http://www.adlinktech.com/Computer-on-Module
Computer-On-Modules
1-1
Focus on your Core Competency
A Computer-On-Module (COM) provides a convenient solution for
OEMs that need computing functionality but are not interested in
investing the time and resources into designing a single board
computer. There are several COM standards, one of the more
popular being COM Express (also referred to as COM.0). COM
Express modules contain the CPU, memory, common peripherals
(USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that
use COM Express modules design a carrier board that contains any
required I/O interfaces not found on the COM Express module as
well as connectors for external I/O. A COM based solution allows
an OEM to focus on their core competency and not the design and
maintenance of a single board computer.
A COM Express based solution with a custom carrier board offers
several advantages:
• The carrier can contain more rugged types of connectors for
external I/O. It is not limited to traditional connectors such as USB,
Ethernet, and video.
• The carrier can contain value added silicon such as FPGAs or other
types of peripherals. Placing these devices on the carrier
eliminates the need for traditional PCI Express or PCI expansion
cards and the mechanics associated with them.
• The CPU function is decoupled from the I/O so that different
processors can be used for different applications, ranging from low
power and cost Atom™ based compute modules to Core™ i7 or
other high performance multicore processor modules.
• The design and maintenance of the compute module no longer
becomes a task for the OEM.
• The use of industry standard modules brings with it availability from
multiple vendors which provides alternative solutions.
The COM Express Standard –
Adaptable to Your Specific Needs
COM Express was developed and is maintained by PICMG
(PCI Industrial Computer Manufacturers Group). COM
Express was released in the summer of 2005 and is the
most widely used COM standard. The standard denes the
physical size, interconnect, and thermal interface for a COM.
The original COM Express specication was written to
support peripherals that were available at the time of release
– including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS,
SDVO, PCI, and PCI Express Gen 1. Several pinout types
were dened by PICMG with each one having a specic
combination of peripherals, expansion interfaces and
connector layout. The most widely used COM Express
module is a type 2, followed by type 1. The table on the
following page shows the features for modules dened in
revision 1 of the COM Express specication.
COM.0 Rev. 2.0 – Future Proof
In 2009, PICMG formed a subcommittee to update the COM
Express specication based on the changes in peripherals
used in modern systems. This included support for Super
Speed USB 3.0, PCI Express Gen 2 signaling, as well as
additional video interfaces such as DVI, HDMI and
DisplayPort. The spec update created two new types to
support the I/O changes: type 6 and 10. Backwards
compatibility with existing type 2 and 1 modules was a main
objective of the specication update.
ADLINK
We Know COM Express
1-2
The Right Size for the Right Job
The COM Express specication also denes three module sizes: the
Compact Module, Basic Module and the Extended Module. A fourth
“Ultra” size module supporting only type 1 and type 10 pinouts has
been presented to PICMG for inclusion in a future release of the
specication.
Basic 125 x 95
Type 2/6 compatible pinout
Compact 95 x 95
Type 2/6 compatible pinout
Ultra 84 x 55
Type 1/10 compatible pinout
ADLINK – We Know COM Express
Although many companies develop COM Express modules,
most are not actively involved in the development of the COM
Express specication. In contrast, ADLINK has heavily invested in
the development and maintenance of the PICMG COM Express
specication over the years. ADLINK recently chaired the PICMG
subcommittee that was tasked with dening the specication
update known as COM Express COM.0 Revision 2.0. As a
leading participant in the creation of the specication, ADLINK is
in a unique position to inuence its direction. By doing so, ADLINK
has a deep understanding of the meaning and intention of the
specication and applies this knowledge in the design of our COM
Express products.
Types
PCI
Express
Lanes
PEG/
SDVO PCI IDE
Ports
SATA
Ports
LAN
Ports
USB 2.0 /
USB 3.0
Display
Interfaces
Type 1
AB
connector
Up to 6 – – – 4 18 / 0 VGA, LVDS
Type 2
AB/CD
connectors
Up to 22 1/2 32-bit 1418 / 0 VGA, LVDS,
PEG/SDVO
Type 3
AB/CD
connectors
Up to 22 1/2 32-bit – 4 3 8 / 0 VGA, LVDS,
PEG/SDVO
Type 6
AB/CD
connectors
Up to 24 1/NA – – 4 18 / 4
VGA,
LVDS,PEG,
3x DDI
Type 10
AB
connector
Up to 4 –/1 – – 2 18 / 0 1x DDI
COM Express pinout types and supported features
□ Rev. 1 Pinouts ■ Rev. 2 Pinouts
125 mm
95 mm
Basic
95 mm
55 mm
95 mm
84 mm
Ultra
Compact
New with COM.0 Rev. 2.0 –
Type 6 and Type 10 Pinouts
The release of COM Express™ COM.0 Revision 2.0 brings
Computer-on-Modules in line with current and future
technology trends by providing for the latest graphics
interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2,
and SuperSpeed USB 3.0. The new Type 6 pinout is based
on the popular Type 2 pinout, but with legacy functions
replaced by Digital Display Interfaces (DDI), additional PCI
Express lanes, and reserved pins for future technologies.
The new Type 10 pinout is based on the Type 1 pinout with
only the A-B connector that is used in the “Ultra” form
factor. The Type 10 pinout provides additional exibility for
developers by freeing up pins reserved for SATA and PCIe
for future technologies and using the second LVDS channel,
VGA and TV-out pins to support SDVO (via DDI). Both of the
new Type 6 and Type 10 pinouts support the SPI Interface,
which was unavailable in COM.0 Rev. 1.0.
COM Express Type 1 vs. Type 10 comparison
AB
BLPC Bus
GbE LAN
LVDS
Channel B CRT
LVDS
Channel A
TV 5Vsb 12V
12V
Control &
Miscellaneous
Control
&
Miscella
neous
4x
SATA
8x
USB2.0
6x
PCIe x1
Audio
A
COM Express
COM.0 rev 1.0
Type 1
AB
CD
BLPC Bus
GbE LAN
LVDS
Channel B CRT
LVDS
Channel A
TV 5Vsb 12V
12V
Control &
Miscellaneous
Control
&
Miscella
neous
4x
SATA
8x
USB2.0
6x
PCIe x1
Audio
A
D
PATA IDE PCI Bus PCIe x16 (or SDVO) 12V
C
COM Express
COM.0 rev 1.0
Type 2
BLPC Bus
GbE LAN
SDVO
Sing Channel
LVDS
Channel A
5Vsb 12V
SPI
2 Serial
TPM,
Type ID
total
amount
of pins
reduced
Control &
Miscellaneous
Control
&
Miscella
neous
FAN &
SM
select
2x
SATA
RS
VD
RS
VD
8x
USB2.0
4x
PCIe x1
Audio
A
COM Express
COM.0 rev 2.0
Type 10 AB
BLPC Bus
GbE LAN LVDS
Channel A
LVDS
Channel B 5Vsb 12V
12V
SPI
2 Serial
TPM,
Type ID
total
amount
of pins
reduced
USB 3.0
2x
PCIe x1
DDI 1
SDVO
DDI 2 DDI 3
extended
signaling to
upgrade four
USB 2.0 ports
DP, HDMI
or DP, HDMI DP, HDMI
Control &
Miscellaneous
Control
&
Miscella
neous
FAN &
SPI
select
CRT
PCIe x16
4x
SATA
8x
USB2.0
6x
PCIe x1
Audio
A
D
C
COM Express
COM.0 rev 2.0
Type 6
AB
CD
COM Express Type 2 vs. Type 6 comparison
Drivers and BSP
All modules come standard with BSP’s for Windows CE, Windows
XP Embedded, Linux, and VxWorks. Support for additional
components on your application specic carrier board under the
above operating systems can be developed on request.
Longevity is Designed in
ADLINK’s COM modules represent an optimized Total Cost of
Ownership. They have longevity designed in by only using
components from the embedded roadmaps of strategic suppliers
that are backed by value-added technical services such as life cycle
management, revision control and end-of-life (EOL) support.
Manufacturing and Quality
ADLINK has its own SMT production line that supports the
production of leadfree products. ADLINK has been ISO-9001
certied since Many 1999. ADLINK also adheres to 6 Sigma, a set
of statistics and methods for improving everything a company does,
from designing, manufacturing to service. By applying the rigorous
practices of 6 Sigma, we’ve been approved by industry-leading
partners, and achieved breakthroughs in quality performance to
deliver better services to our customers.
The Economics of Modularity
Reusability is key to protection of your investment. Computer-On-
Module offer it all, from reusable design, scalability and fast time to
the market to a lower total cost of ownership.
Green because we care
We provide lead-free designs not only to satisfy future regulatory
standards but also to reect our real concern about the environ-
ment – an environment that has to be shared by all of us. Proof of
ADLINK’s commitment is with ISO-14001 certication. ISO-14001,
the international environmental management standard is a voluntary
initiative aimed at improving company environmental performance.
Expertise for Carrier Board Design Support
With product divisions that are front runners in elds such as: Data
Acquisition, Test and Measurement, AdvancedTCA, CompactPCI
and Video Surveillance, ADLINK can offer you a broad portfolio of
technical knowledge to assist you in your application specic carrier
board projects.
Firmware Support (BIOS)
Adding active components to the carrier boards usually requires a
BIOS modication. We offer a whole team of BIOS engineers who
can extend and tune the rmware on our boards to let them behave
exactly the way you want. We use the AMIBIOS8® provides us with
excellent embedded functions such as: custom logo, OEM CMOS
defaults, at panel control, serial port console redirection, CMOS
backup and trusted core support.
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-3
1-4
Selection Guide COM Express™
Type 6 Type 2
Express-MG
Intel® Core™2 Duo (Penryn)
up 2.53 GHz with 6 MB L2 cache
PGA478
Celeron® M 575, T3100 (dual core)
Core™2 Duo (Penryn)
T9400, P8400
1066/800
Intel® GM45 with ICH9M
8 GB (max), dual channel
DDR3 at 1066/800/667
-
Max 8 GB on two 200-pin SODIMM
L2 depends on processor type
1MB, 3MB or 6MB
AMIBIOS®8, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
Intel® GMA X4500 at 533 MHz
Max 829 MB UMA
CRT (QXGA)
single/dual 18/24-bit LVDS (UXGA)
TV-out (PAL/NTSC/HDTV)
PCIe x16 Graphics port
or SDVO port
OpenGL 2.0, DirectX 10
one channel, one device
three SATA 3 Gb/s
optional
integrated Intel® GbE (10/100/1000)
8 ports USB 2.0
Intel® HD Audio
Yes
Yes, Ver. 1.2
5x PCI-Express x1 (or 1 x4)
PCI-Express x8, x4 or x1 (on PEG)
4x PCI rev. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0, S1, S3, S4, S5
23 W with Core™ 2 Duo P8400 at 2.26
GHz and 2 GB memory typical
0°C ~ +60°C
-
PICMG® COM Express™ R1.0, Type 2
Basic Form Factor (95x125 mm)
-
Windows® XP/Xpe, Windows® Vista,
Windows® 7, Windows® CE,
Linux® 2.6.x, AIDI library
1-13
Express-MV
Intel® Core™2 Duo (Penryn)
up 2.26 GHz with 6 MB L2 cache
BGA956
Celeron® M 722, 723
Core™2 Duo (Penryn)
SP9300, SL9400, SL9380, SU9300
1066/800
Intel® GS45 with ICH9M (SFF)
8 GB (max), dual channel
DDR3 at 1066/800/667
-
Max 8 GB on two 200-pin SODIMM
L2 depends on processor type
1MB, 3MB or 6MB
AMIBIOS®8, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
Intel® GMA X4500 at 533/320 MHz
Max 829 MB UMA
CRT (QXGA)
single/dual 18/24-bit LVDS (UXGA)
TV-out (PAL/NTSC/HDTV)
PCIe x16 Graphics port
or SDVO port
OpenGL 2.0, DirectX 10
one channel, one device
three SATA 3 Gb/s
optional
integrated Intel® GbE (10/100/1000)
8 ports USB 2.0
Intel® HD Audio
Yes
Yes, Ver. 1.2
5x PCI-Express x1 (or 1 x4)
PCI-Express x8, x4 or x1 (on PEG)
4x PCI rev. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0, S1, S3, S4, S5
18 W with Core™ 2 Duo SU9300 at
1.2 GHz and 2 GB memory typical
0°C ~ +60°C
selected modules: -20°C ~ +70°C
PICMG
®
COM Express™ R1.0, Type 2
Basic Form Factor (95x125 mm)
