124 High-frequency Relay G6Z
Safety Precautions
■Precautions for Correct Use
Please observe the following precautions to prevent failure to
operate, malfunction, or undesirable effect on product performance.
High-frequency Characteristics Measurement Method
and Measurement Substrate
High-frequency characteristics for the G6Z are measured in the way
shown below. Consult your OMRON representative for details on
50-Ω models.
Measurement Method for 75-Ω Models
Through-hole Substrate (75-Ω Models, E-shape or Y-shape)
SMD-type Substrate (75-Ω Models, E-shape or Y-shape)
Substrate for High-frequency Characteristic Compensation
(75-Ω Models, E-shape or Y-shape)
Substrate Types
Material: FR-4 glass epoxy (glass cloth impregnated with epoxy
resin and copper laminated to its outer surface)
Thickness: 1.6 mm
Thickness of copper plating:18 μm
Note: 1. The compensation substrate is used when measuring the
Relay’s insertion loss. The insertion loss is obtained by
subtracting the measured value for the compensation
substrate from the measured value with the Relay
mounted to the high-frequency measurement substrate.
Note: 2. For convenience, the diagrams of the high-frequency
measurement substrates given here apply both to models
with an E-shape terminal structure and to models with a
Y-shape terminal structure.
Note: 3. Be sure to mount a standoff tightly to the through-hole
substrate.
Note: 4. Use measuring devices, connectors, and substrates that
are appropriate for 50 Ω and 75 Ω respectively.
Note: 5. Ensure that there is no pattern under the Relay.
Otherwise, the impedance may be adversely affected and
the Relay may not be able to attain its full characteristics.
Handling
Do not use the Relay if it has been dropped. Dropping the Relay may
adversely affect its functionality.
Protect the Relay from direct sunlight and keep the Relay under nor-
mal temperature, humidity, and pressure.
Flow Soldering
Solder: JIS Z3282, H63A
Soldering temperature: Approx. 250°C (260°C if the DWS method is
used)
Soldering time: Approx. 5 s max. (approx. 2 s for the first time and
approx. 3 s for the second time if the DWS method is used)
Be sure to make a molten solder level adjustment so that the solder
will not overflow on the PCB.
G6Z
75-Ω terminating
resistance
Network vector analyzer
(Agilent Technologies)
50Ω/75Ω adapter
(Agilent Technologies)
11852B-004
HP8753D
1.4
0.4
30
40
40 30
6.3 0.95
3.59
1
4-dia. through-hole
0.6-dia. through-hole
(Unit: mm)
0.4
1.4
30
40
30
40 3.91
1
0.95
0.6-dia. through-hole
4-dia. through-hole
(Unit: mm)
6.3
20
30.7
1
0.95
40 30
4-dia. through-hole
0.6-dia. through-hole
(Unit: mm)