TLP5214A Photocouplers GaAAs Infrared LED & Photo IC TLP5214A Isolated IGBT/Power MOSFET gate drive AC and brushless DC motor drives Industrial Inverters and Uninterruptible Power Supply (UPS) Unit: mm The TLP5214A is a highly integrated 4.0 A output current IGBT gate drive photocoupler housed in a long creepage and clearance SO16L package. The TLP5214A, a smart gate driver photocoupler, includes functions of IGBT desaturation detection, isolated fault status feedback, soft IGBT turn-off, active Miller cramping and under voltage lockout (UVLO). Moreover, this phorocoupler has features of the desaturation leading edge blanking time, filtering time, and optimisation of the soft-shutdown performance for secure operation of applications. This photocoupler is suitable for driving IGBT and power MOSFET used in inverter applications. The TLP5214A consists two GaAAs infrared light-emitting diodes (LEDs) and two high-gain and high-speed ICs. They realize high current, high-speed output control and output fault status feedback. * Peak output current: 4.0 A (max) * Guaranteed performance over temperature: -40 to 110 C * Supply current: 3.8 mA (max) * Power supply voltage: 15 V to 30 V TOSHIBA * Threshold input current: 6 mA (max) Weight: 0.37 g (typ.) * Propagation delay time: 150 ns (max) * DESAT leading edge blanking time: 1.1 s (typ.) * Common mode transient immunity: 35 kV/s (min) 5000 Vrms (min) * Isolation voltage: * UL approved : UL1577, File No.E67349 * c-UL approved :CSA Component Acceptance Service No. 5A, File No.E67349 * Option (D4) VDE: DIN EN60747-5-5 (Note 1) * CQC: GB4943.1, GB8898 Japan Factory * 11-10M1 Construction mechanical rating SO16L EN60065 or EN60950-1, EN62368-1 Height Creepage Distance Clearance Insulation Thickness 2.3 mm (max) 8.0 mm (min) 8.0 mm (min) 0.4 mm (min) (Pending) Note 1: When a EN60747-5-5 approved type is needed, please designate "Option(D4)" Truth Table DESAT FAULT (14Pin DESAT Terminal Input) (3Pin FAULT Terminal Output) UVLO IF (VCC2-VE) VO OFF Not Active ( > VUVLO+) Not Active High Low ON Not Active ( > VUVLO+) Low ( < VDESATth) High High Not Active ( > VUVLO+) High ( > VDESATth) Low ( FAULT) Low ON ON Active ( < VUVLO-) Not Active High Low OFF Active ( < VUVLO-) Not Active High Low Start of commercial production 2017-03 (c)2017 TOSHIBA CORPORATION 1 2017-03-09 TLP5214A Pin Configuration (top view) VE 16 VLED 15 DESAT 14 VCC2 13 VEE 12 ANODE VOUT 11 7 ANODE VCLAMP 10 8 CATHODE 1 VS 2 VCC1 3 FAULT 4 VS 5 CATHODE 6 VEE 9 1: VS 2: VCC1 3: FAULT 4: VS 5: CATHODE 6: ANODE 7: ANODE 8: CATHODE 9: VEE 10: VCLAMP 11: VOUT 12: VEE 13: VCC2 14: DESAT 15: VLED 16: VE Internal Circuit VCC2 UVLO ANODE VOUT CATHODE DESAT DESAT VEE SHIELD VCLAMP VCC1 VCLAMP VE FAULT Vs VLED Note: A 1-F bypass capacitor must be connected between pins 9 and 13, pins 13 and 16. (c)2017 TOSHIBA CORPORATION 2 2017-03-09 TLP5214A Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 C) Characteristics LED Input forward current Input forward current derating (Ta 95C) Peak transient input forward current (Note 1) Peak transient input forward current derating (Ta 95C) Unit IF 25 mA IF/Ta -1 mA/C IFPT 1 A IFPT/Ta -25 mA/C VR 6 V Input power dissipation PD 145 mW PD /Ta -5.0 mW/C VCC1 -0.5 to 7 V IOPH -4.0 A IOPL +4.0 