-
Windows® XP/Xpe, Windows® Vista,
Windows® 7, Windows® CE,
Linux® 2.6.x, AIDI library
1-11
CPU Type
CPU Package
CPU Models / Speeds
FSB Speed
Main Chipset
System Memory
Memory Type
Soldered Memory
Socket Memory
Cache (L2)
BIOS Type
BIOS Features
BIOS Flash
Graphics Controller
Graphics Memory
Integrated Display Support
External Graphics Bus
Compatibillity
Parallel ATA (IDE)
Serial ATA
Matrix Storage Support
Ethernet
USB
Audio
Watchdog
TPM
PCI Express Support
PCI Suport
LPC Support
Management Bus
Power
Power States
Power Consumption
Operating Temperature
Extended Temperature
Compatibillity
Dimensions
Solid State Disk on Module
BSP & Software Support
Page Number
Basic (125 x 95 mm)
Express-HR
Intel® Core™ i7/i5 (Sandy Bridge)
up 2.53 GHz with 6 MB L3 cache
BGA1288
Core™ i7 (quad core): i7-2715QE;
Core™ i7 (dual core):
i7-2655LE, i7-2610UE, i5-2515E
1333/1066
Intel® PCH QM67
16 GB (max), dual channel
DDR3 non ECC at 1333
-
Max 16 GB on two 200-pin SODIMM
L2 depends on processor type
3MB, 4MB or 6MB
AMI EFI, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
HD Graphics 3000
Max 829 MB UMA
CRT (QXGA)
single/dual 18/24-bit LVDS (UXGA)
3 DDI ports for HDMI/DVI/DP & SDVO
PCIe x16 Graphics port
OpenGL 3.0, DirectX 10.1
one channel, one device
two SATA 3 Gb/s, two SATA 6 Gb/s
Yes
integrated Intel GbE (10/100/1000)
8 ports USB 2.0
Intel® HD Audio
Yes
Yes, Ver. 1.2
6x PCI-Express x1 (or 1 x4)
PCIe two x8, x4 or x1 (on PEG)
4x PCI rev. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0 S1 S3 S4 S5
TBD
0°C ~ +60°C
TBD
PICMG COM.0 R2.0, Type 6
Basic Form Factor (95x125 mm)
optional SATA SSD 4~16 GB
Windows® XP/Xpe, Windows® 7
Linux® 2.6.x, AIDI library
1-7
Express-CB/CBE
Intel® Core™ i7/i5/i3 (Arrandale)
up 2.53 GHz with 4 MB L2 cache
BGA1288
Core™ i3/i5/i7 (Arrandale) i7-610E
620LE 620UE i5-520E i3-330E
Celeron® M P4505
1066/800
Intel® PCH QM57
8 GB (max), dual channel
DDR3 non ECC (CB) or ECC (CBE)
-
Max 8 GB on two 200-pin SODIMM
L2 depends on processor type
2MB, 3MB or 4MB
AMI EFI, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
GMA HD with 12 execution units
Max 829 MB UMA
CRT (QXGA)
single/dual 18/24-bit LVDS (UXGA)
PCIe x16 Graphics port
OpenGL 2.1, DirectX 10
one channel, one device
four SATA 3 Gb/s
Yes
integrated Intel GbE (10/100/1000)
8 ports USB 2.0
Intel® HD Audio
Yes
Yes, Ver. 1.2
6x PCI-Express x1 (or 1 x4)
PCI-Express x8, x4 or x1 (on PEG)
4x PCI rev. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0 S1 S3 S4 S5
21 W with Core™ i7-620UE at 1.2
GHz and 2 GB memory typical
0°C ~ +60°C
selected modules: -20°C ~ +70°C
PICMG COM.0 R2.0, Type 2
Basic Form Factor (95x125 mm)
optional SATA SSD 4~16 GB
Windows® XP/Xpe, Vista,
Windows® 7
Linux® 2.6.x, AIDI library
1-9
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-5
Selection Guide
Basic (125 x 95 mm)
COM Express™
CPU Type
CPU Package
CPU Models / Speeds
FSB Speed
Main Chipset
System Memory
Memory Type
Soldered Memory
Socket Memory
Cache (L2)
BIOS Type
BIOS Features
BIOS Flash
Graphics Controller
Graphics Memory
Integrated Display Support
External Graphics Bus
Compatibillity
Parallel ATA (IDE)
Serial ATA
Matrix Storage Support
Ethernet
USB
Audio
Watchdog
TPM
PCI Express Support
PCI Suport
LPC Support
Management Bus
Power
Power States
Power Consumption
Operating Temperature
Extended Temperature
Compatibillity
Dimensions
Solid State Disk on Module
BSP & Software Support
Page Number
Express-MC800
Intel® Core™2 Duo (Merom)
up 2.2 GHz with 4 MB L2 cache
PPGA478 (socket-P) or PBGA479
Celeron® M 550 (socket)
Core™2 Duo (Meron) U7500, L7500
Core™2 Duo T7500 (socket)
800/667/533
Intel® GME965 with ICH8M
4 GB (max), dual channel
DDR2 at 667/533
-
Max 4 GB on two 200-pin SODIMM
L2 depends on processor type
2MB or 4MB
AMIBIOS®8, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
Intel® GMA X3100
Max 384 MB UMA
CRT (QXGA)
single/dual 18/24-bit LVDS (UXGA)
TV-out (PAL/NTSC/HDTV)
PCIe x16 Graphics Port,
or dual SDVO ports
OpenGL 2.0, DirectX 10
one channel, two devices
three SATA 3 Gb/s
optional (ICH8EM)
integrated Intel® GbE (10/100/1000)
8 ports USB 2.0
Intel® HD Audio
Yes
Yes, Ver. 1.2
5x PCI-Express x1 (or 1 x4)
PCI-Express x8, x4 or x1 (on PEG)
4x PCI rev. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0, S1, S3, S4, S5
19 W with Core™2 Duo U7500
at 1.06 GHz and 2 GB memory typical
0°C ~ +60°C
-
PICMG
®
COM Express™ R1.0, Type 2
Basic Form Factor (95x125 mm)
-
Windows® XP/Xpe, Windows® Vista
Linux® 2.6.x, AIDI library
1-15
Express-NR
Intel® Core™2 Duo (Merom/Yonah)
up to 2.2 GHz with 4MB L2 cache
µFC-PGA (socket-M) or µFC-BGA
Celeron® M 423, 440/530
Core™2 Duo L7400, U7500, U2500
Core™2 Duo T7400 (socket)
667/533
Intel® 945GME with ICH7M
4 GB (max), dual channel
DDR2 at 667/533
-
Max 4 GB on two 200-pin SODIMM
L2 depends on processor type
1MB, 2MB or 4MB
AMIBIOS®8, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
Intel® GMA 950
Max 256 MB UMA
CRT (QXGA)
single/dual 18/24-bit LVDS (UXGA)
TV-out (PAL/NTSC/HDTV)
PCIe x16 Graphics Port,
or dual SDVO ports
OpenGL 1.4, DirectX* 9.0c
one channel, two devices
two SATA 1.5 Gb/s
optional (ICH7MDH)
Intel® 82573 GbE Ethernet (10/100/1000)
8 ports USB 2.0
Intel® HD Audio and AC’97
Yes
Yes, Ver. 1.2
5x PCI-Express x1 (or 1 x4)
PCI-Express x1 (on PEG)
4x PCI Ver. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0, S1, S3, S4, S5
16 W with Core™2 Duo U7500
at 1.06 GHz and 1 GB memory typical
0°C ~ +60°C
selected modules: -20°C ~ +70°C
PICMG® COM Express™ R1.0, Type 2
Basic Form Factor (95x125 mm)
-
Windows® XP/Xpe, Windows® Vista
Windows® CE, Linux® 2.6.x,
AIDI library
1-17
Express-AT
Intel® Atom™
up to 1.6 GHz with 512 KB L2 cache
µFC-BGA
Intel® Atom™ N270 at 1.6 GHz
533
Intel® 945GSE with ICH7M
2 GB (max), single channel
DDR2 at 533
-
Max 2 GB on single 200-pin SODIMM
L2 cache 512 KB
AMIBIOS®8, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
Intel® GMA 950
Max 256 MB UMA
CRT (QXGA)
single/dual 18/24-bit LVDS (UXGA)
TV-out (PAL/NTSC/HDTV)
Single SDVO port
OpenGL 1.4, DirectX* 9.0c
one channel, two devices
two SATA 1.5 Gb/s
-
Realtek RTL8111C GbE (10/100/1000)
8 ports USB 2.0
Intel® HD Audio and AC’97
Yes
Yes, Ver. 1.2
3x PCI-Express x1
(optional 5 PCI Express x1)
4x PCI Ver. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0, S1, S3, S4, S5
9 W with Atom® N270
at 1.6GHz and 1 GB DDR2 typical
0°C ~ +60°C
selected modules: -20°C ~ +70°C
PICMG® COM Express™ R1.0, Type 2
Basic Form Factor (95x125 mm)
optional PATA SSD 512 MB up to 4 GB
Windows® XP/Xpe, Windows® Vista
Windows® CE, Linux® 2.6.x,
AIDI library
1-19
Express-IA533
Intel® Pentium® M
Intel® Celeron® M (3xx series)
µFC-PGA (socket) or µFC-BGA
Celeron® M: 600MHz up to 1.5GHz
Pentium® M: 1.1GHz up to 2.0GHz
533/400
Intel® 915GM with ICH6-M
2 GB (max), dual channel
DDR2 at 400/533
512MB soldered onboard
Max 1 GB on 200-pin SODIMM
L2 depends on processor type
0KB, 512KB, 1MB or 2MB
Phoenix® Award
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
FWH, 4 Mbit Flash
Intel® GMA 900
Max 128 MB UMA
CRT (QXGA)
Dual channel 18-bit LVDS (UXGA)
TV-out (PAL/NTSC/HDTV) optional
PCIe x16 Graphics Port, or dual
SDVO ports
OpenGL 1.4, DirectX* 9.0
one channel, two devices
two SATA 1.5 Gb/s
-
Marvell Yukon GbE (10/100/1000)
6 ports USB 2.0
Intel® HD Audio and AC’97
Yes
-
3x PCI-Express x1
1x PCI-Express x1 (on PEG)
4x PCI rev. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0, S1, S3, S4, S5
12 W with Celeron® M 373
at 1.0 GHz and 512 MB DDR2 typical
0°C ~ +60°C
-
PICMG
®
COM Express™ R1.0, Type 2
Basic Form Factor (95x125 mm)
-
Windows® XP/Xpe
Linux® 2.6.x, AIDI library
1-21
Type 2
1-6
Compact (95 x 95 mm) Ultra (84 x 55 mm)
Express-ATC
Intel® Atom™
up to 1.6 GHz with 512 KB L2 cache
PBGA437
Intel® Atom™ N270 at 1.6 GHz
533
Intel® 945GSE with ICH7M
2 GB (max), single channel
DDR2 533
-
Max 2 GB on single 200-pin SODIMM
L2 cache 512 KB
AMIBIOS®8, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
Intel® GMA 950
Max 256 MB UMA
CRT (QXGA)
single/dual 18/24-bit LVDS (UXGA)
TV-out (PAL/NTSC/HDTV)
Single SDVO port
OpenGL 1.4, DirectX* 9.0c
one channel, two devices
two SATA 1.5 Gb/s
-
Realtek RTL8111C GbE (10/100/1000)
6 ports USB 2.0
Intel® HD Audio and AC’97
Yes
Yes
3x PCI-Express x1
(optional 5 PCI Express x1)
4x PCI rev. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0, S1, S3, S4, S5
9 W with Atom® N270
at 1.6GHz and 1 GB DDR2 typical
0°C ~ +60°C
selected modules: -20°C ~ +70°C
PICMG
®
COM Express™ R1.0, Type 2
Compact Form Factor (95x95 mm)
optional SSD 4 GB up to 8 GB
Windows
®
XP/Xpe, Windows
®
Vista
Windows
®
CE, Linux
®
2.6.x, AIDI library
1-25
nanoX-ML
Intel® Atom™ Processor Z5xx
from 1.1 GHz up to 1.6 GHz
BGA 441
Intel® Atom™ Z530 at 1.6 GHz
Intel® Atom™ Z510 at 1.1 GHz
533/400
Intel® SCH US15W
1 GB (max), single channel
DDR2 400/533
512 MB or 1 GB DDR2 466/533 MHz
-
L2 cache 512 KB
AMIBIOS®8, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
FWH, 8 Mbit Flash
Intel® GMA 500
Max 256 MB UMA
single channel 18/24-bit LVDS (WXGA)
supports HDTV/DHD decode and
MPEG, H.264, hardware decoding
Single SDVO port
OpenGL 2.0, DirectX 9.0c
one channel, one device
one SATA 1.5 Gb/s
-
Realtek RTL8111C GbE (10/100/1000)
8 ports USB 2.0
Intel® HD Audio
Yes
Yes
1x PCIe x1
(optional 2x PCIe without LAN function)
-
Yes
I2C, SMBus
4.75V – 14V wide range (5Vsb
optional for ATX function)
S0, S1, S3, S4, S5
5 W with Atom®Z510 at 1.1 GHz and
512 MB DDR2 typical
0°C ~ +60°C
selected modules: -20°C ~ +70°C
PICMG® COM Express™ R1.0, Type 1
Ultra Form Factor (84x55 mm)
optional SSD 1 GB up to 8 GB
Windows® XP/Xpe, Windows® CE,
Linux®, AIDI library
1-33
CPU Type
CPU Package
CPU Models / Speeds
FSB Speed
Main Chipset
System Memory
Memory Type
Soldered Memory
Socket Memory
Cache (L2)
BIOS Type
BIOS Features
BIOS Flash
Graphics Controller
Graphics Memory
Integrated Display Support
External Graphics Bus
Compatibillity
Parallel ATA (IDE)
Serial ATA
Matrix Storage Support
Ethernet
USB
Audio
Watchdog
TPM
PCI Express Support
PCI Suport
LPC Support
Management Bus
Power
Power States
Power Consumption
Operating Temperature
Extended Temperature
Compatibillity
Dimensions
Solid State Disk on Module
BSP & Software Support
Page Number
Type 2 Type 10 Type 1
Express-LPC
Single / Dual Intel® Atom™
up to 1.8 GHz with 1 MB L2 cache
FCBGA559
Atom™ N455 at 1.66 GHz
Atom™ D425 at 1.8 GHz
Atom™ D525 at 1.8 GHz (dual core)
-
ICH8M
4 GB (max), single channel
DDR3 at 667/800
-
Max 4 GB on two 200-pin SODIMMs
L2 cache 512 KB (N455/D425)
L2 cache 1 MB (D525)
AMIBIOS®8, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
Intel® GMA 3150
Max 384 MB UMA
CRT (QXGA) 2048x1536
single 18 LVDS (WXGA) 1366x768
-
OpenGL 1.5, DirectX 9.0c
one channel, two devices
two SATA 1.5 Gb/s
-
Intel® 82583V GbE (10/100/1000)
6 ports USB 2.0
Intel® HD Audio
Yes
Yes
5x PCI-Express x1
4x PCI rev. 2.3, 32-bit, 33MHz
Yes
I2C, SMBus
12V only (AT), 12V and 5Vsb (ATX)
S0 S1 S3 S4 S5
8 W with Atom® N455
at 1.66 GHz and 1 GB DDR3 typical
0°C ~ +60°C
selected modules : -20°C ~ +70°C
PICMG® COM Express™ R2.0, Type 2
Compact Form Factor (95x95 mm)
optional SSD 4 GB up to 8 GB
Windows® XP/Xpe, Windows® Vista
Windows
®
CE, Linux
®
2.6.x, AIDI library
1-23
nanoX-TC
Intel® Atom™ Processor E6xx from
600 MHz up to 1.6 GHz
FC-BGA 676
E680 at 1.6 GHz, E660 at 1.3 GHz,
E640 at 1.1 GHz, E620 at 600 MHz
-
Intel® PCH EG20T (extended temp)
2 GB (max), single channel
DDR2 400/533
512 MB up 2 GB DDR2 at 800 MHz
-
L2 cache 512 KB
AMI EFI, American Megatrend
Serial Console redirection
EEPROM CMOS backup,
USB boot/legacy, PXE support
8 Mbit Flash SPI
Intel® GMA 600
Max 64 MB UMA
18/24-bit LVDS max 1280x768@60Hz
Encode : MPEG4, H.263, H.264;
