Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 LM2757 Switched-Capacitor Boost Regulator With High Impedance Output in Shutdown 1 Features 3 Description * The LM2757 is a constant-frequency pre-regulated switched-capacitor charge pump that operates at 1.25 MHz to produce a low-noise regulated output voltage. The device can be configured to provide up to 100 mA at 4.1 V, 110 mA at 4.5 V, or 180 mA at 5 V. Excellent efficiency is achieved without the use of an inductor by operating the charge pump in a gain of either 3/2 or 2 according to the input voltage and output voltage option selection. 1 * * * * * * * * Dual Gain Converter (2x, 3/2x) With up to 93% Efficiency Inductorless Solution Uses Only 4 Small Ceramic Capacitors Total Solution Area < 12 mm2 True Input-Output and Output-Input Disconnect Up to 180-mA Output Current Capability (5 V) Selectable 4.1-V, 4.5-V or 5-V Output Pre-Regulation Minimizes Input Current Ripple 1.24-MHz Switching Frequency for Low-Noise, Low-Ripple Output Voltage Integrated Overcurrent and Thermal Shutdown Protection 2 Applications * * * * * * * USB/USB-OTG/HDMI Power Supercapacitor Charger Keypad LED Drive Audio Amplifier Power Supply Low-Current Camera Flash General Purpose Li-Ion-to-5-V Conversion Cellular Phone SIM Cards The LM2757 presents a high impedance at the VOUT pin when shut down. This allows for use in applications that require the regulated output bus to be driven by another supply while the LM2757 is shut down. The LM2757 device comes in a tiny 12-pin 0.4-mm pitch DSBGA package. A perfect fit for spaceconstrained, battery-operated applications, the device requires only 4 small, inexpensive ceramic capacitors. Built-in soft-start, overcurrent protection, and thermal shutdown features are also included in this device. Device Information(1) PART NUMBER LM2757 PACKAGE DSBGA (12) BODY SIZE (MAX) 1.641 mm x 1.581 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application VIN = 3 V - 5.5 V VIN B2,B3 CIN A3 1 F VOUT VOUT = 4.1 V (100 mA), 4.5 V (110 mA) 5 V (180 mA) A2 C1+ 1 F COUT C1 0.47 F B1 A1 C1C2+ LM2757 M0 C2 0.47 F M1 C3 C2- GND D3 D2 C1,C2 *Bump D1 is No Connect (NC) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Options....................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 10 8.1 Overview ................................................................. 10 8.2 Functional Block Diagram ....................................... 10 8.3 Feature Description................................................. 10 8.4 Device Functional Modes........................................ 11 9 Application and Implementation ........................ 13 9.1 Application Information............................................ 13 9.2 Typical Application ................................................. 13 10 Power Supply Recommendations ..................... 18 11 Layout................................................................... 19 11.1 Layout Guidelines ................................................. 19 11.2 Layout Example .................................................... 19 12 Device and Documentation Support ................. 20 12.1 12.2 12.3 12.4 12.5 12.6 Device Support .................................................... Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 20 20 20 20 20 20 13 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (May 2013) to Revision F * Added Device Information and Pin Configuration and Functions sections, ESD Rating table, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sections. ............................................... 1 Changes from Revision D (May 2013) to Revision E * 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 18 Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 5 Device Options Table 1. Mode Selection Definition M0 M1 OUTPUT VOLTAGE MODE 0 0 Device shutdown, output high impedance 0 1 5V 1 0 4.5 V 1 1 4.1 V 6 Pin Configuration and Functions YFQ Package 12-Pin DSBGA Top View (left); Bottom View (right) A1 A2 A3 A3 A2 A1 B1 B2 B3 B3 B2 B1 C1 C2 C3 C3 C2 C1 D1 D2 D3 D3 D2 D1 Pin Functions PIN NUMBER NAME TYPE DESCRIPTION A1 C2+ Power Flying Capacitor C2 Connection A2 VOUT Power Regulated Output Voltage A3 C1+ Power Flying Capacitor C1 Connection B1 C1- Power Flying Capacitor C1 Connection B2 VIN Power Input Voltage Connection B3 VIN Power Input Voltage Connection C1 GND Ground Ground Connection C2 GND Ground Ground Connection C3 C2- Ground Flying Capacitor C2 Connection D1 NC NC D2 M1 Logic input Mode select pin 1 D3 M0 Logic input Mode select pin 0 No Connect -- Do not connect this pin to any node, voltage or GND. Must be left floating. Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 3 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT VIN pin: voltage to GND -0.3 6 V M0, M1 pins: voltage to GND -0.3 6 V Continuous power dissipation (4) Internally Limited Junction temperature, TJ-MAX Maximum lead temperature (soldering, 10 sec.) Storage temperature, Tstg (1) (2) (3) (4) -65 150 C 265 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. All voltages are with respect to the potential at the GND pins. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 145C (typical) and disengages at TJ = 135C (typical). 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge VALUE UNIT 2500 V Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) MIN NOM MAX UNIT Input voltage 2.7 5.5 C Junction temperature, TJ -30 110 C -30 85 C Ambient temperature, TA (1) (2) (3) (3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to the potential at the GND pins. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJMAX-OP = 125C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (RJA), as given by the following equation: TA-MAX = TJ-MAX-OP - (RJA x PD-MAX). 7.4 Thermal Information LM2757 THERMAL METRIC (1) YFQ (DSBGA) UNIT 12 PINS RJA (1) 4 Junction-to-ambient thermal resistance 75 C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 7.5 Electrical Characteristics Unless otherwise specified, typical (TYP) limits in apply for TA = 25C; minimium (MIN) and maximum (MAX) limits apply over the full operating ambient temperature range (-30C TA +85C) . Unless otherwise noted, specifications apply to Typical Application with: VIN = 3.6 V, V(M0) = 0 V, V(M1) = VIN, CIN = C2 = 0.47 F, CIN= COUT = 1 F. (1) (2) (3) PARAMETER VOUT IQ Output voltage Quiescent supply current MIN TYP MAX 3.2 V VIN 5.5 V -30C TA +60C IOUT = 0 to 180 mA V(M0) = 0V, V(M1) = VIN TEST CONDITIONS 4.870 (-2.6%) 5 5.130 (2.6%) 3. V VIN 5.5 V -30C TA +85C IOUT = 0 to 150 mA V(M0) = 0V, V(M1) = VIN 4.865 (-2.7%) 5 5.130 (2.6%) 3 V VIN 5.5 V IOUT = 0 to 110 mA V(M0) = VIN, V(M1) = 0 V 4.406 (-2.1%) 4.5 4.613 (2.5%) 3. V VIN 5.5 V IOUT = 0 to 100 mA V(M0) = VIN, V(M1) = VIN 3.985 (-2.8%) 4.1 4.223 (3%) V(M0) = 0 V, V(M1) = VIN (5 V) IOUT = 0 mA VIN = 3.6 V 2.4 2.79 V(M0) = VIN, V(M1) = 0 V (4.5 V) IOUT = 0 mA VIN = 3.6 V 1.5 1.80 V(M0) = VIN, V(M1) = VIN (4.1 V) IOUT = 0 mA VIN = 3.6 V 1.3 1.65 2 UNIT V mA ISD Shutdown supply current V(M0) = 0 V, V(M1) = 0 V VIN = 3.6 V 1.1 VR Output ivoltage rpple IOUT = 150 mA V(M0) = 0V, V(M1) = VIN (5 V) 3 V VIN 5.5 V 20 SW Switching frequency 3 V VIN 5.5 V VIN Logic input high Input pins: M1, M0 3 V VIN 5.5 V 1 VIN V VIL Logic input low Input pins: M1, M0 3 V VIN 5.5 V 0 0.40 V RPULLDOWN Logic input pulldown resistance (M0, M1) V(M1, M0) = 5.5 V 324 IIH Logic input high current Input Pins: M1, M0 V(M1, M0) = 1.8 V (4) IIL Logic input low current Input Pins: M1, M0 V(M1, M0) = 0 V VG Gain transition voltage ISC Short-circuit output current ION VOUT turnon time from shutdown (5) (1) (2) (3) (4) (5) 0.932 (-25%) 1.242 A mVp-p 1.552 (+25%) MHz 457 k 5 A 10 nA 1.5x to 2x, V(M0) = VIN, V(M1) = 0 V 3.333 V 2x to 1.5x, V(M0) = VIN, V(M1) = 0 V 3.413 Hysteresis, V(M0) = VIN, V(M1) = 0 V 80 1.5x to 2x, V(M0) = 0 V, V(M1) = VIN 3.87 2x to 1.5x, V(M0) = 0 V, V(M1) = VIN 3.93 Hysteresis, V(M0) = 0 V, V(M1) = VIN 60 mV 250 mA 300 s VOUT = 0 V V mV V V All voltages are with respect to the potential at the GND pins. Minimum and maximum limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely norm. CIN, COUT, C1, C2: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. There is a 450-k (typical) pulldown resistor connected internally to each logic input. Turnon time is measured from when the M0 or M1 signal is pulled high until the output voltage crosses 90% of its final value. Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 5 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com 7.6 Typical Characteristics Unless otherwise specified: VIN = 3.6 V, V(M0) = 0 V, V(M1) = VIN, C1 = C2 = 0.47 F, CIN = COUT = 1 F, TA = 25C. Capacitors are low-ESR multi-layer ceramic capacitors (MLCC's). 5-V Mode 4.5-V Mode Figure 1. Efficiency vs. Input Voltage 4.1-V Mode 5-V Mode Figure 3. Efficiency vs. Input Voltage 4.5-V Mode Figure 4. Output Voltage vs. Output Current 4.1-V Mode Figure 5. Output Voltage vs. Output Current 6 Figure 2. Efficiency vs. Input Voltage Figure 6. Output Voltage vs. Output Current Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 Typical Characteristics (continued) Unless otherwise specified: VIN = 3.6 V, V(M0) = 0 V, V(M1) = VIN, C1 = C2 = 0.47 F, CIN = COUT = 1 F, TA = 25C. Capacitors are low-ESR multi-layer ceramic capacitors (MLCC's). 5-V Mode 5-V Mode Figure 7. Output Voltage Ripple vs. Output Current 4.5-V Mode Figure 8. Output Voltage vs. Input Voltage 4.1-V Mode Figure 9. Output Voltage vs. Input Voltage Figure 10. Output Voltage vs. Input Voltage Figure 11. Output Leakage Current, Device Shutdown Figure 12. Output Leakage Current, Device Shutdown Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 7 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com Typical Characteristics (continued) Unless otherwise specified: VIN = 3.6 V, V(M0) = 0 V, V(M1) = VIN, C1 = C2 = 0.47 F, CIN = COUT = 1 F, TA = 25C. Capacitors are low-ESR multi-layer ceramic capacitors (MLCC's). Figure 13. Current Limit vs. Input Voltage Figure 14. Oscillator Frequency vs. Input Voltage Figure 15. Operating Current vs. Input Voltage Figure 16. Shutdown Supply Current vs. Input Voltage VIN = 3.6 V Load = 200 mA Time scale: 100 s/Div CH2: VOUT; Scale: 1V/Div, DC Coupled CH4: IIN; Scale: 200 mA/Div, DC Coupled VOUT = 5-V Mode Load = 200 mA Time scale: 100 s/Div CH1: VIN; Scale: 1V/Div, DC Coupled CH2: VOUT; Scale: 100mV/Div, AC Coupled Figure 17. Start-up Behavior, 5-V Mode 8 Submit Documentation Feedback Figure 18. Line Step, 3.5 V to 4 V Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 Typical Characteristics (continued) Unless otherwise specified: VIN = 3.6 V, V(M0) = 0 V, V(M1) = VIN, C1 = C2 = 0.47 F, CIN = COUT = 1 F, TA = 25C. Capacitors are low-ESR multi-layer ceramic capacitors (MLCC's). VOUT = 5-V Mode VBATT = 4 V Time scale: 10 s/Div CH1: VOUT; Scale: 50mV/Div, AC Coupled CH4: IOUT; Scale: 100mA/Div, DC Coupled Figure 19. Load Step With Li-Ion Battery, 10 mA to 200 mA VOUT = 5-V Mode VBATT = 4 V Time scale: 10 s/Div CH1: VOUT; Scale: 50mV/Div, AC Coupled CH4: IOUT; Scale: 100mA/Div, DC Coupled Figure 20. Load Step With Li-Ion Battery 200 mA to 10 mA Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 9 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com 8 Detailed Description 8.1 Overview The LM2757 is a switched capacitor converter that produces a regulated output voltage of either 5 V, 4.5 V or 4.1 V, depending on the mode selected. The core of the part is a highly efficient charge pump that utilizes fixed frequency pre-regulation to minimize ripple and power losses over wide input voltage and output current ranges. A description of the principal operational characteristics of the LM2757 is shown in the Functional Block Diagram and detailed in Feature Description. 8.2 Functional Block Diagram VIN C1+ GAIN CONTROL V Ref SWITCH CONTROL SWITCH ARRAY 3 G= 2, 2 C1C2+ C2VOUT OSCILLATOR SHORTCIRCUIT PROTECTION EN THERMAL SHUTDOWN M0 M1 VOLTAGE MODE SELECT AND ENABLE CONTROL 1.24 V Ref. Soft-Start Ramp GND 8.3 Feature Description The core of the LM2757 is a two-phase charge pump controlled by an internally generated non-overlapping clock. The charge pump operates by using external flying capacitors C1 and C2 to transfer charge from the input to the output. At input voltages below 3.9 V (typical) for the 5-V mode, the LM2757 operates in a 2x gain, with the input current being equal to 2x the load current. At input voltages above 3.9 V (typical) for the 5-V mode, the part utilizes a gain of 3/2x, resulting in an input current equal to 3/2 times the load current. For