PSSI3120CA/T3 - NXP Semiconductors / Philips Semiconductors

DATA SH EET

Product data sheet 2001 Jul 19

DISCRETE SEMICONDUCTORS

PSSI3120CA

PECL termination

M3D088

2001 Jul 19 2

NXP Semiconductors Product data sheet

PECL termination PSSI3120CA

FEATURES

•Single channel PECL termination in a th ree pin SOT23

package

•ESD protection >2 kV

•Undershoot protec tion

•High capacitance range.

APPLICATIONS

Enhanced high speed clock line signal integrity for the

following:

•Workstations

•Desktop PCs

•Notebook PCs.

DESCRIPTION

Single channel, RC-type positive emitter-coupled logic

(PECL) clock termination with integrated diodes, providing

electros tatic disch arge (ESD) protection up to 2 kV. Using

thin film-on-silicon technology the PSSI3120CA integrates

three resistors, one capacitor and two diodes in a SOT23

package. The capaci tor is protected from damage due to

ESD by the diodes. The product is designed to enhance

signal integr ity in clock di stributio n network s. Addition ally,

it can be us ed as a termination in di gital transmission lines

where its inherent ESD protection helps maintain signal

integrity by reducing undershoots.

PINNING - SOT23

PIN DESCRIPTION

1input/output

2input/output

3ground

handbook, 2 columns

MGC421

Top view

Fig.1 Simplified ou tline and pin configuration .

Marking code: 9C.

handbook, halfpage

MBL313

R3 C1

Fig.2 Functional diagram.

2001 Jul 19 3

NXP Semiconductors Pr oduct dat a shee t

PECL termination PSSI3120CA

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

ELECTRICAL CHARACTERISTIC S

Tamb = 25 °C unless other specified.

THERMAL CHARACTE RISTICS

Note

1. Refer to SOT23 standard mounting conditions.

SYMBOL PARAMETER MIN. MAX. UNIT

Voperating voltage 0 5 V

IFcontinuous forward current −10 mA

IFRM repetitive peak forward current −50 mA

Tstg storage temperature −65 +150 °C

Tjjunction temperature −150 °C

SYMBOL PARAMETER MIN. MAX. UNIT

R1, R2 resistance 45 55 Ω

R3 resistance 41.7 51 Ω

C1 capacitance 120 180 pF

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to

ambient note 1 500 K/W

2001 Jul 19 4

NXP Semiconductors Pr oduct dat a shee t

PECL termination PSSI3120CA

PACKAGE OUTLINE

UNIT A1

max. bpcDE e1HELpQwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

97-02-28

99-09-13

IEC JEDEC EIAJ

mm 0.1 0.48

0.38 0.15

0.09 3.0

2.8 1.4

1.2 0.95

1.9 2.5

2.1 0.55

0.45 0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23 TO-236AB

detail X

vMA

0 1 2 mm

scale

1.1

0.9

Plastic surface mounted package; 3 leads SOT2

2001 Jul 19 5

NXP Semiconductors Pr oduct dat a shee t

PECL termination PSSI3120CA

DATA SHEET STATUS

Notes

1. Please consult the mos t recently issued document befor e initiating or co mpleting a design.

2. The product status of device (s) described in this document may have changed since this do cument was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective specification for pro duct

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production T his document contains the produc t s pecification.

DISCLAIMERS

General ⎯ Information in this document is believed to be

accurate and reliable . H ow ev er, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequenc es of use of such informa tio n.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to informa tion

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereo f.

Suitability for use ⎯ NXP Semiconductors products are

not designed, au thorized or warran ted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in pe rs onal injury, death or seve re

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefor e s uc h inclusion and/or use is at

the customer’s own risk .

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use witho ut fu rth e r testing or modificati on .

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratings only and

operation of the device at these or any other conditions

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any incons istency or conflict between information

in this document an d such terms and conditio ns, the latter

will prevail.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for accept ance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industr i al or inte llectual property rights.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national author ities.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaus tive or legally binding.

NXP Semiconductors

Contact information

For additional information p lease visit: http://www.nxp.com

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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this documen t d oes not form part o f an y q uot ation or co ntract, is believed to b e a ccur ate a nd re li a ble and may be chan ged

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other ind ustrial or intellectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semicon ductors. No changes were

made to the content, except for the legal definitions and disclaimer s.

Printed in The Netherlands 613514/01/pp6 Date of release: 2001 Jul 19 Document orde r number: 9397 750 08302