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REV. A
STRUCTURE Silicon Monolithic Integrated Circuit
PRODUCT NAME
4ch DVD Driver for Car Audio
MODEL NAME
B D 8 2 3 1 E F V
FEATURES 3-phase
brushless spindle motor driver, 2ch for actuator, 1ch for shared Sled/Loading (total 4ch).
HTSSOP-B40 package which has large power dissipation is adopted.
<Spindle driver>
Highly effective and super silent 3-phase PWM drive system are adopted.
<Actuator/DC motor driver>
A linear BTL method with a low noise & a good playability is adopted.
ABSOLUTE MAXIMUM RATING(Ta=25)
Parameter Symbol Limits Unit
Power-supply voltage PREVCC, SLVM, AVM, VM_S, SPVM, SPRNF 15 V
Power dissipationPd 1.6
*1
W
Operating temperatureTopr -4085 ℃
Storage temperatureTs tg -55150 ℃
170mm×70mm, thickness1.6mm, less than 3% share of copper foil when implementing glass epoxy board.
Operating at higher than Ta=25, 12.8mW shall be reduced per 1
RANGE of RECOMMENDED OPERATION
(Please set the power-supply voltage in consideration of a power dissipation.)
Parameter Symbol MIN TYP MAX Unit
Linear driver PreVCC voltage PREVcc 6 8 10 V
Thread/loading driver power part power-supply voltage SLVM 6 8 PREVcc V
Actuator driver power part power-supply voltage AVM 4 8 PREcc V
Spindle driver Pre driver part voltage VM_S 6 8 10 V
Spindle driver power part power-supply voltage SPVM,SPRNF 6 8 VM_S
V
This product is not designed for protection against radioactive rays.
Status of this document
The Japanese version of this document is the formal specification.
A customer may use this translation version only for a reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
Be careful to handle because the content of the description of this material might correspond to the labor
(technology in the design, manufacturing, and use) in foreign country exchange and Foreign Trade Control Law.
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REV. A
ELECTRICAL CHARACTERISTICS
(Unless otherwise noted Ta=25, PREVcc=AVM=SLVM=SPVM=VM_S=8V, Vc=1.65V, RL=8, SPRNF=0.165))
specification value UNIT Condition
Parameter Symbol MIN TYP MAX
Quiescent current I
Q
- 27.5 40.0 mA
At no load
Actuator driver part (CH2,3)
Output offset voltage V
OFFT
-50 0 50 mV
Output saturation voltage
(vertical harmony)
V
OFT
- 1.5 2.3 V IL=500mA
Voltage gain G
VFT
16.0 17.5 19.0 dB
SL/LD driver part (CH4)
Output offset voltage V
OFSL
-50 0 50 mV
Output saturation voltage
(vertical harmony)
V
OSL
- 1.5 2.3 V IL=500mA
voltage gain (SL) G
VSL
13.6 15.6 17.6 dB VIN=±0.5V
voltage gain (LD) G
VLD
17.1 19.1 21.1 dB VIN=±0.5V
Spindle driver part < hall bias >
Voltage of hall bias V
HB
0.45 0.9 1.35 V IHB=10mA
Spindle driver part < hall amplifier >
Input bias current I
HIB
-5 - 5 uA
Input level (one side) V
HIM
50 - - mVpp
Common mode input range V
HICM
1 - 6 V
Spindle driver part < torque instruction I/O >
Input dead zone (one side) V
DZSP
0 10 40 mV
I/O gain gmSP 1.06 1.37 1.64 A/V
Output ON resistance (vertical harmony) R
ONSP
- 1 1.8 IL=500mA
Output limit current I
LIMSP
0.8
(0.132)
1.0
(0.165)
1.2
(0.198)
A
(V)
Input impedance R
inSP
35 47 59 k
PWM frequency fosc - 100 - kHz
Spindle driver part < FG output >
Low voltage V
FGL
- 0.1 0.3 V 10k pull-up (3.3V)
CTL Part
Low input voltage V
ICTL
- - 0.8 V
High input voltage V
ICTH
2 - - V
High-level input current I
CTH
- 50 100 uA
CTL=3.3V
This product is not designed for protection against radioactive rays.
