All specification & dimensions are subject to change, please call your nearest Foxconn
sales representative for update information
.
SPECIFICATIONS Burn-in & test socket
BITS Series
Clamshell, BGA/LGA Type
1.27 mm [.05”] Pitch
41x41 Grid Size Max.
Compressed Contact Design
Mechanical
Durability: 10’000 cycles min.
Actuation force: 1.5kgf max.
DUT Heat Dissipation: 150W max. under 6 CFM.
Electrical
Current Rating: 1Amp/pin min.
Dielectric Withstanding Voltage: 650V A.C for 60 sec.
Insulation Resistance: 1000MΩ min.
Contact Resistance: 300mΩ max.
Hast: Pass 130
℃
at 85% RH, 168 hours duration
THB: Pass 85
℃
at 85% RH, 1000 hours duration
Bake : Pass 150
℃
for 168 hours
Physical
Cover & Base: Thermoplastic, UL 94V-0
Contact: Copper alloy
Contact Plating: See “ORDERING INFORMATION”
Operating Temperature:
150
℃
m
ax
.
DRAWING
ORDERING INFORMATION
PRODUCT NO.: 2 Q * * * * 3 * - 2 0 * 0 - 1 0 F
Design Type
1=Type #1
2=Type #2
Pitch
0=1.27 mm
Tail Plating
3=Au
Chip/Burn-in Board
LF Code
F=LF
Package
1=Soft Tray
Pick-up Design
0=None
Pin Counts
1681=1681 Pos.
1368=1368 Pos
Contact Plating
3=30
µ
” Gold Plating
7=15µ” Gold Plating
Chip Spec.
0=None
2=BGA/LGA
