PART NUMBER UPC8163TB
PACKAGE OUTLINE S06
SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX
ICC Circuit Current (no signal) mA 11.5 16.5 23
CG Conversion Gain fRFOUT = 0.9 GHz, PIFIN = -30 dBm dB 6 9 12
fRFOUT = 1.9 GHz, PIFIN = -30 dBm dB 4 7 10
PSAT Saturated Output Power fRFOUT = 0.9 GHz dBm -1.5 0.5
fRFOUT = 1.9 GHz dBm -4.5 -2
OIP3Output third Order Intercept Point,
fIFIN1 = 240 MHz
fIFIN2 = 240.4 MHz fRFOUT = 0.9 GHz dBm +9.5
PIFIN = -20 dBm fRFOUT = 1.9 GHz dBm +6.0
NF SSB Noise Figure fRFOUT = 0.9 GHz dB 12.5
fRFOUT = 1.9 GHz dB 12.5
RECOMMENDED OPERATING FREQUENCY:
fRFOUT = 0.8 GHz to 2.0 GHz
fIFIN = 50 MHz to 300 MHz
SUPPLY VOLTAGE:
VCC = 2.7 to 3.3 V
HIGH DENSITY SURFACE MOUNTING:
6-pin super minimold package
HIGH IP3:
OIP3 = +9.5 dBm @ fRFOUT = 900 MHz
MINIMIZED CARRIER LEAKAGE:
Due to double balanced mixer
FEATURES
3 V SILICON RFIC
FREQUENCY UPCONVERTER
ELECTRICAL CHARACTERISTICS
(TA = 25°C, VCC = VRFOUT = 3.0 V, fIFIN = 240 MHz, PLOIN = -5 dBm unless otherwise specified)
DESCRIPTION
California Eastern Laboratories
UPC8163TB
NEC's UPC8163TB is a silicon RFIC designed as a frequency
upconverter for cellular/cordless telephone transmitter stages,
and features improved intermodulation. This device is housed
in a 6 pin super mini mold or SOT-363 package making it ideal
for reducing system size. The UPC8106TB is manufactured
using NEC's 20 GHz fTNESATTM III silicon bipolar pro-
cess.
NEC's stringent quality assurance and test procedures ensure
the highest reliability and performance.
LO input
GND
IF input
GND
V
CC
RF output
(Top View)
3
2
1
4
5
6
BLOCK DIAGRAM
APPLICATIONS
• Digital Cellular/Cordless Phones
Pin Pin Applied Pin Description Equivalent Circuit
No. Name Voltage Voltage
1IFINPUT 1.2
2 GND 0
4
3LOINPUT 2.1
5VCC 2.7 to 3.3
6RFOUTPUT
SYMBOLS PARAMETERS UNITS MIN TYP MAX
VCC Supply Voltage1V 2.7 3.0 3.3
PLOIN Local Input Level2dBm -10 -5 0
fRFOUT RF Output Frequency3GHz 0.8 2.0
fIFIN IF Input Frequency MHz 50 300
TOP Operating Temperature ˚C -40 +25 +85
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
SYMBOLS PARAMETERS UNITS RATINGS
VCC Supply Voltage2V 3.6
PTTotal Power Dissipation3mW 200
PIN Input Power dBm +10
TOP Operating Temperature °C -40 to +85
TSTG Storage Temperature °C -55 to +150
UPC8163TB
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage.
2. TA = 25˚C, pins 5 and 6.
3. Mounted on a double-sided copperclad 50x50x1.6 mm epoxy
glass PWB, TA = 85˚C).
RECOMMENDED
OPERATING CONDITIONS
PIN FUNCTIONS
GND pin. Ground pattern on the board should be
as wide as possible. Trace length should be kept
as short as possible to minimize ground
impedance.
LO input pin. Recommended input level is -10 to
0 dBm.
Supply voltage pin.
This pin is the RF output. This pin is designed as
an open collector. Due to the high impedance
output, this pin requires an external LC matching
circuit.
This pin is the IF input to double balanced mixer.
The input is a high impedance.
Same
bias as
VCC
through
external
inductor
Notes:
1. Same voltage applied to pins 5 and 6
2. ZS = 50 (without matching)
3. With external matching circuit
1
3
2
6
5
Phase
Shifter
90˚
DEMO I
Q
I
Q
÷NPLL
PLL
VCO
UPC8163TB
RX
SW
TX
PA
APPLICATION EXAMPLE
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UPC8163TB
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE S06
LEAD CONNECTIONS
Note:
All dimensions are typical unless otherwise specified.
1. IF INPUT
2. GND
3. LO INPUT
4. GND
5. VCC
6. RF OUTPUT
(Top View) (Bottom View)
PART NUMBER QUANTITY
UPC8163TB-E3-A 3K/Reel
ORDERING INFORMATION
TEST CIRCUIT 1 (RFOUT = 900 MHz)
3
2
1
4
5
6
C2Y
3
2
1
4
5
6
EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES Headquarters 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 (408) 988-3500 Telex 34-6393 FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) Internet: http://WWW.CEL.COM
 02/14/2000
DATA SUBJECT TO CHANGE WITHOUT NOTICE
TEST CIRCUIT 2 (RFOUT = 1.9 GHz)
100 pF
10 nH
1.0 pF
900 MHz
Match
1000 pF
1000 pF
L
Oin
IF
in
GND
GND
RFout
V
CC 0.1 µF
100 pF
3
2
1
4
5
6
(Top View)
100 pF
100 nH
1.9 GHz
Match
1000 pF
2.7 pF
1000 pF
LOin
IFin
GND
GND
RFout
VCC 0.1 µF
100 pF
3
2
1
4
5
6
(Top View)
TL = 5 nH
Note: Embossed tape 8 mm wide. Pins 1,2,3 face tape perforation
side.
+0.1
-0
DOT ON
BACK SIDE
+0.1
-0.5
0 ~0.1
0.2
0.15
3
2
16
5
4
0.65
1.3
2.0±0.2
0.65
2.1±0.1
1.25±0.1
0.9 ± 0.1
0.7
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
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4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile:
(
408
)
988-0279
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CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
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go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A -AZ
Lead (Pb) < 1000 PPM Not Detected (*)
Mercury < 1000 PPM Not Detected
Cadmium < 100 PPM Not Detected
Hexavalent Chromium < 1000 PPM Not Detected
PBB < 1000 PPM Not Detected
PBDE < 1000 PPM Not Detected
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standards, please do not hesitate to contact your local representative.
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