PACKAGE OUTLINE
HTSSOP-B40 (UNIT : mm)
LOT NO.
S!PWM
×2
BD8231EFV
(MAX 13.95 include BURR)
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REV. A
BLOCK DIAGRAM
CTL
LEVEL
SHIFT LEVEL
SHIFT LEVEL
SHIFT
HALLAMP/REVERSEPROTECT
MATRIX
HALL
BIAS
DUTY
CONTROL
CURRENT
DETECTOR
FG
Vc
Vc
TKIN
SLIN
FCIN
SLOPOUT
LDIN
SPIN
CTL2
CTL1
FG
SPCNF
HB
HW-
HW+
HV-
HV+
HU-
HU+
PREGND
SUBGND
PREVcc
TKO-
AVM
TKO+
FCO-
FCO+
SL/LDO-
SL/LDO+
PGND
SLVM
W
V
U
SPGND
SPVM
SPRNF
BH
VMS
1 2 3 4 5 6 7 8 9 1011121314151617181920
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
100k
100k
50k
50k
10k 16k
16k
6.7k
1.65V
47k
TEST
GND
PIN ASSIGNMENT
No. Symbol Description No. Symbol Description
1 Vc Control standard voltage input 21 VM_S Spindle driver Pre part power supply
2 TKIN Tracking input 22 BH Spindle driver current sense bottom hold
3 FCIN Focus input 23 SPRNF Spindle driver current sense
4 SLIN Sled input 24 SPVM Spindle driver power supply
5 SLOPOUT Sled input OPAMP output terminal 25 SPGND Spindle part Power GND
6 LDIN Loading input 26 U Spindle driver U aspect output
7 SPIN Spindle driver input 27 V Spindle driver V aspect output
8 CTL1 Control terminal 1 28 W Spindle driver W aspect output
9 CTL2 Control terminal 2 29 SLVM Sled/Loading driver power supply
10 GND GND 30 PGND Power GND
11 TEST Test input terminal (Connect it to GND). 31 SL/LDO+ Sled/Loading positive output
12 FG FG signal output 32 SL/LDO- Sled/Loading negative output
13 SPCNF Spindle driver filter terminal 33 FCO+ Focus positive output
14 HB Hall bias 34 FCO-
Focus negative output
15 HW- Hall signal W-input 35 TKO+ Tracking positive output
16 HW+ Hall signal W+input 36 TKO- Tracking negative output
17 HV- Hall signal V-input 37 AVM
A
ctuator driver power suppl
y
18 HV+ Hall signal V+input 38 PREVcc Linear driver pre part power supply
19 HU- Hall signal U-input 39 PREGND
PREGND
20 HU+ Hall signal U+input 40 SUBGND SUBGND
The FOCUSTRACKINGSLEDLOADING driver's positive output and negative output are the polarities to the FCINTKINSLOPOUTLDIN input respectively.
Example) FCO+>FCO - at FCIN>Vc, FCO+<FCO at FCIN<Vc
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REV. A
NOTE ON USE
1. Absolute maximu m ratings
We are careful enough for quality control about this IC. So, there is no problem under normal operation, excluding that it exceeds the absolute maximum ratings.
However, this IC might be destroyed when the absolute maximum ratings, such as impressed voltages or the operating temperature range is exceeded, and whether the
destruction is short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical countermeasures for safety, such as fusing, if a
particular mode that exceeds the absolute maximum rating is assumed.
2. Reverse pola rity connection
Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part. Please utilize the direction protection device as a diode in the
supply line and motor coil line.
