October 2017 DocID031000 Rev 1 1/10
This is information on a product in full production.
www.st.com
ESDA37W
Dual Transil™ array for ESD protection
Datasheet - production data
Features
Unidirectional device
Low leakage current (IR max. < 1 µA at VRM)
300 W peak pulse power (8/20 µs)
Benefits
High ESD protection level: up to 30 kV
High integration
Suitable for high density boards
Complies with the following
standards
IEC 61000-4-2 (exceeds level 4) :
30 kV (air discharge)
30 kV (contact discharge)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Entertainment
Signal communications
Connectivity
Comfort and convenience
Description
This device is a diode array designed to protect 1
line or 2 lines against ESD transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required.
It can also be used a bidirectional suppressor by
connecting only pin 1 and 2.
Figure 1: Functional diagram
SOT323-3L
3
1
2
1
2
3
Characteristics ESDA37W
2/10 DocID031000 Rev 1
1 Characteristics
Table 1: Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
Vpp Peak pulse voltage(1)
IEC 61000-4-2:
Contact discharge
Air discharge
30
30
kV
Ppp Peak pulse power (8/20 μs) 300 W
Ipp Peak pulse current (8/20 μs) ESDA37W 6.3 A
Tj Operating junction temperature range -40 to 150 °C
Tstg Storage junction temperature range -65 to 150 °C
TL Maximum lead temperature for soldering during 10 s at 5 mm from
case 260 °C
Notes:
(1)For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 2: Electrical characteristics (definitions)
Table 2: Electrical characteristics (Tamb = 25 °C)
Order code
VBR at IR IRM at VRM Rd(1) αT(2) Cline VF at IF
Min. Max. Max. Typ. Max. Typ. at 0 V bias Max.
V V mA µA V mΩ 10-4/°C pF V mA
ESDA37W 37 43.3 1 1 36 2400 11 48 0.9 10
Notes:
(1)Square pulse Ipp = 15 A, tp = 2.5 µs
(2)∆ VBR = αT x (Tamb -25 °C) x VBR (25 °C)
Symbol Parameter
V = Breakdown voltage
I = Leakage current
I = Forward current
I = Peak pulse current
I = Breakdown current
V = Forward voltage drop
C
R
BR
RM
PP
R
F
V = Clamping voltage
= Capacitance
= Dynamic impedance
T = Voltage temperature
CL
F
d
α
V
cl
V
BR
V
RM
Slope = 1/Rd
V
F
I
F
I
RM
I
PP
I
V
V = Stand-off voltage
RM
ESDA37W Characteristics
DocID031000 Rev 1 3/10
1.1 Characteristics (curves)
Figure 3: Peak pulse power dissipation versus
initial junction temperature
Figure 4: Peak pulse power versus exponential
pulse duration (maximum values)
Figure 5: Variation of clamping voltage versus
peak pulse current (maximum values) Figure 6: Variation of leakage current
0
50
100
150
200
250
300
350
25 50 75 100 125 150 175
PPP(W)
Tj(°C)
8/20µs
10
100
1000
10 100 1000
P
PP
(W)
t
p
(µs)
Tjinitial = 25 °C
maximum value
0.1
1
10
100
20 25 30 35 40 45 50 55 60
I
PP
(A)
V
CL
(V)
T
j
initial = 25°C
8/20 µs
0.1
1
10
100
1000
25 50 75 100 125 150 175
I
r
(nA)
Tj(°C)
ESDA37W (V
R
=V
RM
=36V)
Application and design guidelines ESDA37W
4/10 DocID031000 Rev 1
2 Application and design guidelines
Refer to STMicroelectronics application note:
AN2689: Protection of automotive electronics from electrical hazards, guidelines for
design and component selection.
ESDA37W Package information
DocID031000 Rev 1 5/10
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Epoxy meets UL 94,V0
Lead-free package
3.1 SOT323-3L package information
Figure 7: SOT323-3L package outline
L
H
c
b
E
e
θ
A
A1
D
Package information ESDA37W
6/10 DocID031000 Rev 1
0.95
(0.037)
1.0
(0.039)
2.9
(0.114)
0.50
(0.019)
0.8
(0.031)
Table 3: SOT323-3L package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.8 1.1 0.031 0.043
A1 0.0 0.1 0.000 0.003
b 0.25 0.4 0.0098 0.0157
c 0.1 0.26 0.003 0.0102
D 1.8 2.0 2.2 0.070 0.078 0.086
E 1.15 1.25 1.35 0.0452 0.0492 0.0531
e 0.60 0.65 0.70 0.024 0.026 0.028
H 1.8 2.1 2.4 0.070 0.082 0.094
L 0.1 0.2 0.30 0.004 0.008 0.012
ϴ 0 30° 0 30°
Figure 8: SOT323-3L recommended footprint (dimensions in inches)
ESDA37W Recommendation on PCB assembly
DocID031000 Rev 1 7/10
4 Recommendation on PCB assembly
4.1 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Use solder paste with fine particles: powder particle size 20-45 µm.
4.2 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system,
not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
4.3 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. A
symmetrical layout is recommended, to avoid any tilt phenomena caused by
asymmetrical solder paste due to solder flow away.
Recommendation on PCB assembly ESDA37W
8/10 DocID031000 Rev 1
4.4 Reflow profile
Figure 9: ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component
movement.
250
0
50
100
150
200
240210180150120906030 300270
-6°C/s
240-245 °C
2-3°C/s
Temperature (°C) -2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90 max)
ESDA37W Ordering information
DocID031000 Rev 1 9/10
5 Ordering information
Figure 10: Ordering information scheme
Table 4: Ordering information
Order code Marking(1) Package Weight Base qty. Delivery mode
ESDA37W E37 SOT323-3L 6.6 mg 3000 Tape and reel
Notes:
(1)The marking can be rotated by multiples of 90° to differentiate assembly location.
6 Revision history
Table 5: Document revision history
Date Revision Changes
18-Dec-2017 1 First issue.
ESDA XX W
ESD Array
Minimum breakdown voltage
Package
W= SOT323-3L
ESDA37W
10/10 DocID031000 Rev 1
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