CAT3200TDI-TE13 - ON Semiconductor L.L.C.

Characteristics subject to change without notice 1Doc. No. 5002, Rev. I

CAT3200, CAT3200-5

Low Noise Regulated Charge Pump DC-DC Converter

DESCRIPTION

The CAT3200 and CAT3200-5 are switched capacitor

boost converters that deliver a low noise, regulated

output voltage. The CAT3200-5 gives a fixed regulated

5V output. The CAT3200 has an adjustable output

using external resistors. The constant frequency 2MHz

charge pump allows small 1µF ceramic capacitors to

be used.

Maximum output loads of up to 100mA can be

supported over a wide range of input supply voltages

(2.7V to 4.5V) making the device ideal for battery-

powered applications.

FEATURES

■Constant high frequency (2MHz) operation

■100mA output current

■Regulated output voltage (5V fixed CAT3200-5,

Adjustable CAT3200)

■Low quiescent current (1.7mA typ.)

■Input voltage operation down to 2.7V

■Soft start, slew rate control

■Thermal overload shutdown protection

■Low value external capacitors (1µF)

■Foldback current overload protection

■Shutdown current less than 1µA

■CAT3200-5 in low profile (1mm thin) 6-lead

SOT23 package

■CAT3200 in MSOP-8 package

APPLICATIONS

■3V to 5V boost conversion

■White LED driver

■USB On-The-Go 5V supply

A shutdown control input allows the device to be

placed in power-down mode, reducing the supply

current to less than 1µA.

In the event of short circuit or overload conditions, the

device is fully protected by both foldback current

limiting and thermal overload detection. In addition, a

soft start, slew rate control circuit limits inrush current

during power-up.

The CAT3200-5 is available in a 6-lead, 1mm max

thin SOT23 package. The CAT3200 is available in an

8-lead MSOP package.

■Local 5V supply from lower rail

■Battery backup systems

■Handheld portable devices

TYPICAL APPLICATION

CAT3200-5

CNEG CPOS

IN OUT

ON OFF SHDN

GND

5V Output

3.3V

CAT3200

CNEG CPOS

IN OUT

ON OFF SHDN

GND

3.3V

VIN

100mA

VOUT

Adjustable Output

VIN

100m

VOUT

VOUT = 1.27 V 1+

(

CAT3200/3200-5

Characteristics subject to change without notice

PIN CONFIGURATION

ORDERING INFORMATION

6-lead Thin SOT23

CAT3200-5

OUT

GND

SHDN

CPOS

CNEG

8-pin MSOP

CPOS

CNEG

PGND

OUT

SHDN

SGND

CAT3200

PIN DESCRIPTIONS

Designation Description

OUT Regulated output voltage.

GND Ground reference for all voltages.

SHDN Shutdown control logic input (Active LOW)

CNEG Negative connection for the flying capacitor.

IN Input power supply.

CPOS Positive connection for the flying capacitor.

FB Feedback to set the output voltage.

PGND Power ground.

SGND Signal ground.

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CAT3200/3200-5

3Doc No. 5002, Rev. I

Characteristics subject to change without notice

Note 1: ROL = (2VIN - VOUT)/IOUT

Note 2: In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor

feedback network. This will cause a small level of reverse current to flow back into the device to ground.

ELECTRICAL SPECIFICATIONS

Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1µF ceramic capacitors and VIN

is set to 3.6V.

ABSOLUTE MAXIMUM RATINGS

VIN, VOUT, SHDN, CNEG, CPOS Voltage .. -0.6V to 6.0V

VOUT Short Circuit Duration......................... Indefinite

Output Current ................................................ 200mA

ESD Protection (HBM) ..................................... 2000V

Junction Temperature ...................................... 150°C

Storage Temperature Range ............. -65°C to 160°C

Lead Soldering Temperature (10 sec) ............. 300°C

Power Dissipation (SOT23-6) ............................ 0.3W

Power Dissipation (8-MSOP) ............................. 0.5W

RECOMMENDED OPERATING CONDITIONS

VIN ................................................................................... 2.7V to 4.5V

CIN, COUT, CFLY .......................................................................... 1µF

ILOAD ................................................................................. 0 to 100mA

