X9410 (R) Low Noise/Low Power/SPI Bus Data Sheet October 12, 2006 Dual Digitally Controlled Potentiometer (XDCPTM) FEATURES * Two potentiometers per package * SPI serial interface * Register oriented format - Direct read/write/transfer wiper positions - Store as many as four positions per potentiometer * Power supplies - VCC = 2.7V to 5.5V - V+ = 2.7V to 5.5V - V- = -2.7V to -5.5V * Low power CMOS - Standby current < 1A - High reliability - Endurance - 100,000 data changes per bit per register - Register data retention - 100 years * 8-bytes of nonvolatile EEPROM memory * 10k resistor arrays * Resolution: 64 taps each pot * 24 Ld SOIC, 24 Ld TSSOP, and 24 Ld plastic DIP packages * Pb-free plus anneal available (RoHS compliant) FN8193.2 DESCRIPTION The X9410 integrates two digitally controlled potentiometers (XDCPs) on a monolithic CMOS integrated circuit. The digitally controlled potentiometer is implemented using 63 resistive elements in a series array. Between each element are tap points connected to the wiper terminal through switches. The position of the wiper on the array is controlled by the user through the SPI serial bus interface. Each potentiometer has associated with it a volatile Wiper Counter Register (WCR) and four nonvolatile Data Registers (DR0:DR3) that can be directly written to and read by the user. The contents of the WCR controls the position of the wiper on the resistor array through the switches. Power-up recalls the contents of DR0 to the WCR. The XDCP can be used as a three-terminal potentiometer or as a two-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. BLOCK DIAGRAM VCC Pot 0 VSS R0 R1 V+ VR2 R3 HOLD CS SCK SO SI A0 A1 WP VL0/RL0 VW0/RW0 Interface and Control Circuitry 8 VW1/RW1 Pot 1 Data R0 R1 R2 R3 1 VH0/RH0 Wiper Counter Register (WCR) Wiper Counter Register (WCR) Resistor Array Pot1 VH1/RH1 VL1/RL1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. X9410 Ordering Information PART NUMBER VCC LIMITS (V) PART MARKING X9410YS24I X9410YS I X9410YS24IZ (Note) X9410YS ZI X9410WP24I X9410WP I X9410WS24I* POTENTIOMETER ORGANIZATION TEMP RANGE (k) (C) 5 10% PKG. DWG. # -40 to 85 24 Ld SOIC (300 mil) M24.3 -40 to 85 24 Ld SOIC (300 mil) (Pb-free) MDP0027 -40 to 85 24 Ld PDIP E24.6 X9410WS I -40 to 85 24 Ld SOIC (300 mil) M24.3 X9410WS24IZ* (Note) X9410WS ZI -40 to 85 24 Ld SOIC (300 mil) (Pb-free) MDP0027 X9410WV24I* X9410WV I -40 to 85 24 Ld TSSOP (4.4mm) MDP0044 X9410WV24IZ* (Note) X9410WV ZI -40 to 85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 X9410YS24I-2.7 X9410YS G -40 to 85 24 Ld SOIC (300 mil) M24.3 X9410YS24IZ-2.7 (Note) X9410YS ZG -40 to 85 24 Ld SOIC (300 mil) (Pb-free) MDP0027 X9410WP24I-2.7 X9410WP G -40 to 85 24 Ld PDIP E24.6 X9410WS24I-2.7* X9410WS G -40 to 85 24 Ld SOIC (300 mil) M24.3 -40 to 85 24 Ld SOIC (300 mil) (Pb-free) MDP0027 0 to 70 24 Ld TSSOP (4.4mm) MDP0044 0 to 70 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 10 2.7 to 5.5 X9410WS24IZ-2.7* (Note) X9410WS ZG X9410WV24-2.7* X9410WV F X9410WV24Z-2.7* (Note) X9410WV ZF X9410WV24I-2.7* 2.5 PACKAGE X9410WV G X9410WV24IZ-2.7* (Note) X9410WV ZG 2.5 10 -40 to 85 24 Ld TSSOP (4.4mm) MDP0044 -40 to 85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 *Add "T1" suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. PIN DESCRIPTIONS in the active power mode. It should be noted that after a power-up, a HIGH to LOW transition on CS is required prior to the start of any operation. Host Interface Pins Serial Output (SO) SO is a push/pull serial data output pin. During a read cycle, data is shifted out on this pin. Data is clocked out by the falling edge of the serial clock. Serial Input SI is the serial data input pin. All opcodes, byte addresses and data to be written to the pots and pot registers are input on