Decode : MPEG2/4, VC1, WMV9, H.264
Single SDVO max 1920x1080@50Hz
OpenGL 2.1, DirectX 9.0c
-
two SATA 1.5 Gb/s
-
integrated Intel GbE (10/100/1000)
6 ports USB 2.0, 1 client port
Intel® HD Audio
Yes
Yes
3x PCIe x1
(optional 4x PCIe without PCH EG20T)
-
Yes
I2C, SMBus
4.75V – 14V wide range (5Vsb
optional for ATX function)
S0 S1 S3 S4 S5
4.5 W with E620 at 600 MHz and
512 MB DDR2 typical
0°C ~ +60°C
-40°C ~ +85°C (with CPU “T” versions)
PICMG
®
COM Express™ R2.0, Type 10
Ultra Form Factor (84x55 mm)
TBD
Windows® XP/Xpe, Windows® CE,
Win7 Embedded, Linux®, AIDI library
1-31
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-7
Express-HR
Specifications
Core System
CPU Sandy Bridge 32 nm process, BGA type
Intel® Core™ i7-2715QE 2.1 GHz (3.0 GHz Turbo),
6MB L3 cache, 45W
Intel® Core i7-2655LE 2.2 GHz (2.9 GHz Turbo),
4MB L3 cache, 25W
Intel® Core™ i7-2610UE 1.5 GHz (2.4 GHz Turbo),
4MB L3 cache, 17W
Intel® Core™ i5-2515E 2.5 GHz (3.2 GHz Turbo),
3MB L3 cache, 35W
Memory Dual channel non-ECC 1066/1333 MHz DDR3 memory up to
16 GB in dual stacked SODIMM socket
Chipset Intel® Mobile QM67 Express Chipset
L3 Cache 6MB (i7-2715QE), 4MB(i7-2655LE and i7-2610UE),
3MB (i5-2515E)
BIOS AMI EFI with CMOS backup in 16 Mbit SPI BIOS
Hardware Monitor Supply voltages and CPU temperature
Debug Interface XDP SFF-26 extension for ICE debug
Watchdog Timer Programmable timer range to generate RESET
Expansion Busses PCI Express x16 (Gen2) bus for discrete graphics solution
or general purpose PCI Express (2 x8 or 1 x8 with 2 x4) or
Embedded DisplayPort (eDP)
8 PCI Express x1: Lanes 0/1/2/3/4/5/6 are free, lane 7 is
occupied by GbE
LPC bus, SMBus (system) , I2C (user)
Video
Integrated in Processor
HD Graphics 3000 at 650–1300 MHz
Integrated Video DirectX 10.1 and OpenGL 3.0
Feature Support Intel Clear Video HD Technology
Advanced Scheduler 2.0, 1.0, XPDM support
DirectX Video Acceleration (DXVA) support for full AVC/VC1/
MPEG2 hardware decode
CRT Interface Analog CRT support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and CRT
hot plug
LVDS Interface Dual channel 18/24-bit LVDS
Digital Display Interface Three DDI ports supporting HDMI / DVT / DisplayPort or
SDVO
Audio
Chipset Integrated on Intel® PCH QM67
Audio Codec On Express-BASE6 (ALC888)
LAN
Chipset Intel® Gigabit LAN PHY WG82579LM
Interface 10/100/1000 Mbps Ethernet
Multi I/O
Chipset Integrated on QM67
USB Supports up to eight ports USB 2.0
SATA Supports two SATA ports at 6 Gb/s and two ports at 3 Gb/s
with support for RAID 0,1,5,10
SSD Optional SATA based Solid State Disk 8/16/32 GB
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption TBD
Smart Battery Support Yes
Mechanical and Environmental
Operating Temp 0°C to 60°C
Storage Temp -20°C to 80°C
Humidity 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operating
Vibration Non-operating: 1.88Grms, 5-500Hz, each axis
Operating: 0.5Grms, 5-500Hz, each axis
Compatibility COM Express Type 6, Basic form factor 125mm x 95mm
Certication CE, FCC, HALT
Operating Systems
Standard Support Windows® XP(e) / Windows® 7
Linux®
Extended Support (BSP) Embedded XP support package
Linux® 2.6.x BSP
VxWorks 6.x
AIDI Library for Windows® and Linux®
COM Express™ Type 6 Module with
Intel® Core™ i7/i5 processor and QM67 Chipset
Features
Intel® Quad or Dual Core™ i7/i5 Processor
Intel® QM67 Chipset
Up to 16GB Dual Channel DDR3 SDRAM at
1333MHz
Three Digital Display Interfaces (DDI) for
DisplayPort /HDMI/DVI/SDVO
Seven PCIe x1, one PCIe x16 (Gen2) for
graphics (or general purpose x8/4/1)
Two SATA 3 Gb/s, two SATA 6 Gb/s, Gigabit
LAN, eight USB 2.0
1-8
Functional Diagram
PCH
QM67
CPU
Core
i7-26XX /i5-26XX
GbE LAN
82579
GPIO
PCA9535
BC
6x PCIe x1
(port 0~5)
SMBus
Dual channel 24-bit LVDS
4x GP0
I2C
8x USB 2.0 (channel 0/7)
SODIMM 2
1066/1333 MHz
1~8 GB DDR3
SPI 1
BIOS
PCIe x1
(port 7)
HDA Audio
LPC bus
FDI
SODIMM 2
1066/1333 MHz
1~8 GB DDR3
PCI Express x16 (Gen2)
2 x8 or 1 x8 + 2 x4
SPI
DDI 1
DP / HDMI / DVI / SDVO
DDI 2
DP / HDMI / DVI
DDI 3
DP / HDMI / DVI / eDP
PCIe x1
(port 6)
4x GPI Monitor
ADT7490
DMI
CRT
TPM
SLB9635
2x SATA 6 Gb/s (channel 0/1)
2x SATA 3 Gb/s (channel 2/3)
SPI 2
BIOS
Debug
Header
XDP
SFF26
Ordering Information
Modules
Model Number Description/Configuration
Express-HR-i7-2715QE COM Express™ Type 6 module with Intel® Core
i7-2715QE SV processor at 2.1GHz with QM67 chipset
Express-HR-i7-2655LE COM Express™ Type 6 module with Intel® Core
i7-2655LE LV processor at 2.2GHz with QM67 chipset
Express-HR-i7-2610UE COM Express™ Type 6 module with Intel® Core
i7-2610UE ULV processor at 1.5 GHz with QM67 Chipset
Express-HR-i5-2515E COM Express™ Type 6 module with Intel® Core i5-2515E
SV processor at 2.5 GHz with QM67 Chipset
Accessories
Model Number Description/Configuration
Passive Heatsinks
THSH-HR-BL High Prole Heatsink for Express-HR with threaded
standoffs
Heat Spreaders
HTS-HR-RL Heatspreader for Express-HR with threaded standoffs
Heatsink with Active Cooling
THSFH-HR-BL High Performance Heatsink with Fan for Express-HR with
threaded standoffs
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-9
Express-CB/CBE
Specifications
Core System
CPU Arrandale BGA type
Intel® Core™ i7-610E Processor (4M Cache, 2.53 GHz) 35 W
Intel® Core™ i5-520E Processor (3M Cache, 2.40 GHz) 35 W
Intel® Core™ i7-620LE Processor (4M Cache, 2.00 GHz) 25 W
Intel® Core™ i7-620UE Processor (4M Cache, 1.06 GHz) 18 W
Intel® Core™ i3-330E Processor (3M Cache, 2.13 GHz) 35W
Intel® Celeron® Processor P4505 (2M Cache, 1.86 GHz) 35 W
Memory Dual channel 800/1066 MHz DDR3 memory up to 8 GB in
dual stacked SODIMM socket; ECC memory for CBE series
only
Chipset Intel® Mobile QM57
L2 Cache 2 MB (Celeron® M), 4/3 MB (Intel® Core™ i7 / i5)
BIOS AMI EFI with CMOS backup in 16 Mbit SPI BIOS
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses PCI Express x16 bus for discrete graphics solution or
general purpose PCI Express (2 x8 or 2 x4 or 2 x1) or
Embedded Display Port (eDP)
7 PCI Express x1: Lanes 0/1/2/3/4/5 are free, lane 6 is
occupied by GbE; can be optionally congured as 1 x4 (on
0/1/2/3) and 2 x1 (4/5)
32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters
LPC bus, SMBus (system) , I2C (user)
Video
Integrated in Gen 5.75 with 12 execution units
Processor
Integrated Video DirectX 10 and OpenGL 2.1
Feature Support Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0)
Video capture via x1 concurrent PCI Express port
PAVP (Protected Audio-Video Path) support for Protected
Intel HD Audio Playback
High performance MPEG-2 decoding
WMV9 (VC-1) and H.264 (AVC) support
Hardware acceleration for MPEG2 VLD/iDCT
Microsoft DirectX 10 support
OpenGL 2.1 support
Blu-ray support @ 40 Mb/s
Hardware motion compensation
Intermediate Z in classic rendering
CRT Interface Analog CRT support by 300 MHz DAC
Analog monitor support up to QXGA ( 2048 X 1536)
LVDS Interface Single / Dual channel 18- or 24-bit panels
Audio
Chipset Integrated on Intel® PCH QM57
Audio Codec On carrier (ALC888)
LAN
Chipset Integrated on QM57 with 82577LM PHY
Interface 10/100/1000 Mbps Ethernet
Multi I/O
Chipset Integrated on Intel® PCH QM57
USB Supports up to eight ports USB v. 2.0
SATA Four ports SATA 3 Gb/s with optional support for RAID
0,1,5,10
SSD Optional SATA based Solid State Disk 8/16/32 GB
PATA SATA to PATA bridge on SATA channel 1, Master only
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power
AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 21 W with Core™ i7-620UE at 1.2 GHz and 2 GB memory
typical
Smart Battery Support Yes
Mechanical and Environmental
Operating Temp 0°C to 60°C
Storage Temp -20°C to 80°C
Humidity 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Compatibility
COM Express™ Type 2, Basic form factor 125 mm x 95 mm
Certication CE, FCC
Operating Systems
Standard Support Windows® XP(e) / Vista / Windows® 7
Linux®
Extended Support (BSP) Embedded XP support package
Linux® 2.6.x BSP
Vxworks 6.x BSP
AIDI Library for Windows® and Linux®
COM Express™ Module with Intel® Core i7/i5/i3
Processor and QM57 Chipset
Features
Intel® Core™ i7/i5/i3 Processor
Intel® QM57 chipset
Up to 8 GB Dual Channel DDR3 SDRAM at
1066 MHz (optional ECC)
Six PCIe x1, one PCIe x16 for graphics
(or general purpose x8/4/1)
18/24-bit LVDS and Embedded DisplayPort
SATA 3 Gb/s IDE (PATA), Gigabit LAN, USB 2.0
1-10
Functional Diagram
Ordering Information
Modules
Non-ECC
Model Number
ECC
Model Number
Description/Configuration
Express-CB-i7-610E Express-CBE-i7-610E COM Express™ module with Intel®
Core i7-610E SV processor at
2.53 GHz with QM57 chipset
Express-CB-i5-520E Express-CBE-i5-520E COM Express™ module with Intel®
Core i5-520 SV processor at
2.4 GHz with QM57 chipset
Express-CB-i7-620LE Express-CBE-i7-620LE
COM Express™ module with
Intel® Core i7-620LE LV processor
at 2.0 GHz with QM57 chipset
Express-CB-i7-620UE Express-CBE-i7-620UE
COM Express™ module with Intel®
Core i7-620UE ULV processor at
1.07 GHz with QM57 chipset
Express-CB-i7-P4505 Express-CBE-i7-P4505
COM Express™ module with Intel®
Celeron® P4505 SV processor at
1.86 GHz with QM57 chipset
Express-CB-i3-330E Express-CBE-i3-330E
COM Express™ module with Intel®
Core i3-330E SV processor at
2.13 GHz with QM57 chipset
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-CB-B Heatspreader with threaded standoffs for Express-CB/CBE
Heatsink with Active Cooling
THSF-CB-B Heatsink with fan and threaded standoffs for Express-CB/
CBE
SATA
SSD
JM330
SATA to PATA
MAX6621
Mon(T)
LM87
Mon(T/V)
I2C to GPIO
BIOS
AB
Intel
PHY
82577LMPCH
QM57
CPU
Core
i7 / i5 / i3
DMI
SPI
PCIe x1
6x
SATA 2
DDR3
Memory
Controller
with
ECC
Embedded
Graphics Core
LVDS
dual 18/24-bit
PCI
33 MHz
v2.3
8x
USB
2.0
HD Audio
PCI
LPC
GbE
MAC
PCIe x1 (port 0/1/2/3/4/5)
LAN (occupies PCIe x1 port 6)
SMBus
TPM
LPC
SMBus
GPIO
Test
Header
GPIO
I2C BC
SATA(4 ports)
SATA (1 port)
FDI
CRT VGA SDVO
HDMI (3x)
DVI (3x)
DisplayPort (3x)
LVDS
DDR3 SODIMM
with or without ECC
800/1066 MHz
Channel A
PCIe x16 Gfx
2 PCIe x8
Embedded
DisplayPort
(eDP)
PATA IDE
CRT
USB
Audio
LAN
CD
Channel B
DDR3 SODIMM
with or without ECC
800/1066 MHz
SATA (1 port)
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-11
Specifications
Core System
CPU Penryn SFF BGA type
Intel® Core™2 Duo SP9300, FSB 1066, 2.26 GHz
with 6MB L2 cache, 25 Watt
Intel® Core™2 Duo SL9400, FSB 1066, LV 1.86 GHz
with 6MB L2 cache, 17 Watt
Intel® Core™2 Duo SU9300, FSB 800, ULV 1.2 GHz
with 3MB L2 cache, 10 Watt
Intel® Celeron® M 722, FSB 800, ULV 1.2GHz
with 1MB L2 cache, 5.5 Watt
Memory Dual stacked SODIMM sockets supporting dual channel
memory, up to 8 GB of non-ECC, 800/1066 MHz DDR3
Chipset Intel® GS45 Express Graphics Memory Controller Hub SFF
(Small Form Factor) and Intel® I/O Controller Hub ICH9M-SFF
BIOS AMIBIOS®8 with CMOS backup in 16 Mbit SPI Flash
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses Graphics PCI Express x16 bus for SDVO/HDMI/DisplayPort
or general purpose PCI Express (x8 / x4 / x1)
6 PCI Express x1: 0/1/2/3/4 are free, 5 is occupied by GbE;
0/1/2/3 x1 can be optionally congured as 1 x4
32-bit PCI 2.3 at 33MHz, supporting 4 bus masters
LPC, SMBus, I2C
Video
Chipset GS45 GMCH integrated Mobile Intel® Graphics Media
Accelerator 4500MHD with core render clock 533 MHz
@ 1.05-V core voltage or 266 MHz @ 1.025 L.P. Mode
Integrated Video Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0)
Feature Support Video capture via x1 concurrent PCI Express port
PAVP (Protected Audio-Video Path) support for Protected
Intel® HD Audio Playback
High performance MPEG-2 decoding
WMV9 (VC-1) and H.264 (AVC) support
Hardware acceleration for MPEG2 VLD/iDCT
Microsoft DirectX 10 support
Blu-ray support @ 40 Mb/s
