© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 1
Product Specification
Small Form Factor
Single Mode 1300 nm 622 Mbit/s Transceiver
2x5 Pinning with LC™ Connector, with Collar
V23818-H18-Lxx
V23818-H18-Lxxx
File: 1180
PRODUCT FEATURES
• Small Form Factor MSA compliant
transceiver
1)
• RJ-45 style LC™ connector system
• Half the size of SC Duplex 1x9 transceiver
• Single power supply (3.3 V)
• Extremely low power consumption
• Loss of optical signal indicator
• Laser disable input
• LVPECL differential inputs and outputs
• Distance up to 21 km on single mode fiber
(SMF)
• Class 1 FDA and IEC laser safety
compliant
• Multisource footprint
• Small footprint for high channel density
• UL 94 V-0 certified
• Compliant with FCC (Class B) and
EN 55022
• SFF evaluation board V23818-S5-V13
(AC/AC) or V23818-S5-V14 (DC/DC)
available upon request
APPLICATIONS
• SONET OC-12 IR-1
Telcordia GR-253-CORE
• SONET OC-3 IR-1
Telcordia GR-253-CORE
• SDH STM-4 S-4.1 ITU-T G.957
• SDH STM-1 S-1.1 ITU-T G.957
• Suitable for Fast Ethernet
LC™ is a trademark of Lucent.
For PRODUCT SELECTION see next page.
Notes:
1) Current MSA documentation can be found at http://www.sffcommittee.org/ie..
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 2
PRODUCT SELECTION
Part Number Pinning Operating
Temperature
Signal
Detect
Data Outputs
if SD is Low
In-
put
Out-
put
V23818-H18-L37 2x5 –5°C to 70°C LVPECL Switched to Low DC DC
V23818-H18-L36 –40°C to 85°C
V23818-H18-L47 –5°C to 70°C LVTTL AC AC
V23818-H18-L46 –40°C to 85°C
V23818-H18-L437 –5°C to 70°C LVPECL Active DC DC
V23818-H18-L436 –40°C to 85°C
V23818-H18-L447 –5°C to 70°C LVTTL AC AC
V23818-H18-L446 –40°C to 85°C
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 3
Pin Configuration
Figure 1
Pin Description
Pin
No.
Symbol Level/Logic Description
1VEEr Ground Receiver signal ground
2VCCr Power supply Receiver power supply
3 SD LVTTL or
LVPECL output1)
Notes:
1) LVPECL output active high for V23818-H18-L37/L36/L437/L436.
LVTTL output active high for V23818-H18-L47/L46/L447/L446.
Receiver optical input level monitor
4 RD– LVPECL output Receiver data out bar
5 RD+ LVPECL output Receiver data out
6VCCt Power supply Transmitter power supply
7VEEt Ground Transmitter signal ground
8 TDis LVTTL input Transmitter disable
9 TD+ LVPECL input Transmitter data in
10 TD– LVPECL input Transmitter data in bar
MS Mounting studs
HL Housing leads
File: 1331
Tx
Rx
HL
HL
HL
HL
12345
678910
TOP VIEW
MS
MS
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 4
VEEr / VEEt
Connect pins 1 and 7 to signal ground.
VCCr / VCCt
A 3.3 V DC power supply must be applied at pins 2 and 6. A recommended power supply
filter network is given in the termination scheme. Locate power supply filtering directly at
the transceiver power supply pins. Proper power supply filtering is essential for good EMI
performance.
TD+ / TD–
Transmitter data LVPECL level inputs. For V23818-H18-L47/L46/L447/L446 terminated
and AC coupled internally. For V23818-H18-L37/L36/L437/L436 use termination and
coupling as shown in the termination scheme.
RD– / RD+
Receiver data LVPECL level outputs. For V23818-H18-L47/L46/L447/L446 biased and
AC coupled internally. For V23818-H18-L37/L36/L437/L436 use termination and
coupling as shown in the termination scheme.
TDis
A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input
must be applied. Leave pin unconnected if feature not required.
SD
LVTTL output for V23818-H18-L47/L46/L447/L446. LVPECL output for V23818-H18-
L37/L36/L437/L436. A logical high output indicates normal optical input levels to the
receiver. Low optical input levels at the receiver result in a low output. Signal Detect can
be used to determine a definite optical link failure; break in fiber, unplugging of a
connector, faulty laser source. However it is not a detection of a bad link due to data-
related errors.
MS
Mounting studs are provided for transceiver mechanical attachment to the circuit board.
They also provide an optional connection of the transceiver to the equipment chassis
ground. The holes in the circuit board must be tied to chassis ground.
HL
Housing leads are provided for additional signal grounding. The holes in the circuit board
must be included and tied to signal ground.