Ambient Temperature Range ................... -40°C to 85°C

Symbol Parameter Conditions Min Typ Max Units

VOUT Regulated Output ILOAD ≤ 40mA, VIN ≥ 2.7 V 4.8 5.0 5.2 V

ILOAD ≤ 100mA, VIN ≥ 3.1 V

VLINE Line Regulation 3.1V ≤ VIN ≤ 4.5V, ILOAD = 50mA 6 mV

VLOAD Load Regulation ILOAD = 10mA to 100mA, VIN = 3.6V 20 mV

FOSC Switching Frequency 1.3 2.0 2.6 MHz

VROutput Ripple ILOAD = 100mA 30 mVp-p

Voltage CAT3200-5 Only

ηEfficiency ILOAD = 50mA, VIN = 3V, CAT3200-5 80 %

IGND Ground Current ILOAD = 0mA, SHDN = VIN 1.6 4 mA

ISHDN Shutdown Input ILOAD = 0mA, SHDN = 0V to VIN 1µA

Current

VFB FB Voltage CAT3200 Only 1.22 1.27 1.32 V

IFB FB Input Current CAT3200 Only -50 50 nA

ROL Open-Loop ILOAD = 100mA, VIN = 3V (Note 1) 10 Ω

Resistance

TON VOUT Turn-on time ILOAD = 0mA, VIN = 3V 0.5 ms

(10% to 90%)

VIHSHDN High Detect 0.8 1.3 V

Shutdown Threshold

VILSHDN Low Detect 0.4 V

Shutdown Threshold

IROUT Reverse Leakage VOUT = 5V, Shutdown mode (Note 2) 15 30 µA

into OUT pin

ISC Short-circuit Output VOUT = 0V 80 mA

TSD Thermal Shutdown 160 °°

°°

°C

THYST Thermal Hysteresis 20 °°

°°

°C

CAT3200/3200-5

Characteristics subject to change without notice

TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5)

Shutdown Input Threshold vs. Supply Voltage

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

2.7 3.0 3.3 3.6 3.9 4.2 4.5

INPUT VOLTAGE [V]

SHUTDOWN THRESHOLD [V] .

Ground Current vs. Supply Voltage (No Load)

1.2

1.4

1.6

1.8

2.0

2.2

2.73.03.33.63.94.24.5

INPUT VOLTAGE [V]

GROUND CURRENT [mA]

Line Regulation

4.8

4.9

5.0

5.1

5.2

2.73.03.33.63.94.24.5

INPUT VOLTAGE [V]

OUTPUT VOLTAGE [V] .

20mA Load

100mA Load

Load Regulation

4.8

4.9

5.0

5.1

5.2

050100150

LOAD CURRENT [mA]

OUTPUT VOLTAGE [V] .

VIN = 2.7V

VIN = 3V

VIN = 3.2V

Oscillator Frequency vs. Supply Voltage

1.6

1.8

2.0

2.2

2.4

2.6

2.73.03.33.63.94.24.5

INPU T VOLTAGE [V]

OSCILLATOR FREQUENCY [MHz]

Efficiency

vs. Load Current

100

110 100

LOAD CURRENT [mA]

VIN=

2.7V

VIN= 3.7V

VIN= 4.5V

VIN= 3.2V

EFFICIENCY [%]

TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise.

CAT3200/3200-5

5Doc No. 5002, Rev. I

Characteristics subject to change without notice

TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5)

TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise.

Soft Start Power Up (90mA Load, 3.3V Input) Load Step Response (3.3V Input)

Output Ripple (100mA Load, 3.3V Input)

Short Circuit Current vs Supply Voltage

100

150

200

250

2.7 3.0 3.3 3.6 3.9 4.2 4.5

INPUT VOLTAGE [V]

CURRENT LIMIT [mA]

Output Voltage Change vs. Temperature

-2

-1

-40 -20 0 20 40 60 80 100

TEMPERATURE [

OUTPUT VOLTAGE CHANGE [%]

10mA Load

Oscillator Frequency Change vs. Temperature

-4

-2

-40-20 0 20406080100

TEMPERATURE [ C]

FREQUENCY CHANGE [%] .

CAT3200/3200-5

Characteristics subject to change without notice

resistor network (400kΩ). The feedback network will

result in a reverse current of 10µA to 20µA to flow back

through the device to ground.

Whenever the device is taken out of shutdown mode, the

output voltage will experience a slew rate controlled

power-up. Full operating voltage is typically achieved in

less than 0.5 msec.

GND is the ground reference for all voltages on CAT3200-

5 devices.

FB (CAT3200 Only) is the feedback input pin. An output

divider should be connected from OUT to FB to program

the output voltage.

PGND (CAT3200 Only). Is the same as GND for the

CAT3200-5 except for the internal reference connection

to SGND.

SGND (CAT3200 Only) Ground pin for the internal

reference. The CNEG connection is switched to this pin

during the normal charge pump operation.

PIN FUNCTIONS

IN is the power supply. During normal operation the

device draws a supply current which is almost constant.