Hardware motion compensation
Intermediate Z in classic rendering
CRT Interface Analog CRT support by 300MHz DAC
Analog monitor support up to QXGA, supports CRT hot plug
LVDS Interface Single / Dual channel 18/24-bit at 25~112 MHz
TV-out NTSC/PAL up to 1024x768 resolution supported
HDTV 480p/720p/1080i/1080p modes supported
(without Macrovision)
Audio
Chipset Integrated on Intel® ICH9M
Audio Codec HDA codec on carrier
HDMI Audio routed to HDMI interface
LAN
Chipset Integrated on Intel® ICH9M with Intel® 82567LM PHY
Interface 10/100/1000 Mbps Ethernet
Multi I/O
Chipset Integrated on Intel® ICH9M
USB Supports up to eight ports USB v. 2.0
SATA
Four ports SATA 3 Gb/s with (optional) support for RAID
0,1,5,10
PATA SATA to PATA JM20330 controller on SATA channel 3,
Master only
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 18 W (with Core™2 Duo SU9300 at 1.2 GHz and 2 GB
memory typical)
Mechanical and Environmental
Operating Temp. 0°C to 60°C
Storage Temp. -20°C to 80°C
Humidity 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Form Factor COM Express™ Type 2, Basic form factor,
95 mm x 125 mm
Certications CE, FCC
Operating Systems
Standard Support Windows® XP 32/64-bit
Windows® Vista 32/64-bit
Windows® Server 2003/2008
Linux® 2.6.x
Extended Support Embedded XP BSP
Linux® 2.6.x BSP
WinCE 6.0 BSP
AIDI Library for Win32, WinCE and Linux®
COM Express™ Module with Intel® Core™2 Duo
Processor and GS45 / ICH9M-SFF Chipset
Express-MV
Features
Intel® Core™2 Duo processor (up to 2.26 GHz)
Intel® GS45 and ICH9M-SFF chipset
Dual SODIMM for up to 8 GB DDR3
at 1066 MHz
Five PCIe x1, one PCIe x16 for graphics
(or general purpose x8, x4 or x1)
Single/dual channel 18/24-bit LVDS and TV-out
(SDTV and HDTV)
SATA 3 Gb/s, IDE (PATA), Gigabit LAN, USB 2.0
1-12
Functional Diagram
Ordering Information
Modules
Model Number Description/Configuration
Express-MV-SP9300 COM Express™ Module with Intel
®
Core™2 Duo
processor SP9300 at 2.26 GHz
Express-MV-SL9400 COM Express™ Module with LV Intel® Core™2 Duo
processor SL9400 at 1.86 GHz
Express-MV-SU9300 COM Express™ Module with ULV Intel® Core™2 Duo
processor SU9300 at 1.20 GHz
Express-MV-722 COM Express™ Module with ULV Intel® Celeron® M
processor 722 at 1.20 GHz
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-MV-B Heatspreader for Express-MV (BGA CPU) with threaded
standoffs
Passive Heatsinks
THS-MV-BL Low Prole Heatsink for Express-MV (BGA CPU) with
threaded standoffs for bottom mounting with long cooling
ns (incl screws for 5 and 8 mm btb)
Heatsink with Active Cooling
THSF-MV-B High Performance Heatsink with Fan for Express-MV (BGA
CPU) with threaded standoffs
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-13
Express-MG
Specifications
Core System
CPU Socket P
Intel® Core™2 Duo T9400, FSB 1067, 2.53 GHz with
6-MByte L2 cache, 35 Watt
Intel® Core™2 Duo P8400, FSB 1067, 2.26 GHz with
3-MByte L2 cache, 25 Watt
Intel® Dual Celeron® M T3100, FSB 800, 1.90 GHz with
1-MByte L2 cache, 35 Watt
Intel® Celeron® M 575, FSB 667, 2.00 GHz with 1-MByte L2
cache, 31 Watt
Memory Two SODIMM sockets (one on top, one on bottom)
supporting dual channel memory, up to 8 GB of non-ECC,
800/1067 MHz DDR3
Chipset Intel® GM45 Express Graphics Memory Controller Hub and
Intel® I/O Controller Hub 82801IEM (ICH9M-E)
L2 Cache 1 MB (Celeron® M), 6/3 MB (Core™2 Duo)
BIOS AMIBIOS®8 with CMOS backup in 16 Mbit SPI Flash
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses Graphics PCI Express x16 bus or SDVO/HDMI/DisplayPort or
general purpose PCI Express (x8/x4/x1)
6 PCI Express x1: Lanes 0/1/2/3/4 are free, lane 5 is
occupied by GbE LAN; lanes 0/1/2/3 x1 can be optionally
congure as 1 x4
32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters
LPC bus, SMBus (system), I2C (user)
Video
Chipset GM45 GMCH integrated Mobile Intel® Graphics Media
Accelerator X4500 with core render clock 533-MHz @
1.05 Vcore
Integrated Video Intel® Dynamic Video Memory Technology (Intel® DVMT 5.0)
Feature Support Video capture via x1 concurrent PCI Express port
PAVP (Protected Audio-Video Path) support for Protected
Intel® HD Audio Playback
High performance MPEG-2 decoding
WMV9 (VC-1) and H.264 (AVC) support
Hardware acceleration for MPEG2 VLD/iDCT
Microsoft DirectX 10 support
OpenGL 2.1 support
Blu-ray support @ 40 Mb/s
Hardware motion compensation
Intermediate Z in classic rendering
CRT Interface Analog CRT support by 300-MHz DAC
Analog monitor support up to QXGA and support for CRT hot
plug
LVDS Interface Single / Dual channel 18- or 24-bit panels
TV-out NSTC/PAL up to 1024x768 resolution supported
HDTV 480p/720p/1080i/1080p modes supported (without
Macrovision)
Audio
Chipset Integrated on Intel® I/O Controller Hub 9 Mobile (ICH9M)
Audio Codec On carrier (ALC888)
HDMI Audio routed to HDMI interface
LAN
Chipset Integrated on ICH9M with Intel 82567LM PHY
Interface 10/100/1000 Mbps Ethernet
Multi I/O
Chipset Integrated on Intel® I/O Controller Hub 9 Mobile (ICH9M)
USB Supports up to eight ports USB v. 2.0
SATA Four ports SATA 3 Gb/s with optional support for RAID
0,1,5,10
PATA SATA to PATA JM330 controller on SATA channel 3, Master
only (can be removed to free up fourth SATA channel)
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power
AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption
23 W (with Core™2 Duo P8400 at 2.26 GHz and 2 GB
memory, typical)
Smart Battery Support Yes
Mechanical and Environmental
Operating Temp 0°C to 60°C
Storage Temp -20°C to 80°C
Humidity 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Compatibility
COM Express™ Type 2, Basic form factor 125 mm x 95 mm
Certication CE, FCC
Operating Systems
Standard Support Windows® XP(e) / Vista / Windows® 7
Linux®
Extended Support (BSP) Embedded XP support package
Linux® 2.6.x BSP (with Xorg OpenGL setup instructions)
Vxworks 6.x BSP (on request)
AIDI Library for Windows® and Linux®
COM Express™ Module with Intel® Core™2 Duo
Processor and GM45 / ICH9M Chipset
Features
Intel® Core™2 Duo processor (up to 2.53 GHz)
Intel® GM45 and ICH9M chipset
Dual SODIMM for up to 8 GB DDR3
at 1066 MHz
Five PCIe x1, one PCIe x16 for graphics
(or general purpose x8, x4 or x1)
Single/dual channel 18/24-bit LVDS and TV-out
(SDTV and HDTV)
SATA 3 Gb/s, IDE (PATA), Gigabit LAN, USB 2.0
1-14
Ordering Information
Modules
Model Number Description/Configuration
Express-MG-S COM Express™ Module with socket type for Intel®
Core™2 Duo processor with GM45 and ICH9M chipset
Express-MG-S/T9400 COM Express™ Module with socket type Intel
®
Core™2
Duo processor T9400 at 2.53 GHz
Express-MG-S/P8400 COM Express™ Module with socket type Intel® Core™2
Duo processor P8400 at 2.26 GHz
Express-MG-S/T3100 COM Express™ Module with socket type Intel®
Dual Core Celeron® processor T3100 at 1.90 GHz
Express-MG-S / 575 COM Express™ Module with socket type Intel®
Celeron® processor 575 at 2.00 GHz
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-MG-S Heatspreader for Express-MG (socket CPU) with threaded
standoffs
Passive Heatsinks
THS-MG-S Low Prole Heatsink for Express-MG (socket CPU) with
threaded standoffs
Heatsink with Active Cooling
THSF-MG-S High Performance Heatsink with FAN for Express-MG
(socket CPU) with threaded standoffs
Functional Diagram
JM330
SATA / PATA
DDR3 800/1066
SODIMM socket
LM95235
Mon(T)
LM87
Mon(T/V)
I2C to GPIO
BIOS
AB
Intel
PHY
82567LM ICH
Intel® ICH9M
Small Form Factor
CD
CPU
Core™2 Duo
Celeron® M
Socket P
GMCH
Intel®GM45
DMI
SPI
six ports
PCI-E x1
4x SATA 2
DDR3
Memory
Controller
Analog
VGA
RTC
LVDS
dual 18/24-bit
PCIe x16 Gfx
PCIe x8/x4/x1
SDVO (2)
DisplayPort (3)
HDMI (2)
FSB
800/1066 MHz
PCI
8x USB 2.0
Audio
SDTV
HDTV
PCI 33 MHz v2.3
LPC
HDA only
Channel A
Channel B DDR3 800/1066
SODIMM socket
GbE
MAC
PCI-E ports 0 / 1 / 2 / 3 / 4
port 5 N/A (Multifunction with LAN)
SMBus
TPM
LPC
SMBus
GPIO
Test
Header
GPIO
I2CBC
SATA ports 0/1/2 (0/1/2/3 if no PATA support)
SATA (port 3) PATA IDE (master only)
PATA
USB_0/1/2/3/4/5/6/7
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-15
Specifications
Core System
CPU Socket P type
Intel® Core™2 Duo T7500, FSB 800, 2.2 GHz with
4MB L2 cache, 34 W
Intel® Celeron® M 550, FSB 533, 2.0 GHz, with
1MB L2 cache 27 W
BGA type
Intel® Core™2 Duo T7500, FSB 800, 2.2 GHz with
4MB L2 cache, 34 W
Intel® Core™2 Duo L7500, FSB 800, LV 1.5 GHz with
4MB L2 cache, 17 W
Intel® Core™2 Duo U7500, FSB 533, ULV 1.06 GHz with
2MB L2 cache, 10 W
Memory Dual stacked SODIMM sockets supporting dual channel
memory, up to 4 GB of non-ECC, 533/667 MHz DDR2
Chipset Intel® GME965 GMCH and ICH8-M
BIOS AMIBIOS®8 with CMOS backup in 8 Mbit SPI BIOS
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses 6 PCI Express x1 (0 – 4 free, 5 occupied by GbE), optional
congurable as x4
Graphics PCI Express x16 or PCI Express x8/x4/x1, or SDVO
digital video bus
32-bit PCI 2.3 at 33MHz, supporting 6 bus masters
LPC, SMBus, I2C
Video
Chipset GME965 integrated Mobile Intel® GMA X3100
CRT Interface Analog CRT support up to 2048 x1536 at 60 Hz, 32-bpp
LVDS Interface Single / Dual channel 18/24-bit at 25~112 MHz
TV-out NTSC/PAL up to 1024x768 resolution,
HDTV 480p/720p/1080i/1080p modes supported
(without Macrovision)
Audio
Chipset Integrated on Intel® ICH8-M
Audio Codec HDA codec on carrier
LAN
Chipset ICH8-M integrated GbE MAC with Intel® 82566 PHY
Interface 10/100/1000 Mbps with Wake-on-LAN and Alert on LAN
support
Multi I/O
Chipset Intel® ICH8-M
IDE (PATA) Single channel IDE with Ultra ATA 100/66/33 support
SATA Three ports SATA 3 Gb/s
USB Up to eight ports USB 2.0
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 19 W (with Core™2 Duo U7500 at 1.06 GHz and 2 GB
memory, typical)
Mechanical and Environmental
Operating Temp. 0°C to 60°C
Storage Temp. 20°C to 80°C
Humidity 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Form Factor COM Express™ Type 2, Basic form factor, 95 mm x 125 mm
Certications CE, FCC
Operating Systems
Standard Support Windows® XP 32/64-bit
Windows® Vista 32/64-bit
Windows® Server 2003
Linux® 2.6.x
Extended Support Embedded XP BSP
Linux® 2.6.x BSP
AIDI Library for Win32, WinCE and Linux®
COM Express™ Module with Intel® Core™2 Duo
Processor and GME965 / ICH8-M Chipset
Express-MC800
Features
Intel® Core™2 Duo processor (up to 2.2 GHz)
Intel® GME965 / ICH8M chipset
Dual SODIMM for up to 4 GB DDR2 at 800MHz
Five PCIe x1, one PCIe x16 graphic (or x8)
Dual-channel 24-bit LVDS, TV-out
SATA 3 Gb/s, PATA, Gigabit LAN, USB 2.0
1-16
Functional Diagram
GPIO
F75111R
Monitor
LM95235
Monitor
LM87 BIOS
GbE PHY
Intel 82566
ICH
Intel® ICH8M
CPU
Celeron® M
Core™2 Duo
SMT µFCBGA2
or µFCPGA2
GMCH
Intel®GME965
DMI
SPI
PCI
Express
lanes
3x SATA2
DDR-2
Memory
Controller
Analog
VGA
RTC
LVDS
dual 18/24-bit
Gfx PCIe x16
PCIe x8/x4/x2/x1
or 2x SDVO
FSB
533/800 MHz
PCI
PATA 1x
8x USB 2.0
HDA
Audio
SDTV
HDTV
Channel A DDR2 533/667
SODIMM socket
SMBus
TPM
LPC
SMBus
Graphic Core
X3100
GPIO
LPC
header
LPC
Audio
LVDS
TV-out
CRT
IDE0
Channel B DDR2 533/667
SODIMM socket
GbE
MAC
SATA_0/1/3
USB 2.0 0/1/2/3/4/5/6/7
PCIe x1, lane 0/1/2/3/4 or PCIe x4
PCIe x1, lane 5
PCIex16 (multiplexed)
PCI33 MHz, v2.3
BC
I2C
Ordering Information
Modules
Model Number Description/Configuration
Express-MC800-S COM Express™ Module with socket for Celeron® M or
Core™2 Duo processor
(for Intel® Core™2 Duo T7500 processor at 2.2 GHz or
Intel® Celeron® M 550 processor at 2.0 GHz)
Express-MC800-L7500 COM Express™ Module with LV Intel® Core™2 Duo
L7500 processor at 1.6 GHz
Express-MC800-U7500 COM Express™ Module with ULV Intel® Core™2 Duo
U7500 processor at 1.06 GHz
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-MC800-B Heatspreader for Express-MC800 (BGA CPU) with