this pin. Data is latched by the rising edge of the serial clock. Serial Clock (SCK) The SCK input is used to clock data into and out of the X9410. Chip Select (CS) When CS is HIGH, the X9410 is deselected and the SO pin is at high impedance, and (unless an internal write cycle is underway) the device will be in the standby state. CS LOW enables the X9410, placing it 2 Hold (HOLD) HOLD is used in conjunction with the CS pin to select the device. Once the part is selected and a serial sequence is underway, HOLD may be used to pause the serial communication with the controller without resetting the serial sequence. To pause, HOLD must be brought LOW while SCK is LOW. To resume communication, HOLD is brought HIGH, again while SCK is LOW. If the pause feature is not used, HOLD should be held HIGH at all times. Device Address (A0 - A1) The address inputs are used to set the least significant 2 bits of the 8-bit slave address. A match in the slave address serial data stream must be made with the address input in order to initiate communication with the X9410. A maximum of 4 devices may occupy the SPI serial bus. FN8193.2 October 12, 2006 X9410 PIN NAMES Potentiometer Pins VH/RH (VH0/RH0 - VH1/RH1), VL/RL (VL0/RL0 - VL1/RL1) Symbol Description The VH/RH and VL/RL inputs are equivalent to the terminal connections on either end of a mechanical potentiometer. SCK Serial Clock SI, SO Serial Data VW/RW (VW0/RW0 - VW1/RW1) A0 - A1 Device Address The wiper outputs are equivalent to the wiper output of a mechanical potentiometer. VH0/RH0 - VH1/RH1, VL0/RL0 - VL1/RL1 Potentiometer Pins (terminal equivalent) VW0/RW0 - VW1/RW1 Potentiometer Pin (wiper equivalent) The WP pin when LOW prevents nonvolatile writes to the Data Registers. WP Hardware Write Protection V+,V- Analog Supplies Analog Supplies (V+, V-) VCC System Supply Voltage The analog supplies V+, V- are the supply voltages for the XDCP analog section. VSS System Ground NC No Connection Hardware Write Protect Input (WP) PIN CONFIGURATION DEVICE DESCRIPTION DIP/SOIC VCC 1 24 V+ The X9410 is a highly integrated microcircuit incorporating two resistor arrays and their associated registers and counters and the serial interface logic providing direct communication between the host and the XDCP potentiometers. VL0/RL0 2 23 NC VH0/RH0 3 22 NC VW0/RW0 4 21 NC Serial Interface CS 5 20 A0 WP 6 19 SO SI 7 18 HOLD A1 8 17 SCK VL1/RL1 9 16 NC The X9410 supports the SPI interface hardware conventions. The device is accessed via the SI input with data clocked in on the rising SCK. CS must be LOW and the HOLD and WP pins must be HIGH during the entire operation. X9410 VH1/RH1 10 15 NC VW1/RW1 11 14 NC VSS 12 13 V- The SO and SI pins can be connected together, since they have three state outputs. This can help to reduce system pin count. Array Description TSSOP SI 1 24 WP A1 2 23 CS VL1/RL1 3 22 VW0/RW0 VH1/RH1 4 21 VH0/RH0 VW1/RW1 VSS 5 20 VL0/RL0 19 VCC 6 X9410 NC 7 18 NC NC 8 17 NC NC 9 16 NC V- 10 15 V+ SCK 11 14 A0 HOLD 12 13 SO 3 The X9410 is comprised of two resistor arrays. Each array contains 63 discrete resistive segments that are connected in series. The physical ends of each array are equivalent to the fixed terminals of a mechanical potentiometer (VH/RH and VL/RL inputs). At both ends of each array and between each resistor segment is a CMOS switch connected to the wiper (VW/RW) output. Within each individual array only one switch may be turned on at a time. These switches are controlled by a Wiper Counter Register (WCR). The six bits of the WCR are decoded to select, and enable, one of sixty-four switches. FN8193.2 October 12, 2006 X9410 Wiper Counter Register (WCR) Data Registers The X9410 contains two Wiper Counter Registers, one for each XDCP potentiometer. The WCR is equivalent to a