LM5046
September 8, 2011
Phase-Shifted Full-Bridge PWM Controller with Integrated
MOSFET Drivers
General Description
The LM5046 PWM controller contains all of the features nec-
essary to implement a Phase-Shifted Full-Bridge topology
power converter using either current mode or voltage mode
control. This device is intended to operate on the primary side
of an isolated dc-dc converter with input voltage up to 100V.
This highly integrated controller-driver provides dual 2A high
and low side gate drivers for the four external bridge MOS-
FETs, plus control signals for the secondary side syn-
chronous rectifier MOSFETs. External resistors program the
dead-time to enable zero-volt switching of the primary FETs.
Intelligent startup of the synchronous rectifiers allows mono-
tonic turn-on of the power converter even with pre-bias load
conditions. Additional features include cycle-by-cycle current
limiting, hiccup mode restart, programmable soft-start, syn-
chronous rectifier soft-start and a 2 MHz capable oscillator
with synchronization capability and thermal shutdown.
Features
Highest Integration Controller for Small Form Factor, High
Density Power Converters
High Voltage Start-up Regulator
Intelligent Sync Rectifier Start-up Allows Linear Turn-on
into Pre-biased Loads
Synchronous Rectifiers Disabled in UVLO mode and
Hiccup Mode
Two Independent, Programmable Dead-Time
Adjustments to Enable Zero-Volt Switching.
Four High Current 2A Bridge Gate Drivers
Wide-Bandwidth Opto-coupler Interface
Configurable for either Current Mode or Voltage Mode
Control
Dual-mode Over-Current Protection
Resistor Programmed 2MHz Oscillator
Programmable Line UVLO and OVP
Packages
eTSSOP-28
LLP-28 (5mm x 5mm)
Simplified Phase-Shifted Full-Bridge Power Converter
30147801
© 2011 National Semiconductor Corporation 301478 www.national.com
LM5046 Phase-Shifted Full-Bridge PWM Controller with Integrated MOSFET Drivers
Connection Diagrams
Top View
30147802
TSSOP28
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LM5046
Top View
30147803
LLP-28 Package
Ordering Information
Order Number Package Type NSC Package Drawing Supplied As
LM5046MH eTSSOP-28 MXA28A Rail of 48 Units
LM5046MHX eTSSOP-28 MXA28A Tape and Reel of 2500 Units
LM5046SQ LLP-28 SQA28A Available Soon
LM5046SQX LLP-28 SQA28A Available Soon
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LM5046
Pin Descriptions
TSSOP
Pin LLP Pin Name Description Application Information
1 25 UVLO Line Under-Voltage Lockout An external voltage divider from the power source sets the
shutdown and standby comparator levels. When UVLO reaches
the 0.4V threshold the VCC and REF regulators are enabled. At
the 1.25V threshold, the SS pin is released and the controller
enters the active mode. Hysteresis is set by an internal current
sink that pulls 20µA from the external resistor divider.
2 26 OVP/OTP Over Voltage Protection An external voltage divider from the input power supply sets the
shutdown level during an over-voltage condition. Alternatively, an
external NTC thermistor voltage divider can be used to set the
shutdown temperature. The threshold is 1.25V. Hysteresis is set
by an internal current that sources 20 µA of current into the
external resistor divider.
3 27 RAMP Input to PWM Comparator Modulation ramp for the PWM comparator. This ramp can be a
signal representative of the primary current (current mode) or
proportional to the input voltage (feed-forward voltage mode).
This pin is reset to GND at the end of every cycle.
4 28 CS Current Sense Input If CS exceeds 750mV the PWM output pulse will be terminated,
entering cycle-by-cycle current limit. An internal switch holds CS
low for 40nS after either output switches high to blank leading
edge transients.
5 1 SLOPE Slope Compensation Current A ramping current source from 0 to 100µA is provided for slope
compensation in current mode control. This pin can be connected
through an appropriate resistor to the CS pin to provide slope
compensation. If slope compensation is not required, SLOPE
must be tied to ground.
6 2 COMP Input to the Pulse Width Modulator An external opto-coupler connected to the COMP pin sources
current into an internal NPN current mirror. The PWM duty cycle
is at maximum with zero input current, while 1mA reduces the
duty cycle to zero. The current mirror improves the frequency
response by reducing the AC voltage across the opto-coupler.
7 3 REF Output of a 5V reference Maximum output current is 15mA. Locally decouple with a 0.1µF
capacitor.
8 4 RT/SYNC Oscillator Frequency Control and
Frequency Synchronization
The resistance connected between RT and AGND sets the
oscillator frequency. Synchronization is achieved by AC coupling
a pulse to the RT/SYNC pin that raises the voltage at least 1.5V
above the 2V nominal bias level.
9 5 AGND Analog Ground Connect directly to the Power Ground.
10 6 RD1 Passive to Active Delay The resistance connected between RD1 and AGND sets the
delay from the falling edge of HO1/SR1 or LO1/SR2 and the rising
edge of LO1 or HO1 respectively.
11 7 RD2 Active to Passive Delay The resistance connected between RD2 and AGND sets the
delay from the falling edge of LO2 or HO2 and the rising edge of
HO2 or LO2 respectively.
12 8 RES Restart Timer Whenever the CS pin exceeds the 750mV cycle-by-cycle current
limit threshold, 30µA current is sourced into the RES capacitor for
the remainder of the PWM cycle. If the RES capacitor voltage
reaches 1.0V, the SS capacitor is discharged to disable the HO1,
HO2, LO1, LO2 and SR1, SR2 outputs. The SS pin is held low
until the voltage on the RES capacitor has been ramped between
2V and 4V eight times by 10µA charge and 5µA discharge
currents. After the delay sequence, the SS capacitor is released
to initiate a normal start-up sequence.
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LM5046
TSSOP
Pin LLP Pin Name Description Application Information
13 9 SS Soft-Start Input An internal 20µA current source charges the SS pin during start-
up. The input to the PWM comparator gradually rises as the SS
capacitor charges to steadily increase the PWM duty cycle.
Pulling the SS pin to a voltage below 200mV stops PWM pulses
at HO1,2 and LO1,2 and turns off the synchronous rectifier FETs
to a low state.
14 10 SSSR Secondary Side Soft-Start An external capacitor and an internal 20µA current source set the
soft-start ramp for the synchronous rectifiers. The SSSR
capacitor charge-up is enabled after the first output pulse and
SS>2V and Icomp <800µA
15 11 SSOFF Soft-Stop Disable When SS OFF pin is connected to the AGND, the LM5046 soft-
stops in the event of a VIN UVLO and Hiccup mode current limit
condition. If the SSOFF pin is connected to REF pin, the controller
hard-stops on any fault condition. Refer Table 1 for more details.
19 15 SR2 Synchronous Rectifier Driver Control output for synchronous rectifier gate. Capable of peak
sourcing 100mA and sinking 400mA.
21 17 VCC Output of Start-Up Regulator The output voltage of the start-up regulator is initially regulated to
9.5V. Once the secondary side soft-start (SSSR pin) reaches 1V,
the VCC output is reduced to 7.7V. If an auxiliary winding raises
the voltage on this pin above the regulation set-point, the internal
start-up regulator will shutdown, thus reducing the IC power
dissipation.
22 18 PGND Power Ground Connect directly to Analog Ground
23, 20 19, 16 LO1, LO2 Low Side Output Driver Alternating output of the PWM gate driver. Capable of 1.5A peak
source and 2A peak sink current.
24 20 SR1 Synchronous Rectifier Driver Control output for synchronous rectifier gate. Capable of peak
sourcing 100mA and sinking 400mA.
25, 18 21, 14 BST1,2 Gate Drive Bootstrap Bootstrap capacitors connected between BST1,2 and SW1,2
provide bias supply for the high side HO1,2 gate drivers. External
diodes are required between VCC and BST1,2 to charge the
bootstrap capacitors when SW1,2 are low.