threaded standoffs
Passive Heatsinks
THS-MC800-B Low Prole Heatsink for Express-MC800 (BGA CPU) with
threaded standoffs
THSH-MC800-B High Heatsink for Express-MC800 (BGA CPU) with
threaded standoffs
Heatsink with Active Cooling
THSF-MC800-S High Performance Heatsink with Fan for Express-MC800
(socket CPU) with threaded standoffs
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-17
Specifications
Core System
CPU Merom Core socket type
Intel® Core™2 Duo T7400, 2.16GHz with 4MB L2 cache, 34 W
Intel
®
Celeron
®
M 530, 1.73GHz with 1MB L2 cache, 27 W
Merom Core BGA type
Intel
®
Core™2 Duo L7400, 1.5 GHz with 4MB L2 cache, 17 W
Intel
®
Core™2 Duo U7500, 1.06 GHz with 2MB L2 cache, 10 W
Yonah Core socket type
Intel
®
Core™ Duo T2500, 2.0 GHz with 2MB L2 cache, 31 W
Intel
®
Celeron
®
M 440, 1.86 GHz with 1MB L2 cache, 27 W
Yonah Core BGA type
Intel
®
Core™ Duo L2400, 1.66GHz with 2MB L2 cache, 15 W
Intel
®
Core™ Duo U2500, 1.2 GHz with 2MB L2 cache, 9 W
Intel
®
Celeron
®
M 423, 1.06GHz with 1MB L2 cache, 5.5 W
Memory Dual SODIMM sockets supporting dual channel memory,
up to 4 GB of non-ECC, 533/667 MHz DDR2
Chipset Intel® 945GME Express Graphics Memory Controller Hub
Intel® I/O Controller Hub 7 Mobile (ICH7-M DH)
BIOS AMIBIOS®8 with CMOS backup in 8 Mbit SPI BIOS
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses 6 PCI Express x1 (0 – 4 free, 5 occupied by GbE LAN),
optional congurable as x4
Graphics PCI Express x16, or SDVO digital video bus
32-bit PCI 2.3 at 33MHz, supporting 6 bus masters
LPC, SMBus, I2C
Video
Chipset 945GME GMCH integrated graphics supports dual
independent displays
CRT Interface Analog VGA support up to 2048 x1536 resolution
LVDS Interface Single / Dual channel 18/24-bit
TV-out NTSC/PAL up to 1024x768 resolution,
HDTV 480p/720p/1080i/1080p modes supported
(without Macrovision)
Audio
Chipset Integrated on Intel® ICH7-M DH
Audio Codec HDA (Azalia) or AC’97 codec on carrier
LAN
Chipset PCIe type Intel® 82573L
Interface 10/100/1000 Mbps
Multi I/O
Chipset Intel® ICH7-M
IDE (PATA) Single channel IDE with UDMA 100 support
SATA Three SATA 1.5 Gb/s ports
USB Up to eight USB 2.0 ports
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 16 W typical (with Core™2 Duo U7500 and 1 GB memory)
Mechanical and Environmental
Operating Temp. 0°C to 60°C
Storage Temp. -20°C to 80°C
Humidity up to 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Form Factor COM Express™ Type 2, Basic form factor, 95 mm x 125 mm
Certications CE, FCC
Operating Systems
Standard Support Windows® XP 32/64-bit
Windows® Vista 32/64-bit
Windows® Server 2003
Linux® 2.6.x
Extended Support Embedded XP BSP
WinCE BSP
Linux® 2.6.x BSP
AIDI Library for Win32, WinCE and Linux®
COM Express™ Module with Intel® Core™2 Duo
Processor and 945GME / ICH7-M Chipset
Express-NR
Features
Intel® Core™2 Duo processor (up to 2.1 GHz)
Intel® 945GME / ICH7-M chipset
Dual SODIMM for up to 4 GB DDR2 at 667 MHz
One PCIe® x16, five PCIe® x1 (or one x4)
Single/dual 18/24-bit LVDS, TV-out
SATA, PATA, Gigabit LAN, USB 2.0
1-18
Functional Diagram
Ordering Information
Modules
Model Number Description/Configuration
Express-NR-S COM Express™ Module with socket for Celeron® M /
Core™ Duo / Core™2 Duo processor
(for Intel® Core™2 Duo T7400 processor at 2.16 GHz or
Intel® Celeron® M 440 processor at 1.86 GHz)
Express-NR-L7400 COM Express™ Module with LV Intel® Core™2 Duo L7400
processor at 1.5 GHz
Express-NR-L2400 COM Express™ Module with LV Intel® Core™ Duo L2400
processor at 1.66 GHz
Express-NR-U7500 COM Express™ Module with ULV Intel® Core™2 Duo
U7500 processor at 1.06 GHz
Express-NR-423 COM Express™ Module with ULV Intel® Celeron® M 423
processor at 1.06 GHz
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-NR-B Heatspreader for Express-NR (BGA CPU) with threaded
standoffs
Passive Heatsinks
THS-NR-B Low Prole Heatsink for Express-NR (BGA CPU) with
threaded standoffs
THSH-NR-B High Heatsink for Express-NR (BGA CPU) with threaded
standoffs
Heatsink with Active Cooling
THSF-NR-S High Performance Heatsink with Fan for Express-NR
(socket CPU) with threaded standoffs
BC
GPIO LM95235 LM87 BIOS
GbE LAN
Intel 82573L
ICH
Intel® ICH7-M DH
CPU
Celeron® M
Core™ Duo
Core™2 Duo
SMT µFCBGA2
or µFCPGA2
GMCH
Intel®945GME
DMI
SPI
Six
PCIe x1
lanes
2x SATA
DDR-2
Memory
Controller
Analog
VGA
RTC
LVDS
Dual 18/24-bit
PCIe x16 Gfx
PCIe x1 or
2x SDVO
FSB
533/667 MHz
PCI
PATA 1x
8x USB 2.0
AC97
or HDA
Audio
SDTV
HDTV
PCI 33 MHz, v2.3
Channel A
PCIex16 (multiplexed)
DDR2533/667
SODIMM socket
PCIe x1, lane 0/1/2/3/4 or PCIe x4
PCIe x1, lane 5
SMBus
TPM
LPC
SMBus
Graphic Core
250 MHz
GPIO
LPC
header
LPC
Audio
LVDS
TV-out
CRT
IDE
SATA_0/1
USB_0/1/2/3/4/5/6/7
Channel B DDR2533/667
SODIMM socket
I2C
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-19
Specifications
Core System
CPU BGA type
Intel® Atom™ N270, FSB 533, 1.6 GHz with 512 KB L2
cache, 2.5 W, on-die primary 32-kB instruction cache
and 24 KB write-back data cache
Hyper-Threading support (2-threads)
Advanced gunning transceiver logic (AGTL+) bus driver
technology
Enhanced Intel® SpeedStep® Technology
Source synchronous double-pumped (2x) Address
Source synchronous quad-pumped (4x) Data
C0 - C4 low power states supported
Memory Single SODIMM socket memory, up to 2 GB of non-ECC,
400/533 MHz DDR2
Chipset Intel® 945GSE Express Graphic Memory Controller Hub and
Intel® I/O Controller Hub 7 Mobile (ICH7-M)
BIOS AMIBIOS®8 with CMOS backup in 8 Mbit SPI BIOS
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses 4 PCI Express x1 (0/1/2 are free, 3 is occupied by GbE LAN)
optionally congured as x4
Serial Digital Video Out (SDVO)
32-bit PCI 2.3 at 33MHz, supporting 4 bus masters
LPC, SMBus, I2C
Video
Chipset Intel® Graphics Media Accelerator 950 integrated into
945GSE GMCH supporting dual independent displays
CRT Interface Analog CRT support up to 1600 x 1200
LVDS Interface Single / Dual channel 18-bit (optional 24-bit on carrier
through SDVO)
TV-out NTSC/PAL up to 1024x768 resolution supported,
HDTV 480p/720p/1080i/1080p modes supported
(without Macrovision)
Audio
Chipset Integrated on Intel® I/O Controller Hub 7 Mobile (ICH7-M)
Audio Codec HDA (Azalia) or AC’97 codec on carrier
LAN
Chipset PCIe x1 Realtek RTL8111C
Interface 10/100/1000 Mbps
Multi I/O
Chipset Intel® ICH7-M
IDE (PATA) Single IDE channel with UDMA100 with optional
512MB - 8GB IDE-based Solid State Disk
SATA Two port SATA 1.5 Gb/s
USB Up to eight ports USB 2.0
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 9 W typical (with Atom™ N270 and 1 GB memory)
Mechanical and Environmental
Operating Temp. 0°C to 60°C
Storage Temp. -20°C to 80°C
Humidity Up to 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Form Factor COM Express™ Type 2, Basic form factor,
95 mm x 125 mm
Certications CE, FCC
Operating Systems
Standard Support Windows® XP 32-bit
Windows® Vista 32-bit
Linux® 2.6.x
Extended Support Embedded XP BSP
WinCE BSP
Linux® 2.6.x BSP
AIDI Library for Win32, WinCE and Linux®
COM Express™ Module with Intel® Atom™
Processor N270 and 945GSE/ICH7-M Chipset
Express-AT
Features
Intel® Atom™ processor N270 at 1.6 GHz
Intel® 945GSE / ICH7-M chipset
SODIMM for up to 2 GB DDR2 at 533 MHz
Three PCIe x1 (optional 4 x1 or 1 x4)
High resolution CRT, single/dual 18-bit LVDS
and TV-out (SDTV and HDTV)
SATA, IDE (PATA), Gigabit LAN, USB 2.0
Optional 512MB~8GB IDE-based Solid State
Disk
1-20
Functional Diagram
Ordering Information
Modules
Model Number Description/Configuration
Express-AT-N270 COM Express™ module with Intel® Atom™ N270 processor
at 1.6 GHz
Express-AT-N270-4G COM Express™ module with Intel® Atom™ N270 processor
at 1.6 GHz 4GB SSD Solid State Disk
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-CAT-B Heatspreader for Express-AT (BGA CPU) with threaded
standoffs
Passive Heatsinks
THS-CAT-B Low Prole Heatsink for Express-AT (BGA CPU) with
threaded standoffs
AB
BIOS
GbE LAN
Realtek
RTL8111C
ICH
Intel® ICH7-M
CD
CPU
Atom™ N270
GMCH
Intel®945GSE
DMI
SPI
Four
PCIe x1
lanes
2x SATA
DDR-2
Memory
Controller
Analog
VGA
RTC
LVDS
dual 18-bit
Single channel
SDVO
FSB
533 MHz
PCI
PATA 1x
8x USB
2.0
HDA
Audio
SDTV
HDTV
Channel A
DDR2 533
SODIMM socket
up to 2 GB
PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4)
PCIe x1 port 3
SMBus
TPM
LPC
Graphic Core
250 MHz
LPC
header
LPC
Audio
LVDS
TV-out
CRT
IDE
GPIO LM87
SMBus
GPIO
BC
I2C
SATA_0/1
USB_0/1/2/3/4/5/6/7
PCI 33 MHz, v2.3
SDVO
Solid State
Drive
512MB up to 8 GB
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-21
Specifications
Core System
CPU Socket 479 type
Intel® Pentium® M 760, 2.0 GHz, with 2MB L2 cache
Intel® Pentium® M 745, 1.8 GHz, with 2MB L2 cache
BGA type
Intel® Pentium® M 738, 1.4 GHz, with 2MB L2 cache
Intel® Celeron® M 373, 1.0 GHz, with 1MB L2 cache
Memory 400/533 MHz DDR2, non-ECC, unbuffered
Channel A: SO-DIMM socket for DDR2 memory, max 1 GB
Channel B: soldered DDR2 memory, max 512 MB
Chipset Intel® 915GME Express Graphic Memory Controller Hub and
Intel® I/O Controller Hub 6 Mobile (ICH6-M)
BIOS Phoenix AWARD BIOS in 1 MB FWH with console redirection
and CMOS EEPROM backup
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses Four PCI Express x1 lanes (one occupied by GbE LAN)
Six 32-bit PCI 2.3 Masters at 33/66 MHz
Low Pin Count (LPC) interface for Super I/O on carrier
SMBus 2.0 interface support
Video
Chipset 915GME GMCH integrated chipset supports dual
independent displays
CRT Interface Analog CRT support up to 2048 x1536
LVDS Interface Dual channel 18-bit
Graphic Expansion busses
One PCI Express® x16 Graphics port
Two Serial DVO ports (multiplexed with PCI Express® x16)
Audio
Chipset Integrated on Intel® ICH6-M
Audio Codec Optional AC’97 codec on carrier
LAN
Chipset Yukon-EC 88E8053 PCIe Gigabit Ethernet Controller
Interface Triple speed 10/100/1000BASE-T IEEE 802.3 compliant with
fully integrated ASF 2.0 functionality
Multi I/O
Chipset Intel® ICH6-M
IDE (PATA) One Ultra ATA 100/66/33 IDE port
SATA Two SATA 1.5 Gb/s ports
USB Up to eight USB 2.0 ports, supports legacy KB / Mouse
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 18 W typical (with Pentium® M 738 and 1 GB memory)
Mechanical and Environmental
Operating Temp. 0°C to 60°C
Storage Temp. -20°C to 80°C
Humidity Up to 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Form Factor COM Express™ Type 2, Basic form factor, 95 mm x 125 mm
Certications CE, FCC
Operating Systems
Standard Support Windows® XP 32-bit
Linux® 2.6.x
Extended Support Embedded XP BSP
Linux® 2.6.x BSP
AIDI Library for Win32 and Linux®
COM Express™ Module with Intel® Pentium® M
Processor and 915GME/ICH6-M Chipset
Express-IA533
Features
Intel® Pentium® M Processor up to 2.1 GHz
Intel® 915GME Express chipset
Dual-Channel DDR2 533 MHz
Three PCI Express® x1 lanes and one
PCI Express® x16 Graphics lane
Onboard Gigabit Ethernet
SATA, USB 2.0, LVDS, SDVO
1-22
Functional Diagram
Ordering Information
Modules
Model Number Description/Configuration
Express-IA533-S/0 COM Express module with socket for Intel® Celeron®/
Pentium® M processor
Express-IA533-760/0 COM Express module with Intel Pentium® M 760 at 2.0GHz
Express-IA533-745/0 COM Express module with Intel Pentium® M 745 at 1.8GHz
Express-IA533-738/0 COM Express module with Intel Penium® M 738 at 1.4GHz
Express-IA533-373/0 COM Express module with Intel Celeron® M 373 at 1GHz
Note: All models optional soldered memory
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-IA533-B Heatspreader for Express-IA533 (BGA CPU) with threaded
standoffs
Passive Heatsinks
THS-IA533-B Low Prole Heatsink for Express-IA533 (BGA CPU) with
threaded standoffs
Heatsink with Active Cooling
THSF-IA533-S High Performance Heatsink with Fan for Express-IA533