serial-in, parallel-out register/counter with its outputs decoded to select one of sixty-four switches along its resistor array. The contents of the WCR can be altered in four ways: it may be written directly by the host via the Write Wiper Counter Register instruction (serial load); it may be written indirectly by transferring the contents of one of four associated Data Registers via the XFR Data Register or Global XFR Data Register instructions (parallel load); it can be modified one step at a time by the Increment/ Decrement instruction. Finally, it is loaded with the contents of its Data Register zero (DR0) upon power-up. Each potentiometer has four 6-bit nonvolatile Data Registers. These can be read or written directly by the host. Data can also be transferred between any of the four Data Registers and the associated Wiper Counter Register. All operations changing data in one of the Data Registers is a nonvolatile operation and will take a maximum of 10ms. If the application does not require storage of multiple settings for the potentiometer, the Data Registers can be used as regular memory locations for system parameters or user preference data. Data Register Detail (MSB) The Wiper Counter Register is a volatile register; that is, its contents are lost when the X9410 is powereddown. Although the register is automatically loaded with the value in DR0 upon power-up, this may be different from the value present at power-down. (LSB) D5 D4 D3 D2 D1 D0 NV NV NV NV NV NV Figure 1. Detailed Potentiometer Block Diagram (One of Two Arrays) Serial Data Path Serial Bus Input From Interface Circuitry Register 0 Register 1 8 Register 2 If WCR = 00[H] then VW/RW = VL/RL If WCR = 3F[H] then VW/RW = VH/RH 6 Parallel Bus Input Wiper Counter Register (WCR) Register 3 UP/DN Modified SCL VH/RH C o u n t e r D e c o d e INC/DEC Logic UP/DN CLK VL/RL VW/RW 4 FN8193.2 October 12, 2006 X9410 Figure 3. Instruction Byte Format Write in Process The contents of the Data Registers are saved to nonvolatile memory when the CS pin goes from LOW to HIGH after a complete write sequence is received by the device. The progress of this internal write operation can be monitored by a Write In Process bit (WIP). The WIP bit is read with a Read Status command. INSTRUCTIONS Identification (ID) Byte The first byte sent to the X9410 from the host, following a CS going HIGH to LOW, is called the Identification byte. The most significant four bits of the slave address are a device type identifier, for the X9410 this is fixed as 0101[B] (refer to Figure 2). The two least significant bits in the ID byte select one of four devices on the bus. The physical device address is defined by the state of the A0 - A1 input pins. The X9410 compares the serial data stream with the address input state; a successful compare of both address bits is required for the X9410 to successfully continue the command sequence. The A0 - A1 inputs can be actively driven by CMOS input signals or tied to VCC or VSS. The remaining two bits in the ID byte must be set to 0. Figure 2. Identification Byte Format Device Type Identifier 0 1 0 1 0 0 A1 A0 Device Address Instruction Byte The next byte sent to the X9410 contains the instruction and register pointer information. The four most significant bits are the instruction. The next four bits point to one of the two pots and when applicable they point to one of four associated registers. The format is shown below in Figure 3. 