCAPA,
REFCAPB
REFCAPA,
REFCAPB
Reference Buffer Output Force/Sense Pins. These pins must be connected
together and decoupled to AGND using a low ESR, 10 μF ceramic capacitor.
The voltage on these pins is typically 4.5 V.
49 AI V1 V1 V1 Analog Input. This pin is a single-ended analog input. The analog input
range of this channel is determined by the RANGE pin.
50, 52 AI GND V1GND,
V2GND
V1GND,
V2GND
V1GND,
V2GND
Analog Input Ground Pins. These pins correspond to Analog Input Pin V1
and Analog Input Pin V2. All analog input AGND pins should connect to
the AGND plane of a system.
51 AI V2 V2 V2 Analog Input. This pin is a single-ended analog input. The analog input
range of this channel is determined by the RANGE pin.
53 AI/GND V3 V3 AGND Analog Input 3. For the AD7606-4, this is an AGND pin.
54 AI GND/
GND
V3GND V3GND AGND Analog Input Ground Pin. For the AD7606-4, this is an AGND pin.
55 AI/GND V4 AGND AGND Analog Input 4. For the AD7606-6 and the AD7606-4, this is an AGND pin.
56 AI GND/
GND
V4GND AGND AGND Analog Input Ground Pin. For the AD7606-6 and AD7606-4, this is an
AGND pin.
57 AI V5 V4 V3 Analog Inputs. These pins are single-ended analog inputs. The analog
input range of these channels is determined by the RANGE pin.
58 AI GND V5GND V4GND V3GND Analog Input Ground Pins. All analog input AGND pins should connect to
the AGND plane of a system.
59 AI V6 V5 V4 Analog Inputs. These pins are single-ended analog inputs.
60 AI GND V6GND V5GND V4GND Analog Input Ground Pins. All analog input AGND pins should connect to
the AGND plane of a system.
61
AI/GND
V7
V6
AGND
Analog Input Pins. For the AD7606-4, this is an AGND pin.
62 AI GND/
GND
V7GND V6GND AGND Analog Input Ground Pins. For the AD7606-4, this is an AGND pin.
63 AI/GND V8 AGND AGND Analog Input Pin. For the AD7606-4 and AD7606-6, this is an AGND pin.
64 AI GND/
GND
V8GND AGND AGND Analog Input Ground Pin. For the AD7606-4 and AD7606-6, this is an
AGND pin.
1 P is power supply, DI is digital input, DO is digital output, REF is reference input/output, AI is analog input, GND is ground.
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 17 of 37
TYPICAL PERFORMANCE CHARACTERISTICS
Temperature range is from −40°C to +85°C. The AD7606 is functional up to 105°C with throughput rates < 160 kSPS. Specifications are
guaranteed for the operating temperature range of −40°C to +85°C only.
0
0100k90k
80k70k60k50k
40k30k20k
10k
–180
–160
–140
–120
–100
–80
–60
–40
–20
AMPLITUDE ( dB)
INPUT F RE QUENCY ( Hz )
AVCC, VDRIVE = 5V
INT E RNAL REFERE NCE
±10V RANG E
FSAMPLE = 200kS P S
FIN = 1kHz
16,384 POI NT F FT
SNR = 90. 17dB
THD = –106.25d B
08479-011
Figure 11. AD7606 FFT, ±10 V Range
0
0100k90k80k70k
60k50k40k30k
20k10k
–180
–160
–140
–120
–100
–80
–60
–40
–20
AMPLITUDE ( dB)
INPUT F RE QUENCY ( Hz )
AV
CC
, V
DRIVE
= 5V
INT E RNAL REFERE NCE
±5V RANG E
F
SAMPLE
= 200kSPS
F
IN
= 1kHz
16,384 POI NT F FT
SNR = 89. 48dB
THD = –108.65d B
08479-012
Figure 12. AD7606 FFT Plot, ±5 V Range
–180
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
–140
–150
–160
–170
00.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
AMPLITUDE ( dB)
FREQUENCY ( kHz )
08479-031
AV
CC
, V
DRIVE
= 5V
INT E RNAL REFERE NCE
±10V RANG E
F
SAMPLE
= 11.5kS P S
T
A
= 25° C
F
IN
= 133Hz
8192 POINT FF T
OS BY 16
SNR = 96. 01dB
THD = –108.05d B
Figure 13. FFT Plot Oversampling By 16, ±10 V Range
2.0
060k
50k
40k30k
20k10k
–2.0
–1.5
–1.0
–0.5
0
0.5
1.0
1.5
INL (LSB)
CODE
AV
CC
, V
DRIVE
= 5V
F
SAMPLE
= 200kSPS
T
A
= 25° C
INT E RNAL REFERE NCE
±10V RANG E
08479-013
Figure 14. AD7606 Typical INL, ±10 V Range
1.0
060k50k40k
30k20k10k
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.4
0.2
0.6
0.8
DNL ( LSB)
CODE
08479-014
AVCC, VDRIVE = 5V
FSAMPLE = 200kS P S
TA = 25° C
INT E RNAL REFERE NCE
±10V RANG E
Figure 15. AD7606 Typical DNL, ±10 V Range
2.0
065,53657,34449,15240,96032,76824,57616,3848192
–2.0
–1.5
–1.0
–0.5
0
0.5
1.0
1.5
INL (LSB)
CODE
AV
CC
, V
DRIVE
= 5V
INT E RNAL REFERE NCE
±5V RANG E
F
SAMPLE
= 200kSPS
T
A
= 25° C
08479-015
Figure 16. AD7606 Typical INL, ±5 V Range
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 18 of 37
1.00
065,53657,34449,15240,96032,76824,57616,3848192
–1.00
–0.75
–0.50
–0.25
0
0.25
0.50
0.75
DNL ( LSB)
CODE
AV
CC
, V
DRIVE
= 5V
INT E RNAL REFERE NCE
±5V RANG E
F
SAMPLE
= 200kSPS
T
A
= 25° C
08479-016
Figure 17. AD7606 Typical DNL, ±5 V Range
20
15
10
5
0
–5
–10
–15
–40 –25 –10 520 35 50 65 80
–20
NFS E RROR (LSB)
TEMPERATURE (°C)
08479-017
200kSPS
AV
CC
, V
DRIVE
= 5V
EXT E RNAL REFERE NCE
±5V RANG E
±10V RANG E
Figure 18. NFS Error vs. Temperature
20
15
10
5
0
–5
–10
–15
–40 –25 –10 520 35 50 65 80
–20
PFS ERROR (LSB)
TEMPERATURE (°C)
08479-118
200kSPS
AVCC, VDRIVE = 5V
EXT E RNAL REFERE NCE
±5V RANG E
±10V RANG E
Figure 19. PFS Error vs. Temperature
10
–40 –25 –10 520 35 50 65 80
–10
–9
–6
–4
–2
0
2
4
6
8
NFS/PFS CHANNE L MATCHI NG (LSB)
TEMPERATURE (°C)
08479-018
10V RANGE
AVCC, VDRIVE = 5V
EXT E RNAL REFERE NCE
PFS ERROR
NFS E RROR
Figure 20. NFS and PFS Error Matching
10
8
6
4
2
0
0120k100k
80k60k
40k20k
–2
PFS/NFS ERROR (%FS)
SOURCE RESISTANCE (Ω)
08479-019
AV
CC
, V
DRIVE
= 5V
F
SAMPLE
= 200 kSPS
T
A
= 25° C
EXT E RNAL REFERE NCE
SOURCE RE S ISTANCE IS M ATCHED ON
THE V xGND I NP UT
±10V AND ±5V RANGE
Figure 21. PFS and NFS Error vs. Source Resistance
1.0
–40 –25 –10 520 35 50 65 80
–1.0
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
0.8
BIPOL AR ZERO CO DE E RROR (LSB)
TEMPERATURE (°C)
08479-023
200kSPS
AVCC, VDRIVE = 5V
EXT E RNAL REFERE NCE
5V RANGE
10V RANGE
Figure 22. Bipolar Zero Code Error vs. Temperature