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 5
Description
The Finisar 622 Megabit single mode transceiver – part of Finisar Small Form Factor
transceiver family – complies with the ATM Forum’s Network Compatible ATM for Local
Network Applications document and ANSI’s Broadband ISDN - Customer Installation
Interfaces, Physical Media Dependent Specification, T1.646-1995, SONET OC-12 IR-1,
Telcordia GR-253-CORE and STM-4 S-4.1 (ITU-T G.957).
The appropriate fiber optic cable is 9 µm single mode fiber with LC connector.
The Finisar OC-12 single mode transceiver is a single unit comprised of a transmitter, a
receiver, and an LC receptacle. This design frees the customer from many alignment
and PC board layout concerns.
This transceiver supports the LC connectorization concept, which competes with UTP/
CAT 5 solutions. It is compatible with RJ-45 style backpanels for fiber-to-the-desktop
applications while providing the advantages of fiber optic technology. The receptacle
accepts the new LC connector. The Small Form Factor is specially developed for
distances of up to 15 km.
The module is designed for low cost LAN and WAN applications. It can be used as the
network end device interface in mainframes, workstations, servers, and storage devices,
and in a broad range of network devices such as bridges, routers, hubs, and local and
wide area switches.
This transceiver operates at 622 Mbit/s from a single power supply (+3.3 V). The full
differential data inputs and outputs are LVPECL compatible.
Supported Link Lengths
Category within Standard Reach Unit
min. max.1)
Notes:
1) Maximum reach over fiber type SM-G.652 as defined by ITU-T G.957 and Telcordia GR-253-CORE
standards. Longer reach possible depending upon link implementation.
SDH STM S-4.1 0 15,000 meters
SONET OC-12 IR-1 0 21,000
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 6
Functional Description of SFF Transceiver
This transceiver is designed to transmit serial data via single mode fiber.
Figure 2 Functional Diagram
The receiver component converts the optical serial data into an electrical data (RD+ and
RD–). The Signal Detect output (SD) shows whether an optical signal is present.
The transmitter part converts electrical LVPECL compatible serial data (TD+ and TD–)
into optical serial data.
The module has an integrated shutdown function that switches the laser off in the event
of an internal failure.
Reset is only possible if the power is turned off, and then on again. (VCCt switched below
VTH).
Laser
Driver Laser
Monitor
Power
Control
SD
TD+
RD+
RD−
TD−
Tx
Coupling Unit
Rx
Coupling Unit
e/o
o/e
o/e
TDis
File: 1351
Single
Mode
Fiber
Automatic
Shut-Down
Limiting
Amp TIA
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 7
Figure 3 Transceiver Pitch
Regulatory Compliance
Feature Standard Comments
ESD:
Electrostatic Discharge
to the Electrical Pins
EIA/JESD22-A114-B
(MIL-STD 883D
Method 3015.7)
Class 1C
Immunity:
Against Electrostatic
Discharge (ESD) to the
Duplex LC Receptacle
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2kV to
±15 kV on the receptacle cause no
damage to transceiver (under
recommended conditions).
Immunity:
Against Radio
Frequency
Electromagnetic Field
EN 61000-4-3
IEC 61000-4-3
With a field strength of 3 V/m, noise
frequency ranges from 10 MHz to
2 GHz. No effect on transceiver
performance between the
specification limits.
Emission:
Electromagnetic
Interference (EMI)
FCC 47 CFR Part 15,
Class B
EN 55022 Class B
CISPR 22
Noise frequency range:
30 MHz to 18 GHz
(13.97)
.550
*)
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches File: 1501
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 8
Technical Data
Exceeding any one of these values may destroy the device immediately.
Absolute Maximum Ratings
Parameter Symbol Limit Values Unit
min. max.
Package Power Dissipation 0.9 W
Supply Voltage VCC–VEE 4V
Data Input Levels VCC+0.5 VEE–0.5 V
Differential Data Input Voltage Swing VIDpk-pk 5 V
Operating Case Temperature
V23818-H18-L36/L46/L436/L446
V23818-H18-L37/L47/L437/L447
–40
–5
85
70
°C
Storage Ambient Temperature –40 85 °C
Soldering Conditions Temp/Time 260/10 °C/s
Recommended Operating Conditions
Parameter Symbol Values Unit
min. typ. max.
Ambient Temperature1) 3)
Notes:
1) For V23818-H18-L36/L46/L436/L446.
TAMB –40 85 °C
Ambient Temperature2) 3)
2) For V23818-H18-L37/L47/L437/L447.
3) Ambient operating temperature requires a 2 ms–1 airflow over the device.