5 Register Select I3 I2 I1 Instructions I0 R1 R0 0 P0 Pot Select The four high order bits of the instruction byte specify the operation. The next two bits (R1 and R0) select one of the four registers that is to be acted upon when a register oriented instruction is issued. The last bit (P0) selects which one of the two potentiometers is to be affected by the instruction. Four of the ten instructions are two bytes in length and end with the transmission of the instruction byte. These instructions are: - XFR Data Register to Wiper Counter Register--This transfers the contents of one specified Data Register to the associated Wiper Counter Register. - XFR Wiper Counter Register to Data Register--This transfers the contents of the specified Wiper Counter Register to the specified associated Data Register. - Global XFR Data Register to Counter Register--This transfers the contents of both specified Data Registers to the associated Wiper Counter Registers. - Global XFR Wiper Counter Register to Data Register--This transfers the contents of both Wiper Counter Registers to the specified associated Data Registers. The basic sequence of the two byte instructions is illustrated in Figure 4. These two-byte instructions exchange data between the WCR and one of the data registers. A transfer from a Data Register to a WCR is essentially a write to a static RAM, with the static RAM controlling the wiper position. The response of the wiper to this action will be delayed by tWRL. A transfer from the WCR (current wiper position), to a data register is a write to nonvolatile memory and takes a minimum of tWR to complete. The transfer can occur between one of the two potentiometers and one of its associated registers; or it may occur globally, where the transfer occurs between both potentiometers and one associated register. FN8193.2 October 12, 2006 X9410 The sequence of these operations is shown in Figure 5 and Figure 6. Five instructions require a three-byte sequence to complete. These instructions transfer data between the host and the X9410; either between the host and one of the data registers or directly between the host and the Wiper Counter Register. These instructions are: The final command is Increment/Decrement. It is different from the other commands because it's length is indeterminate. Once the command is issued, the master can clock the selected wiper up and/or down in one resistor segment steps, thereby providing a fine tuning capability to the host. For each SCK clock pulse (tHIGH) while SI is HIGH, the selected wiper will move one resistor segment towards the VH/RH terminal. Similarly, for each SCK clock pulse while SI is LOW, the selected wiper will move one resistor segment towards the VL/RL terminal. A detailed illustration of the sequence and timing for this operation are shown in Figure 7 and Figure 8. - Read Wiper Counter Register--read the current wiper position of the selected pot, - Write Wiper Counter Register--change current wiper position of the selected pot, - Read Data Register--read the contents of the selected data register; - Write Data Register--write a new value to the selected data register. - Read Status--This command returns the contents of the WIP bit which indicates if the internal write cycle is in progress. Figure 4. Two-Byte Instruction Sequence CS SCK SI 0 1 0 1 0 0 A1 A0 I3 I2 I1 I0 R1 R0 0 P0 Figure 5. Three-Byte Instruction Sequence (Write) CS SCL SI 0 1 0 1 0 0 A1 A0 I3 I2 I1 I0 R1 R0 0 P0 0 0 D5 D4 D3 D2 D1 D0 Figure 6. Three-Byte Instruction Sequence (Read) CS SCL SI Don't Care 0 1 0 1 0 0 A1 A0 I3 I2 I1 I0 R1 R0 0 P0 S0 0 6 0 D5 D4 D3 D2 D1 D0 FN8193.2 October 12, 2006 X9410 Figure 7. Increment/Decrement Instruction Sequence CS SCK SI 0 1 0 1 0 0 A1 A0 I3 I2 I1 I0 0 0 0 P0 I N C 1 I N C 2 I N C n D E C 1 D E C n Figure 8. Increment/Decrement Timing Limits tWRID SCK SI Voltage Out VW/RW INC/DEC CMD Issued Table 1. Instruction Set Instruction Read Wiper Counter Register I3 1 I2 0 Instruction Set I1 I0 R1 R0 0 1 0 0 Write Wiper Counter Register 1 0 1 0 0 0 0 Read Data Register 1 0 1 1 R1 R0 0 Write Data Register 1 1 0 0 R1 R0 0 XFR