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 19 of 37
4
3
2
1
0
–1
–2
–3
–40 –25 –10 520 35 50 65 80
–4
BIPOL AR ZERO CO DE E RROR MATCHI NG (L S B)
TEMPERATURE (°C)
08479-024
200kSPS
AV
CC
, V
DRIVE
= 5V
EXT E RNAL REFERE NCE
5V RANGE
10V RANGE
Figure 23. Bipolar Zero Code Error Matching Between Channels
–40
–50
–60
–70
–80
–90
–100
–110
1k 100k10k
–120
THD ( dB)
INPUT F RE QUENCY ( Hz )
08479-021
±10V RANG E
AV
CC
, V
DRIVE
= +5V
F
SAMPLE
= 200kSPS
R
SOURCE
MAT CHE D O N V x AND V xGND I NP UTS
105kΩ
48.7kΩ
23.7kΩ
10kΩ
5kΩ
1.2kΩ
100Ω
51Ω
0Ω
Figure 24. THD vs. Input Frequency for Various Source Impedances,
±10 V Range
1k 100k10k
THD ( dB)
INPUT F RE QUENCY ( Hz )
08479-122
±5V RANG E
AVCC, VDRIVE = +5V
FSAMPLE = 200kS P S
RSOURCE MATCHED ON Vx AND V xGND INP UTS
105kΩ
48.7kΩ
23.7kΩ
10kΩ
5kΩ
1.2kΩ
100Ω
51Ω
0Ω
–40
–50
–60
–70
–80
–90
–100
–110
–120
Figure 25. THD vs. Input Frequency for Various Source Impedances,
±5 V Range
98
96
94
92
90
88
86
84
82
10 100k
10k1k
100
80
SNR (dB)
INPUT F RE QUENCY ( Hz )
08479-020
NO OS
OS BY 2
OS BY 4
OS BY 8
OS BY 16
OS BY 32
OS BY 64
AVCC, VDRIVE = 5V
FSAMPLE CHANGES WI TH O S RATE
TA = 25° C
INT E RNAL REFERE NCE
±5V RANG E
Figure 26. SNR vs. Input Frequency for Different Oversampling Rates, ±5 V Range
100
98
96
94
92
90
88
86
84
82
10 100k
10k
1k100
80
SNR (dB)
INPUT F RE QUENCY ( Hz )
08479-121
NO OS
OS BY 2
OS BY 4
OS BY 8
OS BY 16
OS BY 32
OS BY 64
AV
CC
, V
DRIVE
= 5V
F
SAMPLE
CHANGES WI TH O S RATE
T
A
= 25° C
INT E RNAL REFERE NCE
±10V RANG E
Figure 27. SNR vs. Input Frequency for Different Oversampling Rates, ±10 V Range
–50
–60
–70
–80
–90
–100
–110
–120
–130
0160
14012010080604020
–140
CHANNEL-TO-CHANNE L I S OL ATI ON (d B)
NOI S E FREQUENCY ( kHz )
08479-025
±10V RANG E
±5V RANG E
AVCC, VDRIVE = 5V
INT E RNAL REFERE NCE
AD7606 RECOM MENDED DE COUPLI NG USE D
FSAMPLE = 150kS P S
TA = 25° C
INT E RFERE R ON AL L UNSE LECTED CHANNE LS
Figure 28. Channel-to-Channel Isolation
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 20 of 37
100
98
96
94
92
90
88
84
86
82
80
DYNAMI C RANGE ( dB)
OVERSAMPLING RATIO
08479-026
±10V RANG E
±5V RANG E
AVCC, VDRIVE = 5V
TA = 25° C
INT E RNAL REFERE NCE
FSAMPLE SCALES WITH OS RATIO
OFF OS2 OS4 OS8 OS16 OS32 OS64
Figure 29. Dynamic Range vs. Oversampling Rate
2.5010
2.5005
2.5000
2.4995
2.4990
2.4985
–40 –25 –10 520 35 50 65 80
2.4980
REFOUT VOLTAGE (V)
TEMPERATURE (°C)
08479-029
AV
CC
= 4.75V
AV
CC
= 5V AVCC = 5.25V
Figure 30. Reference Output Voltage vs. Temperature for
Different Supply Voltages
8
–10 –8 –6 –4 –2 108642
0
–10
–8
–6
–4
–2
0
2
4
6
INPUT CURRENT (µA)
INPUT VOLTAGE (V)
08479-028
–40°C
+25°C
+85°C
AVCC, VDRIVE = 5V
FSAMPLE = 200kS P S
Figure 31. Analog Input Current vs. Temperature for Various Supply Voltages
22
20
18
16
14
12
10
8
AVCC SUP P LY CURRE NT (mA)
OVERSAMPLING RATIO
08479-027
AVCC, VDRIVE = 5V
TA = 25° C
INT E RNAL REFERE NCE
FSAMPLE V ARIES WI TH O S RATE
NO OS OS2 OS4 OS8 OS16 OS32 OS64
Figure 32. Supply Current vs. Oversampling Rate
140
011001000900800700600500400
300200100
60
70
80
90
100
110
120
130
POWER S UP P LY RE JE CTI ON RAT IO (dB)
AVCC NO ISE FREQUENCY ( kHz )
08479-030
AV
CC
, V
DRIVE
= 5V
INT E RNAL REFERE NCE
AD7606 RECOM MENDED DE COUPLI NG USE D
F
SAMPLE
= 200kSPS
T
A
= 25° C
±10V RANG E
±5V RANG E
Figure 33. PSRR
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 21 of 37
TERMINOLOGY
Integral Nonlinearity
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function. The endpoints of
the transfer function are zero scale, at ½ LSB below the first
code transition; and full scale, at ½ LSB above the last code
transition.
Differential Nonlinearity
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Bipolar Zero Code Error
The deviation of the midscale transition (all 1s to all 0s) from
the ideal, which is 0 V − ½ LSB.
Bipolar Zero Code Error Match
The absolute difference in bipolar zero code error between any
two input channels.
Positive Full-Scale Error
The deviation of the actual last code transition from the ideal
last code transition (10 V − 1½ LSB (9.99954) and 5 V − 1½ LSB
(4.99977)) after bipolar zero code error is adjusted out. The
positive full-scale error includes the contribution from the
internal reference buffer.
Positive Full-Scale Error Match
The absolute difference in positive full-scale error between any
two input channels.
Negative Full-Scale Error
The deviation of the first code transition from the ideal first
code transition (−10 V + ½ LSB (−9.99984) and −5 V + ½ LSB
(−4.99992)) after the bipolar zero code error is adjusted out.
The negative full-scale error includes the contribution from the
internal reference buffer.
Negative Full-Scale Error Match
The absolute difference in negative full-scale error between any
two input channels.
Total Unadjusted Error (TUE)
TUE is a comprehensive specification that includes the gain
linearity and offset errors.
Signal-to-(Noise + Distortion) Ratio
The measured ratio of signal-to-(noise + distortion) at the
output of the ADC. The signal is the rms amplitude of the
fundamental. Noise is the sum of all nonfundamental signals
up to half the sampling frequency (fS/2, excluding dc).
The ratio depends on the number of quantization levels in
the digitization process: the more levels, the smaller the
quantization noise.
The theoretical signal-to-(noise + distortion) ratio for an ideal
N-bit converter with a sine wave input is given by
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB
Thus, for a 16-bit converter, the signal-to-(noise + distortion)
is 98 dB.