26, 17 22, 13 HO1,2 High Side Output Driver High side PWM outputs capable of driving the upper MOSFET of
the bridge with 1.5A peak source and 2A peak sink current.
27, 16 23, 12 HS1,2 Switch Node Common connection of the high side FET source, low side FET
drain and transformer primary winding.
28 24 VIN Input Power Source Input to the Start-up Regulator. Operating input range is 14V to
100V. For power sources outside of this range, the LM5046 can
be biased directly at VCC by an external regulator.
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LM5046
Absolute Maximum Ratings (Note 1)
VIN to GND -0.3V to 105V
HS to GND (Note 4) -5V to 105V
BST1/BST2 to GND -0.3V to 116V
BST1/BST2 to HS1/HS2 -0.3V to 16V
HO1/HO2 to HS1/HS2 (Note 2) -0.3V to BST1/
BST2+0.3V
LO1/LO2/SR1/SR2 (Note 2) -0.3V to VCC+0.3V
VCC to GND -0.3V to 16V
REF,SSOFF,RT,OVP,UVLO to GND -0.3V to 7V
RAMP -0.3V to 7V
COMP -0.3V
COMP Input Current +10mA
All other inputs to GND (Note 2) -0.3 to REF+0.3V
ESD Rating HBM (Note 3) 2 kV
Storage Temperature Range -55°C to 150°C
Junction Temperature 150°C
Operating Ratings (Note 1)
VIN Voltage 14V to 100V
External Voltage Applied to VCC 10V to 14V
Junction Temperature -40°C to +125°C
SLOPE -0.3V to 2V
Electrical Characteristics Limits in standard typeface are for TJ = 25°C only; limits in boldface type apply the
junction temperature range of -40°C to +125°C. Unless otherwise specified, the following conditions apply: VIN = 48V, RT =
25k, RD1=RD2=20k. No load on HO1, HO2, LO1, LO2, SR1, SR2, COMP=0V, UVLO=2.5V, OVP=0V, SSOFF=0V.
Symbol Parameter Conditions Min Typ Max Units
Startup Regulator (VCC pin)
VCC1 VCC voltage ICC= 10mA (SSSR<1V) 9.3 9.6 9.9 V
VCC2 VCC voltage ICC= 10mA (SSSR>1V) 7.5 7.8 8.1 V
ICC(Lim) VCC current limit VCC= 6V 52 70 mA
ICC(ext) VCC supply current Supply current into VCC from an externally
applied source. VCC = 10V
4.6 mA
VCC load regulation ICC from 0 to 50 mA 35 mV
VCC(UV) VCC under-voltage threshold Positive going VCC VCC1
0.2
VCC1
0.1
V
VCC under-voltage threshold Negative going VCC 5.9 6.3 6.7 V
IIN VIN operating current 4 mA
VIN shutdown current VIN=20V, VUVLO=0V 300 520 µA
VVIN=100V, VUVLO=0V 350 550 µA
VIN start-up regulator leakage VCC=10V 160 µA
Voltage Reference Regulator (REF pin)
VREF REF Voltage IREF = 0mA 4.85 55.15 V
REF voltage regulation IREF = 0 to 10mA 25 50 mV
IREF(Lim) REF current limit VREF = 4.5V 15 20 mA
VREFUV VREF under-voltage threshold Positive going VREF 4.3 4.5 4.7 V
Hysteresis 0.25 V
Under-Voltage Lock Out and shutdown (UVLO pin)
VUVLO Under-voltage threshold 1.18 1.25 1.32 V
IUVLO Hysteresis current UVLO pin sinking current when
VUVLO<1.25V
16 20 24 µA
Under-voltage standby enable
threshold
UVLO voltage rising 0.32 0.4 0.48 V
Hysteresis 0.05 V
VOVP OVP shutdown threshold OVP rising 1.18 1.25 1.32 V
OVP hysteresis current OVP sources current when OVP>1.25V 16 20 24 µA
Soft-Start (SS Pin)
ISS SS charge current VSS = 0V 16 20 24 µA
SS threshold for SSSR charge
current enable
ICOMP<800µA 1.93 2.0 2.20 V
SS output low voltage Sinking 100µA 40 mV
SS threshold to disable switching 200 mV
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LM5046
Symbol Parameter Conditions Min Typ Max Units
ISSSR SSSR charge current VSS>2V, ICOMP<800µA 16 20 24 µA
ISSSR-DIS1 SSSR discharge current 1 VUVLO<1.25V 54 65 75 µA
ISSSR-DIS2 SSSR discharge current 2 VRES>1V 109 125 147 µA
SSSR output low voltage Sinking 100µA 50 mV
SSSR threshold to enable SR1/SR2 1.2 V
Current Sense Input (CS Pin)
VCS Current limit threshold 0.710 0.750 0.785 V
CS delay to output 65 ns
CS leading edge blanking 50 ns
RCS CS sink impedance (clocked) Internal FET sink impedance 18 45
Soft-Stop Disable (SS OFF Pin)
VIH(min) SSOFF Input Threshold 2.8 V
SSOFF pull down resistance 200 k
Current Limit Restart (RES Pin)
RRES RES pull-down resistance Termination of hiccup timer 37
VRES RES hiccup threshold 1 V
RES upper counter threshold 4 V
RES lower counter threshold 2 V
IRES-SRC1 Charge current source 1 VRES<1V,VCS>750mV 30 µA
IRES-SRC2 Charge current source 2 1V<VRES<4V 10 µA
IRES-DIS2 Discharge current source 1 VCS<750mV 5 µA
IRES-DIS2 Discharge current source 2 2V<VRES<4V 5 µA
Ratio of time in hiccup mode to time
in current limit
VRES>1V, Hiccup counter 147
Voltage Feed-Forward (RAMP Pin)
RAMP sink impedance (Clocked) 5.5 20
Oscillator (RT Pin)
FSW1 Frequency (LO1, half oscillator
frequency)
RT = 25 k185 200 215 kHz
FSW2 Frequency (LO1, half oscillator
frequency)
RT = 10 k420 480 540 kHz
DC level 2.0 V
RT sync threshold 2.8 33.3 V
ZVS Timing Control (RD1 & RD2 Pins)
TPA HO1/SR1 turn-off to LO1 turn-on
LO1/SR2 turn-off to HO1 turn-on
RD1=20 k39 65 89 ns
RD1=100 k230 300 391 ns
TAP LO2 turn-off to HO2 turn-on
HO2 turn-off to LO2 turn-on
RD2=20 k27 55 78 ns
RD2=100 k214 300 378 ns
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LM5046
Symbol Parameter Conditions Min Typ Max Units
Comp Pin
VPWM-OS COMP current to RAMP offset VRAMP=0V 680 800 940 µA
VSS-OS SS to RAMP offset VRAMP=0V 0.78 1.0 1.22 V
COMP current to RAMP gain ΔRAMP/ΔICOMP 2400
SS to RAMP gain ΔSS/ΔRAMP 0.5
COMP current for SSSR charge
current enable
VSS > 2V 690 800 915 µA
COMP to output delay 120 ns
Minimum duty cycle ICOMP = 1mA 0%
Slope Compensation (SLOPE Pin)
ISLOPE Slope compensation current ramp Peak of RAMP current 100 µA
BOOST (BST Pin)
VBst uv BST under-voltage threshold VBST-VHS rising 3.8 4.7 5.6 V
Hysteresis 0.5 V
HO1, HO2, LO1, LO2 Gate Drivers
VOL Low-state output voltage IHO/LO = 100mA 0.16 0.32 V
VOH High-state output voltage IHO/LO = 100mA
VOHL = VCC-VLO
VOHH = VBST-VHO
0.27 0.495 V
Rise Time C-load = 1000pF 16 ns
Fall Time C-load = 1000pF 11 ns
IOHL Peak Source Current VHO/LO = 0V 1.5 - A
IOLL Peak Sink Current VHO/LO = VCC 2 - A
SR1, SR2 Gate Drivers
VOL Low-state output voltage ISR1/SR2 = 10mA 0.05 0.10 V
VOH High-state output voltage ISR1/SR2 = 10mA,
VOH = VREF-VSR
0.17 0.28 V
Rise Time C-load = 1000pF 60 ns
Fall Time C-load = 1000pF 20 ns
IOHL Peak Source Current VSR = 0V 0.1 - A
IOLL Peak Sink Current VSR = VREF 0.4 - A
Thermal
TSD Thermal Shutdown Temp 160 °C
Thermal Shutdown Hysteresis 25 °C
RJA Junction to Ambient (Note 5) eTSSOP - 28/LLP-28 40 °C/W
RJC Junction to Case 4 °C/W
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: These pins are output pins and as such should not be connected to an external voltage source. The voltage range listed is the limits the internal circuitry
is designed to reliably tolerate in the application circuit.