Data Register to Wiper Counter Register 1 1 0 1 R1 R0 0 XFR Wiper Counter Register to Data Register 1 1 1 0 R1 R0 0 Global XFR Data Register to Wiper Counter Register 0 0 0 1 R1 R0 0 Global XFR Wiper Counter Register to Data Register 1 0 0 0 R1 R0 0 Increment/Decrement Wiper Counter Register Read Status (WIP bit) 0 0 1 0 0 0 0 0 1 0 1 0 0 0 7 P1 0 P0 Operation P0 Read the contents of the Wiper Counter Register pointed to by P0 P0 Write new value to the Wiper Counter Register pointed to by P0 P0 Read the contents of the Data Register pointed to by P0 and R1 - R0 P0 Write new value to the Data Register pointed to by P0 and R1 - R0 P0 Transfer the contents of the Data Register pointed to by R1 - R0 to the Wiper Counter Register pointed to by P0 P0 Transfer the contents of the Wiper Counter Register pointed to by P0 to the Register pointed to by R1 - R0 0 Transfer the contents of the Data Registers pointed to by R1 - R0 of both pots to their respective Wiper Counter Register 0 Transfer the contents of all Wiper Counter Registers to their respective data Registers pointed to by R1 - R0 of both pots P0 Enable Increment/decrement of the Wiper Counter Register pointed to by P0 1 Read the status of the internal write cycle, by checking the WIP bit. FN8193.2 October 12, 2006 X9410 Instruction Format Notes: (1) (2) (2) (3) "A1 ~ A0": stands for the device addresses sent by the master. WPx refers to wiper position data in the Counter Register "I": stands for the increment operation, SI held HIGH during active SCK phase (high). "D": stands for the decrement operation, SI held LOW during active SCK phase (high). Read Wiper Counter Register (WCR) device type identifier device addresses instruction opcode WCR addresses wiper position (sent by X9410 on SO) instruction opcode WCR addresses Data Byte (sent by Host on SI) instruction opcode DR and WCR addresses CS CS Falling W W W W W W Rising Edge 0 1 0 1 0 0 A A 1 0 0 1 0 0 0 P 0 0 P P P P P P Edge 1 0 0 5 4 3 2 1 0 Write Wiper Counter Register (WCR) device type identifier device addresses CS CS Falling W W W W W W Rising Edge 0 1 0 1 0 0 A A 1 0 1 0 0 0 0 P 0 0 P P P P P P Edge 1 0 0 5 4 3 2 1 0 Read Data Register (DR) device type identifier device addresses CS Falling Edge 0 1 0 1 0 0 A A 1 0 1 1 R R 1 0 1 0 0 Data Byte (sent by X9410 on SO) CS W W W W W W Rising P 0 0 P P P P P P Edge 0 5 4 3 2 1 0 Write Data Register(DR) device type device identifier addresses instruction opcode DR and WCR addresses CS Falling Edge 0 1 0 1 0 0 A A 1 1 0 0 R 1 0 1 R 0 0 P 0 Data Byte (sent by host on SI) CS W W W W W W Rising 0 0 P P P P P P Edge 5 4 3 2 1 0 HIGH-VOLTAGE WRITE CYCLE Transfer Data Register (DR) to Wiper Counter Register (WCR) device type device instruction DR and WCR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 1 1 0 1 R R 0 P Edge 1 0 1 0 0 Transfer Wiper Counter Register (WCR) to Data Register (DR) device type device instruction DR and WCR identifier addresses opcode addresses CS CS Falling Rising D D Edge 0 1 0 1 0 0 A A 1 1 1 0 R R 0 P Edge 1 0 0 1 0 8 HIGH-VOLTAGE WRITE CYCLE FN8193.2 October 12, 2006 X9410 Increment/Decrement Wiper Counter Register (WCR) device type device instruction WCR increment/decrement CS CS identifier addresses opcode addresses (sent by master on SDA) Falling Rising Edge 0 1 0 1 0 0 A A 0 0 1 0 X X 0 P I/ I/ . . . . I/ I/ Edge 1 0 0 D D D D Global Transfer Data Register (DR) to Wiper Counter Register (WCR) device type device instruction DR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 0 0 0 1 R R 0 0 Edge 1 0 1 0 Global Transfer Wiper Counter Register (WCR) to Data Register (DR) device type device instruction DR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 1 0 0 0 R R 0 0 Edge 1 0 1 0 HIGH-VOLTAGE WRITE CYCLE Read Status device type identifier device addresses instruction opcode wiper addresses Data Byte (sent by X9410 on SO) CS CS Falling W Rising Edge 0 1 0 1 0 0 A A 0 1 0 1 0 0 0 1 0 0 0 0 0 0 0 I Edge 1 0 P 9 FN8193.2 October 12, 2006 X9410 ABSOLUTE MAXIMUM RATINGS COMMENT Temperature under bias .................... -65C to +135C Storage temperature ......................... -65C to +150C Voltage on SCK, SCL or any address input with respect to VSS ......................... -1V to +7V Voltage on V+ (referenced to VSS) ........................ 