the 4.5-V mode, the LM2757 operates in a 2x gain when the input voltage is below 3.35 V (typical) and transitions to a 3/2x gain when the input voltage is above 3.35 V (typical). For the 4.1-V mode, the device utilizes the 3/2x gain for the entire input voltage range. The two phases of the switched capacitor switching cycle are referred to as the phase one and the phase two. During phase one, one flying capacitor is charged by the input supply while the other flying capacitor is connected to the output and delivers charge to the load . After half of the switching cycle [ t = 1/(2 x SW)], the LM2757 switches to phase two. In this configuration, the capacitor that supplied charge to the load in phase one is connected to the input to be recharged while the capacitor that had been charged in the previous phase is connected to the output to deliver charge. With this topology, output ripple is reduced by delivering charge to the output in every phase. 10 Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 Feature Description (continued) The LM2757 uses fixed frequency pre-regulation to regulate the output voltage. The input and output connections of the flying capacitors are made with internal MOS switches. Pre-regulation limits the gate drive of the MOS switch connected between the voltage input and the flying capacitors. Controlling the on resistance of this switch limits the amount of charge transferred into and out of each flying capacitor during the charge and discharge phases, and in turn helps to keep the output ripple very low. 8.3.1 Efficiency Performance Charge-pump efficiency is derived in Equation 1 and Equation 2 (supply current and other losses are neglected for simplicity): IIN = G x IOUT E = (VOUT x IOUT) / (VIN x IIN) = VOUT / (G x VIN) (1) where * * G = the charge pump gain E = efficiency (2) Efficiency is at its highest as G x VIN approaches VOUT. Refer to Typical Characteristics for detailed efficiency data. The transition between gains of 3/2 and 2 are clearly distinguished by the sharp discontinuity in the efficiency curve. 8.3.2 Soft Start The LM2757 employs soft-start circuitry to prevent excessive input inrush currents during start-up. At start-up, the output voltage gradually rises from 0 V to the nominal output voltage. This occurs in 300 s (typical). Softstart is engaged when the device is enabled. 8.3.3 Thermal Shutdown Protection from damage related to overheating is achieved with a thermal shutdown feature. When the junction temperature rises to 145C (typical), the device switches into shutdown mode. The LM2757 disengages thermal shutdown when the junction temperature of the part is reduced to 135C (typical). Due to the high efficiency of the LM2757, thermal shutdown and/or thermal cycling are not encountered when the part is operated within specified input voltage, output current, and ambient temperature operating ratings. If thermal cycling is seen under these conditions, the most likely cause is an inadequate PCB layout that does not allow heat to be sufficiently dissipated out of the device. 8.3.4 Current-Limit Protection The LM2757 charge pump contains current-limit protection circuitry that protects the device during VOUT fault conditions where excessive current is drawn. Output current is limited to 250 mA (typical). 8.4 Device Functional Modes 8.4.1 Enable and Voltage Mode Selection The LM2757 is enabled when either one of the mode select pins (M0, M1) has a logic High voltage applied to it. There are 450-k pulldown resistors connected internally to each of the mode select pins. The voltage mode is selected according to Table 1. Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 11 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com Device Functional Modes (continued) 8.4.2 Shutdown With Output High Impedance The LM2757 is in shutdown mode when there is a logic Low voltage on both mode select pins (M0, M1). There are also 450-k pulldown resistors connected to both mode select pins, pulling the nodes down to ground when there is no signal present. When in shutdown, the output of the LM2757 is high impedance, allowing an external supply to drive the output line such as in USB OTG or mobile HDMI applications. Refer to the output leakage current graphs in Typical Characteristics for typical leakage currents into the VOUT pin, when driven by a separate supply during shutdown. Output leakage increases with temperature, with the lowest leakage occurring at -30C and the highest leakage at 85C (on which the graph is based). It should be noted when looking at the graphs as the input voltage falls the leakage peaks at around an input voltage of 1.5 V, then goes down as the input voltage decrease to 0 V. The leakage at an input voltage of 0 V is the same as the leakage current when the battery is disconnected from the circuit. 12 Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The LM2757 can create a 4.1-V, 4.5-V or 5-V system rail capable of delivering up to 180 mA of output current to the load. The 1.242-MHz switched capacitor boost allows for the use of small value discrete external components. 9.2 Typical Application 9.2.1 Switched-Capacitor Boost Regulator VIN = 3 V - 5.5 V VIN B2,B3 CIN A3 1 F VOUT VOUT = 4.1 V (100 mA), 4.5 V (110 mA) 5 V (180 mA) A2 C1+ COUT 1 F C1 0.47 F B1 A1 C1C2+ LM2757 M0 C2 0.47 F M1 C3 C2- GND D3 D2 C1,C2 *Bump D1 is No Connect (NC) Figure 21. LM2757 Typical Application 9.2.1.1 Design Requirements Example requirements for typical switched-capacitor boost regulator applications: Table 2. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage range 2.7 V to 5.5 V Output current 0 to 180 mA Boost switching frequency 1.242 MHz 9.2.1.2 Detailed Design Procedure 9.2.1.2.1 Recommended Capacitor Types The LM2757 requires 4 external capacitors for proper operation. Surface-mount multi-layer ceramic capacitors are recommended. These capacitors are small, inexpensive and have very low equivalent series resistance (ESR, 15 m typical). Tantalum capacitors, OS-CON capacitors, and aluminum electrolytic capacitors generally are not recommended for use with the LM2757 due to their high ESR, as compared to ceramic capacitors. For most applications, ceramic capacitors with an X7R or X5R temperature characteristic are preferred for use with the LM2757. These capacitors have tight capacitance tolerance (as good as 10%) and hold their value over temperature (X7R: 15% over -55C to 125C; X5R: 15% over -55C to 85C). Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 13 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com Capacitors with a Y5V or Z5U temperature characteristic are generally not recommended for use with the LM2757. These types of capacitors typically have wide capacitance tolerance (80%, -20%) and vary significantly over temperature (Y5V: +22%, -82% over -30C to +85C range; Z5U: 22%, -56% over a 10C to 85C range). Under some conditions, a 1-F-rated Y5V or Z5U capacitor could have a capacitance as low as 0.1 F. Such detrimental deviation is likely to cause Y5V and Z5U capacitors to fail to meet the minimum capacitance requirements of the LM2757. Net capacitance of a ceramic capacitor decreases with increased DC bias. This degradation can result in lower capacitance than expected on the input and/or output, resulting in higher ripple voltages and currents. Using capacitors at DC bias voltages significantly below the capacitor voltage rating usually minimizes DC bias effects. Consult capacitor manufacturers for information on capacitor DC bias characteristics. Capacitance characteristics can vary quite dramatically with different application conditions, capacitor types, and capacitor manufacturers. It is strongly recommended that the LM2757 circuit be thoroughly evaluated early in the design-in process with the mass-production capacitors of choice. This helps ensure that any such variability in capacitance does not negatively impact circuit performance. The voltage rating of the output capacitor should be 10 V or more. For example, a 10-V 0603 1-F capacitor is acceptable for use with the LM2757, as long as the capacitance does not fall below a minimum of 0.5 F in the intended application. All other capacitors should have a voltage rating at or above the maximum input voltage of the application. The capacitors should be selected such that the capacitance on the input does not fall below 0.7 F, and