A very brief interval of non-conduction will occur at the

switching frequency. The duration of the non-conduction

interval is set by the internal non-overlapping

“break-before-make” timing. IN should be bypassed

with a 1µF to 4.7µF low ESR (Equivalent Series

Resistance) ceramic capacitor.

For filtering, a low ESR ceramic bypass capacitor (1µF)

in close proximity to the IN pin prevents noise from being

injected back into the power supply.

SHDNSHDN

SHDN is the logic control input (Active LOW) that places

the device into shutdown mode. The internal logic is

CMOS and the pin does not use an internal pull-down

resistor. The SHDNSHDN

SHDNSHDN

SHDN pin should not be allowed to float.

CPOS, CNEG are the positive and negative connections

respectively for the charge pump flying capacitor. A low

ESR ceramic capacitor (1µF) should be connected

between these pins. During initial power-up it may be

possible for the capacitor to experience a voltage reversal

and for this reason, avoid using a polarized (tantalum or

aluminum) flying capacitor.

OUT is the regulated output voltage to power the load.

During normal operation, the device will deliver a train of

current pulses to the pin at a frequency of 2MHz.

Adequate filtering on the pin can typically be achieved

through the use a low ESR ceramic bypass capacitor

(1µF to 4.7µF) in close proximity to the OUT pin. The

ESR of the output capacitor will directly influence the

output ripple voltage.

When the shutdown mode is entered, the output is

immediately isolated from the input supply, however, the

output will remain connected to the internal feedback

CAT3200 Adjustable Output CAT3200-5 5V Fixed Output

BLOCK DIAGRAM

—

2MHz

Voltage

Doubler

1.25V

SGND

SHDN

CNEG CPOS

2VIN

5V/100mA

OUT

PGND

—

2MHz

Voltage

Doubler

300k

100k

1.25V

GND

SHDN

CNEG CPOS

2VIN

100mA OUT

CAT3200/3200-5

7Doc No. 5002, Rev. I

Characteristics subject to change without notice

Figure 1: Programming the Adjustable CAT3200

Typical values for total voltage divider resistance can

range from several kΩs up to 1MΩ.

OUT

PGND

SGND

VOUT

1.27V

COUT

( )

1 + R1

CPOS CNEG

SHDN

DEVICE OPERATION

The CAT3200/CAT3200-5 use a switched capacitor

charge pump to boost the voltage at IN to a regulated

output voltage. Regulation is achieved by sensing the

output voltage through an internal resistor divider

(CAT3200-5) and modulating the charge pump output

current based on the error signal. A 2-phase non-

overlapping clock activates the charge pump switches.

The flying capacitor is charged from the IN voltage on the

first phase of the clock. On the second phase of the clock

it is stacked in series with the input voltage and connected

to OUT. The charging and discharging the flying capacitor

continues at a free running frequency of typically 2MHz.

In shutdown mode all circuitry is turned off and the

CAT3200/CAT3200-5 draw only leakage current from

the VIN supply. OUT is disconnected from IN. The SHDN

pin is a CMOS input with a threshold voltage of

approximately 0.8V. The CAT3200/CAT3200-5 is in

shutdown when a logic LOW is applied to the SHDN pin.

The SHDN pin is a high impedance CMOS input. SHDN

does not have an internal pull-down resistor and should

not be allowed to float and. It must always be driven with

a valid logic level.

Short-Circuit and Thermal Protection

The CAT3200 and CAT3200-5 have built-in short-circuit

current limiting and over temperature protection. During

overload conditions, output current is limited to

approximately 225mA. At higher temperatures, or if the

input voltage is high enough to cause excessive chip self

heating, the thermal shutdown circuit shuts down the

charge pump as the junction temperature exceeds

approximately 160°C. Once the junction temperature

drops back to approximately 140°C, the charge pump is

enabled. The CAT3200and CAT3200-5 will cycle in and

out of thermal shutdown indefinitely without latch-up or

damage until a short-circuit on OUT is removed.

Programming the CAT3200 Output Voltage (FB Pin)

The CAT3200-5 version has an internal resistive divider

to program the output voltage. The programmable

CAT3200 may be set to an arbitrary voltage via an

external resistive divider. Since it employs a voltage

doubling charge pump, it is not possible to achieve

output voltages greater than twice the available input

voltage. Figure 1 shows the required voltage divider

connection. The voltage divider ratio is given by the

formula:

OUT1

2127 1=−

CAT3200/3200-5

Characteristics subject to change without notice

APPLICATION INFORMATION

Ceramic Capacitors

Ceramic capacitors of different dielectric materials lose

their capacitance with higher temperature and voltage at

different rates. For example, a capacitor made of X5R or

X7R material will retain most of its capacitance from –

40°C to 85°C whereas a Z5U or Y5V style capacitor will

lose considerable capacitance over that range.