10V Voltage on V- (referenced to VSS) ........................-10V (V+) - (V-) .............................................................. 12V Any VH .....................................................................V+ Any VL ......................................................................VLead temperature (soldering, 10s) .................. +300C IW (10s) ............................................................12mA Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Temp Commercial Industrial Min. 0C -40C Max. +70C +85C Device X9410 X9410-2.7 Supply Voltage (VCC) Limits 5V 10% 2.7V to 5.5V ANALOG CHARACTERISTICS (Over recommended operating conditions unless otherwise stated.) Limits Symbol Max. Unit End to end resistance 20 % Power rating 50 mW IW Wiper current 6 mA RW Wiper resistance 150 250 Wiper Current = 1mA, VCC = 3V 40 100 Wiper Current = 1mA, VCC = 5V V RTOTAL Vv+ VvVTERM Parameter Voltage on V+ Pin Voltage on V- Pin +4.5 +5.5 X9410-2.7 +2.7 +5.5 X9410 -5.5 -4.5 X9410-2.7 -5.5 -2.7 V- V+ Noise (4) Absolute linearity (1) Relative linearity (2) Typ. X9410 Voltage on any VH/RH or VL/RL Pin Resolution Min. Temperature coefficient of RTOTAL Potentiometer capacitances V dBV 1.6 % Ref: 1kHz 1 MI(3) Rw(n)(actual) - Rw(n)(expected) 0.2 MI(3) Rw(n + 1) - [Rw(n) + MI] 300 ppm/C 20 10/10/25 +25C, each pot V -120 Ratiometric temp. coefficient CH/CL/CW Test Conditions ppm/C pF See Circuit #3 Notes: (1) Absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a potentiometer. (2) Relative linearity is utilized to determine the actual change in voltage between two successive tap positions when used as a potentiometer. It is a measure of the error in step size. (3) MI = RTOT/63 or (RH - RL)/63, single pot (4) Individual array resolution 10 FN8193.2 October 12, 2006 X9410 D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.) Limits Symbol Parameter Min. Typ. Max. Units Test Conditions 400 A fSCK = 2MHz, SO = Open, Other Inputs = VSS ICC1 VCC supply current (Active) ICC2 VCC supply current (Nonvolatile Write) 1 mA fSCK = 2MHz, SO = Open, Other Inputs = VSS ISB VCC current (standby) 1 A SCK = SI = VSS, Addr. = VSS ILI Input leakage current 10 A VIN = VSS to VCC ILO Output leakage current 10 A VOUT = VSS to VCC VIH Input HIGH voltage VCC x 0.7 VCC + 0.5 V VIL Input LOW voltage -0.5 VCC x 0.1 V VOL Output LOW voltage 0.4 V IOL = 3mA ENDURANCE AND DATA RETENTION Parameter Min. Unit Minimum endurance 100,000 Data changes per bit per register Data retention 100 years CAPACITANCE Symbol COUT CIN (5) (5) Test Max. Unit Test Conditions Output capacitance (SO) 8 pF VOUT = 0V Input capacitance (A0, A1, SI, and SCK) 6 pF VIN = 0V POWER-UP TIMING Symbol tPUR (6) (6) tPUW tR VCC Parameter Min. Max. Unit Power-up to initiation of read operation 1 1 ms Power-up to initiation of write operation 5 5 ms 0.2 50 V/msec VCC Power-up ramp POWER-UP AND POWER-DOWN There are no restrictions on the power-up or powerdown sequencing of the bias supplies VCC, V+, and Vprovided that all three supplies reach their final values within 1msec of each other. However, at all times, the voltages on the potentiometer pins must be less than V+ and more than V-. The recall of the wiper position from nonvolatile memory is not in effect until all supplies reach their final value. 