3. Power supply line
Due to return of regenerative current by reverse electromotive force, using electrolytic and ceramic suppress filter capacitors (0.1µF) close to the IC power input
terminals (Vcc and GND) are recommended. Please note the electrolytic capacitor value decreases at lower temperatures and examine to dispensephysical measures
for safety.
4. GND line
Please keep the GND line [GND(10pin),SPGND(25pin),PGND(30pin),PREGND(39pin),SUBGND(40pin)] the lowest potential always, and check the GND voltage when
transient voltages are connected to the IC.
5. Thermal design
Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and please design enough temperature margins. This product has
exposed the frame to the back side of the package, but please notes that it is assumed to use heat radiation efficiency by the heat radiation for this part. Please take the
heat radiation pattern on not only the surface of the substrate but also the back of the substrate widely.
6. Short circuit mode bet ween terminals and wrong mounting
Do not mount the IC in the wrong direction and displacement, and be careful about the reverse-connection of the power connector. Moreover, this IC might be
destroyed when the dust short the terminals between them or GND.
7. Radiation
Strong electromagnetic radiation can cause operation failures.
8. ASO (A rea of Sa fety Ope ration)
Do not exceed the maximum ASO and the absolute maximum ratings of the output driver.
9. TSD (Thermal Shut-Down)
The TSD is activated when the junction temperature (Tj) exceeds Tjmax, and the output terminal is switched to OPEN.
The guarantee and protection of set are not purpose. Therefore, please do not use this IC after TSD circuit operates, nor use it for assumption that operates the TSD
circuit.
10. Capa citor between output and GND
If a large capacitor is connected between the output and GND, this IC might be destroyed when Vcc becomes 0V or GND, because the electric charge accumulated in
the capacitor flows to the output. Please set said capacitor to smaller than 0.1µF.
11. Inspection by the set circuit bo ard
The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please discharge electricity in each and all process. Moreover, when
attaching or detaching from jig in the inspection process, please turn off the power before mounting the IC, and turn on after mounting the IC, and vice versa. In addition,
please take into consideration the countermeasures for electrostatic damage, such as giving the earth in assembly process, transportation or preservation.
12. Input terminal
This IC is a monolithic IC, and has P
+
isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer and N-layer of each
element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure below. When the GND voltage potential is greater than the voltage
potential at Terminals A on the resistor, at Terminal B on the transistor, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in
said parasitic diode and the N layer of surrounding elements close to said parasitic diode.
These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the interference of circuit operation, then the
wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than GND (P
substrate). Please do not apply the voltage to the input terminal when the power-supply voltage is not impressed. Moreover, please impress each input terminal lower
than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage is impressing.
Simplified structure of IC
13. Earth wiring pattern
If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and large current not to change
voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of external parts, it is similar to the
above-mentioned.
14. Reverse-rotation braking
In the case of reverse-rotation braking from high-speed rotation, pay good attention to reverse electromotive force. Furthermore, fully check output current and consider
the revolutions applied to the reverse-rotation brake.
15. About the cap acitor between SPVM and PGND
The capacitor between SPVM and PGND absorbs the change in a steep voltage and the current because of the PWM drive, as a result, there is a role to suppress the
disorder of the SPVM voltage. However, the effect falls by the influence of the wiring impedance etc, if the capacitor becomes far from IC. Please examine the capacitor
between SPVM and PGND to arrange it near IC.
Terminal-A
Parasitic
element GND
P
+
P
Terminal-A
Terminal-B
GND
P
P-Substrate
CB
GND
E
E
C
B
GND
Surrounding
elements
Resistor Transistor(NPN)
P
+
P
+
P
+
P-Substrate
Parasitic
element
Parasitic
element
Parasitic
element
Terminal-B
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
Appendix1-Rev2.0
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More detail product informations and catalogs are available, please contact your nearest sales office.
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Copyright © 2007 ROHM CO.,LTD.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121
FAX : +81-75-315-0172
Appendix