Note 3: The human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin.
Note 4: The negative HS voltage must never be more negative than VCC-16V. For example, if VCC=12V, the negative transients at HS must not exceed -4V.
Note 5: 4 layer standard thermal test board. Cu thickness of layers (2oz, 1oz, 1oz, 2oz).
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LM5046
Typical Performance Characteristics
Application Board Efficiency
5 10 15 20 25 30
50
60
70
80
90
100
EFFICIENCY (%)
LOAD CURRENT (A)
36V
48V
72V
VOUT = 3.3V
30147852
VCC vs ICC
30147859
VVCC and VREF vs. VVIN
30147855
IIN vs. VIN
0 20 40 60 80 100
0
1
2
3
4
5
6
I IN (V)
V IN (V)
VUVLO=3V
VUVLO=1V
VUVLO=0V
30147860
VREF vs. IREF
30147809
Oscillator Frequency vs. RT
30147856
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LM5046
Dead-Time TPA, TAP vs. Temperature
30147865
Dead-Time TPA, TAP vs. RD1, RD2
30147866
CS Threshold vs. Temperature
30147813
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LM5046
Block Diagram
30147804
FIGURE 1.
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LM5046
Functional Description
The LM5046 PWM controller contains all of the features nec-
essary to implement a Phase-Shifted Full-Bridge (PSFB)
topology power converter using either current mode or volt-
age mode control. This device is intended to operate on the
primary side of an isolated dc-dc converter with input voltage
up to 100V. This highly integrated controller-driver provides
dual 2A high and low side gate drivers for the four external
bridge MOSFETs plus control signals for secondary side syn-
chronous rectifiers. External resistors program the dead-time
to enable Zero-Volt Switching (ZVS) of the primary FETs.
Please refer to the Applications Information for details on the
operation of the PSFB topology. Intelligent startup of syn-
chronous rectifier allows turn-on of the power converter into
the pre-bias loads. Cycle-by-cycle current limit protects the
power components from load transients while hiccup mode
protection limits average power dissipation during extended
overload conditions. Additional features include pro-
grammable soft-start, soft-start of the synchronous rectifiers,
and a 2 MHz capable oscillator with synchronization capability
and thermal shutdown.
High-Voltage Start-Up Regulator
The LM5046 contains an internal high voltage start-up regu-
lator that allows the input pin (VIN) to be connected directly
to the supply voltage over a wide range from 14V to 100V.
The input can withstand transients up to 105V. When the UV-
LO pin potential is greater than 0.4V, the VCC regulator is
enabled to charge an external capacitor connected to the
VCC pin. The VCC regulator provides power to the voltage
reference (REF) and the gate drivers (HO1/HO2 and LO1/
LO2). When the voltage on the VCC pin exceeds its Under
Voltage (UV) threshold, the internal voltage reference (REF)
reaches its regulation set point of 5V and the UVLO voltage
is greater than 1.25V, the soft-start capacitor is released and
normal operation begins. The regulator output at VCC is in-
ternally current limited. The value of the VCC capacitor de-
pends on the total system design, and its start-up character-
istics. The recommended range of values for the VCC
capacitor is 0.47μF to 10µF.
The internal power dissipation of the LM5046 can be reduced
by powering VCC from an external supply. The output voltage
of the VCC regulator is initially regulated to 9.5V. After the
synchronous rectifiers are engaged (which is approximately
when the output voltage in within regulation), the VCC voltage
is reduced to 7.7V. In typical applications, an auxiliary trans-
former winding is connected through a diode to the VCC pin.
This winding must raise the VCC voltage above 8V to shut off
the internal start-up regulator. Powering VCC from an auxil-
iary winding improves efficiency while reducing the
controller’s power dissipation. The VCC UV circuit will still
function in this mode, requiring that VCC never falls below its
UV threshold during the start-up sequence. The VCC regula-
tor series pass transistor includes a diode between VCC and
VIN that should not be forward biased in normal operation.
Therefore, the auxiliary VCC voltage should never exceed the
VIN voltage.
An external DC bias voltage can be used instead of the inter-
nal regulator by connecting the external bias voltage to both
the VCC and the VIN pins. This implementation is shown in
the Applications Information section. The external bias must
be greater than 10V and less than the VCC maximum voltage
rating of 14V.
Line Under-Voltage Detector
The LM5046 contains a dual level Under-Voltage Lockout
(UVLO) circuit. When the UVLO pin voltage is below 0.4V, the
controller is in a low current shutdown mode. When the UVLO
pin voltage is greater than 0.4V but less than 1.25V, the con-
troller is in standby mode. In standby mode the VCC and REF
bias regulators are active while the controller outputs are dis-
abled. When the VCC and REF outputs exceed their respec-
tive under-voltage thresholds and the UVLO pin voltage is
greater than 1.25V, the soft-start capacitor is released and the
normal operation begins. An external set-point voltage divider
from VIN to GND can be used to set the minimum operating
voltage of the converter. The divider must be designed such
that the voltage at the UVLO pin will be greater than 1.25V
when VIN enters the desired operating range. UVLO hystere-
sis is accomplished with an internal 20μA current sink that is
switched on or off into the impedance of the set-point divider.
When the UVLO threshold is exceeded, the current sink is
deactivated to quickly raise the voltage at the UVLO pin.
When the UVLO pin voltage falls below the 1.25V threshold,
the current sink is enabled causing the voltage at the UVLO
pin to quickly fall. The hysteresis of the 0.4V shutdown com-
parator is internally fixed at 50mV.
The UVLO pin can also be used to implement various remote
enable / disable functions. Turning off the converter by forcing
the UVLO pin to standby condition (0.4V < UVLO < 1.25V)
provides a controlled soft-stop. Refer to the Soft Stop section
for more details.
Over Voltage Protection
An external voltage divider can be used to set either an over
voltage or an over temperature protection. During an OVP
condition, the SS and SSSR capacitors are discharged and
all the outputs are disabled. The divider must be designed
such that the voltage at the OVP pin is greater than 1.25V
when over voltage/temperature condition exists. Hysteresis is
accomplished with an internal 20μA current source. When the
OVP pin voltage exceeds 1.25V, the 20μA current source is
activated to quickly raise the voltage at the OVP pin. When
the OVP pin voltage falls below the 1.25V threshold, the cur-
rent source is deactivated causing the voltage at the OVP to
quickly fall. Refer to the Applications Information section for
more details.
Reference
The REF pin is the output of a 5V linear regulator that can be
used to bias an opto-coupler transistor and external house-
keeping circuits. The regulator output is internally current
limited to 15mA. The REF pin needs to be locally decoupled
with a ceramic capacitor, the recommended range of values
are from 0.1μF to 10μF
Oscillator, Sync Input
The LM5046 oscillator frequency is set by a resistor connect-
ed between the RT pin and AGND. The RT resistor should be
located very close to the device. To set a desired oscillator
frequency (FOSC), the necessary value of RT resistor can be
calculated from the following equation:
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LM5046
For example, if the desired oscillator frequency is 400 kHz i.e.
each phase (LO1 or LO2) at 200 kHz, the value of RT will be
25k. If the LM5046 is to be synchronized to an external
clock, that signal must be coupled into the RT pin through a
100pF capacitor. The RT pin voltage is nominally regulated
at 2.0V and the external pulse amplitude should lift the pin to
between 3.5V and 5.0V on the low-to-high transition. The
synchronization pulse width should be between 15 and
200ns. The RT resistor is always required, whether the oscil-
lator is free running or externally synchronized and the SYNC
frequency must be equal to, or greater than the frequency set
by the RT resistor. When syncing to an external clock, it is
recommended to add slope compensation by connecting an
appropriate resistor from the VCC pin to the CS pin. Also dis-
able the SLOPE pin by grounding it.