Z5U and Y5V capacitors may also have voltage coefficient

causing them to lose 60% or more of their capacitance

when the rated voltage is applied. When comparing

different capacitors it is often useful consider the amount

of achievable capacitance for a given case size rather

than discussing the specified capacitance value. For

example, over rated voltage and temperature conditions,

a 1µF, 10V, Y5V ceramic capacitor in an 0603 case may

not provide any more capacitance than a 0.22µF, 10V,

X7R available in the same 0603 case. For many

CAT3200/CAT3200-5 applications these capacitors can

be considered roughly equivalent.

The capacitor manufacturer’s data sheet should be

consulted to determine what value of capacitor is needed

to ensure the desired capacitance at all temperatures

and voltages. Below is a list of ceramic capacitor

manufacturers and how to contact them:

Capacitor

Manufacturer Web Phone

Murata www.murata.com 814.237.1431

AVX/Kemet www.avxcorp.com 843.448.9411

Vishay www.vishay.com

Kemet www.kemet.com 408.986.0424

Taiyo Yuden www.t-yuden.com 408.573.4150

Thermal Management

For higher input voltages and maximum output current

there can be substantial power dissipation in the

CAT3200/CAT3200-5. If the junction temperature

increases to 160°C, the thermal shutdown circuitry will

automatically turn off the output.

A good thermal connection to the PC board is

recommended to reduce the chip temperature.

Connecting the GND pin (Pins 4/5 for CAT3200, Pin 2 for

CAT3200-5) to a ground plane, and maintaining a solid

ground plane under the device reduces the overall

thermal resistance.

The overall junction to ambient thermal resistance (θJA)

for device power dissipation (PD) consists primarily of

two paths in series. The first path is the junction to the

case (θJC) which is defined by the package style, and the

second path is case to ambient (θCA) thermal resistance

which is dependent on board layout. The final operating

junction temperature for any set of conditions can be

estimated by the following thermal equation:

TTP P

JUNC AMB D JC DCA

=+ +() ()ΘΘ

=+TP

AMB D JA

()Θ

The CAT3200 in SOT23 package, when mounted on

printed circuit board with two square inches of copper

allocated for “heat spreading”, will result with an overall

θJA of less than 150°C/W.

For a typical application operating from a 3.8V input

supply, the maximum power dissipation is 260mW

(100mA x 3V). This would result if a maximum junction

temperature of :

T = T + P ()

= 85 C + 0.26W (150 C/W)

= 85 C + 39 C = 124 C

JUNC AMB D JA

°°

°° °

The use of multi-layer board construction with power

planes will further enhance the overall thermal

performance. In the event of no dedicated copper area

being used for heat spreading, a multi-layer board will

typically provide the CAT3200 with an overall θJA of

200°C/W. This level of thermal conduction would allow

up to 200mW be safely dissipated within the device.

CAT3200/3200-5

9Doc No. 5002, Rev. I

Characteristics subject to change without notice

ON OFF

C+C-

IN OUT

SGND

PGND

SHDN

82Ω82Ω82Ω82Ω82Ω

CAT3200

VSHDN

Apply PWM Waveform for

Adjustable Brightness Control

3V to 4.4V

Li-ion

Battery

Up to 6 LEDs

ON OFF

C-C+

IN OUT

SGND

SHDN

100Ω100Ω100Ω100Ω

CAT3200-5

VSHDN

Apply PWM Waveform for

Adjustable Brightness Control

3V to 4.4V

Li-ion

Battery

Drive up to 5 LEDs

100Ω

CAT3200-5

VOUT

5V + 4%

100mA

3.3 V + 10%

CAT3200-5

VOUT

5V + 4%

IN OUT

SHDN

GND

IN OUT

SHDN

GND

TYPICAL APPLICATIONS

White or Blue LED Driver with LED Current Control

Lithium-Ion Battery to 5V White or Blue LED Driver

3.3 V Supply to 5 V USB Port to Regulated 5V Power Supply

CAT3200/3200-5

Characteristics subject to change without notice

Notes:

1. Dimensions and tolerancing per ASME Y14.5M - 1994

2. Dimension are in mm.

3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs

shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.15mm per side. D and E1 dimensions are determined at Datum H.