the capacitance of the flying capacitors does not fall below 0.2 F. Table 3 lists some leading ceramic capacitor manufacturers. Table 3. Manufacturers of Suggested Capacitors MANUFACTURER CONTACT INFORMATION AVX www.avx.com Murata www.murata.com Taiyo-Yuden www.t-yuden.com TDK www.component.tdk.com Vishay-Vitramon www.vishay.com 9.2.1.2.2 Output Capacitor And Output Voltage Ripple The output capacitor in the LM2757 circuit (COUT) directly impacts the magnitude of output voltage ripple. Other prominent factors also affecting output voltage ripple include input voltage, output current, and flying capacitance. Due to the complexity of the regulation topology, providing equations or models to approximate the magnitude of the ripple can not be easily accomplished. But one important generalization can be made: increasing (decreasing) the output capacitance results in a proportional decrease (increase) in output voltage ripple. In typical high-current applications, a 1-F low-ESR ceramic output capacitor is recommended. Different output capacitance values can be used to reduce ripple, shrink the solution size, and/or cut the cost of the solution. But changing the output capacitor may also require changing the flying capacitor and/or input capacitor to maintain good overall circuit performance. Performance of the LM2757 with different capacitor setups in discussed in Recommended Capacitance. High ESR in the output capacitor increases output voltage ripple. If a ceramic capacitor is used at the output, this is usually not a concern because the ESR of a ceramic capacitor is typically very low and has only a minimal impact on ripple magnitudes. If a different capacitor type with higher ESR is used (tantalum, for example), the ESR could result in high ripple. To eliminate this effect, the net output ESR can be significantly reduced by placing a low-ESR ceramic capacitor in parallel with the primary output capacitor. The low ESR of the ceramic capacitor is in parallel with the higher ESR, resulting in a low net ESR based on the principles of parallel resistance reduction. 9.2.1.2.3 Input Capacitor And Input Voltage Ripple The input capacitor (CIN) is a reservoir of charge that aids a quick transfer of charge from the supply to the flying capacitors during the charge phase of operation. The input capacitor helps to keep the input voltage from drooping at the start of the charge phase when the flying capacitors are connected to the input. It also filters noise on the input pin, keeping this noise out of sensitive internal analog circuitry that is biased off the input line. 14 Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 Much like the relationship between the output capacitance and output voltage ripple, input capacitance has a dominant and first-order effect on input ripple magnitude. Increasing (decreasing) the input capacitance results in a proportional decrease (increase) in input voltage ripple. Input voltage, output current, and flying capacitance also affects input ripple levels to some degree. In typical high-current applications, a 1-F low-ESR ceramic capacitor is recommended on the input. Different input capacitance values can be used to reduce ripple, shrink the solution size, and/or cut the cost of the solution. But changing the input capacitor may also require changing the flying capacitor and/or output capacitor to maintain good overall circuit performance. Performance of the LM2757 with different capacitor setups is discussed in Recommended Capacitance. 9.2.1.2.4 Flying Capacitors The flying capacitors (C1, C2) transfer charge from the input to the output. Flying capacitance can impact both output current capability and ripple magnitudes. If flying capacitance is too small, the LM2757 may not be able to regulate the output voltage when load currents are high. On the other hand, if the flying capacitance is too large, the flying capacitor might overwhelm the input and output capacitors, resulting in increased input and output ripple. In typical high-current applications, 0.47-F low-ESR ceramic capacitors are recommended for the flying capacitors. Polarized capacitors (tantalum, aluminum electrolytic, etc.) must not be used for the flying capacitor, as they could become reverse-biased during LM2757 operation. 