Cycle-by-Cycle Current Limit
The CS pin is to be driven by a signal representative of the
transformer’s primary current. If the voltage on the CS pin ex-
ceeds 0.75V, the current sense comparator immediately ter-
minates the PWM cycle. A small RC filter connected to the
CS pin and located near the controller is recommended to
suppress noise. An internal 18 MOSFET discharges the ex-
ternal current sense filter capacitor at the conclusion of every
cycle. The discharge MOSFET remains on for an additional
40ns after the start of a new PWM cycle to blank leading edge
spikes. The current sense comparator is very fast and may
respond to short duration noise pulses. Layout is critical for
the current sense filter and the sense resistor. The capacitor
associated with CS filter must be placed very close to the de-
vice and connected directly to the CS and AGND pins. If a
current sense transformer is used, both the leads of the trans-
former secondary should be routed to the filter network, which
should be located close to the IC. When designing with a cur-
rent sense resistor, all of the noise sensitive low power ground
connections should be connected together near the AGND
pin, and a single connection should be made to the power
ground (sense resistor ground point).
Hiccup Mode
The LM5046 provides a current limit restart timer to disable
the controller outputs and force a delayed restart (i.e. Hiccup
mode) if a current limit condition is repeatedly sensed. The
number of cycle-by-cycle current limit events required to trig-
ger the restart is programmed by the external capacitor at the
RES pin. During each PWM cycle, the LM5046 either sources
or sinks current from the RES capacitor. If current limit is de-
tected, the 5μA current sink is disabled and a 30μA current
source is enabled. If the RES voltage reaches the 1.0V
threshold, the following restart sequence occurs, as shown in
Figure 2:
The SS and SSSR capacitors are fully discharged
The 30μA current source is turned-off and the 10μA
current source is turned-on.
Once the voltage at the RES pin reaches 4.0V the 10μA
current source is turned-off and a 5μA current sink is
turned-on, ramping the voltage on the RES capacitor
down to 2.0V.
Once RES capacitor reaches 2.0V, threshold, the 10μA
current source is turned-on again. The RES capacitor
voltage is ramped between 4.0V and 2.0V eight times.
When the counter reaches eight, the RES pin voltage is
pulled low and the soft-start capacitor is released to begin
a soft-start sequence. The SS capacitor voltage slowly
increases. When the SS voltage reaches 1.0V, the PWM
comparator will produce the first narrow pulse.
If the overload condition persists after restart, cycle-by-
cycle current limiting will begin to increase the voltage on
the RES capacitor again, repeating the hiccup mode
sequence.
If the overload condition no longer exists after restart, the
RES pin will be held at ground by the 5μA current sink and
the normal operation resumes.
The hiccup mode function can be completely disabled by
connecting the RES pin to the AGND pin. In this configuration
the cycle-by-cycle protection will limit the maximum output
current indefinitely, no hiccup restart sequences will occur.
30147816
FIGURE 2. Hiccup Mode Delay and Soft-Start Timing Diagram
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LM5046
PWM Comparator
The LM5046 pulse width modulator (PWM) comparator is a
three input device, it compares the signal at the RAMP pin to
the loop error signal or the soft-start, whichever is lower, to
control the duty cycle. This comparator is optimized for speed
in order to achieve minimum controllable duty cycles. The
loop error signal is received from the external feedback and
isolation circuit in the form of a control current into the COMP
pin. The COMP pin current is internally mirrored by a match-
ing pair of NPN transistors which sink current through a 5k
resistor connected to the 5V reference. The resulting control
voltage passes through a 1V offset, followed by a 2:1 resistor
divider before being applied to the PWM comparator.
An opto-coupler detector can be connected between the REF
pin and the COMP pin. Because the COMP pin is controlled
by a current input, the potential difference across the opto-
coupler detector is nearly constant. The bandwidth limiting
phase delay which is normally introduced by the significant
capacitance of the opto-coupler is thereby greatly reduced.
Higher loop bandwidths can be realized since the bandwidth
limiting pole associated with the opto-coupler is now at a
much higher frequency. The PWM comparator polarity is con-
figured such that with no current flowing into the COMP pin,
the controller produces maximum duty cycle.
RAMP Pin
The voltage at the RAMP pin provides the modulation ramp
for the PWM comparator. The PWM comparator compares
the modulation ramp signal at the RAMP pin to the loop error
signal to control the duty cycle. The modulation ramp signal
can be implemented either as a ramp proportional to the input
voltage, known as feed-forward voltage mode control, or as
a ramp proportional to the primary current, known as current
mode control. The RAMP pin is reset by an internal MOSFET
with an RDS(ON) of 5.5 at the conclusion of each PWM cycle.
The ability to configure the RAMP pin for either voltage mode
or current mode allows the controller to be implemented for
the optimum control method depending upon the design con-
straints. Refer to the Applications Information section for more
details on configuring the RAMP pin for feed-forward voltage
mode control and peak current mode control.
Slope Pin
For duty cycles greater than 50% (25% for each phase), peak
current mode control is subject to sub-harmonic oscillation.
Sub-harmonic oscillation is normally characterized by observ-
ing alternating wide and narrow duty cycles. This can be
eliminated by adding an artificial ramp, known as slope com-
pensation, to the modulating signal at the RAMP pin. The
SLOPE pin provides a current source ramping from 0 to
100μA, at the frequency set by the RT resistor, for slope com-
pensation. The ramping current source at the SLOPE pin can
be utilized in a couple of different ways to add slope compen-
sation to the RAMP signal:
1) As shown in Figure 3(a), the SLOPE and RAMP pins can
be connected together through an appropriate resistor to the
CS pin. This configuration will inject current sense signal plus
slope compensation to the RAMP pin but CS pin will not see
any slope compensation. Therefore, in this scheme slope
compensation will not affect the current limit.
2) In a second configuration, as shown in Figure 3(b), the
SLOPE, RAMP and CS pins can be tied together. In this con-
figuration the ramping current source from the SLOPE pin will
flow through the filter resistor and filter capacitor, therefore
both the CS pin and the RAMP pin will see the current sense
signal plus the slope compensation ramp. In this scheme, the
current limit is compensated by the slope compensation and
the current limit onset point will vary.
If slope compensation is not required for e.g. in feed-forward
voltage mode control, the SLOPE pin must be connected to
the AGND pin. When the RT pin is synched to an external
clock, it is recommended to disable the SLOPE pin and add
slope compensation externally by connecting an appropriate
resistor from the VCC pin to the CS pin. Please refer to the
Applications Information section for more details.
30147851
FIGURE 3. Slope Compensation Configuration
a) Slope Compensation Configured for PWM Only (No Current Limit Slope)
b) Slope Compensation Configured for PWM and Current Limit
www.national.com 14
LM5046
Soft-Start
The soft-start circuit allows the power converter to gradually
reach a steady state operating point, thereby reducing the
start-up stresses and current surges. When bias is supplied
to the LM5046, the SS capacitor is discharged by an internal
MOSFET. When the UVLO, VCC and REF pins reach their
operating thresholds, the SS capacitor is released and is
charged with a 20µA current source. Once the SS pin voltage
crosses the 1V offset, SS controls the duty cycle. The PWM
comparator is a three input device; it compares the RAMP
signal against the lower of the signals between the soft-start
and the loop error signal. In a typical isolated application, as
the secondary bias is established, the error amplifier on the
secondary side soft-starts and establishes closed-loop con-
trol, steering the control away from the SS pin.