Total Harmonic Distortion (THD)
The ratio of the rms sum of the harmonics to the fundamental.
For the AD7606/AD7606-6/AD7606-4, it is defined as
THD (dB) =
20log
1
6
54
32
V
VVVVVVVV
2
9
2
8
2
7
22222
+++++++
where:
V1 is the rms amplitude of the fundamental.
V2 to V9 are the rms amplitudes of the second through ninth
harmonics.
Peak Harmonic or Spurious Noise
The ratio of the rms value of the next largest component in the
ADC output spectrum (up to fS/2, excluding dc) to the rms value
of the fundamental. Normally, the value of this specification is
determined by the largest harmonic in the spectrum, but for
ADCs where the harmonics are buried in the noise floor, it is
determined by a noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and fb,
any active device with nonlinearities creates distortion products
at sum and difference frequencies of mfa ± nfb, where m, n = 0,
1, 2, 3. Intermodulation distortion terms are those for which
neither m nor n is equal to 0. For example, the second-order
terms include (fa + fb) and (fa − fb), and the third-order terms
include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb).
The calculation of the intermodulation distortion is per the
THD specification, where it is the ratio of the rms sum of the
individual distortion products to the rms amplitude of the sum
of the fundamentals expressed in decibels (dB).
Power Supply Rejection Ratio (PSRR)
Variations in power supply affect the full-scale transition but not
the converter’s linearity. PSR is the maximum change in full-
scale transition point due to a change in power supply voltage
from the nominal value. The PSR ratio (PSRR) is defined as the
ratio of the power in the ADC output at full-scale frequency, f,
to the power of a 100 mV p-p sine wave applied to the ADC’s
VDD and VSS supplies of Frequency fS.
PSRR (dB) = 10 log (Pf/PfS)
where:
Pf is equal to the power at Frequency f in the ADC output.
PfS is equal to the power at Frequency fS coupled onto the AVCC
supply.
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of
crosstalk between all input channels. It is measured by applying a
full-scale sine wave signal, up to 160 kHz, to all unselected input
channels and then determining the degree to which the signal
attenuates in the selected channel with a 1 kHz sine wave signal
applied (see Figure 28).
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 22 of 37
THEORY OF OPERATION
CONVERTER DETAILS
The AD7606/AD7606-6/AD7606-4 are data acquisition systems
that employ a high speed, low power, charge redistribution,
successive approximation analog-to-digital converter (ADC)
and allow the simultaneous sampling of eight/six/four analog
input channels. The analog inputs on the AD7606/AD7606-
6/AD7606-4 can accept true bipolar input signals. The RANGE
pin is used to select either ±10 V or ±5 V as the input range.
The AD7606/ AD7606-6/AD7606-4 operate from a single 5 V
supply.
The AD7606/AD7606-6/AD7606-4 contain input clamp
protection, input signal scaling amplifiers, a second-order anti-
aliasing filter, track-and-hold amplifiers, an on-chip reference,
reference buffers, a high speed ADC, a digital filter, and high
speed parallel and serial interfaces. Sampling on the AD7606/
AD7606-6/AD7606-4 is controlled using the CONVST signals.
ANALOG INPUT
Analog Input Ranges
The AD7606/AD7606-6/AD7606-4 can handle true bipolar,
single-ended input voltages. The logic level on the RANGE pin
determines the analog input range of all analog input channels.
If this pin is tied to a logic high, the analog input range is ±10 V
for all channels. If this pin is tied to a logic low, the analog
input range is ±5 V for all channels. A logic change on this pin
has an immediate effect on the analog input range; however,
there is typically a settling time of approximately 80 µs, in
addition to the normal acquisition time requirement. The
recommended practice is to hardwire the RANGE pin
according to the desired input range for the system signals.
During normal operation, the applied analog input voltage
should remain within the analog input range selected via the
RANGE pin. A RESET pulse must be applied after power up to
ensure the analog input channels are configured for the range
selected.
When in a power-down mode, it is recommended to tie the
analog inputs to GND. Per the Analog Input Clamp Protection
section, the overvoltage clamp protection is recommended for
use in transient overvoltage conditions and should not remain
active for extended periods. Stressing the analog inputs outside
of the conditions mentioned here may degrade the bipolar zero
code error and THD performance of the AD7606/AD7606-6/
AD7606-4.
Analog Input Impedance
The analog input impedance of the AD7606/AD7606-6/
AD7606-4 is 1 MΩ. This is a fixed input impedance that does
not vary with the AD7606 sampling frequency. This high
analog input impedance eliminates the need for a driver
amplifier in front of the AD7606/AD7606-6/AD7606-4,
allowing for direct connection to the source or sensor. With
the need for a driver amplifier eliminated, bipolar supplies
(which are often a source of noise in a system) can be removed
from the signal chain.
Analog Input Clamp Protection
Figure 34 shows the analog input structure of the AD7606/
AD7606-6/AD7606-4. Each analog input of the AD7606/
AD7606-6/AD7606-4 contains clamp protection circuitry.
Despite single 5 V supply operation, this analog input clamp
protection allows for an input over voltage of up to ±16.5 V.
1MΩ
CLAMPVx
1MΩ
CLAMPVxGND SECOND-
ORDER
LPF
RFB
RFB
08479-032
Figure 34. Analog Input Circuitry
Figure 35 shows the voltage vs. current characteristic of the
clamp circuit. For input voltages of up to ±16.5 V, no current
flows in the clamp circuit. For input voltages that are above
±16.5 V, the AD7606/AD7606-6/AD7606-4 clamp circuitry
turns on.
30
–50
–40
–30
–20
–10
0
10
20
–20 –15 –10 –5 0 5 10 15 20
INPUT CL AM P CURRE NT (mA)
SOURCE VOLTAGE (V)
08479-033
AV
CC
, V
DRIVE
= 5V
T
A
= 25° C
Figure 35. Input Protection Clamp Profile
A series resistor should be placed on the analog input channels
to limit the current to ±10 mA for input voltages above ±16.5
V. In an application where there is a series resistance on an
analog input channel, Vx, a corresponding resistance is
required on the analog input GND channel, VxGND (see
Figure 36). If there is no corresponding resistor on the VxGND
channel, an offset error occurs on that channel. It is
recommended that the input overvoltage clamp protection
circuitry be used to protect the AD7606/AD7606-6/AD7606-4
against transient overvoltage events. It is not recommended to
leave the AD7606/AD7606-6/
AD7606-4 in a condition where the clamp protection circuitry
is active in normal or power-down conditions for extended
periods because this may degrade the bipolar zero code error
performance of the AD7606/AD7606-6/AD7606-4.
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 23 of 37
1MΩ
CLAMP
Vx
1MΩ
CLAMP
VxGND
RFB
RFB
C
R
R
ANALOG
INPUT
SIGNAL
AD7606
08479-034
Figure 36. Input Resistance Matching on the Analog Input of the
AD7606/AD7606-6/AD7606-4
Analog Input Antialiasing Filter
An analog antialiasing filter (a second-order Butterworth) is also
provided on the AD7606/AD7606-6/AD7606-4. Figure 37 and
Figure 38 show the frequency and phase response, respectively,
of the analog antialiasing filter. In the ±5 V range, the −3 dB
frequency is typically 15 kHz. In the ±10 V range, the −3 dB
frequency is typically 23 kHz.
