Specifications (characteristics)
Recommended soldering patternExternal dimensions
(Unit: mm)
Do not connect
#2 and #3 to external device.
Internal connection
(Unit: mm)
#4 #4 #3
#1 #2
#3
#1
0.5 5.5 (0.9) (0.9)
1.9
#2
3.2
2.38
2.54 max. 3.8 max.
8.0 max.
32.768k
571E
1.3
1.91.31.9
1.3 4.2
Series resistance
MC-306
• High-density mounting-type SMD.
•
Photolithography finished allows uniform and stable performance.
• Excellent reliability and environmental capability.
• 2.54mm thickness is equal to SMD-type IC.
Item
Nominal frequency
Temperature
range
Maximum drive level
Soldering condition
Frequency tolerance (standard)
Peak temperature (frequency)
Temperature coefficient (frequency)
Load capacitance
Series resistance
Motional capacitance
Shunt capacitance
Insulation resistance
Aging
Shock resistance
Symbol
f
TSTG
TOPR
GL
TSOL
∆f/f
θT
a
CL
R1
C1
C0
IR
fa
S.R.
Specifications
32.768 kHz 20.000 kHz to 165.000 kHz
-55˚C to +125˚C
-40˚C to +85˚C
1.0µW max.
Twice at under 260˚C within 10 sec.
or under 230˚C within 3 min.
±20ppm, ±50ppm ±50ppm, ±100ppm
25˚C ±5˚C
-0.04ppm/˚C2max.
6pF to ∞
50 kΩmax. 55 kΩto 10 kΩ
1.8fF typ. 4.0fF to 0.6fF
0.9pF typ. 2.0pF to 0.6pF
500 MΩmin.
±3ppm/Y max. ±5ppm/Y max.
±5ppm max.
Remarks
Stored as bare product after unpacking
Ta=25˚C, DL=0.1µW
Please specify
As per below table
Ta=25˚C ±3˚C, first year
Three drops on a hard board from 75 cm or excitation
test with 3000G x 0.3ms x 1/2 sine wave x 3 directions
Storage temperature
Operating temperature
Actual size
Frequency (kHz)
Series resonance
resistance (Ω)
20 ≤f < 30
55K Ωmax.
30 ≤f < 40
45K Ωmax.
40 ≤f < 60
20K Ωmax.
60 ≤f < 70
15K Ωmax.
70 ≤f < 120
12K Ωmax.
120 ≤f < 165
10K Ωmax.
SMALL SMD LOW / MEDIUM-FREQUENCY
CRYSTAL UNIT
There are some cases that a parts of the cylindrical capsule of quartz unit expose on the surface of the molding material.
http://www.spezial.cz - - - spezial@spezial.cz - - - Hotlines: Tel (02) 2434 2200 - - - Fax (02) 2434 3200