–5 70
Power Supply Voltage VCC–VEE 3.14 3.3 3.46 V
Supply Current ICC 230 mA
Transmitter
Data Input High Voltage VIH–VCC –1165 –880 mV
Differential Data Input Voltage
Swing
VIDpk-pk 250 1600 mV
Data Input Low Voltage VIL–VCC –1810 –1475 mV
Data Input Rise/Fall Time ti120 ps
Receiver
Input Center Wavelength λRx 1260 1580 nm
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 9
The electro-optical characteristics described in the following tables are valid only for use
under the recommended operating conditions.
Transmitter Electro-Optical Characteristics
Transmitter Symbol Values Unit
min. typ. max.
Output Power (Average)1)
Notes:
1) Into single mode fiber, 9 µm diameter
PO–15 –8 dBm
Center Wavelength λC1274 1356 nm
Spectral Width (rms) σ2.5 nm
Extinction Ratio (Dynamic) ER 8.2 dB
Eye Diagram ED ITU-T G.957 mask pattern
Reset Threshold for VCCt 2)
2) Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES.
VTH 2.7 V
Power on Delay2) tDEL 30 ms
Jitter Generation3)
3) The transceiver is specified to meet the SONET/SDH Jitter performance as outlined in ITU-T G.958 and
Telcordia GR-253. Jitter Generation is defined as the amount of jitter that is generated by the transceiver. The
Jitter Generation specifications are referenced to the optical OC-12 signals. If no or minimum jitter is applied
to the electrical inputs of the transmitter, then Jitter Generation can simply be defined as the amount of jitter
on the Tx optical output. The SONET specifications for Jitter Generation are 0.01 UI rms, maximum and 0.1
UI pk-pk, maximum. For SDH, 10 mUI rms, maximum. Both are measured with a 12 kHz - 5 MHz filter in line.
A UI is a Unit Interval, which is equivalent to one bit slot. At OC-12, the bit slot is 1.6 ns, so the Jitter Generation
specification translates to 16 ps rms, max. and 160 ps pk-pk, max.
JGEpk-pk 0.1 UI
JGErms 0.01 UI
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 10
Receiver Electro-Optical Characteristics
Receiver Symbol Values Unit
min. typ. max.
Sensitivity (Average Power)1) PIN –28 dBm
Saturation (Average Power) PSAT –8 dBm
Signal Detect Assert Level2) PSDA –28 dBm
Signal Detect Deassert Level3) PSDD –37 dBm
Signal Detect Hysteresis PSDA
–PSDD
3dB
Signal Detect Assert Time2) tASS 0.1 ms
Signal Detect Deassert Time3) tDAS 0.35 ms
Output Voltage4) VOH–VCC –1110 –650 mV
Output Voltage4) VOL–VCC –1800 –1300 mV
Differential Data Output
Voltage Swing4) VODpk-pk 1000 2000 mV
Signal Detect Output High
Voltage LVPECL5) 6)
V
SDH
–
V
EE
VCC
–1200
VCC
–820
mV
Signal Detect Output Low
Voltage LVPECL5) 6) VSDL–VEE VCC
–1900
VCC
–1580
mV
Signal Detect Output High
Voltage LVTTL5) 7) VSDH 2.4 V
Signal Detect Output Low
Voltage LVTTL5) 7) VSDL 0.5 V
Notes:
1) Minimum average optical power at which the BER is less than 1x10–10. Measured with a 223–1 NRZ PRBS as
recommended by ANSI T1E1.2, SONET OC-12, and ITU-T G.957.
2) An increase in optical power above the specified level will cause the Signal Detect to switch from a low state
to a high state (high active output).
3) A decrease in optical power below the specified level will cause the Signal Detect to switch from a high state
to a low state.
4) Load is 100 Ω differential.
5) Internal load is 510 Ω to GND, no external load necessary. Signal Detect is a high active output. High level
means signal is present, low level means loss of signal.
6) For V23818-H18-L37/L36/L437/L436.
7) For V23818-H18-L47/L46/L447/L446.
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 11
Eye Safety
This laser based single mode transceiver is a Class 1 product. It complies with IEC
60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10
and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001.
CLASS 1 LASER PRODUCT
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Note: All adjustments have been made at the factory prior to shipment of the devices.
No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result in voided
product warranty.
Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification
of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Figure 4 Required Labels
Figure 5 Laser Emission
Laser Emission Data
Wavelength 1310 nm
Maximum total output power
(as defined by IEC: 7 mm aperture at 14 mm distance)
15.6 mW / 11.9 dBm
Beam divergence (full angle) / NA (half angle) 11° / 0.1 rad
Class 1 Laser Product
IEC
Complies with 21 CFR
1040.10 and 1040.11
FDA
File: 1401
Tx
Rx
Laser
Emission
File: 1332
12345
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Top view
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 12
EMI-Recommendations
To avoid electromagnetic radiation exceeding the required limits please take note of the
following recommendations.