5
0
–5
–10
–15
–20
–25
–30
–35
–40
100 1k 10k 100k
ATTENUAT IO N ( dB)
INPUT F RE QUENCY ( Hz )
08479-035
±10V RANG E
±5V RANG E
AV
CC
, V
DRIVE
= 5V
F
SAMPLE
= 200kSPS
T
A
= 25° C
±10V RANG E 0.1dB 3dB
–40 10,303 24,365Hz
+25 9619 23,389Hz
+85 9326 22,607Hz
±5V RANG E 0.1dB 3dB
–40 5225 16,162Hz
+25 5225 15,478Hz
+85 4932 14,990Hz
Figure 37. Analog Antialiasing Filter Frequency Response
18
16
14
12
10
8
6
4
2
0
–2
–4
–6
10 100k10k1k
–8
PHASE DELAY (µs)
INPUT F RE QUENCY ( Hz )
08479-036
AV
CC
, V
DRIVE
= 5V
F
SAMPLE
= 200kSPS
T
A
= 25° C
±5V RANG E
±10V RANG E
Figure 38. Analog Antialias Filter Phase Response
Track-and-Hold Amplifiers
The track-and-hold amplifiers on the AD7606/AD7606-6/
AD7606-4 allow the ADC to accurately acquire an input sine wave
of full-scale amplitude to 16-bit resolution. The track-and-hold
amplifiers sample their respective inputs simultaneously on the
rising edge of CONVST x. The aperture time for the track-and-
hold (that is, the delay time between the external CONVST x
signal and the track-and-hold actually going into hold) is well
matched, by design, across all eight track-and-holds on one
device and from device to device. This matching allows more
than one AD7606/AD7606-6/AD7606-4 device to be sampled
simultaneously in a system.
The end of the conversion process across all eight channels is
indicated by the falling edge of BUSY; and it is at this point that the
track-and-holds return to track mode, and the acquisition time
for the next set of conversions begins.
The conversion clock for the part is internally generated, and
the conversion time for all channels is 4 µs on the AD7606,
3 µs on the AD7606-6, and 2 µs on the AD7606-4. On the AD7606,
the BUSY signal returns low after all eight conversions to indicate
the end of the conversion process. On the falling edge of BUSY,
the track-and-hold amplifiers return to track mode. New data
can be read from the output register via the parallel, parallel
byte, or serial interface after BUSY goes low; or, alternatively,
data from the previous conversion can be read while BUSY is
high. Reading data from the AD7606/AD7606-6/AD7606-4
while a conversion is in progress has little effect on performance
and allows a faster throughput to be achieved. In parallel mode
at VDRIVE > 3.3 V, the SNR is reduced by ~1.5 dB when reading
during a conversion.
ADC TRANSFER FUNCTION
The output coding of the AD7606/AD7606-6/AD7606-4 is
twos complement. The designed code transitions occur midway
between successive integer LSB values, that is, 1/2 LSB and 3/2 LSB.
The LSB size is FSR/65,536 for the AD7606. The ideal transfer
characteristic for the AD7606/AD7606-6/AD7606-4 is shown
in Figure 39.
011...111
011...110
000...001
000...000
111...111
100...010
100...001
100...000
–FS + 1/2LSB 0V – 1/2LSB +FS – 3/2LSB
ADC CODE
ANALO G I NP UT
+FS MIDSCALE –FS LSB
±10V RANG E +10V 0V –10V 305µV
±5V RANG E +5V 0V –5V 152µV
+FS – (–FS)
2
16
LSB =
VIN
5V REF
2.5V
±5V CO DE = × 32,768 ×
VIN
10V REF
2.5V
±10V CO DE = × 32, 768 ×
08479-037
Figure 39. AD7606/AD7606-6/AD7606-4 Transfer Characteristics
The LSB size is dependent on the analog input range selected.
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 24 of 37
INTERNAL/EXTERNAL REFERENCE
The AD7606/AD7606-6/AD7606-4 contain an on-chip 2.5 V
band gap reference. The REFIN/REFOUT pin allows access to
the 2.5 V reference that generates the on-chip 4.5 V reference
internally, or it allows an external reference of 2.5 V to be applied
to the AD7606/AD7606-6/AD7606-4. An externally applied
reference of 2.5 V is also gained up to 4.5 V, using the internal
buffer. This 4.5 V buffered reference is the reference used by the
SAR ADC.
The REF SELECT pin is a logic input pin that allows the user to
select between the internal reference and an external reference.
If this pin is set to logic high, the internal reference is selected
and enabled. If this pin is set to logic low, the internal reference
is disabled and an external reference voltage must be applied
to the REFIN/REFOUT pin. The internal reference buffer is
always enabled. After a reset, the AD7606/AD7606-6/AD7606-4
operate in the reference mode selected by the REF SELECT pin.
Decoupling is required on the REFIN/REFOUT pin for both
the internal and external reference options. A 10 µF ceramic
capacitor is required on the REFIN/REFOUT pin.
The AD7606/AD7606-6/AD7606-4 contain a reference buffer
configured to gain the REF voltage up to ~4.5 V, as shown in
Figure 40. The REFCAPA and REFCAPB pins must be shorted
together externally, and a ceramic capacitor of 10 μF applied to
REFGND, to ensure that the reference buffer is in closed-loop
operation. The reference voltage available at the REFIN/REFOUT
pin is 2.5 V.
When the AD7606/AD7606-6/AD7606-4 are configured in
external reference mode, the REFIN/REFOUT pin is a high
input impedance pin. For applications using multiple AD7606
devices, the following configurations are recommended,
depending on the application requirements.
External Reference Mode
One ADR421 external reference can be used to drive the
REFIN/REFOUT pins of all AD7606 devices (see Figure 41).
In this configuration, each REFIN/REFOUT pin of the
AD7606/AD7606-6/AD7606-4 should be decoupled with at
least a 100 nF decoupling capacitor.
Internal Reference Mode
One AD7606/AD7606-6/AD7606-4 device, configured to operate
in the internal reference mode, can be used to drive the remaining
AD7606/AD7606-6/AD7606-4 devices, which are configured to
operate in external reference mode (see Figure 42). The REFIN/
REFOUT pin of the AD7606/AD7606-6/AD7606-4, configured
in internal reference mode, should be decoupled using a 10 µF
ceramic decoupling capacitor. The other AD7606/AD7606-6/
AD7606-4 devices, configured in external reference mode,
should use at least a 100 nF decoupling capacitor on their
REFIN/REFOUT pins.
BUF
SAR
2.5V
REF
REFCAPA
REFIN/REFOUT
REFCAPB 10µF
08479-038
Figure 40. Reference Circuitry
AD7606
REF SELECT
REFIN/REFOUT
AD7606
REF SELECT
REFIN/REFOUT
100nF
0.1µF
100nF
AD7606
REF SELECT
REFIN/REFOUT
100nF
ADR421
08479-040
Figure 41. Single External Reference Driving Multiple AD7606/AD7606-6/
AD7606-4 REFIN Pins
AD7606
REF SELECT
REFIN/REFOUT
+10µF
AD7606
REF SELECT
REFIN/REFOUT
100nF
AD7606
REF SELECT
REFIN/REFOUT
100nF
VDRIVE
08479-039
Figure 42. Internal Reference Driving Multiple AD7606/AD7606-6/AD7606-4
REFIN Pins
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 25 of 37
TYPICAL CONNECTION DIAGRAM
Figure 43 shows the typical connection diagram for the AD7606/
AD7606-6/AD7606-4. There are four AVCC supply pins on the
part, and each of the four pins should be decoupled using a 100 nF
capacitor at each supply pin and a 10 µF capacitor at the supply
source. The AD7606/AD7606-6/AD7606-4 can operate with the
internal reference or an externally applied reference. In this
configuration, the AD7606 is configured to operate with the
internal reference. When using a single AD7606/AD7606-6/
AD7606-4 device on the board, the REFIN/REFOUT pin
should be decoupled with a 10 µF capacitor. Refer to the
Internal/External Reference section when using an application
with multiple AD7606/AD7606-6/AD7606-4 devices. The
REFCAPA and REFCAPB pins are shorted together and
decoupled with a 10 µF ceramic capacitor.