(socket CPU) with threaded standoffs
Gigabit
Ethernet
Marvell Yukon
88E8053
AB
ICH6-M
CD
CPU
Celeron® M
Pentium® M
SMT µFCBGA or
socket µFCPGA
GMCH
Intel® 915GME
DMI
LPC
four ports
PCI-E x1
2x SATA
DDR-2
Memory
Controller
VGA
SATA1
RTC
EEPROM
CMOS
Backup
DDR2 400/533
SODIMM Socket
LVDS
2x 18-bit
PCIe x16 Gfx
PCIe x1
or 2x SDVO
BIOS
FSB
400 /533 MHz
PCI
single
PATA
8x USB 2.0
AC97
PORT 0
SATA0 PCI 33 MHz v2.3
LPC
SMBus/I2C
GPIO
Dual
Watchdog
PORT 3
Channel A
Channel B DDR2 533
soldered onboard
PORT 1
PORT 2
Monitor
Temp
Voltage
LVDS
CRT
PCIe x16 (multiplexed)
IDE0
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-23
Specifications
Core System
CPU Intel® Atom™ Processor
N455: Single Core Intel® Atom™ processor 1.66 GHz at 6.5 W
D425: Single Core Intel® Atom™ processor 1.80 GHz at 10 W
D525: Dual Core Intel® Atom™ processor 1.80 GHz at 13 W
N570: Dual Core Intel® Atom™ processor 1.66 GHz at 8.5 W
Memory Dual SODIMM sockets support up to 4 GB of non-ECC
667/800 MHz DDR3 memory
Chipset Intel® I/O Controller Hub 8 Mobile (ICH8-M)
L2 Cache 1 MB for D525, 512KB for N455 & D425
BIOS AMIBIOS® 8 with CMOS backup in 16 Mbit SPI BIOS
supports SPI BIOS on carrier (COM.0 R2.0)
Hardware Monitor Supply voltages and CPU temperature
Debug Interface XDP SFF-26 extension for ICE debug
Embedded Features Instant on with Intel Bootloader support, OEM BIOS settings,
Board Info & Statistics, ACPI 3.0, Smart Battery Management
support, Watchdog with programmable timer ranges
Expansion Busses 6 PCI Express x1: 0/1/2/3/4 are free, 5 is occupied by GbE;
0/1/2/3 x1 can be optionally congured as 1 x4
32-bit PCI: PCI rev. 2.3 at 33MHz, supporting 4 bus masters
LPC bus, SMBus (system), I2C (user)
Video
GPU Core Integrated in CPU with Gen3.5+ GFX Core and render core
frequency at 200 MHz (N455) and 400 MHz (D425/D525)
Integrated Video Intel® Dynamic Video Memory Technology 4.0 support
Feature Support DirectX 9 compliant Pixel Shader v2.0
400 MHz render clock frequency
2 display ports: LVDS and RGB
Intel® Clear Video Technology
MPEG2 Hardware Acceleration, ProcAmp
CRT Interface Analog RGB display, resolution up to 2048x1536@ 60 Hz
LVDS Interface Single 18-bit channel, resolution up to 1366x768, 18bpp
Audio
Chipset Integrated in Intel® I/O Controller Hub 8 Mobile (ICH8M)
Audio Codec On carrier (ALC888)
LAN
Chipset Intel® 82583V Gigabit Ethernet Controller
Interface 10/100/1000 Mbps Ethernet
Multi I/O and Storage
Chipset Intel® I/O Controller Hub 8 Mobile (ICH8M)
USB Supports up to eight ports USB 2.0
SATA Three ports SATA 3 Gb/s
IDE (PATA) Single IDE channel (UDMA100) with optional
4GB ~ 8GB IDE-based Solid State Drive
Super I/O
BIOS support for legacy free or legacy with two types of
Super I/O (Winbond W83627HG and W83627DHG)
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power
AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 10 W (with N455 CPU and 2 GB memory typical)
Smart Battery Support Yes
Mechanical and Environmental
Operating Temp 0°C to 60°C
Storage Temp -20°C to 80°C
Humidity 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operating
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Compatibility
COM Express™ Type 2, COM.0 R2.0
Compact form factor 95 mm x 95 mm
Certication CE, FCC
Operating Systems
Standard Support Windows® XP(e) / Vista, Windows® 7
Linux®
Extended Support (BSP) Embedded XP / 2009 support package
Linux® 2.6.x BSP
VxWorks 6.x BSP
AIDI Library for Windows® and Linux®
Compact COM Express™ Module with Single/Dual
Core Intel® Atom™ Processor and ICH8M Chipset
Express-LPC
Features
Single/Dual Core Atom™ processor at 1.8 GHz
Intel® I/O Controller Hub 8 Mobile
Up to 4 GB DDR3 SDRAM at 800 MHz
Five free PCIe x1 lanes (optional PCIe x4)
CRT and LVDS support
SATA 3 Gb/s, IDE (PATA), Gigabit LAN, USB 2.0
DDR3
1-24
Atom
N455
D425
D525
N570
GbE LAN
82583V
GPIO
PCA9535
BC
AB
3x SATA (port 0~2)
ICH8M
SODIMM 1
512MB ~ 2GB DDR3
5x PCIe x1
(port 0~4)
SMBus
CRT
18-bit LVDS
4x GPI
4x GP0
I2C
8x USB
CD
SODIMM 2
512MB ~ 2GB DDR3
SPISPI BIOS
PATA IDE
PCIe x1
(port 5)
HDA Audio
LPC bus
PCI Bus
SPI
XDP
SFF-26
Functional Diagram
Ordering Information
Modules
Model Number Description/Configuration
Express-LPC-N455
Compact COM Express™ Module with Intel® Atom™ Single
Core Low Voltage Processor N455 at 1.66 GHz
Express-LPC-D425 Compact COM Express™ Module with Intel® Atom™
Single Core Processor D425 at 1.80 GHz
Express-LPC-D525 Compact COM Express™ Module with Intel® Atom™ Dual
Core Processor D525 at 1.80 GHz
Express-LPC-N570 Compact COM Express™ Module with Intel® Atom™ Dual
Core Low Voltage Processor N570 at 1.66 GHz
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-LPC-B Heatspreader for Express-LPC with threaded standoffs
Passive Heatsinks
THS-LPC-B Low Prole Heatsink for Express-LPC with threaded
standoffs
Active Heatsinks
THSF-LPC-B Heatsink with Fan for Express-LPC with threaded standoffs
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-25
Specifications
Core System
CPU BGA type
Intel® Atom™ N270, FSB 533, 1.6 GHz with 512 KB L2
cache, 2.5 W, on-die primary 32-kB instruction cache
and 24 KB write-back data cache
Hyper-Threading support (2-threads)
Advanced gunning transceiver logic (AGTL+) bus driver
technology
Enhanced Intel SpeedStep® Technology
Source synchronous double-pumped (2x) Address
Source synchronous quad-pumped (4x) Data
C0 - C4 low power states supported
Memory Single SODIMM socket up to 2 GB of non-ECC,
400/533 MHz DDR2 memory
Chipset Intel® 945GSE Express Graphic Memory Controller Hub and
Intel® I/O Controller Hub 7 Mobile (ICH7-M)
BIOS AMIBIOS®8 with CMOS backup in 8 Mbit SPI BIOS
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses 4 PCI Express x1 (0/1/2 are free, 3 is occupied by GbE LAN)
optionally congured as one PCIe x4
Serial Digital Video Out (SDVO)
32-bit PCI 2.3 at 33MHz, supporting 4 bus masters
LPC, SMBus, I2C
Video
Chipset Intel® Graphics Media Accelerator 950 integrated into
945GSE GMCH supporting dual independent displays
CRT Interface Analog CRT support up to 1600 x 1200
LVDS Interface Single / Dual channel 18-bit (optional 24-bit on carrier
through SDVO)
TV-out NTSC/PAL up to 1024x768 resolution supported,
HDTV 480p/720p/1080i/1080p modes supported
(without Macrovision)
Audio
Chipset Integrated on Intel® I/O Controller Hub 7 Mobile (ICH7-M)
Audio Codec HDA (Azalia) or AC’97 codec on carrier
LAN
Chipset PCIe x1 Realtek RTL8111C
Interface 10/100/1000 Mbps
Multi I/O
Chipset Intel® ICH7-M
IDE (PATA) Single IDE channel with UDMA100 with optional
1GB ~ 8GB IDE-based Solid State Drive
SATA Two ports SATA 1.5 Gb/s
USB Up to eight ports USB 2.0
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Inneon SLB9635TT1.2
Type TPM 1.2
Power Specications
Input Power AT mode (12 V) and ATX mode (12 V and 5 Vsb)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 9 W typical (with Atom™ N270 and 1 GB memory)
Mechanical and Environmental
Operating Temp. 0°C to 60°C
Storage Temp. -20°C to 80°C
Humidity Up to 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Form Factor COM Express™ Type 2, Compact form factor,
95 mm x 95 mm
Certications CE, FCC
Operating Systems
Standard Support Windows® XP 32-bit
Windows® Vista 32-bit
Linux® 2.6.x
Extended Support Embedded XP BSP
WinCE BSP
Linux® 2.6.x BSP
AIDI Library for Win32, WinCE and Linux®
Compact COM Express™ Module with Intel® Atom™
Processor N270 and 945GSE/ICH7-M Chipset
Express-ATC
Features
Intel® Atom™ processor N270 at 1.6 GHz
Intel® 945GSE/ICH7-M chipset
SODIMM for up to 2 GB DDR2 at 533 MHz
Three PCIe x1 (optional 4 x1 or 1 x4)
High resolution CRT, single/dual 18-bit LVDS
and TV-out (SDTV and HDTV)
SATA, IDE (PATA), Gigabit LAN, USB 2.0
Optional 1GB ~ 8GB IDE-based Solid State
Drive
1-26
Functional Diagram
Ordering Information
Modules
Model Number Description/Configuration
Express-ATC-N270 Compact COM Express™ module with Intel® Atom™ N270
processor at 1.6 GHz
Express-ATC-N270-4G
Compact COM Express™ module with Intel® Atom™ N270
processor at 1.6 GHz with 4GB SSD Solid State Disk
Express-ATC-N270-8G
Compact COM Express™ module with Intel® Atom™ N270
processor at 1.6 GHz with 8GB SSD Solid State Disk
Accessories
Model Number Description/Configuration
Heat Spreaders
HTS-ATC-B Heatspreader for Express-ATC (BGA CPU) with threaded
standoffs
Passive Heatsinks
THS-ATC-B Low Prole Heatsink for Express-ATC (BGA CPU) with
threaded standoffs
AB
BIOS
GbE LAN
Realtek
RTL8111C
ICH
Intel® ICH7-M
CD
CPU
Atom™ N270
GMCH
Intel®945GSE
DMI
SPI
Four
PCIe x1
lanes
2x SATA
DDR-2
Memory
Controller
Analog
VGA
RTC
LVDS
dual 18-bit
Single channel
SDVO
FSB
533 MHz
PCI
PATA 1x
8x USB
2.0
HDA
Audio
SDTV
HDTV
Channel A
DDR2 533
SODIMM socket
up to 2 GB
PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4)
PCIe x1 port 3
SMBus
TPM
LPC
Graphic Core
250 MHz
LPC
header
LPC
Audio
LVDS
TV-out
CRT
IDE
GPIO LM87
SMBus
GPIO
BC
I2C
SATA_0/1
USB_0/1/2/3/4/5/6/7
PCI 33 MHz, v2.3
SDVO
Solid State
Drive
512MB up to 8 GB
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-27
Specifications
Form Factor
Core Module Interface PICMG® COM Express™ Revision 2.0
Supports Type 1 and Type 2 Basic form factor modules
Dimensions 305 mm x 244 mm (AT/ATX)
Expansion Busses Two 32-bit PCI™ v2.3 slots
Five PCI Express® x1 slots
One PCI Express x16 / SDVO slot
LPC bus header
BIOS / Debug
POST LEDs Onboard diagnostics for BIOS POST code data and address
on LPC bus
Allows single step BIOS execution
Secondary BIOS Onboard sockets for secondary LPC & SPI BIOS
Active Components
Audio ALC880 High Denition Audio Codec
Super I/O Winbond WF83627HG on LPC
Connectors
COM Express™ Two x 220-pin (Type 2)
CRT DB15 on Rear I/O panel for VGA/CRT displays
LVDS Two onboard headers supporting dual channel LVDS
Audio Mic/Line-in/Speakers on rear I/O panel, Mic/Line-in on
header, S/PDIF on header
PATA IDE One 40-pin header
SATA IDE Four SATA connectors
PCIe Mini Card One socket onboard
LAN 10/100/1000BASE-T compatible RJ45 on rear I/O panel
USB 2.0 Four + two on rear I/O panel, two on header and one through
Mini Express Card
Serial Port One DB-9 on rear I/O panel, one header onboard
Parallel Port One DB-25 on rear I/O panel
FDD 34-pin header
Smart Battery One header for Smart Battery management communications
(connects to ADLINK BattMan board)
KB/Mouse Two 6-pin mini DIN (on rear I/O panel)
Digital I/O 8-pin header
Feature Connectors SMBus, I2C, module control signals, at panel control signals
Miscellaneous Reset, Power LED, HDD LED, Buzzer
Power Standard ATX connector
Switches Onboard RESET button and ATX mini switch
COM Express™ Reference Carrier Board
in ATX Form Factor
Express-BASE
Functional Diagram
Ordering Information
Carrier
Model Number Description/Configuration
Express-BASE COM Express™ Reference Carrier Board in ATX form factor
Features
Five PCI Express® x1 slots
PCI Express x16 Graphic slot / SDVO slot
Two Legacy 32-bit PCI slots
Dual LPC BIOS, single step execution
LPC Super I/O (enable/disable)
CF Card or Express Card
Integrated POST Code
ATX / AT or Battery Powered
AB
CD
LPC
W83627HF
Primary
Super I/O
LPT1
COM1
COM2
FDD
POST Code
Display
Six PCI Express x1
6x USB on Rear I/O
1x USB on header
Audio
Codec
Audio on
Rear I/O
KB/MS
Eight USB
Debug Header
SATA 4 onboard
SATA headers
Secondary
BIOS
Express
Card
CRT VGA
Rear I/O
P
C
I
E
1
P
C
I
E
1
P
C
I
E
1
P
C
I
E
1
P
C
I
E
5
LVDS
headers
Gigabit
Ethernet
Rear I/O
PCI Express x16
(can also be used for
SDVO ADD2 card)
PCI Express x16
onboard slot
PATA
Single Channel
IDE Connector
32-bit PCI
PCI
2 slot
COM Express Carrier Design Guide
Provides detailed information on designing your own custom carrier
board for COM Express modules.
