AON6458 250V,14A N-Channel MOSFET General Description Product Summary The AON6458 is fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC applications.By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability this device can be adopted quickly into new and existing offline power supply designs.This device is ideal for boost converters and synchronous rectifiers for consumer, telecom, industrial power supplies and LED backlighting. VDS 300V@150 ID (at VGS=10V) 14A RDS(ON) (at VGS=10V) < 0.17 100% UIS Tested! 100% Rg Tested! DFN5X6 Top View Bottom View D Top View 1 8 2 7 3 6 4 5 G PIN1 S Absolute Maximum Ratings TA=25C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS TC=25C Continuous Drain CurrentB Pulsed Drain Current Avalanche Current C V A 42 2.2 IDSM TA=70C 30 8.8 IDM TA=25C Continuous Drain Current Units V 14 ID TC=100C C Maximum 250 A 1.7 IAR 4.5 A Repetitive avalanche energy C EAR 304 mJ Single pulsed avalanche energy H Peak diode recovery dv/dt TC=25C EAS dv/dt 608 5 83 mJ V/ns W 33 W Power Dissipation B PD TC=100C TA=25C Power Dissipation A PDSM TA=70C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Case Rev0: June 2011 2 TJ, TSTG Symbol t 10s Steady-State Steady-State RJA RJC www.aosmd.com W 1.25 -50 to 150 Typ 24 53 1 C Max 30 64 1.5 Units C/W C/W C/W Page 1 of 6 AON6458 Electrical Characteristics (TJ=25C unless otherwise noted) Symbol Parameter Conditions Min ID=250A, VGS=0V, TJ=25C 250 Typ Max Units STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage BVDSS /TJ Zero Gate Voltage Drain Current IDSS Zero Gate Voltage Drain Current IGSS Gate-Body leakage current VDS=0V, VGS=30V Gate Threshold Voltage VDS=5V, ID=250A VGS(th) ID=250A, VGS=0V, TJ=150C 300 V ID=250A, VGS=0V 0.25 V/ oC VDS=250V, VGS=0V 1 VDS=200V, TJ=125C 10 A 100 3.2 3.8 4.5 n V 0.17 1 V RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=10A 0.14 gFS Forward Transconductance VDS=40V, ID=10A 16 VSD Diode Forward Voltage IS=1A,VGS=0V IS Maximum Body-Diode Continuous Current 14 A ISM Maximum Body-Diode Pulsed Current 42 A DYNAMIC PARAMETERS Input Capacitance Ciss Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance VGS=0V, VDS=25V, f=1MHz VGS=0V, VDS=0V, f=1MHz SWITCHING PARAMETERS Qg Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge S 0.72 810 1028 1240 pF 110 167 225 pF 5 11 17 pF 1.9 3.9 5.9 17 22 27 nC VGS=10V, VDS=200V, ID=10A 6.3 nC 8 nC 28 ns 57 ns tD(on) Turn-On DelayTime tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf trr Turn-Off Fall Time Body Diode Reverse Recovery Time IF=10A,dI/dt=100A/s,VDS=100V 125 158 190 Qrr Body Diode Reverse Recovery Charge IF=10A,dI/dt=100A/s,VDS=100V 0.8 1 1.2 VGS=10V, VDS=125V, ID=10A, RG=25 65 ns 40 ns ns C A. The value of RJA is measured with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25C. The Power Dissipation PDSM is based on RJA t 10s value and the maximum allowed junction temperature of 150C. The value in any given application depends on the user's specific board design. B. The power dissipation PD is based on TJ(MAX)=150C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150C. Ratings are based on low frequency and duty cycles to keep initial TJ =25C. D. The RJA is the sum of the thermal impedance from junction to case RJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300s pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150C. The SOA curve provides a single pulse rating. G.These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25C. H. L=60mH, IAS=4.5A, VDD=150V, RG=25, Starting TJ=25C. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev0: June 2011 www.aosmd.com Page 2 of 6 AON6458 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 30 100 -55C VDS=40V 10V 25 125C 10 6.5V ID(A) ID (A) 20 15 6.0V 10 1 25C 5 VGS=5.5V 0 0.1 0 5 10 15 20 25 VDS (Volts) Figure 1: On-Region Characteristics 30 2 0.30 6 8 VGS(Volts) Figure 2: Transfer Characteristics 10 3 VGS=10V Normalized On-Resistance 0.25 0.20 RDS(ON) ( ) 4 0.15 0.10 0.05 0.00 2.5 VGS=10V ID=10A 2 1.5 1 0.5 0 0 5 10 15 20 25 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage -100 -50 0 50 100 150 200 Temperature (C) Figure 4: On-Resistance vs. Junction Temperature 1.0E+02 1.2 40 125C 1.0E+00 IS (A) BVDSS (Normalized) 1.0E+01 1.1 1 25C 1.0E-01 1.0E-02 0.9 1.0E-03 1.0E-04 0.8 -100 50 100 150 200 TJ (oC) Figure 5: Break Down vs. Junction Temperature Rev0: June 2011 -50 0 www.aosmd.com 0.2 0.4 0.6 0.8 VSD (Volts) Figure 6: Body-Diode Characteristics 1.0 Page 2 of 6 AON6458 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 15 10000 VDS=200V ID=10A Ciss 1000 Capacitance (pF) VGS (Volts) 12 9 6 100 10 3 Crss 0 1 0 5 10 15 20 25 30 Qg (nC) Figure 7: Gate-Charge Characteristics 35 0.1 100 1 10 VDS (Volts) Figure 8: Capacitance Characteristics 100 400 TJ(Max)=150C TC=25C 10s 10 Power (W) 300 100s ID (Amps) Coss RDS(ON) limited 1 1ms DC 10ms 0.1s 0.1 200 100 TJ(Max)=150C TC=25C 0.01 0 1 10 100 1000 0.0001 VDS (Volts) 0.001 0.01 0.1 1 10 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toCase (Note F) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) Z JC Normalized Transient Thermal Resistance 10 D=Ton/T TJ,PK=TC+PDM.ZJC.RJC In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 1 0.1 PD 0.01 Single Pulse Ton T 0.001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F) Rev0: June 2011 www.aosmd.com Page 2 of 6 AON6458 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 80 12 Current rating ID(A) 15 Power Dissipation (W) 100 60 40 20 9 6 3 0 0 0 25 50 75 100 125 150 0 25 75 100 125 TCASE (C) Figure 13: Current De-rating (Note B) TCASE (C) Figure 12: Power De-rating (Note B) 50 150 300 TJ(Max)=150C TA=25C 250 Power (W) 200 150 100 50 0 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note G) Z JA Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TA+PDM.ZJA.RJA RJA=64C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD 0.01 Single Pulse Ton T 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 15: Normalized Maximum Transient Thermal Impedance (Note G) Rev0: June 2011 www.aosmd.com Page 2 of 6 AON6458 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + VDC - VDC DUT Qgs Vds Qgd - Vgs Ig Charge Res istive Switching Test Circuit & Waveforms RL Vds Vds DUT Vgs + VDC 90% Vdd - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf t off Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L EAR= 1/2 LI Vds 2 AR BVDSS Vds Id + Vgs Vgs VDC - Rg Vdd I AR Id DUT Vgs Vgs Diode Recovery Tes t Circuit & Waveforms Qrr = - Idt Vds + DUT Vgs Vds - Isd Vgs Ig Rev0: June 2011 L Isd + Vdd trr dI/dt IRM Vdd VDC - IF Vds www.aosmd.com Page 2 of 6