The VDRIVE supply is connected to the same supply as the
processor. The VDRIVE voltage controls the voltage value of the
output logic signals. For layout, decoupling, and grounding
hints, see the Layout Guidelines section.
After supplies are applied to the AD7606/AD7606-6/AD7606-4, a
reset should be applied to the AD7606/AD7606-6/AD7606-4 to
ensure that it is configured for the correct mode of operation.
POWER-DOWN MODES
Two power-down modes are available on the AD7606/AD7606-6/
AD7606-4: standby mode and shutdown mode. The STBY pin
controls whether the AD7606/AD7606-6/AD7606-4 are in
normal mode or in one of the two power-down modes.
The power-down mode is selected through the state of the
RANGE pin when the STBY pin is low. Table 7 shows the
configurations required to choose the desired power-down mode.
When the AD7606/AD7606-6/AD7606-4 are placed in standby
mode, the current consumption is 8 mA maximum and power-
up time is approximately 100 µs because the capacitor on the
REFCAPA and REFCAPB pins must charge up. In standby mode,
the on-chip reference and regulators remain powered up, and
the amplifiers and ADC core are powered down.
When the AD7606/AD7606-6/AD7606-4 are placed in shutdown
mode, the current consumption is 6 µA maximum and power-up
time is approximately 13 ms (external reference mode). In shut-
down mode, all circuitry is powered down. When the AD7606/
AD7606-6/AD7606-4 are powered up from shutdown mode,
a RESET signal must be applied to the AD7606/AD7606-6/
AD7606-4 after the required power-up time has elapsed.
Table 7. Power-Down Mode Selection
Power-Down Mode STBY RANGE
Standby 0 1
Shutdown 0 0
AV
CC
AGND
V
DRIVE
+
REFIN/REFOUT
DB0 TO DB15
CONVS T A, CONVS T B
CS
RD
BUSY
RESET
AD7606
1µF
10µF 100nF
DIGITAL SUPPLY
VOLTAGE +2.3V TO +5.25V
ANALO G SUP P LY
VOLTAGE 5V
1
EIGHT ANALOG
INPUTS V1 TO V8
PARALLEL
INTERFACE
1DECOUP LI NG SHOW N ON T HE AVCC PIN AP P LI E S TO E ACH AVCC P IN (PIN 1, P IN 37, P IN 38, P IN 48).
DECOUP LI NG CAPACIT OR CAN BE S HARE D BE TW EE N AVCC P IN 37 AND PIN 38.
2DECOUP LI NG SHOW N ON T HE RE GCAP PIN APP LI E S TO E ACH RE GCAP P IN (PIN 36, P IN 39).
REGCAP2
+
10µF
REFCAPA
REFCAPB
OS 2
OS 1
OS 0 OVERSAMPLING
100nF
V1
PAR/SER SEL
STBY
REF SELECT
RANGE
V2
V3
V4
V5
V6
V7
V8
REFGND
V1GND
V2GND
V3GND
V4GND
V5GND
V6GND
V7GND
V8GND
VDRIVE
VDRIVE
08479-041
MICROPROCESSOR/
MICROCONVERTER/
DSP
Figure 43. AD7606 Typical Connection Diagram
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 26 of 37
CONVERSION CONTROL
Simultaneous Sampling on All Analog Input Channels
The AD7606/AD7606-6/AD7606-4 allow simultaneous sampling
of all analog input channels. All channels are sampled simul-
taneously when both CONVST pins (CONVST A, CONVST B)
are tied together. A single CONVST signal is used to control both
CONVST x inputs. The rising edge of this common CONVST
signal initiates simultaneous sampling on all analog input channels
(V1 to V8 for the AD7606, V1 to V6 for the AD7606-6, and V1
to V4 for the AD7606-4).
The AD7606 contains an on-chip oscillator that is used to
perform the conversions. The conversion time for all ADC
channels is tCONV. The BUSY signal indicates to the user when
conversions are in progress, so when the rising edge of CONVST
is applied, BUSY goes logic high and transitions low at the end
of the entire conversion process. The falling edge of the BUSY
signal is used to place all eight track-and-hold amplifiers back
into track mode. The falling edge of BUSY also indicates that
the new data can now be read from the parallel bus (DB[15:0]),
the DOUTA and DOUTB serial data lines, or the parallel byte bus,
DB[7:0].
Simultaneously Sampling Two Sets of Channels
The AD7606/AD7606-6/AD7606-4 also allow the analog input
channels to be sampled simultaneously in two sets. This can be
used in power-line protection and measurement systems to
compensate for phase differences introduced by PT and CT
transformers. In a 50 Hz system, this allows for up to 9° of phase
compensation; and in a 60 Hz system, it allows for up to 10° of
phase compensation.
This is accomplished by pulsing the two CONVST pins
independently and is possible only if oversampling is not in use.
CONVST A is used to initiate simultaneous sampling of the
first set of channels (V1 to V4 for the AD7606, V1 to V3 for the
AD7606-6, and V1 and V2 for the AD7606-4); and CONVST B
is used to initiate simultaneous sampling on the second set of
analog input channels (V5 to V8 for the AD7606, V4 to V6 for
the AD7606-6, and V3 and V4 for the AD7606-4), as illustrated
in Figure 44. On the rising edge of CONVST A, the track-and-
hold amplifiers for the first set of channels are placed into hold
mode. On the rising edge of CONVST B, the track-and-hold
amplifiers for the second set of channels are placed into hold
mode. The conversion process begins once both rising edges
of CONVST x have occurred; therefore BUSY goes high on the
rising edge of the later CONVST x signal. In Table 3, Time t5
indicates the maximum allowable time between CONVST x
sampling points.
There is no change to the data read process when using two
separate CONVST x signals.
Connect all unused analog input channels to AGND. The results
for any unused channels are still included in the data read because
all channels are always converted.
CONVS T A
CONVS T B
BUSY
CS/RD
DATA: DB[ 15: 0]
FRSTDATA
V1 V2 V3 V7 V8
t5
tCONV
V1 TO V4 TRACK-AND- HOL D
ENTE R HOL D V5 T O V8 T RACK- AND- HOL D
ENTE R HOL D
AD7606 CONVE RTS
ON AL L 8 CHANNELS
08479-042
Figure 44. AD7606 Simultaneous Sampling on Channel Sets While Using Independent CONVST A and CONVST B Signals—Parallel Mode
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 27 of 37
DIGITAL INTERFACE
The AD7606/AD7606-6/AD7606-4 provide three interface
options: a parallel interface, a high speed serial interface, and
a parallel byte interface. The required interface mode is selected
via the PAR/SER/BYTE SEL and DB15/BYTE SEL pins.
Table 8. Interface Mode Selection
PAR/SER/BYTE SEL DB15 Interface Mode
0 0 Parallel interface mode
1 0 Serial interface mode
1 1 Parallel byte interface mode
Operation of the interface modes is discussed in the following
sections.
PARALLEL INTERFACE (PAR/SER/BYTE SEL = 0)
Data can be read from the AD7606/AD7606-6/AD7606-4 via
the parallel data bus with standard CS and RD signals. To read the
data over the parallel bus, the PAR/SER/BYTE SEL pin should
be tied low. The CS and RD input signals are internally gated to
enable the conversion result onto the data bus. The data lines,
DB15 to DB0, leave their high impedance state when both CS
and RD are logic low.
AD7606 14
BUSY
12
RD/SCLK
[33:24]
[22:16]
DB[15:0]
13
CS
DIGITAL
HOST
INTERRUPT
08479-043
Figure 45. AD7606 Interface Diagram—One AD7606 Using the Parallel Bus,
with CS and RD Shorted Together
The rising edge of the CS input signal three-states the bus, and
the falling edge of the CS input signal takes the bus out of the
high impedance state. CS is the control signal that enables the
data lines; it is the function that allows multiple AD7606/
AD7606-6/ AD7606-4 devices to share the same parallel
data bus.