Download from the Express-BASE product webpage at www.adlinktech.com
1-28
Specifications
Form Factor
Core Module Interface PICMG® COM Express™ Revision 2.0
Supports Type 6 Basic form factor modules
Dimensions 305 mm x 244 mm (ATX)
Expansion Busses Seven PCI Express x1 slots
One PCI Express Mini Card slot
One PCI Express x16 / SDVO slot
BIOS / Debug
POST LEDs Onboard diagnostics for BIOS POST code data and address
on LPC bus
Secondary BIOS Onboard sockets for secondary LPC & SPI BIOS
Active Components
Audio Realtek ALC888 High Denition Audio Codec
Super I/O Winbond WF83627DHG on LPC bus
Digital I/O I2C to GPIO bridge PCA9535
Connectors
COM Express™ Two x 220-pin (Type 6)
CRT DB15 on Rear I/O panel for VGA/CRT display
LVDS Onboard 34-pin header
Digital Display Interface Supports three DDI ports to HDMI/DVI/DIsplayPort output by
adapter card (PCIe x16 slot with proprietary pinout)
Flat Panel Control Onboard 8-pin header
Audio Mic/Line-in/Line-out on I/O panel
SATA Four SATA connectors
PCIe Mini Card One socket onboard
LAN 10/100/1000BASE-T compatible RJ45 on I/O panel
USB 2.0 Four USB 2.0 on I/O panel,
Four USB 2.0/3.0 on I/O panel
Serial Port One DB-9 on I/O panel
One onboard 10-pin header
Smart Battery One 10-pin header for Smart Battery management
communications (connects to ADLINK BattMan board)
LPC Debug Onboard 20-pin header
KB/Mouse Two 6-pin mini DIN (on rear I/O panel)
Feature Connectors SMBus, I2C, module control signals
Miscellaneous Reset, Power LED, HDD LED, Buzzer
COM Express™ Type 6 Reference Carrier Board
in ATX Form Factor
Express-BASE6
Functional Diagram
Features
Seven PCI Express x 1 slots
PCI Express x16 / SDVO slot
Supports three Digital Display Interfaces (DDI)
with HDMI/DVI/DisplayPort output
LPC based Super I/O
Dual BIOS (SPI and LPC)
Conforms to COM Express™ Carrier Design
Guide
COM Express Carrier Design Guide
Provides detailed information on designing your own custom carrier
board for COM Express modules.
Download from the Express-BASE6 product webpage at www.adlinktech.com
Ordering Information
Modules
Model Number Description/Configuration
Express-BASE6 COM Express Type 6 Reference Carrier Board in ATX
form factor
Audio
Codec
ALC888
Transformer
PS/2 KB/MS
USB4
USB5
USB6
USB7
PCIe lane 0
LPC
Analog VGA (CRT)
DB15
Dual Channel LVDS
SATA0
SATA
SATA1
SATA
SATA2
SATA
SATA3
SATA
HDA
Audio 7.1
Channel
S/PDIF out
4GPI–4GPO
Header
SMBus
Header
Header
SPI
I2C
Header
2nd SPI BIOS
Feature / Control Signals
Header
Flat Panel Control signals
RJ45
GPIO
PCA9535
EEPROM
USB0
USB1
USB2
USB3
PCIe x1
PCIe lane 1 PCIe x1
PCIe lane 2 PCIe x1
PCIe lane 3 PCIe x1
PCIe lane 4 PCIe x1
PCIe lane 5 PCIe x1
PCIe x1 PCIe lane 6
Express
Card
PCIe lane 7
USB 2.0/3.0
LAN
Super I/O
Winbond
W83627DHG
LPC
USB 2.0/3.0
USB 2.0/3.0
USB 2.0/3.0
DDI
Adapter
Card slot
(PCI x16 w/
proprietary pinout)
4x
USB 2.0
DDI1
DDI2
DDI3
PCIe x16
slot
PCIe x16
COM1
COM2
Header
34-pin Header
8-pin Header
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module
This Computer-on-Module Starter Kit gets you going with
Carrier Board Design and Software Verification in no time
Starter Kit - COM Express
Includes
COM Express™ Module
CPU, Memory
Express-BASE Reference Carrier Board
Thermal Solution (heatspreader and heatsink)
Schematics, Design Guide, and User Manuals
ADLINK USB stick with Documentation, Drivers,
BSPs, Libraries
The Starter Kit consists of a COM Express™ core module with ATX size reference carrier board that offers one PCI Express
graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, CRT, LVDS, TV-out, USB 2,0, Gigabit LAN, and
Super I/O. All necessary cables are included.
COM Express
Module Carrier Board Memory Heatsink PSU Accessories
Contents
Standard Items
• Express-BASE reference carrier board
• Accessory kit:
- IDE cable
- SATA cable
- TV out cable
- CF adapter
- PCI 2-slot riser card
- USB Stick with documentation, drivers, libraries, and
BSP for Linux®, WinCE, Embedded XP
- Carrier Design Guide and product manuals
Optional Items
• COM Express™ module of your choice
• Socket-type CPU of your choice
• Memory of your choice
• Thermal solution of your choice (heatspreader, heatsink)
C112-09-P29-30-100-0103.indd 29 2011/1/20 下午 02:28:54
1-29
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module
This Computer-on-Module Starter Kit gets you going with
Carrier Board Design and Software Verification in no time
Starter Kit - COM Express
Includes
COM Express™ Module
CPU, Memory
Express-BASE Reference Carrier Board
Thermal Solution (heatspreader and heatsink)
Schematics, Design Guide, and User Manuals
ADLINK USB stick with Documentation, Drivers,
BSPs, Libraries
The Starter Kit consists of a COM Express™ core module with ATX size reference carrier board that offers one PCI Express
graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, CRT, LVDS, TV-out, USB 2,0, Gigabit LAN, and
Super I/O. All necessary cables are included.
COM Express
Module Carrier Board Memory Heatsink PSU Accessories
Contents
Standard Items
• Express-BASE reference carrier board
• Accessory kit:
- IDE cable
- SATA cable
- TV out cable
- CF adapter
- PCI 2-slot riser card
- USB Stick with documentation, drivers, libraries, and
BSP for Linux®, WinCE, Embedded XP
- Carrier Design Guide and product manuals
Optional Items
• COM Express™ module of your choice
• Socket-type CPU of your choice
• Memory of your choice
• Thermal solution of your choice (heatspreader, heatsink)
C112-09-P29-30-100-0103.indd 29 2011/1/20 下午 02:28:54
How to order Starter Kit – COM Express
ADLINK provides a “tailor made” Starter Kit service. We let you choose your preferred core
module and thermal solution to suit your specic application development needs.
ADLINK also provides a set of Engineering Test Tools to save you time and expedite
your application development
BattMan Smart Battery Management
Reference System
Flat Panel Transfer Board
Please refer to page 9-39
for detailed information
Please refer to page 9-39
for detailed information
Select a core module, memory,
thermal solution, and CPU (for socket
type) according to your needs
Contact an ADLINK sales
representative in your region
Get the specic part number for your
starter kit
C112-09-P29-30-100-0103.indd 30 2011/1/20 下午 02:28:57
1-30
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-31
nanoX-TC
Specifications
Core System
CPU Intel® Atom™ E680 / E680T*, 1.6 GHz, 3.9 W TDP
Intel® Atom™ E660 / E660T*, 1.3 GHz, 3.3W TDP
Intel® Atom™ E640 / E640T*, 1.0 GHz, 3.3W TDP
Intel® Atom™ E620 / E620T*, 600 MHz, 2.7W TDP
(* T versions support -40°C to +85°C wide operating
temperature range)
All processors support Intel® Hyper-Threading and Intel®
Virtualization Technology
L2 cache 512 KB on all processors
Memory Soldered 512 MB, 1 or 2 GB DDR2 at 800 MHz
BIOS License-free bootloader or AMI UEFI BIOS
Hardware Monitor Supply voltages and CPU temperature
Debug Interface XDP SFF-26 extension for ICE debug
Embedded Features Instant on with Intel Bootloader support, OEM BIOS settings,
Board Info & Statistics, ACPI 3.0, Smart Battery Management
support, Watchdog with programmable timer ranges
Expansion Busses 4 PCI Express x1 (0/1/2/3, port 3 is optionally used for
EG20T PCH; no PCIe x4 support)
LPC Bus, SMBus (system) , I2C (user)
4 GPI and 4 GPO (shared with SDIO on optional EG20T)
SPI (supports BIOS only)
Video
2D/3D Graphic Engine Integrated in Intel® Atom™ Processor E6xx
Decoding MPEG2, MPEG4, VC1, WMV9, H.264 and DivX
Encoding MPEG4, H.264 (baseline at L3)
LVDS Interface Single channel 18- or 24-bit pixel color depths with maximum
resolution of up to 1280x768 @ 60 Hz. Pixel clock rate
between 19.75 MHz (minimum) and 80 MHz (maximum).
SDVO Serial digital video output supporting devices for DVI, TV-out,
analog CRT. Maximum resolution of up to 1280x1024 @ 85
Hz and pixel clock rate up to 160 MHz.
Audio
High Denition Audio Integrated in Intel® Atom™ Processor E6xx
Characteristics Multi-channel audio stream, 32-bit sample depth, sample
rate up to 192 kHz
Audio Codec On carrier (standard support for ALC888)
Multi I/O and Storage
Chipset Integrated in Intel® PCH EG20T
USB Six USB 1.1/2.0 host ports and one USB 1.1/2.0 client port
SATA Two ports supporting SATA 1.5 Gb/s and 3 Gb/s
SDIO port SDIO/MMC supporting SDHC speed class 6 (shared with
GPIO)
SDIO storage TBD
Serial and CAN One RS-232 (RX/TX) and one CAN (AX/RX) port (optional 2x
RS-232 w/o CAN)
LAN
GbE MAC Integrated in Intel® EG20T PCH
PHY Realtek RTL8211CL
Speed 10/100/1000 Mbps
Power Specications
Input Power 4.75 V – 21 V wide range, supports AT mode and ATX mode
(with additional 5 Vsb)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 5W at 5V typical, 3W idle
Smart Battery Support Yes
Mechanical and Environmental
Operating Temp 0°C to 70°C or industrial grade -40°C to 85°C
Storage Temp -20°C to 80°C or industrial grade -40°C to 85°C
Humidity 90% at 60°C
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Compatibility PICMG COM Express™ COM.0 R2.0 Type 10
Mechanical Ultra size 84 mm x 55 mm (3.3” x 2.17”)
Certication CE, FCC, HALT
Operating Systems
Standard Support Windows® XP / Windows® 7
Linux®
Extended Support (BSP) Embedded XP
WinCE 6.0
Linux® / Moblin
VxWorks 6.x
QNX
AIDI Library
Ultra size COM Express™ Type 10 Pinout Compatible
Module with Intel® Atom™ Processor E6xx and EG20T PCH
Features
Intel® Atom™ Processor E6xx from 600 MHz up to 1.6 GHz
Up to 2 GB soldered DDR2 SDRAM at 800 MHz
24-bit LVDS and SDVO support
4x PCI Express x1 lanes
Optional Intel® Platform Controller Hub EG20T
for USB, LAN, SDIO, Serial & CAN bus and SATA
COM Express™ COM.0 R2.0 Type 10 Pinout
Ultra form factor 84 x 55 mm
Operation at 0°C to +70°C or -40°C to +85°C
1-32
Functional Diagram
Ordering Information
Modules
Model Number Description
nanoX-TC-E680-1G Intel® Atom™ E680 processor at 1.6GHz with PCH EG20T
nanoX-TC-E680T-1G Intel® Atom™ E680T processor at 1.6GHz with PCH EG20T,
Industrial grade temperature range from -40°C to 85°C
nanoX-TC-E660-1G Intel® Atom™ E660 processor at 1.3GHz with PCH EG20T
nanoX-TC-E660T-1G Intel® Atom™ E660T processor at 1.3GHz with PCH EG20T,
Industrial grade temperature range from -40°C to 85°C
nanoX-TC-E640-1G Intel® Atom™ E640 processor at 1.1GHz with PCH EG20T
nanoX-TC-E640T-1G Intel® Atom™ E640T processor at 1.1GHz with PCH EG20T,
Industrial grade temperature range from -40°C to 85°C
nanoX-TC-E620-1G Intel® Atom™ E620 processor at 600 MHz with PCH EG20T
nanoX-TC-E620T-1G
Intel
®
Atom™ E620T processor at 600 MHz with PCH EG20T,
Industrial grade temperature range from -40°C to 85°C
Accessories
Model Number Description
Heat Spreaders
HTS-nXTC-B Heatspreader for nanoX-TC with threaded standoffs for
bottom mounting
HTS-nXTC-BT Heatspreader for nanoX-TC with throughole standoffs for
top mounting
Passive Heatsinks
THS-nXTC-B Multidirectional Heatsink for nanoX-TC with threaded
standoffs for bottom mounting
Switch
GPIO
PCA9535
BC
2x SATA (port 0,1)
SDVO
Intel® Atom™
Processor
E6xx(T)
Intel® Platform
Controller Hub
EG20T
Soldered Memory
512 MB ~ 2 GB DDR2
3x PCIe x1 (port 1~3)
PCIe x1 (port 0)
PCIe x1 (port 0)
SMBus
18/24-bit LVDS
HDA Audio
LPC bus
4x GPI
4x GP0
SPI
SDIO/MMC port 0
I2C
BIOS
6x USB Host
1x USB Client
UART (Tx/Rx)
CAN bus (Ax/Rx)
LAN PHY
RTL8211CL
XDP
SFF-26
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-33
Specifications
Core System
CPU Intel® Atom™ processor Z530 at 1.6 GHz with 533 MHz FSB,
2.3 watts TDP, supports Hyper-Threading
Intel® Atom™ processor Z510 at 1.1 GHz with 400 MHz FSB,
2.0 watts TDP
Memory Soldered 512/1024 MB non-ECC, unbuffered 400/533 MHz
DDR2
Chipset Intel® System Controller Hub US15W
BIOS AMIBIOS®8 with CMOS backup in 8 Mbit LPC Flash
Hardware Monitor Supply voltages and CPU temperature
Watchdog Timer Programmable timer ranges to generate RESET
Expansion Busses Two PCI Express x1
LPC bus
SMBus / I2C
Video
Chipset GMA 500 integrated on Intel® on System Controller Hub
US15W
Features Ultra low power integrated 3D graphics core with full HD HW
video decode engine and dual independent display support
CRT Interface Analog VGA not supported
LVDS Interface Single channel 18/24-bit at 25~112 MHz
SDVO May be used for any external display device (HDMI/DVI,
analog TV, VGA/CRT and LVDS); includes EDID and
EDID-less support, and a 160 MHz pixel clock
Audio
Chipset Integrated on Intel® System Controller Hub US15W
Type Supports Intel® High Denition Audio codec on carrier board
LAN
Chipset Realtek RTL8111C PCI Express Gigabit Ethernet Controller
Interface 10/100/1000 Mbps with Wake-on-LAN and Alert on LAN
support
Multi I/O
IDE (PATA) Single channel IDE with UDMA (33/66/100) connects to
onboard Solid State Disk of 1 GB up to 8 GB
SATA PATA to SATA bridge
One SATA port
USB Eight USB 2.0 ports capable of transfers up to 480 MB/s; one
port optionally congurable as USB client
Power Specications
Input Power 4.75V ~ 14V wide range input support, with optional 5Vsb for
ATX support
Power States Supports S0, S1, S3, S4, S5
Power Consumption 5 W (with Atom Z510 and 512 MB memory, typical)
Mechanical and Environmental
Operating Temp. 0°C to 60°C