9.2.1.2.5 Recommended Capacitance The data in Table 4 can be used to assist in the selection of capacitance for each node that best balances solution size and cost with the electrical requirements of the application. As previously discussed, input and output ripple voltages varies with output current and input voltage. The numbers provided show expected ripple voltage with VIN = 3.6 V and a load current of 200 mA at 5-V output, 100 mA at 4.5-V output, and 100 mA at 4.1-V output. Table 4 offers a first look at approximate ripple levels and provides a comparison of different capacitance configurations, but is not intended to ensure performance. With any capacitance configuration chosen, always verify that the performance of the ripple waveforms are suitable for the intended application. The same capacitance value must be used for all the flying capacitors. For output regulation performance with different capacitor configurations, please refer to the output voltage vs. input voltage graphs in Typical Characteristics. The output voltage regulation is typically better when using capacitors with a higher capacitance value and a higher voltage bias rating than the nominal voltage applied to them, as can be seen in the graphs, but this may have an impact in capacitor case size. For typical high-current small solution size applications, 1-F capacitance X5R temperature characteristic rating 0402 (C1005) case size and 10-V bias or higher capacitors can be used for the input, output and flying capacitors. According to current capacitor offerings, there are no capacitors in the 0201 (C0603) case size that satisfy the minimum capacitance requirements of the LM2757 circuit. When selecting capacitors, those with the highest voltage bias rating available from the capacitor supplier are preferred. Table 4. LM2757 Performance With Different Capacitor Configurations (1) CAPACITOR CONFIGURATION (VIN = 3.6 V) 5-V, 200-mA OUTPUT RIPPLE (mV)(typical) 4.5-V, 100-mA OUTPUT RIPPLE (mV) (typical) 4.1-V, 100-mA OUTPUT RIPPLE (mV)(typical) CIN = 1 F, COUT = 1 F, C1 and C2 = 0.47 F 32 12 11 CIN = 0.68 F, COUT = 1 F, C1 and C2 = 0.47 F 32 11 11 CIN = 0.68 F, COUT = 0.47 F, C1 and C2 = 0.47 F 51 151 15 CIN = 0.68 F, COUT = 0.47 F, C1 and C2 = 0.22 F 53 181 18 (1) Refer to the text in Recommended Capacitance for detailed information on the data in this table. Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 15 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com 9.2.1.3 Application Curves 5-V Mode 4.5-V Mode Figure 22. Efficiency vs. Input Voltage Figure 23. Efficiency vs. Input Voltage 4.1-V Mode Figure 24. Efficiency vs. Input Voltage 9.2.2 USB OTG / Mobile HDMI Power Supply The 5-V output mode is normally used for the USB OTG / Mobile HDMI application. Therefore, the LM2757 can be enabled or disabled by applying a logic signal on only the M1 pin while grounding the M0 pin. Depending on the USB/HDMI mode of the application, the LM2757 can be enabled to drive the power bus line (Host), or disabled to put its output in high impedance allowing an external supply to drive the bus line (Slave). In addition to the high-impedance backdrive protection, the output current limit protection is 250 mA (typical), well within the USB OTG and HDMI requirements. 16 Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 VBAT (System Voltage) EN (VM1) LM2757 (Host Mode VBUS Power) USB Connector VM0 VOUT / VBUS (5V) VBUS Dual Role Application Processor ID D+ D- USB OTG Transceiver GND Figure 25. USB OTG / Mobile HDMI 9.2.3 Supercapacitor Flash Driver Using the 5-V output voltage mode, the LM2757 can charge a supercapacitor for LED flash applications while limiting the peak current drawn off the battery during the charge cycle. The LM2757 can be disabled for the Flash event, placing its output in high impedance with the input. In this way, all charge for the flash LED(s) comes directly off the supercapacitor and does not load the main battery line. The LM2757 can be enabled or disabled by applying a logic signal on only the M1 pin while grounding the M0 pin. Special consideration must be