The CS signal can be permanently tied low, and the RD signal
can be used to access the conversion results as shown in Figure 4.
A read operation of new data can take place after the BUSY
signal goes low (see Figure 2); or, alternatively, a read operation
of data from the previous conversion process can take place
while BUSY is high (see Figure 3).
The RD pin is used to read data from the output conversion
results register. Applying a sequence of RD pulses to the RD pin
of the AD7606/AD7606-6/AD7606-4 clocks the conversion
results out from each channel onto the Parallel Bus DB[15:0] in
ascending order. The first RD falling edge after BUSY goes low
clocks out the conversion result from Channel V1. The next RD
falling edge updates the bus with the V2 conversion result, and so
on. On the AD7606, the eighth falling edge of RD clocks out the
conversion result for Channel V8.
When the RD signal is logic low, it enables the data conversion
result from each channel to be transferred to the digital host
(DSP, FPGA).
When there is only one AD7606/AD7606-6/AD7606-4 in
a system/board and it does not share the parallel bus, data can
be read using just one control signal from the digital host. The
CS and RD signals can be tied together, as shown in Figure 5.
In this case, the data bus comes out of three-state on the falling
edge of CS/RD. The combined CS and RD signal allows the data
to be clocked out of the AD7606/AD7606-6/AD7606-4 and to
be read by the digital host. In this case, CS is used to frame the
data transfer of each data channel.
PARALLEL BYTE (PAR/SER/BYTE SEL = 1, DB15 = 1)
Parallel byte interface mode operates much like the parallel
interface mode, except that each channel conversion result is read
out in two 8-bit transfers. Therefore, 16 RD pulses are required
to read all eight conversion results from the AD7606. For the
AD7606-6, 12 RD pulses are required; and on the AD7606-4,
eight RD pulses are required to read all the channel results.
To configure the AD7606/AD76706-6/AD7606-4 to operate in
parallel byte mode, the PAR/SER/BYTE SEL and BYTE SEL/
DB15 pins should be tied to logic high (see Table 8). In parallel
byte mode, DB[7:0] are used to transfer the data to the digital
host. DB0 is the LSB of the data transfer, and DB7 is the MSB of
the data transfer. In parallel byte mode, DB14 acts as an HBEN
pin. When DB14/HBEN is tied to logic high, the most
significant byte (MSB) of the conversion result is output first,
followed by the LSB of the conversion result. When DB14 is
tied to logic low, the LSB of the conversion result is output first,
followed by the MSB of the conversion result. The FRSTDATA
pin remains high until the entire 16 bits of the conversion result
from V1 are read from the AD7606/AD7606-6/AD7606-4.
SERIAL INTERFACE (PAR/SER/BYTE SEL = 1)
To read data back from the AD7606 over the serial interface,
the PAR/SER/BYTE SEL pin must be tied high. The CS and
SCLK signals are used to transfer data from the AD7606. The
AD7606/ AD7606-6/AD7606-4 have two serial data output
pins, DOUTA and DOUTB. Data can be read back from the
AD7606/AD76706-6/AD7606-4 using one or both of these
DOUT lines. For the AD7606, conversion results from Channel
V1 to Channel V4 first appear on DOUTA, and conversion
results from Channel V5 to Channel V8 first appear on DOUTB.
For the AD7606-6, conversion results from Channel V1 to
Channel V3 first appear on DOUTA, and conversion results from
Channel V4 to Channel V6 first appear on DOUTB. For the
AD7606-4, conversion results from Channel V1 and Channel
V2 first appear on DOUTA, and conversion results from
Channels V3 and Channel V4 first appear on DOUTB.
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 28 of 37
The CS falling edge takes the data output lines, DOUTA and DOUTB,
out of three-state and clocks out the MSB of the conversion
result. The rising edge of SCLK clocks all subsequent data bits
onto the serial data outputs, DOUTA and DOUTB. The CS input
can be held low for the entire serial read operation, or it can be
pulsed to frame each channel read of 16 SCLK cycles. Figure 46
shows a read of eight simultaneous conversion results using
two DOUT lines on the AD7606. In this case, a 64 SCLK transfer is
used to access data from the AD7606, and CS is held low to
frame the entire 64 SCLK cycles. Data can also be clocked out
using just one DOUT line, in which case it is recommended that
DOUTA be used to access all conversion data because the channel
data is output in ascending order. For the AD7606 to access all
eight conversion results on one DOUT line, a total of 128 SCLK
cycles is required. These 128 SCLK cycles can be framed by one
CS signal, or each group of 16 SCLK cycles can be individually
framed by the CS signal. The disadvantage of using just one DOUT
line is that the throughput rate is reduced if reading occurs after
conversion. The unused DOUT line should be left unconnected in
serial mode. For the AD7606, if DOUTB is to be used as a single
DOUT line, the channel results are output in the following order:
V5, V6, V7, V8, V1, V2, V3, and V4; however, the FRSTDATA
indicator returns low after V5 is read on DOUTB. For the AD7606-6
and the AD7606-4, if DOUTB is to be used as a single DOUT line,
the channel results are output in the following order: V4, V5, V6,
V1, V2, and V3 for the AD7606-6; and V3, V4, V1, and V2 for
the AD7606-4.
Figure 6 shows the timing diagram for reading one channel of
data, framed by the CS signal, from the AD7606/AD7606-6/
AD7606-4 in serial mode. The SCLK input signal provides the
clock source for the serial read operation. The CS goes low to
access the data from the AD7606/AD7606-6/AD7606-4.
The falling edge of CS takes the bus out of three-state and
clocks out the MSB of the 16-bit conversion result. This MSB is
valid on the first falling edge of the SCLK after the CS falling
edge. The subsequent 15 data bits are clocked out of the AD7606/
AD7606-6/AD7606-4 on the SCLK rising edge. Data is valid on
the SCLK falling edge. To access each conversion result, 16 clock
cycles must be provided to the AD7606/AD7606-6/AD7606-4.
The FRSTDATA output signal indicates when the first channel,
V1, is being read back. When the CS input is high, the FRSTDATA
output pin is in three-state. In serial mode, the falling edge of CS
takes FRSTDATA out of three-state and sets the FRSTDATA
pin high, indicating that the result from V1 is available on the
DOUTA output data line. The FRSTDATA output returns to
a logic low following the 16th SCLK falling edge. If all channels
are read on DOUTB, the FRSTDATA output does not go high when
V1 is being output on this serial data output pin. It goes high only
when V1 is available on DOUTA (and this is when V5 is available
on DOUTB for the AD7606).
READING DURING CONVERSION
Data can be read from the AD7606/AD7606-6/AD7606-4 while
BUSY is high and the conversions are in progress. This has little
effect on the performance of the converter, and it allows a faster
throughput rate to be achieved. A parallel, parallel byte, or
serial read can be performed during conversions and when
oversampling may or may not be in use. Figure 3 shows the
timing diagram for reading while BUSY is high in parallel or
serial mode. Reading during conversions allows the full
throughput rate to be achieved when using the serial interface
with VDRIVE above 4.75 V.
Data can be read from the AD7606 at any time other than on
the falling edge of BUSY because this is when the output data
registers are updated with the new conversion data. Time t6, as
outlined in Table 3, should be observed in this condition.