One method to shutdown the regulator is to ground the SS
pin. This forces the internal PWM control signal to ground,
reducing the output duty cycle quickly to zero. Releasing the
SS pin begins a soft-start cycle and normal operation re-
sumes. A second shutdown method is presented in the UVLO
section.
Gate Driver Outputs
The LM5046 provides four gate drivers: two floating high side
gate drivers HO1 and HO2 and two ground referenced low
side gate drivers LO1 and LO2. Each internal driver is capable
of sourcing 1.5A peak and sinking 2A peak. The low-side gate
drivers are powered directly by the VCC regulator. The HO1
and HO2 gate drivers are powered from a bootstrap capacitor
connected between BST1/BST2 and HS1/HS2 respectively.
An external diode connected between VCC (anode pin) and
BST (cathode pin) provides the high side gate driver power
by charging the bootstrap capacitor from VCC when the cor-
responding switch node (HS1/HS2 pin) is low. When the high
side MOSFET is turned on, BST1 rises to a peak voltage
equal to VCC + VHS1 where VHS1 is the switch node voltage.
The BST and VCC capacitors should be placed close to the
pins of the LM5046 to minimize voltage transients due to par-
asitic inductances since the peak current sourced to the MOS-
FET gates can exceed 1.5A. The recommended value of the
BST capacitor is 0.1μF or greater. A low ESR / ESL capacitor,
such as a surface mount ceramic, should be used to prevent
voltage droop during the HO transitions.
Figure 4 illustrates the sequence of the LM5046 gate-drive
outputs. Initially, the diagonal HO1 and LO2 are turned-on to-
gether during the power transfer cycle, followed by the free-
wheel cycle, where HO1 and HO2 are kept on. In the
subsequent phase, the diagonal HO2 and LO1 are turned-on
together during the power transfer cycle, followed by a free-
wheel cycle, where LO1 and LO2 are kept on. The power
transfer mode is often called the active mode and the free-
wheel mode is often called as the passive mode. The dead-
time between the passive mode and the active mode, TPA, is
set by the RD1 resistor and the dead-time between the active
mode and the passive mode, TAP, is set by the RD2 resistor.
Refer to the Applications Information section for more details
on the operation of the phase-shifted full-bridge topology.
If the COMP pin is open circuit, the outputs will operate at
maximum duty cycle. The maximum duty cycle for each
phase is limited by the dead-time set by the RD1 resistor. If
the RD1 resistor is set to zero then the maximum duty cycle
is slightly less than 50% due to the internally fixed dead-time.
The internally fixed dead-time is 30ns which does not vary
with the operating frequency. The maximum duty cycle for
each output can be calculated from the following equation:
Where, TPA is the time set by the RD1 resistor and FOSC is the
frequency of the oscillator. For example, if the oscillator fre-
quency is set at 400 kHz and the TPA time set by the RD1
resistor is 60ns, the resulting DMAX will be equal to 0.488.
30147821
FIGURE 4. Timing Diagram Illustrating the Sequence of Gate-Driver Outputs in the PSFB Topology
15 www.national.com
LM5046
Synchronous Rectifier Control
Outputs (SR1 & SR2)
Synchronous rectification (SR) of the transformer secondary
provides higher efficiency, especially for low output voltage
converters, compared to the diode rectification. The reduction
of rectifier forward voltage drop (0.5V - 1.5V) to 10mV -
200mV VDS voltage for a MOSFET significantly reduces
rectification losses. In a typical application, the transformer
secondary winding is center tapped, with the output power
inductor in series with the center tap. The SR MOSFETs pro-
vide the ground path for the energized secondary winding and
the inductor current. From Figure 5 it can be seen that when
the HO1/LO2 diagonal is turned ON, power transfer is en-
abled from the primary. During this period, the SR1 MOSFET
is enabled and the SR2 MOSFET is turned-off. The sec-
ondary winding connected to the SR2 MOSFET drain is twice
the voltage of the center tap at this time. At the conclusion of
the HO1/LO2 pulse, the inductor current continues to flow
through the SR2 MOSFET body diode. Since the body diode
causes more loss than the SR MOSFET, efficiency can be
improved by minimizing the TSRON period. In the LM5046, the
time TSRON is internally fixed to be 30ns. The 30ns internally
fixed dead-time, along with inherent system delays due to
galvanic isolation, plus the gate drive ICs, will provide suffi-
cient margin to prevent the shoot-through current.
During the freewheeling period, the inductor current flows in
both the SR1 and SR2 MOSFETs, which effectively shorts the
transformer secondary. The SR MOSFETs are disabled at the
rising edge of the CLK, which also disables HO1 or LO1. As
shown in Figure 5, SR1 is disabled at the same instant as HO1
is disabled, and SR2 is disabled at the same instant as LO1
is disabled. The dead-times, TSROFF and TPA achieve two dif-
ferent things but are set by single resistor, RD1. Therefore,
RD1 value should be selected such that the SR1/SR2 turns-
off before the next power transfer cycle is initiated by TPA.
The SR drivers are powered by the REF regulator and each
SR output is capable of sourcing 0.1A and sinking 0.4A peak.
The amplitude of the SR drivers is limited to 5V. The 5V SR
signals enable the LM5046 to transfer SR control across the
isolation barrier either through a solid-state isolator or a pulse
transformer. The actual gate sourcing and sinking currents for
the synchronous MOSFETs are provided by the secondary-
side bias and gate drivers.
TPA and TAP can be programmed by connecting a resistor be-
tween RD1 and RD2 pins and AGND. It should be noted that
while RD1 effects the maximum duty cycle, RD2 does not.
The RD1 and RD2 resistors should be located very close to
the device. The formula for RD1 and RD2 resistors are given
below:
If the desired dead-time for TPA is 60ns, then the RD1 will be
20 kΩ.
30147836
FIGURE 5. Synchronous Rectifier Timing Diagram
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LM5046
Soft-Start of the Synchronous
Rectifiers
In addition to the basic soft-start already described, the
LM5046 contains a second soft-start function that gradually
turns on the synchronous rectifiers to their steady-state duty
cycle. This function keeps the synchronous rectifiers off dur-
ing the basic soft-start allowing a linear start-up of the output
voltage even into pre-biased loads. Then the SR output duty
cycle is gradually increased to prevent output voltage distur-
bances due to the difference in the voltage drop between the
body diode and the channel resistance of the synchronous
MOSFETs. Initially, when bias is supplied to the LM5046, the
SSSR capacitor is discharged by an internal MOSFET. When
the SS capacitor reaches a 2V threshold and once it is es-
tablished that COMP is in control of the duty cycle i.e. ICOMP
< 800µA, the SSSR discharge is released and SSSR capac-
itor begins charging with a 20µA current source. During the
soft-start of synchronous rectifiers, SR1 and SR2 are turned
on simultaneously in pairs, as shown in Figure 6(a), to avoid
any transformer imbalance. The duty cycle of the SR outputs
gradually increase with increasing SSSR voltage until the du-
ty cycle gets locked into the steady state value as shown in
Figure 6(b). The synchronous rectifier outputs can be dis-
abled by grounding the SSSR pin.
30147832
FIGURE 6. (a) Waveforms during Soft-Start
(b) Waveforms after Soft-Start
Pre-Bias Startup
A common requirement for power converters is to have a
monotonic output voltage start-up into a pre-biased load i.e.
a pre-charged output capacitor. In a pre-biased load condi-
tion, if the synchronous rectifiers are engaged prematurely
they will sink current from the pre-charged output capacitors
resulting in an undesired output voltage dip. This condition is
undesirable and could potentially damage the power convert-
er. The LM5046 utilizes unique control circuitry to ensure
intelligent turn-on of the synchronous rectifiers such that the
output has a monotonic startup. Initially, the SSSR capacitor
is held at ground to disable the synchronous MOSFETs al-
lowing the body diode to conduct. The synchronous rectifier
soft-start is initiated once it is established the duty cycle is
controlled by the COMP instead of the soft-start capacitor i.e.
