(0.80 mm) .0315" ERM8-RA, ERM8-EM SERIES
ERM8–030–01–L–D–RA–L–K–TR
ERM8–060–01–L–D–EM2–TR
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
(0.80)
.0315 (1.57)
.062
DIA
(5.75)
.226
(5.01)
.197
(6.25)
.246
No. of Positions x
(0.80) .0315 + (13.00) .512
(11.00)
.433
02
01
Ground
Pin Signal Pins
Ground Pin
(1.68)
.066 (6.12)
.241
(0.35)
.014 (1.00)
.039 (1.40)
.055
ERM8-RA / ERM8-EM
Board Mates:
ERF8
ERM8-RA Cable Mates:
ERCD
For complete specifications and
recommended PCB layouts see
www.samtec.com?ERM8-RA or
www.samtec.com?ERM8-EM
Insulator Material: Black LCP
Terminal Material:
Phosphor Bronze
Latch Material: BeCu
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating: 2.2 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
235 VAC / 318 VDC
RoHS Compliant: Ye s
–010, –013, –020,
–025, –030, –040, –049,
–050, –060, –070, –075
–L
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
–L
–DS
ERM8 NO. OF POSITIONS
PER ROW D RA TR01 PLATING
OPTION OTHER
OPTION
–TR
= Tape &
Reel
RUGGED EDGE RATE® STRIPS
–EM2
= (1.60 mm) .062"
Thick PCB
APPLICATIONS
STANDARD POS. PART NOs. SERIES
NEXUS5001™.org
POWER.org™
11 ASP-137971-01 ERM8-EM
17 ASP-137974-01 ERM8-EM
ARM/HSSTP 20 ASP-133811-01 ERM8-EM
NEXUS5001™.org
POWER.org™
23 ASP-133811-02 ERM8-EM
35 ASP-135040-01 ERM8-EM
–005, –010, –013, –020,
–025, –030, –040, –049,
–050, –060, –070, –075
ERM8 NO. OF POSITIONS
PER ROW DEM2 TR01 PLATING
OPTION OTHER
OPTION
–TR
= Tape
& Reel
–L
= Latching
(Mates to ERF8
Lead Style –05.0
or –RA only)
–DS
= Differential Pair
(–013, –025 pos.only)
(Hot Swap)
–EGPS
= Extended
Guide Post Shield
(–010, –020, –025,
–030 pos.only)
–DSS
= Differential Pair
+ Extended Guide
Post Shield
(–025 pos. only)
(Hot Swap)
–L
= 10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
(6.80)
.268
02
01
(0.80)
.0315
No. of positions x
(0.80) .0315 + (9.00) .354
EGPS = No. of positions x
(0.80) .0315 + (10.00) .394
(3.20)
.126
(3.82)
.150
(7.75)
.305
(5.20)
.205
(0.80) .031
(5.60)
.220
(14.79)
.582
(2.10)
.082
(5.70)
.224
–L
–L OPTION
–DS OPTION
PIN
COUNT
PAIR
COUNT
2x13 8
2x25 16
For complete scope
of recognitions see
www.samtec.com/quality
RECOGNITIONS
–K
= (6.00 mm) .236"
DIA Polyimide
Film Pick
& Place Pad
–L
= Latching
–DS
= Differential Pair
(–013, –025
positions only)
(Hot swap)
SPECIFICATIONS
PROCESSING
Lead–Free Solderable: Ye s
SMT Lead Coplanarity
(ERM8-RA):
(0.10 mm) .004" max (010-050)
(0.15 mm) .006" max (060-075)*
SMT Lead Coplanarity
(ERM8-EM):
(0.10 mm) .004" max (005-030)
(0.12 mm) .005" max (040-075)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
FILE NO. E111594
–EGPS
Notes:
Patented
Some lengths, styles and
options are non-standard,
non-returnable.
Gbps
28
HIGH-SPEED CHANNEL PERFORMANCE
ERM8-RA/ERF8-RA
Rating based on Samtec reference
channel.For full SI performance
data visit Samtec.com
or contact SIG@samtec.com
ALSO AVAILABLE
(MOQ Required)
• Other Positions
• Solder
leads & weld tab for
(2.36 mm) .093" thick board
• Other platings
F-219