V1 V4V2 V3
V5 V8V6 V7
SCLK
D
OUT
A
D
OUT
B
CS
64
08479-044
Figure 46. AD7606 Serial Interface with Two DOUT Lines
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 29 of 37
DIGITAL FILTER
The AD7606/AD7606-6/AD7606-4 contain an optional digital
first-order sinc filter that should be used in applications where
slower throughput rates are used or where higher signal-to-
noise ratio or dynamic range is desirable. The oversampling
ratio of the digital filter is controlled using the oversampling pins,
OS [2:0] (see Table 9). OS 2 is the MSB control bit, and OS 0 is
the LSB control bit. Table 9 provides the oversampling bit
decoding to select the different oversample rates. The OS pins are
latched on the falling edge of BUSY. This sets the oversampling
rate for the next conversion (see Figure 48). In addition to the
oversampling function, the output result is decimated to 16-bit
resolution.
If the OS pins are set to select an OS ratio of eight, the next
CONVST x rising edge takes the first sample for each channel,
and the remaining seven samples for all channels are taken with
an internally generated sampling signal. These samples are then
averaged to yield an improvement in SNR performance. Table 9
shows typical SNR performance for both the ±10 V and the ±5 V
range. As Table 9 shows, there is an improvement in SNR as the
OS ratio increases. As the OS ratio increases, the 3 dB
frequency is reduced, and the allowed sampling frequency is
also reduced. In an application where the required sampling
frequency is 10 kSPS, an OS ratio of up to 16 can be used. In
this case, the application sees an improvement in SNR, but the
input 3 dB bandwidth is limited to ~6 kHz.
The CONVST A and CONVST B pins must be tied/driven
together when oversampling is turned on. When the over-
sampling function is turned on, the BUSY high time for the
conversion process extends. The actual BUSY high time
depends on the oversampling rate that is selected: the higher the
oversampling rate, the longer the BUSY high, or total conversion
time (see Table 3).
08479-046
CS
RD
DATA:
DB[15:0]
BUSY
CONVS T A
AND
CONVS T B
t
CYCLE
t
CONV
4µs
t
4
t
4
t
4
9µs
19µs
OS = 0 O S = 2 OS = 4
Figure 47. AD7606—No Oversampling, Oversampling × 2, and
Oversampling × 4 While Using Read After Conversion
Figure 47 shows that the conversion time extends as the over-
sampling rate is increased, and the BUSY signal lengthens for the
different oversampling rates. For example, a sampling frequency
of 10 kSPS yields a cycle time of 100 µs. Figure 47 shows OS × 2
and OS × 4; for a 10 kSPS example, there is adequate cycle time
to further increase the oversampling rate and yield greater
improve-ments in SNR performance. In an application where
the initial sampling or throughput rate is at 200 kSPS, for
example, and oversampling is turned on, the throughput rate
must be reduced to accommodate the longer conversion time
and to allow for the read. To achieve the fastest throughput rate
possible when over-sampling is turned on, the read can be
performed during the BUSY high time. The falling edge of BUSY
is used to update the output data registers with the new
conversion data; therefore, the reading of conversion data should
not occur on this edge.
CONVS T A
AND
CONVS T B
BUSY
OS x
tOS_SETUP
tOS_HOLD
CONVE RS IO N N CONVE RS IO N N + 1
OVERSAMPLE RATE
LAT CHE D FO R CONVE RS IO N N + 1
08479-045
Figure 48. OS x Pin Timing
Table 9. Oversample Bit Decoding
OS[2:0]
OS
Ratio
SNR 5 V Range
(dB)
SNR 10 V Range
(dB)
3 dB BW 5 V Range
(kHz)
3 dB BW 10 V Range
(kHz)
Maximum Throughput
CONVST Frequency (kHz)
000 No OS 89 90 15 22 200
001 2 91.2 92 15 22 100
010 4 92.6 93.6 13.7 18.5 50
011 8 94.2 95 10.3 11.9 25
100 16 95.5 96 6 6 12.5
101 32 96.4 96.7 3 3 6.25
110 64 96.9 97 1.5 1.5 3.125
111 Invalid
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 30 of 37
Figure 49 to Figure 55 illustrate the effect of oversampling on
the code spread in a dc histogram plot. As the oversample rate
is increased, the spread of the codes is reduced.
1000
0
100
200
300
400
500
600
700
800
900
NUMBER O F O CCURE NCE S
CODE ( LSB)
–3 –2 –1 0 1
928 887
3
0 3 2
2
131 97
08479-047
NO OVERSAMPLING
F
SAMPLE
= 200kSPS
AV
CC
= 5V
V
DRIVE
= 2.5V
Figure 49. Histogram of Codes—No OS (Six Codes)
1400
0
200
400
600
1000
1200
800
NUMBER O F O CCURE NCE S
CODE ( LSB)
–3 –2 –1 0 1 3
0 0 0
2
16
08479-048
OVERSAMPLING BY 2
F
SAMPLE
= 100kSPS
AV
CC
= 5V
V
DRIVE
= 2.5V
80
804
1148
Figure 50. Histogram of Codes—OS × 2 (Four Codes)
1400
0
200
400
600
1000
1200
800
NUMBER O F O CCURE NCE S
CODE ( LSB)
–3 –2 –1 0 1 3
0 0 0
2
3
08479-049
OVERSAMPLING BY 4
F
SAMPLE
= 50kSPS
AV
CC
= 5V
V
DRIVE
= 2.5V
19
764
1262
Figure 51. Histogram of Codes—OS × 4 (Four Codes)
1400
0
200
400
600
1000
1200
800
NUMBER O F O CCURE NCE S
CODE ( LSB)
–3 –2 –1 0 1 3
0 0 0
2
0
08479-050
OVERSAMPLING BY 8
F
SAMPLE
= 25kSPS
AV
CC
= 5V
V
DRIVE
= 2.5V
2
783
1263
Figure 52. Histogram of Codes—OS × 8 (Three Codes)
1400
0
200
400
600
1000
1200
800
NUMBER O F O CCURE NCE S
CODE ( LSB)
–3 –2 –1 0 1 3
0 0 0
2
0
08479-151
OVERSAMPLING BY 16
F
SAMPLE
= 12.5kS P S
AV
CC
= 5V
V
DRIVE
= 2.5V
0
595
1453
Figure 53. Histogram of Codes—OS × 16 (Two Codes)
1600
1400
0
200
400
600
1000
1200
800
NUMBER O F O CCURE NCE S
CODE ( LSB)
–3 –2 –1 0 1 3
0 0 0
2
0
08479-152
OVERSAMPLING BY 32
F
SAMPLE
= 6.125kS P S
AV
CC
= 5V
V
DRIVE
= 2.5V
0
631
1417
Figure 54. Histogram of Codes—OS × 32 (Two Codes)
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 31 of 37
1600
1400
0
200
400
600
1000
1200
800
NUMBER O F O CCURE NCE S
CODE ( LSB)
–3 –2 –1 0 1 3
0 0 0
2
0
08479-153
OVERSAMPLING BY 64
F
SAMPLE
= 3kSPS
AV
CC
= 5V
V
DRIVE
= 2.5V
0
1679
369
Figure 55. Histogram of Codes—OS × 64 (Two Codes)
When the oversampling mode is selected for the AD7606/
AD7606-6/AD7606-4, it has the effect of adding a digital filter
function after the ADC. The different oversampling rates and
the CONVST sampling frequency produce different digital
filter frequency profiles.
Figure 56 to Figure 61 show the digital filter frequency profiles
for the different oversampling rates. The combination of the
analog antialiasing filter and the oversampling digital filter can be
used to eliminate and reduce the complexity of the design of any
filter before the AD7606/AD7606-6/AD7606-4. The digital
filtering combines steep roll-off and linear phase response.