ICOMP < 800µA and the voltage at the SS pin>2V. The SSSR
capacitor is then released and is charged by a 20µA current
source. Further, as shown in Figure 7, a 1V offset on the
SSSR pin is used to provide additional delay. This delay en-
sures the output voltage is in regulation avoiding any reverse
current when the synchronous MOSFETs are engaged.
Soft-Stop
As shown in Figure 8, if the UVLO pin voltage falls below the
1.25V standby threshold, but above the 0.4V shutdown
threshold, the SSSR capacitor is soft-stopped with a 60µA
current source (3 times the charging current). Once the SSSR
pin reaches the 1.0V threshold, both the SS and SSSR pins
are immediately discharged to GND. Soft-stopping the power
converter gradually winds down the energy in the output ca-
pacitors and results in a monotonic decay of the output volt-
age. During the hiccup mode, the same sequence is executed
except that the SSSR is discharged with a 120µA current
source (6 times the charging current). In case of an OVP, VCC
UV, thermal limit or a VREF UV condition, the power converter
hard-stops, whereby all of the control outputs are driven to a
low state immediately.
17 www.national.com
LM5046
30147833
FIGURE 7. Pre-Bias Voltage Startup Waveforms
Soft-Stop Off
The Soft-Start Off (SSOFF) pin gives additional flexibility by
allowing the power converter to be configured for hard-stop
during line UVLO and hiccup mode condition. If the SS OFF
pin is pulled up to the 5V REF pin, the power converter hard-
stops in any fault condition. Hard-stop drives each control
output to a low state immediately. Refer to Table 1 for more
details.
30147834
FIGURE 8. Stop-Stop Waveforms during a UVLO Event
www.national.com 18
LM5046
Table 1: Soft-Stop in Fault
Conditions
Fault Condition SSSR
UVLO
(UVLO<1.25V)
Soft-Stop
3x the charging rate
OVP
(OVP>1.25V)
Hard-Stop
Hiccup
(CS>0.75 and RES>1V)
Soft-Stop
6x the charging rate
VCC/VREF UV Hard-Stop
Internal Thermal Limit Hard-Stop
Note: All the above conditions are valid with SSOFF pin tied
to GND. If SSOFF=5V, the LM5046 hard-stops in all the con-
ditions. The SS pin remains high in all the conditions until the
SSSR pin reaches 1V.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect the
integrated circuit in the event the maximum rated junction
temperature is exceeded. When activated, typically at 160°C,
the controller is forced into a shutdown state with the output
drivers, the bias regulators (VCC and REF) disabled. This
helps to prevent catastrophic failures from accidental device
overheating. During thermal shutdown, the SS and SSSR ca-
pacitors are fully discharged and the controller follows a nor-
mal start-up sequence after the junction temperature falls to
the operating level (140 °C).
Applications Information
30147862
FIGURE 9. Operating States of the PSFB Topology
PHASE-SHIFTED FULL-BRIDGE OPERATION
The phase shifted full-bridge topology is a derivative of the
conventional full-bridge topology. When tuned appropriately
the PSFB topology achieves zero voltage switching (ZVS) of
the primary FETs while maintaining constant switching fre-
quency. The ZVS feature is highly desirable as it reduces both
the switching losses and the EMI emissions. The realization
of the PSFB topology using the LM5046 is explained as fol-
lows:
Operating State 1 (Power Transfer/Active Mode)
The power transfer mode of the PSFB topology is similar to
the hard switching full-bridge i.e. When the FETs in the diag-
onal of the bridge are turned-on (HO1 & LO2 or HO2 & LO1),
a power transfer cycle from the primary to the secondary is
initiated. Figure 9 depicts the case where the diagonal switch-
es HO1 and LO2 are activated. In this state, full VIN is applied
to the primary of the power transformer, which is typically
stepped down on the secondary winding.
Operating State 2 (Active to Passive Transition)
At the end of the power transfer cycle, PWM turns off switch
LO2. In the primary side, the reflected load current plus the
magnetizing current propels the SW2 node towards VIN. The
active to passive transition is finished when either the body
diode of HO2 is forward-biased or HO2 is turned-on, whichev-
er happens earlier. A delay can be introduced by setting RD2
to an appropriate value, such that HO2 is turned-on only after
the body-diode is forward biased. In this mode, the Imag
+ILpeak act as a current source charging the parasitic capacitor
located at the node SW2. At light load conditions, it takes a
longer time to propel SW node towards VIN.
The active to passive transition time can be approximated by
using the following formula:
19 www.national.com
LM5046
Where, Im is the magnetizing current, NTR is the power
transformer’s turns ratio, ILpeak is the peak output filter inductor
current and Cparasitic is the parasitic capacitance at the node
SW2.
Operating State 3 (Freewheel/Passive Mode)
In the freewheel mode, unlike the conventional full-bridge
topology where all the four primary FETs are off, in the PSFB
topology the primary of the power transformer is shorted by
activating either both the top FETs (HO1 and HO2) or both of
the bottom FETs (LO1 and LO2) alternatively. In the current
CLK cycle, the top FETs HO1 and HO2 are kept on together.
Further in this mode, on the secondary side, similar to the
classic full-bridge topology the synchronous FETs are both
activated. During this state there is no energy transfer from
the primary and the filter inductor current in the secondary
freewheels through both the synchronous FETs.
Operating State 4 (Passive to Active Transition)
At the end of the switching cycle i.e. after the oscillator times
out the current CLK cycle, the primary switch HO1 and the
secondary FET SR1 are turned-off simultaneously. The volt-
age at the node SW1 begins to fall towards the GND. This is
due to the resonance between leakage inductance of the
power transformer plus any additional commutation inductor
and the parasitic capacitances at SW1. The magnetizing in-
ductor is shorted in the freewheel mode and therefore it does
not play any role in this transition. The LC resonance results
in a half-wave sinusoid whose period is determined by the
leakage inductor and parasitic capacitor. The peak of the half-
wave sinusoid is a function of the load current. The passive
to active transition time can be approximated by using the
following formula:
When tuned appropriately either by deliberately increasing
the leakage inductance or by adding an extra commutating
inductor, the sinusoidal resonant waveform peaks such that
it is clamped by the body-diode of the LO1 switch. At this in-
stant, ZVS can be realized by turning on the LO1 switch.
The switching sequence in this CLK cycle is as follows: acti-
vation of the switch LO1 turns the diagonal LO1 and HO2 on,
resulting in power transfer. The power transfer cycle ends
when PWM turns off HO2, which is followed by an active to
passive transition where LO2 is turned on. In the freewheel
mode, LO1 and LO2 are both activated. From this sequence,
it can be inferred that the FETs on the right side of the bridge
(HO2 and LO2) are always terminated by the PWM ending a
power transfer cycle and the SW2 node always sees an active
to passive transition. Further, the FETs on the left side of the
bridge (HO1 and LO1) are always turned-off by the CLK end-
ing a freewheel cycle and the SW1 node always sees a
passive to active transition.
30147863
FIGURE 10. Simplified PSFB Topology Showing the Turn-Off Mechanism
www.national.com 20
LM5046
CONTROL METHOD SELECTION
The LM5046 is a versatile PWM control IC that can be con-
figured for either current mode control or voltage mode con-
trol. The choice of the control method usually depends upon
the designer preference. The following must be taken into
consideration while selecting the control method. Current
mode control can inherently balance flux in both phases of the
PSFB topology. The PSFB topology, like other double ended
topologies, is susceptible to the transformer core saturation.
Any asymmetry in the volt-second product applied between
the two alternating phases results in flux imbalance that caus-
es a dc buildup in the transformer. This continual dc buildup
may eventually push the transformer into saturation. The volt-
second asymmetry can be corrected by employing current
mode control. In current mode control, a signal representative
of the primary current is compared against an error signal to
control the duty cycle. In steady-state, this results in each
phase being terminated at the same peak current by adjusting
the pulse-width and thus applying equal volt-seconds to both
the phases.
