Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Overview All COTS testing includes voltage conditioning and postelectrical testing as per MIL-PRF-55681. For enhanced reliability, KEMET also provides the following test level options and conformance certifications: KEMET's COTS program is an extension of KEMET knowledge of high reliability test regimes and requirements. KEMET regularly supplies "up-screened" products by working with customer drawings and imposing specified design and test requirements. The COTS program offers the same high quality and high reliability components as up-screened products, but at a lower cost to the customer. This is accomplished by eliminating the need for customer-specific drawings to achieve the reliability level required for customer applications. A series of tests and inspections have been selected to provide the accelerated conditioning and 100% screening necessary to eliminate infant mortal failures from the population. Test Level A Test Level B Test Level C Voltage Conditioning DWV IR@25C CAP DF Voltage Conditioning DWV IR@25C CAP DF Voltage Conditioning DWV IR@25C CAP DF PDA 8% PDA 8% PDA 8% C of C DPA DPA C of C 85/85 KEMET's C0G dielectric features a 125C maximum operating temperature and is considered "stable." The Electronics Components, Assemblies & Materials Association (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to 30 ppm/C from -55C to +125C. C of C Click image above for interactive 3D content Ordering Information C Ceramic 1206 Case Size Specification/ (L" x W") Series 0402 0603 0805 1206 1210 1812 2220 1 2 T T = COTS Open PDF in Adobe Reader for full functionality 104 K Capacitance Code (pF) Capacitance Tolerance1 Two significant digits and number of zeros Use 9 for 1.0 - 9.9 pF Use 8 for 0.5 - .99 pF e.g., 2.2 pF = 229 e.g., 0.5 pF = 508 B = 0.10 pF C = 0.25 pF D = 0.5 pF F = 1% G = 2% J = 5% K = 10% M = 20% 5 G A C Rated Voltage Dielectric Test Level (VDC) 8 = 10 G = C0G A = Testing per MILPRF-55681 PDA 8% 4 = 16 3 = 25 B = Testing per MIL6 = 35 PRF-55681 PDA 8%, DPA 5 = 50 per EIA-469 1 = 100 C = Testing per MIL2 = 200 PRF-55681 PDA 8%, DPA A = 250 per EIA-469, Humidity per MIL-STD-202, Method 103, Condition A TU Termination Packaging/ Finish2 Grade (C-Spec) C = 100% Matte Sn L = SnPb (5% Pb minimum) See "Packaging C-Spec Ordering Options Table" Additional capacitance tolerance offerings may be available. Contact KEMET for details. Additional termination finish options may be available. Contact KEMET for details. Built Into Tomorrow (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Packaging C-Spec Ordering Options Table Packaging Type1 Bulk Bag/Unmarked 7" Reel/Unmarked 13" Reel/Unmarked 7" Reel/Unmarked/2 mm pitch2 13" Reel/Unmarked/2 mm pitch2 Packaging/Grade Ordering Code (C-Spec) Not required (Blank) TU 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) 7081 7082 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging. The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". 1 1 Benefits * -55C to +125C operating temperature range * Lead (Pb)-free, RoHS and REACH compliant * Voltage conditioning and post-electrical testing per MIL-PRF-55681, Paragraph 4.8.3.1, Standard Voltage Conditioning * Destructive Physical Analysis (DPA) per EIA-469 * Humidity, steady state, low voltage (85/85) per MIL-STD-202, Method 103, Condition A * RoHS Compliant (excluding SnPb end metallization option) * EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220 case sizes * DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, 200 V and 250 V * Capacitance offerings ranging from 0.5 pF up to 0.47 F * Available capacitance tolerances of 0.10 pF, 0.25 pF, 0.5 pF, 1%, 2%, 5%, 10%, and 20% * Certificate of compliance * No piezoelectric noise * Extremely low ESR and ESL * High thermal stability * High ripple current capability * Preferred capacitance solution at line frequencies and into the MHz range * No capacitance change with respect to applied rated DC voltage * Negligible capacitance change with respect to temperature * No capacitance decay with time * Non-polar device, minimizing installation concerns * SnPb end metallization option available upon request (5% Pb minimum) Applications Typical applications include military, space quality and high reliability electronics. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Dimensions - Millimeters (Inches) L W B T S EIA Size Code Metric Size Code 0402 1005 0603 1608 0805 2012 1206 3216 1210 3225 1812 4532 2220 5650 L Length W Width 1.00 (0.040) 0.05 (0.002) 1.60 (0.063) 0.15 (0.006) 2.00 (0.079) 0.20 (0.008) 3.20 (0.126) 0.20 (0.008) 3.20 (0.126) 0.20 (0.008) 4.50 (0.177) 0.30 (0.012) 5.70 (0.224) 0.40 (0.016) 0.50 (0.020) 0.05 (0.002) 0.80 (0.032) 0.15 (0.006) 1.25 (0.049) 0.20 (0.008) 1.60 (0.063) 0.20 (0.008) 2.50 (0.098) 0.20 (0.008) 3.20 (0.126) 0.30 (0.012) 5.00 (0.197) 0.40 (0.016) T Thickness B Bandwidth See Table 2 for Thickness 0.30 (0.012) 0.10 (0.004) 0.35 (0.014) 0.15 (0.006) 0.50 (0.02) 0.25 (0.010) 0.50 (0.02) 0.25 (0.010) 0.50 (0.02) 0.25 (0.010) 0.60 (0.024) 0.35 (0.014) 0.60 (0.024) 0.35 (0.014) S Separation Minimum Mounting Technique 0.30 (0.012) Solder Reflow Only 0.70 (0.028) 0.75 (0.030) N/A Solder Wave or Solder Reflow Solder Reflow Only Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) 1 2 Dissipation Factor (DF) Maximum Limit at 25C 3 Insulation Resistance (IR) Limit at 25C -55C to +125C 30 ppm/C 0% 250% of rated voltage (51 seconds and charge/discharge not exceeding 50 mA) 0.1% 1,000 megohm microfarads or 100 G (Rated voltage applied for 1205 seconds at 25C) DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz 100 kHz and 1.0 Vrms 0.2 V if capacitance 1,000 pF 1 kHz 50 Hz and 1.0 Vrms 0.2 V if capacitance > 1,000 pF 3 To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." 1 Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) Capacitance Shift C0G All All 0.5 0.3% or 0.25 pF (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com Insulation Resistance 10% of Initial Limit C1026_C0G_COTS_SMD * 9/15/2020 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Table 1A - Capacitance Range/Selection Waterfall (0402 - 0805 Case Sizes) 25 50 100 200 250 A 16 2 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CH CH CH CH CH CH CH CH CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CH CH CH CH CH CH CH CH DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DN DN DN DN DP DP DP DE DE DE DE DN DN DN DN DN DN DN DN DN DN DP DF DG DG DG DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DN DN DN DN DP DP DP DE DE DE DE DN DN DN DN DN DN DN DN DN DN DP DF DG DG DG DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DN DN DN DN DP DP DP DE DE DE DE DN DN DN DN DN DN DN DN DN DN DP DF DG DG DG DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DN DN DN DN DP DP DP DE DE DE DE DN DN DN DN DN DN DN DN DP DP DF DN DN DN DN DN DN DN DN DN DN DN DN DN DP DP DN DN DP DP DP DP DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DP DE DG DN DN DN DN DN DN DN DN DN DN DN DP DN DP DP DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DP DP DG DG DG DG DN DN DN DN DN DN DN DN DN DN DN DP DN DP DP DN DN DN DN DN DN DN DN DN DN DN DN DP DP DP DP DP DP DG DG DG DG Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BD BD BB BB BB BD BD 250 10 16 25 50 100 200 250 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 200 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 100 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 50 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 25 3 1 16 4 5 10 8 3 250 Voltage Code Case Size/Series 4 10 200 Rated Voltage (VDC) 8 200 Cap Code A 250 100 Capacitance 2 100 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 1 200 50 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 5 50 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 3 100 25 508 & 758 B C D 109 - 919* B C D 100 - 910* F G J K M 101 F G J K M 111 -181* F G J K M 201 - 271* F G J K M 301 F G J K M 331 F G J K M 361 F G J K M 391 F G J K M 431 F G J K M 471 F G J K M 511 - 821* F G J K M 911 F G J K M 102 F G J K M 112 F G J K M 122 F G J K M 132 F G J K M 152 F G J K M 162 F G J K M 182 F G J K M 202 F G J K M 222 F G J K M 242 F G J K M 272 F G J K M 302 F G J K M 332 F G J K M 362 F G J K M 392 F G J K M 432 F G J K M 472 F G J K M 512 F G J K M 562 F G J K M 622 F G J K M 682 F G J K M 752 F G J K M 822 F G J K M 912 F G J K M 103 F G J K M 123 F G J K M 153 F G J K M 183 F G J K M 223 F G J K M 273 F G J K M 333 F G J K M 393 F G J K M 473 F G J K M 4 50 16 0.50 & 0.75 pF 1.0 - 9.1 pF* 10 - 91 pF* 100 pF 110 - 180 pF* 200 - 270 pF* 300 pF 330 pF 360 pF 390 pF 430 pF 470 pF 510 - 820 pF* 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 8 25 Rated Voltage (VDC) Capacitance Tolerance C0805T A 16 2 10 1 250 5 25 Voltage Code 3 16 Cap Code C0603T 4 10 Capacitance C0402T 8 10 Case Size/Series 5 1 2 A 8 4 3 5 1 2 A 8 4 3 5 1 2 A C0402T C0603T C0805T *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Table 1B - Capacitance Range/Selection Waterfall (1210 - 2225 Case Sizes) 50 100 200 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GB GB GH GH GB GB GJ GJ JE JE JB GB GH GB GB JE JE JB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GH GK GH GG GB GB GB GB GB GB GB GB GB GB GD GH GN GB GB GB GB GB GB GB GB GD GD GK GM GM GB GB GB GB GB GB GB GB GD GD GK GM GM JE JE JE JE JE JE JB JB JB JB JB JB JB JB JB JB JB JB JD JG JG JE JE JE JE JB JB JB JB JB JB JB JB JB JB JB JD JD JF JG JB JB JB JB JB JB JB JB JB JB JB JB JD JD JG JG JL 100 200 50 GB GB GB GB GB GB GB GB GB GB 50 250 250 200 GB GB GB GB GB GB GB GB GB GB 250 100 200 1 2 200 5 1 100 3 5 100 4 A 50 8 2 250 Voltage Code 1 A 5 1 2 A 5 1 2 Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions EB EB EB EB EE EB EB EC EC ED ED ED ED EC EC EB EB EB EB EB EB EB EB EB EB EB EC EC EC ED EF EH EH FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FB FC FE FG FH FJ FK FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FB FC FE FG FH FJ FK FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FB FC FE FG FH FJ FK 2 A 8 4 C1206T FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FC FF FG FH FM FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FC FF FF FF FF FG FG FG FG FG FC FC FE FF FB FB FB FB FB FB FE FE FF FG FH FM FB FB FB FB FB FB FB FC FE FE FE FE FG FC FC FF FF FF FF FF FG FG FG FB FB FB FB FB FB FB FC FC FF FG FH FH FJ FB FB FB FB FB FB FB FC FE FE FE FE FG FC FC FF FF FF FF FF FG FG FG FB FB FB FB FB FB FB FC FC FF FG FH FH FJ 200 EB EB EB EB EE EB EB EC EC ED ED ED EE EC EC EB EB EB EB EB EB EB EB EB EB EB EC EC EC ED EF EH EH 5 100 EB EB EB EB EB EB EB EC ED ED ED ED EE EC EC EC EE EE EF EC EC ED ED EB EB EB EB EB EB EB EB EB EC EE EE EH EH A 50 200 Rated Voltage (VDC) Case Size/Series EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EE EE EF EH EH 2 50 100 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EC EC ED EF EH EH 1 25 50 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EC EC ED EF EH EH 5 25 Cap Code EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EC EC ED EF EH EH 3 16 25 109 - 919* B C D 100 - 910* F G J K M 101 - 431* F G J K M 471 - 911* F G J K M 102 F G J K M 112 F G J K M 122 F G J K M 132 F G J K M 152 F G J K M 162 F G J K M 182 F G J K M 202 F G J K M 222 F G J K M 242 F G J K M 272 F G J K M 302 F G J K M 332 F G J K M 362 F G J K M 392 F G J K M 432 F G J K M 472 F G J K M 512 F G J K M 562 F G J K M 622 F G J K M 682 F G J K M 752 F G J K M 822 F G J K M 912 F G J K M 103 F G J K M 123 F G J K M 153 F G J K M 183 F G J K M 223 F G J K M 273 F G J K M 333 F G J K M 393 F G J K M 473 F G J K M 563 F G J K M 683 F G J K M 823 F G J K M 104 F G J K M 124 F G J K M 154 F G J K M 184 F G J K M 224 F G J K M 274 F G J K M 334 F G J K M 394 F G J K M 474 F G J K M 4 16 16 Capacitance Tolerance 8 10 Rated Voltage (VDC) C2220T A 10 2 C1812T 250 1 250 5 200 3 100 4 50 8 25 Capacitance C1210T Voltage Code 16 1.0 - 9.1 pF* 10 - 91 pF* 100 - 430 pF* 470 - 910 pF* 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 F 0.12 F 0.15 F 0.18 F 0.22 F 0.27 F 0.33 F 0.39 F 0.47 F Cap Code 10 Capacitance C1206T 10 Case Size/Series 3 5 1 2 C1210T C1812T C2220T *Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91) KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (configuration and dimensions). These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Table 2A - Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity1 Plastic Quantity Thickness Code Case Size1 Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB BD CF CH DN DP DE DF DG EB EC ED EE EF EH FB FC FE FF FG FH FM FJ FK GB GD GH GG GK GJ GN GM JB JD JE JF JG JL 0402 0402 0603 0603 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 1812 1812 2220 2220 2220 2220 2220 2220 0.50 0.05 0.55 0.05 0.80 0.07 0.85 0.07 0.78 0.10 0.90 0.10 1.00 0.10 1.10 