0
–10
–20
–30
–40
–50
–60
–70
–80
100 1k 10k 100k 10M
1M
–90
ATT E NUATI ON (dB)
FREQUENCY ( Hz )
08479-051
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 2
Figure 56. Digital Filter Response for OS 2
0
–10
–20
–30
–40
–50
–60
–70
–80
100 1k 10k 100k 10M1M
–100
–90
ATT E NUATI ON (dB)
FREQUENCY ( Hz )
08479-052
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 4
Figure 57. Digital Filter Response for OS 4
0
–10
–20
–30
–40
–50
–60
–70
–80
100 1k 10k 100k 10M1M
–100
–90
ATT E NUATI ON (dB)
FREQUENCY ( Hz )
08479-053
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 8
Figure 58. Digital Filter Response for OS 8
0
–10
–20
–30
–40
–50
–60
–70
–80
100 1k 10k 100k 10M1M
–100
–90
ATT E NUATI ON (dB)
FREQUENCY ( Hz )
08479-154
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 16
Figure 59. Digital Filter Response for OS 16
0
–10
–20
–30
–40
–50
–60
–70
–80
100 1k 10k 100k 10M1M
–100
–90
ATT E NUATI ON (dB)
FREQUENCY ( Hz )
08479-155
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 32
Figure 60. Digital Filter Response for OS 32
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 32 of 37
0
–10
–20
–30
–40
–50
–60
–70
–80
100 1k 10k 100k 10M1M
–100
–90
ATT E NUATI ON (dB)
FREQUENCY ( Hz )
08479-156
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 64
Figure 61. Digital Filter Response for OS 64
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 33 of 37
LAYOUT GUIDELINES
The printed circuit board that houses the AD7606/AD7606-6/
AD7606-4 should be designed so that the analog and digital
sections are separated and confined to different areas of the board.
At least one ground plane should be used. It can be common or
split between the digital and analog sections. In the case of the
split plane, the digital and analog ground planes should be
joined in only one place, preferably as close as possible to the
AD7606/AD7606-6/AD7606-4.
If the AD7606/AD7606-6/AD7606-4 are in a system where
multiple devices require analog-to-digital ground connections,
the connection should still be made at only one point: a star
ground point that should be established as close as possible to the
AD7606/AD7606-6/AD7606-4. Good connections should be
made to the ground plane. Avoid sharing one connection for
multiple ground pins. Use individual vias or multiple vias to the
ground plane for each ground pin.
Avoid running digital lines under the devices because doing so
couples noise onto the die. The analog ground plane should be
allowed to run under the AD7606/AD7606-6/AD7606-4 to
avoid noise coupling. Fast switching signals like CONVST A,
CONVST B, or clocks should be shielded with digital ground
to avoid radiating noise to other sections of the board, and they
should never run near analog signal paths. Avoid crossover of
digital and analog signals. Traces on layers in close proximity
on the board should run at right angles to each other to reduce
the effect of feedthrough through the board.
The power supply lines to the AVCC and VDRIVE pins on the
AD7606/AD7606-6/AD7606-4 should use as large a trace as
possible to provide low impedance paths and reduce the effect
of glitches on the power supply lines. Where possible, use supply
planes and make good connections between the AD7606 supply
pins and the power tracks on the board. Use a single via or multiple
vias for each supply pin.
Good decoupling is also important to lower the supply impedance
presented to the AD7606/AD7606-6/AD7606-4 and to reduce
the magnitude of the supply spikes. The decoupling capacitors
should be placed close to (ideally, right up against) these pins
and their corresponding ground pins. Place the decoupling
capacitors for the REFIN/REFOUT pin and the REFCAPA and
REFCAPB pins as close as possible to their respective AD7606/
AD7606-6/AD7606-4 pins; and, where possible, they should be
placed on the same side of the board as the AD7606 device.
Figure 62 shows the recommended decoupling on the top layer
of the AD7606 board. Figure 63 shows bottom layer decoupling,
which is used for the four AVCC pins and the VDRIVE pin decoupling.
Where the ceramic 100 nF caps for the AVCC pins are placed
close to their respective device pins, a single 100 nF capacitor
can be shared between Pin 37 and Pin 38.
08479-054
Figure 62. Top Layer Decoupling REFIN/REFOUT,
REFCAPA, REFCAPB, and REGCAP Pins
08479-055
Figure 63. Bottom Layer Decoupling
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 34 of 37
To ensure good device-to-device performance matching in
a system that contains multiple AD7606/AD7606-6/AD7606-4
devices, a symmetrical layout between the AD7606/AD7606-6/
AD7606-4 devices is important.
Figure 64 shows a layout with two AD7606/AD7606-6/AD7606-4
devices. The AVCC supply plane runs to the right of both devices,
and the VDRIVE supply track runs to the left of the two devices.
The reference chip is positioned between the two devices, and
the reference voltage track runs north to Pin 42 of U1 and south
to Pin 42 of U2. A solid ground plane is used.
These symmetrical layout principles can also be applied to a system
that contains more than two AD7606/AD7606-6/AD7606-4
devices. The AD7606/AD7606-6/AD7606-4 devices can be placed
in a north-south direction, with the reference voltage located
midway between the devices and the reference track running in
the north-south direction, similar to Figure 64.
AVCC
U2
U1
AVCC
U2
U1
08479-056
Figure 64. Layout for Multiple AD7606 Devices—Top Layer and
Supply Plane Layer
Data Sheet AD7606/AD7606-6/AD7606-4
Rev. F | Page 35 of 37
OUTLINE DIMENSIONS
COMPLIANT TO JE DE C S TANDARDS MS-026-BCD
051706-A
TOP VIEW
(PINS DOW N)
1
16
17 33
32
48
49
64
0.27
0.22
0.17
0.50
BSC
LEAD P IT CH
12.20
12.00 SQ
11.80
PIN 1
1.60
MAX
0.75
0.60
0.45
10.20
10.00 SQ
9.80
VIEW A
0.20
0.09
1.45
1.40
1.35
0.08
COPLANARITY
VIEW A
ROTAT E D 90° CCW
SEATING
PLANE
0.15
0.05
7°
3.5°
0°
Figure 65. 64-Lead Low Profile Quad Flat Package [LQFP]
(ST-64-2)
Dimensions shown in millimetres
ORDERING GUIDE
Model1, 2, 3 Temperature Range Package Description Package Option
AD7606BSTZ −40°C to +85°C 64-Lead Low Profile Quad Flat Package [LQFP] ST-64-2
AD7606BSTZ-RL −40°C to +85°C 64-Lead Low Profile Quad Flat Package [LQFP] ST-64-2
AD7606BSTZ-6 −40°C to +85°C 64-Lead Low Profile Quad Flat Package [LQFP] ST-64-2
AD7606BSTZ-6RL −40°C to +85°C 64-Lead Low Profile Quad Flat Package [LQFP] ST-64-2
AD7606BSTZ-4 −40°C to +85°C 64-Lead Low Profile Quad Flat Package [LQFP] ST-64-2
AD7606BSTZ-4RL −40°C to +85°C 64-Lead Low Profile Quad Flat Package [LQFP] ST-64-2
EVAL-AD7606SDZ Evaluation Board for the AD7606
EVAL-AD7606-6SDZ Evaluation Board for the AD7606-6
EVAL-AD7606-4SDZ Evaluation Board for the AD7606-4
EVAL-SDP-CB1Z Evaluation Controller Board
1 Z = RoHS Compliant Part.
2 The EVAL-AD7606SDZ, EVAL-AD7606-6SDZ, and EVAL-AD7606-4SDZ can be used as standalone evaluation boards or in conjunction with the EVAL-SDP-CB1Z for
evaluation/demonstration purposes.
3 The EVAL-SDP-CB1Z allows the PC to control and communicate with all Analog Devices, Inc., evaluation boards ending in the SDZ designator.
AD7606/AD7606-6/AD7606-4 Data Sheet
Rev. F | Page 36 of 37
NOTES