A FAULT output current IFAULT 8 mA FAULT pin voltage VFAULT -0.5 to VCC1 V (VCC2-VEE) -0.5 to 35 V Negative output supply voltage (VE-VEE) -0.5 to 15 V Positive output supply voltage (VCC2-VE) -0.5 to 35 - (VE-VEE) V VO -0.5 to VCC2 V Peak clamping sinking current IClamp 1.7 A Miller clamping pin voltage VClamp -0.5 to VCC2 V DESAT voltage VDESAT VE to VE + 10 V PO 410 mW PO /Ta -14.0 mW/C Topr -40 to 110 C Positive input supply voltage "H" peak output current Ta = -40 to 110 C (Note 2) "L" peak output current Total output supply voltage Output voltage Output power dissipation Output power dissipation derating (Ta 95C) Common Rating Reverse input voltage Input power dissipation derating (Ta 95C) Detector Symbol Operating temperature range Storage temperature range Tstg -55 to 125 C Lead soldering temperature (10 s) (Note 3) Tsol 260 C Isolation voltage (AC, 60 s, R.H. 60%) (Note 4) BVS 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note: A ceramic capacitor (1 F) should be connected between pins 9 and 13, pins 13 and 16 to stabilize the operation of the high gain linear amplifier. Furthermore, in case VE - VEE > 0 V, a bypass capacitor, which has good high frequency characteristic, a ceramic capacitor (1 F) should be connected between pins 9 and 16. Failure to provide the bypassing may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Note 1: Pulse width PW 1 s, 300 pps Note 2: Exponential waveform pulse width PW 0.2 s, f 15 kHz, VCC2 = 15 V Note 3: For the effective lead soldering area. Note 4: This device considered a two-terminal device: All pins on the LED side are shorted together, and all pin on the photodetector side are shorted together. (c)2017 TOSHIBA CORPORATION 3 2017-03-09 TLP5214A Recommended Operating Conditions (Note) Characteristics Symbol Min Typ. Max Unit Total output supply voltage (Note 1) (VCC2-VEE) 15 - 30 V Negative output supply voltage (VE-VEE) 0 - 15 V Positive output supply voltage (VCC2-VE) 15 - 30 - (VE-VEE) V VCC1 3.3 - 5.5 V Positive input supply voltage Input on-state current (Note 2) Input off-state voltage Operating frequency (Note 3) IF(ON) 7.5 - 10 mA VF(OFF) 0 - 0.8 V f - - 50 kHz Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note 1: If the VCC2 rise slope is sharp, an internal circuit might not operate with stability. Please design the VCC2 rise slope under 3.0 V / s. Note 2: Input signal rise time (fall time) 0.5 s. Note 3: Exponential waveform. IOPH -4.0 A ( 90 ns), IOPL 4.0 A ( 90 ns), Ta = 110 C (c)2017 TOSHIBA CORPORATION 4 2017-03-09 TLP5214A Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 110 C, VCC2 - VEE = 15 to 30 V, VE - VEE = 0 V) Symbol Test Circuit Input forward voltage VF IF = 10 mA, Ta = 25C Input reverse current IR Input capacitance Ct VFAULTL Characteristics FAULT low level output voltage FAULT high level output current High level output current (Note 1) IFAULTH IOPH Test Condition Min Typ. Max Unit 1.4 - 1.7 V VR = 5 V - - 10 A V = 0 V, f = 1 MHz, Ta = 25 C - 95 - pF IFAULT = 1.1 mA, VCC1 = 5.5 V - 0.2 0.4 IFAULT = 1.1 mA, VCC1 = 3.3 V - 0.2 0.4 VFAULT = 5.5 V, VCC1 = 5.5 V, Ta = 25 C - - 0.5 VFAULT = 5.5 V, VCC1 = 3.3 V, Ta = 25 C - - 0.3 VO = VCC2 - 4 V - -4.0 -1.2 VO = VCC2 - 7 V - -6.5 -3.0 VO = VEE + 2.5 V 1.2 3.5 - VO = VEE + 7 V 