Tolerances of Form and Position Notes

aaa 0.15 1,2

bbb 0.25 1,2

ccc 0.10 1,2

Variations

AA 6 AB BA

Min Nom Max Min Nom Max Min Nom Max Notes

b 0.30 —0.45 0.30 —0.45 0.22 —0.36 7,8

b1 0.31 0.35 0.39 0.31 0.35 0.39 0.22 0.26 0.30

e 0.95BSC 0.95BSC 0.65BSC

e1 1.90BSC 1.90BSC 1.95BSC

N6 5 8

Tolerances of Form and Position

ddd 0.20 0.20 0.13 1,2

4. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, the bar

burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. D and E1 dimensions are determined at Datum H.

5. Datums A & B to be determined at Datum H.

6. Package varation "AB" is a 5 lead version of the 6 lead variation "AA" where lead #5 has been removed from the 6 lead "AA" variation.

7. These dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip.

8. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition. The dambar

cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm.

aaa C 2X

aaa C D

3 4

bbb C

2X N/2 TIPS

NX b

12 N/2

N/2

ddd C

MA B D

E1/2

E/2

ccc C

SEATING

PLANE

ANX

SEE VIEW C

VIEW A-A

GAUGE

PLANE

SEATING

PLANE

VIEW C

BASE METAL

SECTION B - B

WITH METAL

(b)

b5 8

X=A &/or B

ODD LEAD SIDES

TOP VIEW

X=A &/or B

EVEN LEAD SIDES

TOP VIEW

e/2

(L1)

MECHANICAL PACKAGE DRAWINGS

6-LEAD THIN

SOT-23

All Dimensions are in Millimeters

Min Nom Max Notes

A——1.00

A1 0.01 0.05 0.10

A2 0.84 0.87 0.90

c 0.12 0.15 0.20 7

c1 0.08 0.13 0.16 7

D 2.80 2.90 3.00 3,4

E 2.60 2.80 3.00 3,4

E1 1.50 1.60 1.75 3,4

L 0.30 0.40 0.50

L1 0.60REF

L2 0.25BSC

R 0.10 ——

R1 0.10 —0.25

θ0°4°8°

θ14°10°12°

CAT3200/3200-5

11 Doc No. 5002, Rev. I

Characteristics subject to change without notice

Notes:

(1) All dimensions are in mm Angles in degrees.

2 Does not include Mold Flash, Protrusion or Gate Burrs. Mold Flash, Protrusions or Gate Burrs shall not exceed 0.15 mm. per side.

3 Does not include Interlead Flash orProtrusion. Interlead Flash or Protrusion shall not exceed 0.25 mm per side.

4 Does not include Dambar Protrusion, allowable Dambar Protrusion shall be 0.08 mm.

(5) This part is compliant with JEDEC Specification MO-187 Variations AA.

(6) Lead span/stand off height/coplanarity are considered as special characteristics. (S)

(7) Controlling dimensions in inches. [mm]

MECHANICAL PACKAGE DRAWINGS

8-LEAD MSOP

0.0150

0.0110

0.38

0.28

0.1970

0.1890

5.00

4.80 S

0.0256 [0.65] BSC

0.1220

0.1142

3.10

2.90

0.0433 [1.10] MAX.

0.039 [0.10] MAX. S 0.0059

0.0020

0.15

0.05 S

0.0374

0.0295

0.95

0.75

0.0276

0.0157

0.70

0.40

0.1220

0.1142

3.10

2.90 0˚ - 6˚

0.0091

0.0051

0.23

0.13

0.0118 [0.30] REF.

BASE METAL

0.0050 [0.127]

0.0150

0.0110

0.38

0.28

WITH PLATING

SECTION A - A

WITH PLATING

Catalyst Semiconductor, Inc.

Corporate Headquarters

1250 Borregas Avenue

Sunnyvale, CA 94089

Phone: 408.542.1000

Fax: 408.542.1200

www.caalyst-semiconductor.com

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Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents

issued to Catalyst Semiconductor contact the Company’s corporate office at 408.542.1000.

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PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE

RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING

OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.

Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or

other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a

situation where personal injury or death may occur.

Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets

labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.

Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate

typical semiconductor applications and may not be complete.

Publication #: 5002

Revison: I

Issue date: 09/22/05

REVISION HISTORY

Date Rev. Reason

06/17/2004 A Initial Release

09/3/2004 B Update Ordering Information

09/23/2004 C Minor change

10/26/2004 D Removed TDFN package, minor changes

10/29/2004 E Added Green Packages

02/1/2005 F Update 6-lead SOT-23 mechanical package drawing

02/28/2005 G Update Ordering Information

03/18/2005 H Update Ordering Information

09/22/2005 I Update Ordering Information