Current mode control can be susceptible to noise and sub-
harmonic oscillation, while voltage mode control employs a
larger ramp for PWM and is usually less susceptible. Voltage-
mode control with input line feed-forward also has excellent
line transient response. When configuring for voltage mode
control, a dc blocking capacitor can be placed in series with
the primary winding of the power transformer to avoid any flux
imbalance that may cause transformer core saturation.
VOLTAGE MODE CONTROL USING THE LM5046
To configure the LM5046 for voltage mode control, an exter-
nal resistor (RFF) and capacitor (CFF) connected to VIN, AG-
ND, and the RAMP pins is required to create a saw-tooth
modulation ramp signal shown in Figure 11. The slope of the
signal at RAMP will vary in proportion to the input line voltage.
The varying slope provides line feed-forward information nec-
essary to improve line transient response with voltage mode
control. With a constant error signal, the on-time (TON) varies
inversely with the input voltage (VIN) to stabilize the Volt-
Second product of the transformer primary. Using a line feed-
forward ramp for PWM control requires very little change in
the voltage regulation loop to compensate for changes in in-
put voltage, as compared to a fixed slope oscillator ramp.
Furthermore, voltage mode control is less susceptible to
noise and does not require leading edge filtering. Therefore,
it is a good choice for wide input range power converters.
Voltage mode control requires a Type-III compensation net-
work, due to the complex-conjugate poles of the L-C output
filter.
30147824
FIGURE 11. Feed-Forward Voltage Mode Configuration
The recommended capacitor value range for CFF is from
100pF to 1800pF. Referring to Figure 11, it can be seen that
CFF value must be small enough to be discharged with in the
clock pulse-width which is typically within 50ns. The RDS(ON)
of the internal discharge FET is 5.5Ω.
The value of RFF required can be calculated from
For example, assuming a VRAMP of 1.5V (a good compromise
of signal range and noise immunity), at VINMIN of 36V (oscil-
lator frequency of 400 kHz and CFF = 470pF results in a value
for RFF of 125 kΩ.
CURRENT MODE CONTROL USING THE LM5046
The LM5046 can be configured for current mode control by
applying a signal proportional to the primary current to the
RAMP pin. One way to achieve this is shown in Figure 12.
The primary current can be sensed using a current trans-
former or sense resistor, the resulting signal is filtered and
applied to the RAMP pin through a resistor used for slope
compensation. It can be seen that the signal applied to the
RAMP pin consists of the primary current information from the
CS pin plus an additional ramp for slope compensation,
added by the resistor RSLOPE.
The current sense resistor is selected such that during over
current condition, the voltage across the current sense resis-
tor is above the minimum CS threshold of 728mV.
21 www.national.com
LM5046
In general, the amount of slope compensation required to
avoid sub-harmonic oscillation is equal to at least one-half the
down-slope of the output inductor current, transformed to the
primary. To mitigate sub-harmonic oscillation after one
switching period, the slope compensation has to be equal to
one times the down slope of the filter inductor current trans-
posed to primary. This is known as deadbeat control. The
slope compensation resistor required to implement dead-beat
control can be calculated as follows:
Where NTR is the turns-ratio with respect to the secondary.
For example, for a 3.3V output converter with a turns-ratio
between primary and secondary of 9:1, an output filter induc-
tance (LFILTER) of 800nH and a current sense resistor
(RSENSE) of 150m, RSLOPE of 1.67k will suffice.
30147825
FIGURE 12. Current Mode Configuration
VIN and VCC
The voltage applied to the VIN pin, which may be the same
as the system voltage applied to the power transformer’s pri-
mary (VPWR), can vary in the range of the 14 to 100V. It is
recommended that the filter shown in Figure 13 be used to
suppress the transients that may occur at the input supply.
This is particularly important when VIN is operated close to
the maximum operating rating of the LM5046. The current into
VIN depends primarily on the LM5046’s operating current, the
switching frequency, and any external loads on the VCC pin,
that typically include the gate capacitances of the power
MOSFETs. In typical applications, an auxiliary transformer
winding is connected through a diode to the VCC pin. This pin
must raise VCC voltage above 8V to shut off the internal start-
up regulator.
After the outputs are enabled and the external VCC supply
voltage has begun supplying power to the IC, the current into
the VIN pin drops below 1mA. VIN should remain at a voltage
equal to or above the VCC voltage to avoid reverse current
through the internal body diode of the internal VCC regulator.
FOR APPLICATIONS WITH > 100V INPUT
For applications where the system input voltage exceeds
100V, VIN can be powered from an external start-up regulator
as shown in Figure 14. In this configuration, the VIN and VCC
pins should be connected together. The voltage at the VCC
and VIN pins must be greater than 10V (>Max VCC reference
voltage) yet not exceed 16V. To enable operation the VCC
voltage must be raised above 10V. The voltage at the VCC
pin must not exceed 16V. The voltage source at the right side
of Figure 14 is typically derived from the power stage, and
becomes active once the LM5046’s outputs are active.
www.national.com 22
LM5046
30147830
FIGURE 13. Input Transient Protection
30147837
FIGURE 14. Start-up Regulator for VPWR>100V
UVLO AND OVP VOLTAGE DIVIDER SELECTION
Two dedicated comparators connected to the UVLO and OVP
pins are used to detect under voltage and over voltage con-
ditions. The threshold values of both these comparators are
set at 1.25V. The two functions can be programmed inde-
pendently with two separate voltage dividers from VIN to
AGND as shown in Figure 15 and Figure 16, or with a three-
resistor divider as shown in Figure 17. Independent UVLO
and OVP pins provide greater flexibility for the user to select
the operational voltage range of the system. When the UVLO
pin voltage is below 0.4V, the controller is in a low current
shutdown mode. For a UVLO pin voltage greater than 0.4V
but less than 1.25V the controller is in standby mode. Once
the UVLO pin voltage is greater than 1.25V, the controller is
fully enabled. Two external resistors can be used to program
the minimum operational voltage for the power converter as
shown in Figure 15. When the UVLO pin voltage falls below
the 1.25V threshold, an internal 20µA current sink is enabled
to lower the voltage at the UVLO pin, thus providing threshold
hysteresis. Resistance values for R1 and R2 can be deter-
mined from the following equations:
Where VPWR is the desired turn-on voltage and VHYS is the
desired UVLO hysteresis at VPWR.
For example, if the LM5046 is to be enabled when VPWR
reaches 33V, and disabled when VPWR is decreased to 31V,
R1 should be 100k, and R2 should be 4.2k. The voltage at
the UVLO pin should not exceed 7V at any time.
Two external resistors can be used to program the maximum
operational voltage for the power converter as shown in Fig-
ure 16. When the OVP pin voltage rises above the 1.25V
threshold, an internal 20µA current source is enabled to raise
the voltage at the OVP pin, thus providing threshold hystere-
sis. Resistance values for R1 and R2 can be determined from
the following equations:
If the LM5046 is to be disabled when VPWR-OFF reaches 80V
and enabled when it is decreased to 78V. R1 should be
100k, and R2 should be 1.5 k. The voltage at the OVP pin
should not exceed 7V at any time.
23 www.national.com
LM5046
30147838
FIGURE 15. Basic UVLO Configuration
30147839
FIGURE 16. Basic OVP Configuration
The UVLO and OVP can also be set together using a 3 re-
sistor divider ladder as shown in Figure 17. R1 is calculated
as explained in the basic UVLO divider selection. Using the
same values, as in the above two examples, for the UVLO
and OVP set points, R1 and R3 remain the same at 100k
and 1.5k. The R2 is 2.7k obtained by subtracting R3 from
4.2kΩ.
Remote configuration of the controller’s operational modes
can be accomplished with open drain device(s) connected to
the UVLO pin as shown in Figure 18.