3 5.5 - 90 150 230 V A 1 A Low level output current (Note 1) IOPL Low level output current 2 IOLF VO - VEE = 14 V High level output voltage VOH 3 IO = -100 mA VCC2-0.3 VCC2-0.1 - Low level output voltage VOL 4 IO = 100 mA - 0.1 0.2 VtClamp - 2.5 - ICL VO = VEE + 2.5 V 0.56 1.8 - High level supply current ICC2H 5 IO = 0 mA - 2.4 3.8 Low level supply current ICC2L 6 IO = 0 mA - 2.3 3.8 Blanking capacitor charging current ICHG 7 VDESAT = 2 V -0.33 -0.24 -0.13 Blanking capacitor discharge current IDSCHG 8 VDESAT = 7 V 10 49 - DESAT threshold voltage VDESAT VCC2 - VE VUVLO- 5.9 6.5 7.5 VUVLO+ 9 VO 5 V 10.5 11.6 13.5 VUVLO- 9 VO 5 V 9.2 10.3 11.1 UVLOHYS - 1.3 - Threshold input current (L/H) IFLH 10 VCC2 = 30 V, VO < 5 V - 0.8 6 mA Threshold input voltage (H/L) VFHL VCC2 = 30 V, VO > 5 V 0.8 - - V during fault condition Clamp pin threshold voltage Clamp low level sinking current mA V A mA UVLO threshold voltage UVLO hysteresis V Note: All typical values are at Ta = 25 C Note: This product is more sensitive than conventional products to electrostatic discharge ESD owing to its low power consumption design. It is therefore all the more necessary to observe general precautions regarding ESD when handling this component. Note 1: IO application time 50 s, 1 pulse (c)2017 TOSHIBA CORPORATION 5 2017-03-09 TLP5214A Isolation Characteristics (Note) (Ta = 25 C) Characteristic Symbol Capacitance input to output CS Isolation resistance RS Test Condition Vs = 0 V, f = 1 MHz Min Typ. Max Unit - 1.0 - pF 14 10 - 5000 - - AC, 1 s, in oil - 10000 - DC, 60 s, in oil - 10000 - R.H. 60 %, VS = 500 V AC, 60 s 12 1x10 Vrms Isolation voltage BVS Vdc Note: This device considered a two-terminal device: All pins on the LED side are shorted together, and all pin on the photodetector side are shorted together. (c)2017 TOSHIBA CORPORATION 6 2017-03-09 TLP5214A Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 110 C, VCC2 - V EE = 15 to 30 V, VE - VEE = 0 V) Characteristics Symbol Propagation delay time (Note 1) Test Circuit Test Condition Min Typ. Max LH tpLH IF = 0 10 mA 50 85 150 HL tpHL IF = 10 0 mA 50 90 150 Rg = 10 , IF = 0 10 mA - 32 - Cg = 25 nF, IF = 10 0 mA - 18 - IF = 0 10 mA - - 50 IF = 0 10 mA -80 - 80 Cg = 25 nF - 230 500 Cg = 25 nF - 7.0 8.5 CDESAT = 100 pF, Cg = 10 nF Rg = 10 , VCC2 = 30 V, RF = 2.1 k, VCC1 = 5 V - 2.5 3.5 - 1.1 - - 90 - - 350 550 - 200 - 7 20 - 0.2 0.6 2 VO (min) = 26 V, VFAULT(min) = 2 V 35 - - VO (max) = 1 V, VFAULT(max) = 0.8 V 35 - - Output rise time (10-90 %) (Note 1) tr Output fall time (90-10 %) (Note 1) tf 11 VCC2 = 30 V Pulse with distortion (Note 1) | tpHL-tpLH | Propagation delay skew (device to device) (Note 1) (Note 2) tpsk DESAT sense to 90% delay tDESAT(90%) DESAT sense to 10% delay tDESAT(10%) DESAT leading edge blanking time tDESAT(LEB) DESAT filter time tDESAT(FILTER) DESAT sense to low level FAULT signal delay tDESAT(FAULT) tDESAT(LOW) DESAT input mute tDESAT(MUTE) Common-mode transient immunity at high level output (Note 3) Common-mode transient immunity at low level output (Note 4) ns s ns ns DESAT sense to low propagation delay RESET to high level FAULT signal delay 12 Unit - CDESAT = 100 pF, Rg = 10 , VCC2 = 30 V, RF = 2.1 k, VCC1 = 5.5 V tRESET(FAULT) CMH 13 to 16 CML Ta = 25 C, Rg = 10 , Cg = 25 nF, VCC2 = 30 V, RF = 2.1 k, CF = 15 pF, VCM = 1500 Vp-p s kV/s Note: All typical values are at Ta = 25 C. Note 1: Input signal (f = 10 kHz, duty = 50%, tr = tf = 5 ns or less) CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). Note 3: CMH is the maximum rate of fall of the common mode voltage that can sustained with the output voltage in the logic high state (VO > 26 V or VFAULT > 2 V). Note 4: CML is the maximum rate of rise of the common mode voltage that can sustained with the output voltage in the logic low state (VO < 1 V or VFAULT < 0.8 V). (c)2017 TOSHIBA CORPORATION 7 2017-03-09 TLP5214A Test Circuit Test Circuit 1: IOPH Test Circuit 2: IOPL Test Circuit 3: VOH Test Circuit 4: VOL Test Circuit 5: ICC2H Test Circuit 6: ICC2L (c)2017 TOSHIBA CORPORATION 8 2017-03-09 TLP5214A Test Circuit 7: ICHG Test Circuit 8: IDSCHG Test Circuit 9: VUVLO Test Circuit 10: IFLH Test Circuit 11: tpLH, tpHL, tr, tf, | tpHL-tpLH | IF = 10 mA (P.G.) (f =10 kHz, duty = 50%, tr = tf = 5 ns or less) P.G.: Pulse generator Test Circuit 12: tDESAT(90%), tDESAT(10%), tDESAT(LEB), tDESAT(FILTER), tDESAT(FAULT), tDESAT(Low), tDESAT(MUTE), tRESET(FAULT) IF = 10 mA (P.G.) (f =10 kHz, duty = 50%, tr = tf = 5 ns or less) P.G.: Pulse generator (c)2017 TOSHIBA CORPORATION 9 2017-03-09 TLP5214A Test Circuit 13: CMR_LED1 ON Test Circuit 14: CMR_LED1 OFF Test Circuit 15: CMR_LED2 ON Test Circuit 16: CMR_LED2 OFF (c)2017 TOSHIBA CORPORATION 10 2017-03-09 TLP5214A Characteristics Curves (Note) IF - T a (V) IF - VF IOPH - Ta (VOH - VCC2) - IOPH IOPL - Ta VOL - IOPL (c)2017 TOSHIBA CORPORATION 11 2017-03-09 TLP5214A ICL - Ta (VCLAMP - VEE) - ICL ICC2L, ICC2H - Ta ICC2L, ICC2H - VCC2 ICHG - Ta (c)2017 TOSHIBA CORPORATION VDESAT - Ta 12 2017-03-09 TLP5214A (VOH - VCC2) - Ta VOL - Ta IFLH - Ta VO - IF tpHL, tpLH, |tpHL - tpLH| - Ta (c)2017 TOSHIBA CORPORATION tpHL, tpLH, |tpHL - tpLH| - IF 13 2017-03-09 TLP5214A tpHL, tpLH, |tpHL - tpLH| - VCC2 tDESAT(90%) - Ta tDESAT(10%) - Ta tDESAT(LEB) - Ta tDESAT(FILTER) - Ta (c)2017 TOSHIBA CORPORATION tDESAT(FAULT) - Ta 14 2017-03-09 TLP5214A tDESAT(LOW) - Ta tRESET(FAULT) - Ta Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c)2017 TOSHIBA CORPORATION 15 2017-03-09 TLP5214A Soldering and Storage (1) Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. When using soldering reflow The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be complicated with the interval from the first to the last mountings being 2 weeks. An example of a temperature profile when lead(Pb)-free solder is used When using soldering flow Preheat the device at a temperature of 150 C (package surface temperature) for 60 to 150 seconds. Mounting condition of 260 C within 10 seconds is recommended. Flow soldering must be performed once. When using soldering iron Complete soldering within 10 seconds for lead temperature not exceeding 260 C or within 3 seconds not exceeding 350 C. Heating by soldering iron must be done only once per lead. (2) Precautions for General Storage Avoid storage locations where devices may be exposed to moisture or direct sunlight. Follow the precautions printed on the packing label of the device for transportation and storage. Keep the storage location temperature and humidity within a range of 5 C to 35 C and 45 % to 75 %. Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation of corrosion, which will deteriorate the solderability of the leads. When restoring devices after removal from their packing, use anti-static containers. Do not allow loads to be applied directly to devices while they are in storage. If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. (c)2017 TOSHIBA CORPORATION 16 2017-03-09 TLP5214A Land Pattern Dimensions for Reference Only Unit: mm Marking Lot No. TLP5214A J Part No. (or abbreviation code) Process lot No. Country of origin J; Japan Pin No. 1 (c)2017 TOSHIBA CORPORATION 17 2017-03-09 TLP5214A Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers 1. Applicable Package Package Product Type SO16L Long creepage mini flat coupler 2. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP5214A(TP,E(O Part number: TLP5214A Tape type: TP [[G]]/RoHS COMPATIBLE: E (Note 1) Domestic ID (Country / Region of origin: Japan): (O Note 1 : Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 3. Tape Dimensions Specification Tape Type Division Packing Amount (A unit per reel) TP 1500 3.1 Orientation of Device in Relation to Direction of Feed Device orientation in the carrier cavities as shown in Figure 1. Tape feed TLPXXXX Figure 1 Device Orientation 3.2 Empty Cavities Characteristics Criterion Occurrences of 2 or more successive empty cavities 0 device Single empty cavity Remarks Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel (c)2017 TOSHIBA CORPORATION 18 Not including leader and trailer 2017-03-09 TLP5214A 3.3 Tape Leader and Trailer The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and more than 30 mm only for a cover tape. 3.4 Tape Dimensions Tape material: Plastic (for protection against static electricity) Unit: mm Table Tape Dimensions (unit: mm, tolerance: 0.1) Symbol Dimension Remark A 10.4 B 10.7 D 7.5 Center line of embossed cavity and sprocket hole E 1.75 Distance between tape edge and sprocket hole center F 12.0 Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes G 4.0 Cumulative error +0.1/-0.3 (max) per 10 sprocket holes K0 2.4 Internal space (c)2017 TOSHIBA CORPORATION 19 2017-03-09 TLP5214A 3.5 Reel Specification Material: Plastic Table Reel Dimensions A B C Unit: mm Symbol Dimension A 330 2 B 100 1 C 13 0.5 E 2.0 0.5 U 4.0 0.5 W1 17.4 1.0 W2 21.4 1.0 W1 W2 4. Packing (Note) 26 Unit: mm 30 25(in size) 334(in size) 337(in size) Label Note: Taping reel diameter: 330 mm 5. Label Format (1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. (2) Reel: The label provides the part number, the taping name, quantity, lot number, etc. (c)2017 TOSHIBA CORPORATION 20 2017-03-09 TLP5214A 6. Ordering Method When placing an order, please specify the part number, the tape and the quantity (Multiples of 1500) as shown in the following example. Example) TLP5214A(TP,E(O 1500 pcs Part number: TLP5214A Tape type: TP (12-mm pitch) [[G]]/RoHS COMPATIBLE: E (Note 1) Domestic ID (Country/Region of origin: Japan): O Quantity (must be a multiple of 1500): 1500 pcs Note 1 : Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. (c)2017 TOSHIBA CORPORATION 21 2017-03-09 TLP5214A RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. (c)2017 TOSHIBA CORPORATION 22 2017-03-09