Storage Temp. -20°C to 80°C
Humidity 10% to 90%, storage: 5% to 95% (non condensing)
Shock 15G peak-to-peak, 11ms duration, non-operation
Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis
Operating: 0.5 Grms, 5-500 Hz, each axis
Compatibility PICMG COM Express™ COM.0 Type 1
Mechanical Ultra size 84 mm x 55 mm (3.3” x 2.17”)
Certications CE, FCC
Operating Systems
Standard Support Windows® XP 32-bit
Windows® Vista 32-bit
Linux® 2.6.26 and up
Extended Support Embedded XP BSP
WinCE BSP
Linux® 2.6.x BSP
AIDI I2C Library for Win32, WinCE and Linux®
Ultra size COM Express™ Type 1 Pinout Compatible Module
with Intel® Atom™ Processor Z5xx and US15W Chipset
nanoX-ML
Features
Intel® Atom™ Processor Z530/Z510
Intel® System Controller Hub US15W
One PCIe x1 (opt. 2 without LAN)
18/24-bit LVDS and SDVO
GbE LAN, SATA, USB 2.0, SDIO, LPC
AMIBIOS®8 BIOS
Solid State Disk: 1 GB up to 8 GB
Ultra Compact 84 x 55 mm footprint
1-34
PATA to
SATA
Bridge
LAN
GbE
RT8111C
Intel®Atom™
Z510/Z530
Intel®US15W DDR-2
Memory
Controller
LVDS
18/24-bit
FSB
400/533
MHz
EIDE
PATA
1x
8x
USB 2.0
HDA
Audio
DDR2 400/533
soldered
LPC
Graphics Core
200 MHz
two
PCIe x1
SDIO/
MMC
SDVO
SSD
Solid State Drive
1GB up to 8 GB
SDVO
PATA Slave
Master
SATA
PCIe x1, lane 0
LAN
LPC
BC
I2C
SMBus
Functional Diagram
Ordering Information
Modules
Model Number Description
nanoX-ML-51/512-0 Ultra COM Express™ Type 1 compatible module with Intel®
Atom™ processor Z510 at 1.1 GHz and 512 MB DDR2
nanoX-ML-53/512-0 Ultra COM Express™ Type 1 compatible module with Intel®
Atom™ processor Z530 at 1.6 GHz and 512 MB DDR2
nanoX-ML-51-512/4G Ultra COM Express™ Type 1 compatible module with Intel®
Atom™ Processor Z510 at 1.1 GHz, 512 MB memory and
4 GB SSD storage
nanoX-ML-53-512/4G Ultra COM Express™ Type 1 compatible module with Intel®
Atom™ Processor Z530 at 1.6 GHz, 512 MB memory and
4 GB SSD storage
nanoX-ML-51-1024/4G
Ultra COM Express™ Type 1 compatible module with Intel®
Atom™ Processor Z510 at 1.1 GHz, 1GB memory and
4 GB SSD storage
nanoX-ML-53-1024/4G
Ultra COM Express™ Type 1 compatible module with Intel®
Atom™ Processor Z530 at 1.6 GHz, 1GB memory and
4 GB SSD storage
Accessories
Model Number Description
Heat Spreaders
HTS-nML-B Heatspreader for nanoX-ML (BGA CPU) with threaded
standoffs
Passive Heatsinks
THS-nML-B Low prole Heatsink for nanoX-ML (BGA CPU) with
threaded standoffs
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-35
Specifications
Form Factor
Core Module Interface PICMG® COM Express™ Revision 1.0
Supports Type 1 Basic and Ultra form factor modules
Dimensions 305 mm x 240 mm (AT/ATX)
Expansion Busses Five PCI Express® x1 slots
Two 32-bit PCI™ v2.3 slots
One PCI Express® Mini Card slot
One SDVO ADD2 slot
LPC bus header
BIOS / Debug
POST LEDs Onboard diagnostics for BIOS POST code data and address
on LPC bus
Secondary BIOS Onboard sockets for secondary LPC & SPI BIOS
Active Components
PCI Express Switch PLX PEX8505 switch with PCIE0 input from module
PCI Express to PLX PEX8112 bridge with PCIe x1 input from PEX8505
PCI Bridge switch
Super I/O Winbond WF83627DHG on LPC bus
Audio Codec Realtek ALC888 High Denition Audio Codec
Digital I/O I2C to GPIO bridge PCA9535
Connectors
COM Express™ Connector AB only, one 220-pin (Type 1)
LVDS Onboard 34-pin header
Audio Mic/Line-in/Line-out on I/O panel
SATA Two SATA connectors
PCIe Mini Card One socket onboard (USB + PCIe x1)
LAN 10/100/1000BASE-T compatible RJ45 on I/O panel
USB 2.0 Five on I/O panel, one Mini-USB (client only) and one through
PCIe Mini Card
Serial Port Two DB-9 on I/O panel
Parallel Port One header onboard
Smart Battery One header for Smart Battery management communications
(connects to ADLINK BattMan board)
KB/Mouse Two 6-pin mini DIN (on rear I/O panel)
SDIO/MMC SD socket for bootable storage or function extension
Feature Connectors SMBus, I2C, module control signals, at panel control signals
Miscellaneous Reset, Power LED, HDD LED, Buzzer
Power Standard ATX connector
Switches Onboard RESET button and ATX mini switch
COM Express™ Type 1 Reference Carrier Board
with onboard PCIe-to-PCI Bridge
nanoX-BASE
Features
Six PCI Express® x1 (5 slots, 1 PCIe Mini Card slot)
PCIe-to-PCI bridge, two PCI™ slots
SDVO ADD2 card slot
LPC based Super I/O (enable/disable)
SDIO/MMC support, multiplexed on GPIO
Dual BIOS (both LPC and SPI)
Compatible with PICMG® COM Express™
Carrier Design Guide
1-36
Audio
Codec
ALC888
Super I/O
Winbond
W83627DHG
AB
COM1
COM2
IrDA
PCIe
Switch
PEX 8505
PS/2 KB/MS
PCI
Express
Mini Card
RJ-45
&
2-port
USB
USB0
USB1
NC
USB3
USB4
USB5
LAN
4-port
USB
USB2Mini USB
USB6
PCIe to
PCI bridge
PEX 8112
PCIe (x1)
PCIe (x1)
PCIE0 (x1)
PCIe (x1)
PCIe x16 Slot
PCIe (x1)
PCIe x1 Slot
PCI Slot
PCI Slot
PCI
PCI
PCIE1 (x1)PCIe x1 Slot
PCIE2 (x1)PCIe x1 Slot
PCIE3 (x1)PCIe x1 Slot
LPC
LPT1
Single Channel LVDS
Header
SATA0
SATA
SATA1
SATA
HDA / AC’97
Audio 7.1
Channel
GPIO / SDIO
Header
SDIO / MMC
PCIe x16 SlotSDVO Flat cable in
SMBus
Header
GPIO
PCA9535
Header
2nd LPC BIOS
I2C
EEPROM
Header
LPC
Feature / Control Signals
Header
Flat Panel Control Signals
Header
Functional Diagram
Ordering Information
Carrier
Model Number Description
nanoX-BASE COM Express™ Type 1 Reference Carrier Board with
onboard PCIe to PCI bridge
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module
This Computer-on-Module Starter Kit gets you going with
Carrier Board Design and Software Verification in no time
Starter Kit - nanoX
Includes
COM Express™ Type 1 core module
Thermal solution (heatspreader or heatsink)
nanoX-BASE Reference Carrier Board
LVDS flat panel evaluation kit
Schematics, Design Guide, and User Manuals
ADLINK USB stick with Documentation, Drivers,
BSPs, Libraries
The nanoX Starter Kit consists of a COM Express™ Type 1 core module with ATX size reference carrier board that provides
four PCI Express x1 slots, one PCI Express x16 slot (x1 link), two PCI slots, an SDVO/ADD2 slot, one PCIe Mini Card slot, one
SDIO/MMC slot, USB 2.0, Gigabit LAN and Super I/O. ADLINK also provides additional development tools including a veried
10.1” LVDS panel, LVDS-to-TTL conversion board, ADD2 DVI card, power supply, thermal solution and cabling accessories.
COM Express Type
1/10 Module
Carrier Board LVDS Panel FPTB
Heatsink PSUADD2
Accessories
Contents
Standard Items
• nanoX-BASE reference carrier board
• 10.1” (1024 x 600) LVDS at panel
• SDVO to DVI adapter
• Flat panel transfer board
• ATX power supply
Optional Items
• COM Express Type 1 core module of your choice
• Thermal solution of your choice (heatspreader or heatsink)
• Accessory kit:
- LVDS at panel cabling
- SATA, SDVO, USB cables
- Power cord
- USB stick with documentation, drivers, libraries, and BSP for
Linux, Embedded XP
- Carrier Design Guide and product manuals
09-37-38-100-0103.indd 37 2011/1/20 下午 02:28:03
1-37
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module
This Computer-on-Module Starter Kit gets you going with
Carrier Board Design and Software Verification in no time
Starter Kit - nanoX
Includes
COM Express™ Type 1 core module
Thermal solution (heatspreader or heatsink)
nanoX-BASE Reference Carrier Board
LVDS flat panel evaluation kit
Schematics, Design Guide, and User Manuals
ADLINK USB stick with Documentation, Drivers,
BSPs, Libraries
The nanoX Starter Kit consists of a COM Express™ Type 1 core module with ATX size reference carrier board that provides
four PCI Express x1 slots, one PCI Express x16 slot (x1 link), two PCI slots, an SDVO/ADD2 slot, one PCIe Mini Card slot, one
SDIO/MMC slot, USB 2.0, Gigabit LAN and Super I/O. ADLINK also provides additional development tools including a veried
10.1” LVDS panel, LVDS-to-TTL conversion board, ADD2 DVI card, power supply, thermal solution and cabling accessories.
COM Express Type
1/10 Module
Carrier Board LVDS Panel FPTB
Heatsink PSUADD2
Accessories
Contents
Standard Items
• nanoX-BASE reference carrier board
• 10.1” (1024 x 600) LVDS at panel
• SDVO to DVI adapter
• Flat panel transfer board
• ATX power supply
Optional Items
• COM Express Type 1 core module of your choice
• Thermal solution of your choice (heatspreader or heatsink)
• Accessory kit:
- LVDS at panel cabling
- SATA, SDVO, USB cables
- Power cord
- USB stick with documentation, drivers, libraries, and BSP for
Linux, Embedded XP
- Carrier Design Guide and product manuals
09-37-38-100-0103.indd 37 2011/1/20 下午 02:28:03
How to order Starter Kit – nanoX
ADLINK provides a “tailor made” Starter Kit service. We let you choose your preferred core
module and thermal solution to suit your specic application development needs.
ADLINK also provides a set of Engineering Test Tools to save you time and expedite
your application development
BattMan Smart Battery Management
Reference System
LPC POST Debug Card
Please refer to page 9-40
for detailed information
Please refer to page 9-39
for detailed information
Select a core module and thermal
solution according to your needs
Contact an ADLINK sales
representative in your region
Get the specic part number for your
nanoX Starter Kit
09-37-38-100-0103.indd 38 2011/1/20 下午 02:28:07
1-38
Computer-On-Modules
http://www.adlinktech.com/Computer-on-Module1-39
Useful time saving tools to expedite
your application development
Engineering Test Tools
BattMan Smart Battery
Management Reference System
Flat Panel Transfer Board
PCIe x16 MXM Carrier Board
The BattMan Smart Battery Management Reference System supports
two Smart Batteries and provides ATX power for COM Express mobile
embedded systems. The BattMan system allows developers to
easily implement battery power in COM Express based applications
requiring high mobility.
Contents
• BattMan module
• Two Smart Batteries
• Power adapter and cabling
• USB disk with BattMan board reference schematic, drivers
and documentation
The Flat Panel Transfer Board (FPTB) supports prototyping and
verication of LVDS and TTL at panel displays with Express-BASE
and nanoX-BASE carrier boards and is equipped with an LVDS-to-
TTL converter to allow users to implement TTL displays with COM
Express systems that support LVDS only. Onboard PWM circuitry
supports backlight control for LVDS and TTL displays.
ADLINK’s PCIe x16 MXM carrier boards allow for discrete PCIe
graphics expansion using a Mobile PCI Express Module (MXM). The
MXM carrier board series supports MXM-II and MXM-III graphics
modules, allowing developers to evaluate, prototype and verify MXM
graphics modules before full integration into the custom carrier board
design.
Ordering Information
Model Number Description/Configuration
StarterKit-Battman Smart Battery Reference Platform for COM Express™
modules (includes two Smart Batteries)
Ordering Information
Model Number Description/Configuration
FPTB Flat Panel Transfer Board for LVDS-to-TTL signal
conversion
LCD 10.1” TFT HannStar 10.1” LVDS at panel display
(HSD100IFW1-A00)
LVDS 30P to 34P+8P cable LVDS cable to connect HannStar HSD100IFW1-A00
LVDS at panel display to FPTB, Express-BASE, or
nanoX-BASE
LVDS cable for FPTB FPTB LVDS-to-LVDS cable
Note: Included in the Starter Kit - nanoX.
Ordering Information
Model Number Description/Configuration
MXM2CR PEG x16 MXM-II carrier board (w/o MXM graphics module)
MXM3CR PEG x16 MXM-III carrier board (w/o MXM graphics module)
MXM3-E4690 MXM-III module based on ATI Radeon™ E4690 GPU
1-40
PCIe x16-to-two-x8 Adapter Card
LPC POST Debug Board
COM-T6T2 Adapter Board
T6-DDI Video Adapter Card
COM Express Type 6 to Type 2 Conversion
COM Express Type 6 DDI to HDMI/DVI/DisplayPort
The ADLINK PCIe x16-to-two-x8 adapter card allows the use of two
PCIe x8 add-on cards from a single PCIe x16 slot.
LPC POST debug board with secondary LPC BIOS and POST
status LED. Can be easily connected to the LPC debug port on the
Computer-on-Module to monitor BIOS POST status. A single step
switch is provided for BIOS debug verication.
The COM-T6T2 adapter board allows COM Express Type 6 modules
to be backwards compatible with Type 2 carrier boards. A SATA-
to-PATA converter and PCIe-to-PCI bridge are onboard to provide
signal conversion to the required COM Express Type 2 interfaces.
The SDVO port is rerouted to correspond with the Type 2 pin
denition (no PCIe x16).
The T6-DDI Video Adapter Card provides connector access to
COM Express Type 6 module Digital Display Interface (DDI) outputs.
HDMI, DVI and DisplayPort outputs are provided. The T6-DDI is
installed on the ADLINK Express-BASE6 Type 6 carrier board using
a PCIe x16 slot with proprietary pinout.
Ordering Information
Model Number Description/Configuration
P16TO28 PCIe x16-to-two-x8 adapter card
Ordering Information
Model Number Description/Configuration
LPC_DEBUG_2 LPC POST debug board with secondary LPC BIOS
Ordering Information
Model Number Description/Configuration
COM-T6T2 COM Express Type 6 to Type 2 adapter card (w/ SDVO)
Ordering Information
Model Number Description/Configuration
T6-DDI COM Express Type 6 DDI-to-HDMI/DVI/DisplayPort
adapter card
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
ADLINK Technology:
STARTERKIT-NANOX-TC-E680-1G STARTERKIT-NANOX-TC-E640-1G STARTERKIT-NANOX-TC-E620-1G