11 EQUIVALENT A.C. LOAD CIRCUIT 5V 2.7V 1533 SDA Output 100pF 100pF FN8193.2 October 12, 2006 X9410 A.C. TEST CONDITIONS Test Circuit #3 SPICE Macro Model Input pulse levels VCC x 0.1 to VCC x 0.9 Input rise and fall times 10ns Input and output timing level VCC x 0.5 RTOTAL RH CH Notes: (5) This parameter is periodically sampled and not 100% tested (6) tPUR and tPUW are the delays required from the time the third (last) power supply (VCC, V+ or V-) is stable until the specific instruction can be issued. These parameters are periodically sampled and not 100% tested. CW 10pF CL RL 10pF 25pF RW AC TIMING Symbol Parameter Min. Max. Unit 2.0 MHz fSCK SSI/SPI clock frequency tCYC SSI/SPI clock cycle time tWH SSI/SPI clock high time 200 ns tWL SSI/SPI clock low time 200 ns tLEAD Lead time 250 ns tLAG Lag time 250 ns tSU SI, SCK, HOLD and CS input setup time 50 ns 50 500 ns tH SI, SCK, HOLD and CS input hold time tRI SI, SCK, HOLD and CS input rise time 2 s tFI SI, SCK, HOLD and CS input fall time 2 s 500 ns 100 ns tDIS SO output disable time 0 ns tV SO output valid time tHO SO output hold time tRO SO output rise time 50 ns tFO SO output fall time 50 ns 0 ns tHOLD HOLD time 400 ns tHSU HOLD setup time 100 ns tHH HOLD hold time 100 tHZ HOLD low to output in High Z 100 ns tLZ HOLD high to output in Low Z 100 ns TI Noise suppression time constant at SI, SCK, HOLD and CS inputs tCS CS deselect time 2 s tWPASU WP, A0 and A1 setup time 0 ns tWPAH WP, A0 and A1 hold time 0 ns 12 ns 20 ns FN8193.2 October 12, 2006 X9410 HIGH-VOLTAGE WRITE CYCLE TIMING Symbol Parameter tWR Typ. Max. Unit 5 10 ms High-voltage write cycle time (store instructions) XDCP TIMING Symbol tWRPO Parameter Min. Max. Unit Wiper response time after the third (last) power supply is stable 10 s tWRL Wiper response time after instruction issued (all load instructions) 10 s tWRID Wiper response time from an active SCL/SCK edge (increment/decrement instruction) 450 ns SYMBOL TABLE WAVEFORM INPUTS OUTPUTS Must be steady Will be steady May change from Low to High Will change from Low to High May change from High to Low Will change from High to Low Don't Care: Changes Allowed Changing: State Not Known N/A Center Line is High Impedance TIMING DIAGRAMS Input Timing tCS CS SCK tSU SI SO tH MSB tLAG tCYC tLEAD tWL ... tWH ... tRI tFI LSB High Impedance 13 FN8193.2 October 12, 2006 X9410 Output Timing CS SCK tV ... tHO ... MSB SO tDIS LSB ADDR SI Hold Timing CS tHSU tHH SCK ... tRO tFO SO tHZ tLZ SI tHOLD HOLD XDCP Timing (for All Load Instructions) CS SCK SI ... MSB ... tWRL LSB VW/RW SO High Impedance 14 FN8193.2 October 12, 2006 X9410 XDCP Timing (for Increment/Decrement Instruction) CS SCK ... tWRID ... VW/RW ADDR SI Inc/Dec Inc/Dec ... High Impedance SO Write Protect and Device Address Pins Timing (Any Instruction) CS tWPASU WP tWPAH A0 A1 15 FN8193.2 October 12, 2006 X9410 APPLICATIONS INFORMATION Basic Configurations of Electronic Potentiometers VR VR VW/RW I Three terminal Potentiometer; Variable voltage divider Two terminal Variable Resistor; Variable current Application Circuits NONINVERTING AMPLIFIER VS VOLTAGE REGULATOR + VO - VIN VO (REG) 317 R1 R2 Iadj R1 R2 VO = (1+R2/R1)VS VO (REG) = 1.25V (1+R2/R1)+Iadj R2 OFFSET VOLTAGE ADJUSTMENT R1 COMPARATOR WITH HYSTERESIS R2 VS VS - + 100k - VO + +12V 10k R1 } 10k } TL072 10k VO R2 VUL = {R1/(R1+R2)} VO(max) VLL = {R1/(R1+R2)} VO(min) -12V 16 FN8193.2 October 12, 2006 X9410 Application Circuits (continued) ATTENUATOR FILTER C VS R2 R1 - - VS + R VO + R3 R4 R2 All RS = 10k R1 GO = 1 + R2/R1 fc = 1/(2RC) V O = G VS -1/2 G +1/2 R2 } VS R1 } INVERTING AMPLIFIER EQUIVALENT L-R CIRCUIT R2 C1 - VS VO + + - R1 ZIN V O = G VS G = -R2/R1 R3 ZIN = R2 + s R2 (R1 + R3) C1 = R2 + s Leq (R1 + R3) >> R2 FUNCTION GENERATOR C R2 - + R1 - } RA + } RB frequency R1, R2, C amplitude RA, RB 17 FN8193.2 October 12, 2006 X9410 Dual-In-Line Plastic Packages (PDIP) E24.6 (JEDEC MS-011-AA ISSUE B) N 24 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 SYMBOL -B- -C- SEATING PLANE A2 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MAX - 0.250 - - 0.39 A2 0.125 0.195 3.18 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.030 0.070 0.77 1.77 8 eA C 0.008 0.015 0.204 0.381 - D 1.150 1.290 D1 0.005 - C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 6.35 NOTES 0.015 A L D1 MIN A E BASE PLANE MAX A1 -AD MILLIMETERS MIN 29.3 4 - 4 32.7 5 - 5 0.13 E 0.600 0.625 15.24 15.87 6 E1 0.485 0.580 12.32 14.73 5 e 0.100 BSC 2.54 BSC - eA 0.600 BSC 15.24 BSC 6 eB - 0.700 - 17.78 7 L 0.115 0.200 2.93 5.08 4 N 24 24 9 Rev. 0 12/93 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 18 FN8193.2 October 12, 2006 X9410 Small Outline Plastic Packages (SOIC) M24.3 (JEDEC MS-013-AD ISSUE C) N 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- A D h x 45 -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e B S 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N NOTES: MILLIMETERS 24 0 24 8 0 7 8 Rev. 1 4/06 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 19 FN8193.2 October 12, 2006 X9410 Small Outline Package Family (SO) A D h X 45 (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL "X" 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4 4 DETAIL X MDP0027 SMALL OUTLINE PACKAGE FAMILY (SO) SYMBOL SO-8 SO-14 SO16 (0.150") SO16 (0.300") (SOL-16) SO20 (SOL-20) SO24 (SOL-24) SO28 (SOL-28) TOLERANCE NOTES A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX - A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 0.003 - A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 0.002 - b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 0.003 - c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 0.001 - D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 0.004 1, 3 E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 0.008 - E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 0.004 2, 3 e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic - L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 0.009 - L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic - h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference - 16 20 24 28 Reference N 8 14 16 Rev. L 2/01 NOTES: 1. Plastic or metal protrusions of 0.006" maximum per side are not included. 2. Plastic interlead protrusions of 0.010" maximum per side are not included. 3. Dimensions "D" and "E1" are measured at Datum Plane "H". 4. Dimensioning and tolerancing per ASME Y14.5M-1994 20 FN8193.2 October 12, 2006 X9410 Thin Shrink Small Outline Package Family (TSSOP) MDP0044 0.25 M C A B D THIN SHRINK SMALL OUTLINE PACKAGE FAMILY A SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE (N/2)+1 N PIN #1 I.D. E E1 0.20 C B A 1 (N/2) B 2X N/2 LEAD TIPS TOP VIEW 0.05 e C H A 1.20 1.20 1.20 1.20 1.20 Max A1 0.10 0.10 0.10 0.10 0.10 0.05 A2 0.90 0.90 0.90 0.90 0.90 0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 5.00 6.50 7.80 9.70 0.10 E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 0.10 e 0.65 0.65 0.65 0.65 0.65 Basic L 0.60 0.60 0.60 0.60 0.60 0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference Rev. E 12/02 NOTES: SEATING PLANE 0.10 M C A B b 0.10 C N LEADS SIDE VIEW 1. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 2. Dimension "E1" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side. 3. Dimensions "D" and "E1" are measured at dAtum Plane H. SEE DETAIL "X" c 4. Dimensioning and tolerancing per ASME Y14.5M-1994. END VIEW L1 A A2 GAUGE PLANE 0.25 L A1 0 - 8 DETAIL X All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 21 FN8193.2 October 12, 2006