given when using supercapacitors for LED flash applications where the voltage on the capacitor is charged to a fixed value. This is due to the possible power management issues that can arise as a result of the high flash current and wide tolerance ranges (V-I characteristics) of typical flash LEDs. If the voltage across the Flash LED(s) is not managed, damage may occur where a relatively low Vf LED is overdriven or places excessive voltage across the bottom control FET. To help avoid this issue, the use of a high-power current sink is advised in applications where the forward voltage specification of the flash LED has a wide range. VOUT = 5V VBAT Charge (M1) LM2757 Supercapacitor Flash Charger Flash LED(s) 2.7 k: R R M0 2.7 k: 0.6F, 5V, Dual Supercapacitor Flash Figure 26. Supercapacitor Flash Driver Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 17 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com 9.2.4 LED Driver The 5-V, 4.5-V, or the 4.1-V mode can be used depending on the forward voltage and load requirements of the LED application. The LM2757 can be enabled or disabled by applying the appropriate combination of logic signals on the M1 and M0 pins. LED current for each string in this application is limited by the voltage across the string's ballast resistor, which is dependent on the output voltage mode selected and the V-I profile of each LED used. VOUT = 4.1V (100 mA), 4.5V (110 mA) 5.0V (180 mA) VBAT M0 M1 LM2757 LED Driver LED(s) D1 DX R R Figure 27. LED Driver 10 Power Supply Recommendations The LM2757 is designed to operate as an inverter over an input voltage supply range between 2.7 V and 5.5 V. 18 Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 11 Layout 11.1 Layout Guidelines Proper board layout helps to ensure optimal performance of the LM2757 circuit. The following guidelines are recommended: * Place capacitors as close to the LM2757 as possible, and preferably on the same side of the board as the device. * Use short, wide traces to connect the external capacitors to the LM2757 to minimize trace resistance and inductance. * Use a low resistance connection between ground and the GND pin of the LM2757. Using wide traces and/or multiple vias to connect GND to a ground plane on the board is most advantageous. 11.2 Layout Example VOUT 1 PF C1+ 1 PF C2+ C1- VIAs to GND Plane C2+ VOUT C1+ C1- VIN VIN GND GND C2- 1 PF VIN C2- GND NC M1 M0 M1 M0 1 PF Figure 28. LM2757 Layout Example Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 19 LM2757 SNVS536F - OCTOBER 2007 - REVISED JULY 2015 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.2 Documentation Support 12.2.1 Related Documentation For related documentation see the following: Texas Instruments Application Note 1112 DSBGA Wafer Level Chip Scale Package (SNVA009). 12.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 20 Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 LM2757 www.ti.com SNVS536F - OCTOBER 2007 - REVISED JULY 2015 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2007-2015, Texas Instruments Incorporated Product Folder Links: LM2757 21 PACKAGE OPTION ADDENDUM www.ti.com 5-Jul-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2757TM/NOPB ACTIVE DSBGA YFQ 12 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -30 to 85 DL LM2757TMX/NOPB ACTIVE DSBGA YFQ 12 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -30 to 85 DL (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Jul-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 7-Jul-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM2757TM/NOPB DSBGA YFQ 12 250 178.0 8.4 LM2757TMX/NOPB DSBGA YFQ 12 3000 178.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.35 1.75 0.76 4.0 8.0 Q1 1.35 1.75 0.76 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Jul-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2757TM/NOPB DSBGA YFQ LM2757TMX/NOPB DSBGA YFQ 12 250 210.0 185.0 35.0 12 3000 210.0 185.0 35.0 Pack Materials-Page 2 MECHANICAL DATA YFQ0012xxx D 0.600 0.075 E TMD12XXX (Rev B) D: Max = 1.641 mm, Min =1.581 mm E: Max = 1.248 mm, Min =1.187 mm 4215079/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. 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