4/4
REV. A
◎NOTE ON USE
1. Absolute maximu m ratings
We are careful enough for quality control about this IC. So, there is no problem under normal operation, excluding that it exceeds the absolute maximum ratings.
However, this IC might be destroyed when the absolute maximum ratings, such as impressed voltages or the operating temperature range is exceeded, and whether the
destruction is short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical countermeasures for safety, such as fusing, if a
particular mode that exceeds the absolute maximum rating is assumed.
2. Reverse pola rity connection
Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part. Please utilize the direction protection device as a diode in the
supply line and motor coil line.
3. Power supply line
Due to return of regenerative current by reverse electromotive force, using electrolytic and ceramic suppress filter capacitors (0.1µF) close to the IC power input
terminals (Vcc and GND) are recommended. Please note the electrolytic capacitor value decreases at lower temperatures and examine to dispensephysical measures
for safety.
4. GND line
Please keep the GND line [GND(10pin),SPGND(25pin),PGND(30pin),PREGND(39pin),SUBGND(40pin)] the lowest potential always, and check the GND voltage when
transient voltages are connected to the IC.
5. Thermal design
Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough temperature margins. This product has
exposed the frame to the back side of the package, but please notes that it is assumed to use heat radiation efficiency by the heat radiation for this part. Please take the
heat radiation pattern on not only the surface of the substrate but also the back of the substrate widely.
6. Short circuit mode bet ween terminals and wrong mounting
Do not mount the IC in the wrong direction and displacement, and be careful about the reverse-connection of the power connector. Moreover, this IC might be
destroyed when the dust short the terminals between them or GND.
7. Radiation
Strong electromagnetic radiation can cause operation failures.
8. ASO (A rea of Sa fety Ope ration)
Do not exceed the maximum ASO and the absolute maximum ratings of the output driver.
9. TSD (Thermal Shut-Down)
The TSD is activated when the junction temperature (Tj) exceeds Tjmax, and the output terminal is switched to OPEN.
The guarantee and protection of set are not purpose. Therefore, please do not use this IC after TSD circuit operates, nor use it for assumption that operates the TSD
circuit.
10. Capa citor between output and GND
If a large capacitor is connected between the output and GND, this IC might be destroyed when Vcc becomes 0V or GND, because the electric charge accumulated in
the capacitor flows to the output. Please set said capacitor to smaller than 0.1µF.
11. Inspection by the set circuit bo ard
The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please discharge electricity in each and all process. Moreover, when
attaching or detaching from jig in the inspection process, please turn off the power before mounting the IC, and turn on after mounting the IC, and vice versa. In addition,
please take into consideration the countermeasures for electrostatic damage, such as giving the earth in assembly process, transportation or preservation.
12. Input terminal
This IC is a monolithic IC, and has P
+
isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer and N-layer of each
element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure below. When the GND voltage potential is greater than the voltage
potential at Terminals A on the resistor, at Terminal B on the transistor, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in
said parasitic diode and the N layer of surrounding elements close to said parasitic diode.
These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the interference of circuit operation, then the
wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than GND (P
substrate). Please do not apply the voltage to the input terminal when the power-supply voltage is not impressed. Moreover, please impress each input terminal lower
than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage is impressing.
Simplified structure of IC
13. Earth wiring pattern
If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and large current not to change
voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of external parts, it is similar to the
above-mentioned.
14. Reverse-rotation braking
In the case of reverse-rotation braking from high-speed rotation, pay good attention to reverse electromotive force. Furthermore, fully check output current and consider
the revolutions applied to the reverse-rotation brake.
15. About the cap acitor between SPVM and PGND
The capacitor between SPVM and PGND absorbs the change in a steep voltage and the current because of the PWM drive, as a result, there is a role to suppress the
disorder of the SPVM voltage. However, the effect falls by the influence of the wiring impedance etc, if the capacitor becomes far from IC. Please examine the capacitor
between SPVM and PGND to arrange it near IC.
Terminal-A
Parasitic
element GND
P
+
P
Terminal-A
Terminal-B
GND
P
P-Substrate
CB
GND
E
E
C
B
GND
Surrounding
elements
Resistor Transistor(NPN)
P
+
P
+
P
+
P-Substrate
Parasitic
element
Parasitic
element
Parasitic
element
Terminal-B