When Gigabit switching components are found on a PCB (multiplexers, clock recoveries
etc.) any opening of the chassis may produce radiation also at chassis slots other than
that of the device itself. Thus every mechanical opening or aperture should be as small
as possible.
On the board itself every data connection should be an impedance matched line (e.g.
strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should
be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched
line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In
DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows:
for 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data
and Datanot. Please consider whether there is an internal termination inside an IC or a
transceiver.
In certain cases signal GND is the most harmful source of radiation. Connecting chassis
GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic
transceiver may result in a large amount of radiation. Even a capacitive coupling
between signal GND and chassis may be harmful if it is too close to an opening or an
aperture.
If a separation of signal GND and chassis GND is not planned, it is strongly
recommended to provide a proper contact between signal GND and chassis GND at
every location where possible. This concept is designed to avoid hotspots. Hotspots are
places of highest radiation which could be generated if only a few connections between
signal and chassis GND exist. Compensation currents would concentrate at these
connections, causing radiation.
By use of Gigabit switching components in a design, the return path of the RF current
must also be considered. Thus a split GND plane of Tx and Rx portion may result in
severe EMI problems.
A recommendation is to connect the housing leads to signal GND. However, in certain
applications it may improve EMI performance by connecting them to chassis GND.
The cutout should be sized so that all contact springs make good contact with the face
plate.
Please consider that the PCB may behave like a waveguide. With an εr of 4, the
wavelength of the harmonics inside the PCB will be half of that in free space. In this
scenario even the smallest PCBs may have unexpected resonances.
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 13
Recommended Termination Schemes
2x5 DC/DC Transceiver
Figure 6
File: 1392
C1/2/3
C4/5/6/7
C8/9/10
L1/2*)
R1
R2/3
R4/5
Place R1/4/5 close to SerDes chip.
Place R2/3 close to SFF transceiver.
*) The inductors may be replaced by appropriate Ferrite beads.
= 4.7 ... 10 µF
= 100 nF
= Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
= 1 ... 4.7 µH
= 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or
100 Ω differential is provided. Check for termination inside of SerDes chip).
= 150 Ω
= Biasing for outputs depending on Serializer.
C6
C7
8TDis
100 Ω
Laser
Driver
Signal
Detect
Limiting
Amplifier
Pre-
Amp SerDat In −
SerDat In +
SerDat Out
SerDat Out −
Serializer/
Deserializer
RD−
ECL/
PECL
Driver
Receiver
PLL etc.
SFF Transceiver
5
4
3
2
6
10
9
1
7
SD
VEEt
TD+
TD−
VCCt
VCCr
SD
RD−
RD+
VEEr
VCC
R4
R5
L1
L2
C2
C1
R2
R3
R1
C3
C4
C5
VCC SerDes
VCC
3.3 V
RD+
TDis
+
C8
C9
C10
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 14
2x5 AC/AC Transceiver
Figure 7
File: 1393
C1/2/3
C4/5/6
L1/2*)
R1/2/3/4
R5/6
Place R1/2/3/4/5/6 close to SerDes chip.
*) The inductors may be replaced by appropriate Ferrite beads.
= 4.7 ... 10 µF
= Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
= 1 ... 4.7 µH
= Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω
differential is provided. Check for termination inside of SerDes chip.
= Biasing (depends on SerDes chip).
8TDis
Laser
Driver
Signal
Detect
Limiting
Amplifier
Pre-
Amp SerDat In −
SerDat In +
SerDat Out
SerDat Out −
Serializer/
Deserializer
RD−
ECL/
PECL
Driver
Receiver
PLL etc.
SFF Transceiver
5
4
3
2
6
10
9
1
7
SD
VEEt
TD+
TD−
VCCt
VCCr
SD
RD−
RD+
VEEr
VCC
R5
R6
L1
L2
C2
C1
C3
VCC SerDes
VCC
3.3 V
RD+
TDis
+
R3
R4
R1
R2
100 ΩC4
C5
C6
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 15
Package Outlines
Figure 8
a) recommended bezel position
Drawing shown is with collar
Dimensions in mm [inches] File: 1212
V23818-H18-Lxx, V23818-H18-Lxxx Product Specification – August 2004
© Finisar Corporation August 20, 2004 Rev. C Preliminary Data Page 16
For More Information
Finisar Corporation
1308 Moffett Park Drive
Sunnyvale, CA 94089-1133
Tel. 1-408-548-1000
Fax 1-408-541-6138
sales@finisar.com
www.finisar.com
Revision History: August 20, 2004 Rev. C
Previous Version: April 24, 2003
Page Subjects (major changes since last revision)
Company name has been changed
Document’s layout has been changed
December 2004