Figure 19 shows an application of the OVP comparator for
Remote Thermal Protection using a thermistor (or multiple
thermistors) which may be located near the main heat
sources of the power converter. The negative temperature
coefficient (NTC) thermistor is nearly logarithmic, and in this
example a 100k thermistor with the β material constant of
4500 Kelvin changes to approximately 2k at 130ºC. Setting
R1 to one-third of this resistance (665) establishes 130ºC as
the desired trip point (for VREF = 5V). In a temperature band
from 20ºC below to 20ºC above the OVP threshold, the volt-
age divider is nearly linear with 25mV per ºC sensitivity.
R2 provides temperature hysteresis by raising the OVP com-
parator input by R2 x 20µA. For example, if a 22k resistor is
selected for R2, then the OVP pin voltage will increase by 22k
x 20µA = 506mV. The NTC temperature must therefore fall
by 506mV / 25mV per ºC = 20ºC before the LM5046 switches
from standby mode to the normal mode.
www.national.com 24
LM5046
30147843
FIGURE 17. UVLO/OVP Divider
30147844
FIGURE 18. Remote Standby and Disable Control
30147814
FIGURE 19. Remote Thermal Protection
25 www.national.com
LM5046
CURRENT SENSE
The CS pin receives an input signal representative of its
transformer’s primary current, either from a current sense
transformer or from a resistor located at the junction of source
pin of the primary switches, as shown in Figure 20 and Figure
21, respectively. In both the cases, the filter components RF
and CF should be located as close to the IC as possible, and
the ground connection from the current sense transformer, or
RSENSE should be a dedicated trace to the appropriate GND
pin. Please refer to the layout section for more layout tips.
The current sense components must provide a signal >
710mV at the CS pin during an over-load event. Once the
voltage on the CS pin crosses the current limit threshold, the
current sense comparator terminates the PWM pulse and
starts to charge the RES pin. Depending on the configuration
of the RES pin, the LM5046 will eventually initiate a hiccup
mode restart or be in continuous current limit.
30147815
FIGURE 20. Transformer Current Sense
30147822
FIGURE 21. Resistor Current Sense
www.national.com 26
LM5046
HICCUP MODE CURRENT LIMIT RESTART
The operation of the hiccup mode restart circuit is explained
in the Functional Description section. During a continuous
current limit condition, the RES pin is charged with 30µA cur-
rent source. The restart delay time required to reach the 1.0V
threshold is given by:
This establishes the number of current limit events allowed
before the IC initiates a hiccup restart sequence. For exam-
ple, if the CRES=0.01µF, the time TCS as noted in Figure 22
below is 334µs. Once the RES pin reaches 1.0V, the 30µA
current source is turned-off and a 10µA current source is
turned-on during the ramp up to 4V and a 5µA is turned on
during the ramp down to 2V. The hiccup mode off-time is giv-
en by:
With a CRES=0.01µF, the hiccup time is 49ms. Once the hic-
cup time is finished, the RES pin is pulled-low and the SS pin
is released allowing a soft-start sequence to commence.
Once the SS pin reaches 1V, the PWM pulses will commence.
The hiccup mode provides a cool-down period for the power
converter in the event of a sustained overload condition there-
by lowering the average input current and temperature of the
power components during such an event.
30147816
FIGURE 22. Hiccup Mode Delay and Soft-Start Timing Diagram
Augmenting the Gate Drive Strength
The LM5046 includes powerful 2A integrated gate drivers.
However, in certain high power applications (>500W), it might
be necessary to augment the strength of the internal gate
driver to achieve higher efficiency and better thermal perfor-
mance. In high power applications, typically, the I2xR loss in
the primary MOSFETs is significantly higher than the switch-
ing loss. In order to minimize the I2xR loss, either the primary
MOSFETs are paralleled or MOSFETs with low RDS (on) are
employed. Both these scenarios increase the total gate
charge to be driven by the controller IC. An increase in the
gate charge increases the FET transition time and hence in-
creases the switching losses. Therefore, to keep the total
losses within a manageable limit the transition time needs to
be reduced.
Generally, during the miller capacitance charge/discharge the
total available driver current is lower during the turn-off pro-
cess than during the turn-on process and often it is enough to
speed-up the turn-off time to achieve the efficiency and ther-
mal goals. This can be achieved simply by employing a PNP
device, as shown in Figure 23, from gate to source of the
power FET. During the turn-on process, when the LO1 goes
high, the current is sourced through the diode D1 and the BJT
Q1 provides the path for the turn-off current. Q1 should be
located as close to the power FET as possible so that the turn-
off current has the shortest possible path to the ground and
does not have to pass through the controller.
27 www.national.com
LM5046
301478101
FIGURE 23. Circuit to Speed-up the Turn-off Process
Depending on the gate charge characteristics of the primary
FET, if it is required to speed up both the turn-on and the turn-
off time, a bipolar totem pole structure as shown in Figure
24 can be used. When LO1 goes high, the gate to source
current is sourced through the NPN transistor Q1 and similar
to the circuit shown in Figure 23 when LO1 goes low the PNP
transistor Q2 expedites the turn-off process.
301478102
FIGURE 24. Bipolar Totem Pole Arrangement
Alternatively, a low side gate driver such as LM5112 can be
utilized instead of the discrete totem pole. The LM5112 comes
in a small package with a 3A source and a 7A sink capability.
While driving the high-side FET, the HS1 acts as a local
ground and the boot capacitor between the BST and HS pins
acts as VCC.
www.national.com 28
LM5046
301478103
FIGURE 25. Using a Low Side Gate Driver to Augment Gate Drive Strength
Printed Circuit Board Layout
The LM5046 current sense and PWM comparators are very
fast and respond to short duration noise pulses. The compo-
nents at the CS, COMP, SLOPE, RAMP, SS, SSSR, RES,
UVLO, OVP, RD1, RD2, and RT pins should be physically
close as possible to the IC, thereby minimizing noise pickup
on the PC board trace inductance. Eliminating or minimizing
via’s in these critical connections are essential. Layout con-
sideration is critical for the current sense filter. If a current
sense transformer is used, both leads of the transformer sec-
ondary should be routed to the sense filter components and
to the IC pins. The ground side of the transformer should be
connected via a dedicated PC board trace to the AGND pin,
rather than through the ground plane. If the current sense cir-
cuit employs a sense resistor in the drive transistor source,
low inductance resistors should be used. In this case, all the
noise sensitive, low-current ground trace should be connect-
ed in common near the IC, and then a single connection made
to the power ground (sense resistor ground point).
The gate drive outputs of the LM5046 should have short, di-
rect paths to the power MOSFETs in order to minimize in-
ductance in the PC board. The boot-strap capacitors required
for the high side gate drivers should be located very close to
the IC and connected directly to the BST and HS pins. The
VCC and REF capacitors should also be placed close to their
respective pins with short trace inductance. Low ESR and
ESL ceramic capacitors are recommended for the boot-strap,
VCC and the REF capacitors. The two ground pins (AGND,
PGND) must be connected together directly underneath the
IC with a short, direct connection, to avoid jitter due to relative
ground bounce.
Application Circuit Example
The following schematic shows an example of a 100W phase-
shifted full-bridge converter controlled by LM5046. The oper-
ating input voltage range is 36V to 75V, and the output voltage
is 3.3V. The output current capability is 30 Amps. The con-
verter is configured for current mode control with external
slope compensation. An auxiliary winding is used to raise the
VCC voltage to reduce the controller power dissipation.
29 www.national.com
LM5046
Evaluation Board Schematic
30147858
FIGURE 26.
www.national.com 30
LM5046
Physical Dimensions inches (millimeters) unless otherwise noted
Molded TSSOP-28
NS Package Number MXA28A
28-Lead LLP Package
NS Package Number SQA28A
31 www.national.com
LM5046
Notes
LM5046 Phase-Shifted Full-Bridge PWM Controller with Integrated MOSFET Drivers
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