0.10 1.25 0.15 0.78 0.10 0.90 0.10 1.00 0.10 1.10 0.10 1.20 0.15 1.60 0.20 0.78 0.10 0.90 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.55 0.15 1.70 0.20 1.85 0.20 2.10 0.20 1.00 0.10 1.25 0.15 1.40 0.15 1.55 0.10 1.60 0.20 1.70 0.15 1.70 0.20 2.00 0.20 1.00 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.70 0.15 2.00 0.20 10,000 10,000 4,000 4,000 4,000 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50,000 50,000 15,000 10,000 15,000 15,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,500 2,500 2,500 4,000 4,000 2,500 2,500 2,500 2,000 4,000 4,000 2,500 2,500 2,500 2,000 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 1,000 1,000 1,000 1,000 1,000 500 0 0 0 0 0 0 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 10,000 8,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 4,000 4,000 4,000 4,000 4,000 2,000 Thickness Code Case Size1 Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity 1 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information". (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Table 2B - Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 N/A 2 Case Size Packaging Quantities (pieces/unit packaging) EIA (in) Metric (mm) 0402 0603 0805 1206 1210 1808 1005 1608 2012 3216 3225 4520 1812 1825 2220 2225 4532 4564 5650 5664 Minimum Maximum 50,000 1 20,000 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. 1 (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Table 3 - Chip Capacitor Land Pattern Design Recommendations per IPC-7351 EIA Size Code Metric Size Code 0402 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 Only for capacitance values 22 F Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC-7351). 1 Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Soldering Process Recommended Soldering Technique: * Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 * All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET's families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Termination Finish SnPb TP 100% Matte Sn Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax 100C 150C 60 - 120 seconds 150C 200C 60 - 120 seconds Ramp-Up Rate (TL to TP) 3C/second maximum 3C/second maximum Liquidous Temperature (TL) 183C 217C Time Above Liquidous (tL) 60 - 150 seconds 60 - 150 seconds Peak Temperature (TP) 235C 260C Time Within 5C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (TP to TL) 6C/second maximum 6C/second maximum TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3C/second Maximum Ramp-down Rate = 6C/second tL Tsmax Tsmin 25 ts 25C to Peak Time Time 25C to Peak 6 minutes 8 minutes Temperature maximum maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Table 4 - Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS-C-6429 Appendix 2, Note: Standard termination system - 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system - 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J-STD-002 a) Method B, 4 hours at 155C, dry heat at 235C b) Method B at 215C category 3 c) Method D, category 3 at 260C Temperature Cycling JESD22 Method JA-104 Biased Humidity MIL-STD-202 Method 103 Moisture Resistance Thermal Shock High Temperature Life Storage Life Vibration Mechanical Shock Resistance to Solvents MIL-STD-202 Method 106 MIL-STD-202 Method 107 MIL-STD-202 Method 108 /EIA-198 MIL-STD-202 Method 108 MIL-STD-202 Method 204 MIL-STD-202 Method 213 MIL-STD-202 Method 215 1,000 Cycles (-55C to +125C). Measurement at 24 hours +/- 4 hours after test conclusion. Load Humidity: 1,000 hours 85C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 4 hours after test conclusion. Low Volt Humidity: 1,000 hours 85C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 4 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours +/- 4 hours after test conclusion. -55C/+125C. Note: Number of cycles required - 300, maximum transfer time - 20 seconds, dwell time - 15 minutes. Air - Air. 1,000 hours at 125C (85C for X5R, Z5U and Y5V) with 2 X rated voltage applied. 150C, 0 VDC for 1,000 hours. 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 - 2,000 Hz Figure 1 of Method 213, Condition F. Add aqueous wash chemical, OKEM Clean or equivalent. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature-reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40C and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Construction Detailed Cross Section Dielectric Material (CaZrO3) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Inner Electrodes (Ni) Capacitor Marking (Optional) Laser marking option is not available on: * C0G, Ultra Stable X8R and Y5V dielectric devices * EIA 0402 case size devices * EIA 0603 case size devices with Flexible Termination option. * KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel (R) Embossed plastic* or punched paper carrier. ET KEM Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 8 mm, 12 mm or 16 mm carrier tape 180 mm (7.00") or 330 mm (13.00") Anti-static cover tape (0.10 mm (0.004") maximum thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 - Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Pitch (P1)* Punched Paper 7" Reel 13" Reel Pitch (P1)* 01005 - 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 - 1210 8 4 4 4 4 1805 - 1808 12 4 4 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 and 2220 16 12 12 Array 0612 8 4 4 *Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 and 7 for tolerance specifications. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) Packaging Type/Options C-3190 C-3191 C-7081 C-7082 Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing * Lower placement costs. * Double the parts on each reel results in fewer reel changes and increased efficiency. * Fewer reels result in lower packaging, shipping and storage costs, reducing waste. C1026_C0G_COTS_SMD * 9/15/2020 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Figure 1 - Embossed (Plastic) Carrier Tape Dimensions P2 T T2 OD0 (10 pitches cumulative tolerance on tape 0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity OD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 - Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) R Reference S1 Minimum T Note 2 Note 3 Maximum 25.0 (0.984) 1.75 0.10 4.0 0.10 2.0 0.05 0.600 0.600 (0.069 0.004) (0.157 0.004) (0.079 0.002) (0.024) (0.024) 30 (1.181) E1 P0 P2 T1 Maximum 0.100 (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size 8 mm 12 mm 16 mm B1 Maximum Note 4 4.35 Single (4 mm) (0.171) Single (4 mm) 8.2 and double (8 mm) (0.323) 12.1 Triple (12 mm) (0.476) Pitch E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 0.05 4.0 0.10 (0.138 0.002) (0.157 0.004) 5.5 0.05 8.0 0.10 (0.217 0.002) (0.315 0.004) 7.5 0.05 12.0 0.10 (0.138 0.002) (0.157 0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independently of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6.) 3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.) 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see Figure 3.) (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4.) (e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Figure 2 - Punched (Paper) Carrier Tape Dimensions T Po ODo (10 pitches cumulative tolerance on tape 0.2 mm) A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 - Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (0.004) maximum R Reference Note 2 0.75 (0.030) 25 (0.984) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum F P1 T Maximum W Maximum A0 B 0 6.25 (0.246) 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see Figure 3.) d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.) e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6.) (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 - Maximum Component Rotation T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 - 200 10 Bo T) s Tape Width (mm) 8,12 16 - 56 72 - 200 Typical Component Centerline Ao Figure 4 - Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum Maximum Rotation ( 20 10 5 S) Figure 5 - Bending Radius Embossed Carrier 16 mm Tape Punched Carrier 1.0 mm maximum 1.0 mm maximum R (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com Bending Radius R C1026_C0G_COTS_SMD * 9/15/2020 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Figure 6 - Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (O 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 - Reel Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions -- Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC Figure 7 - Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 - Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10 - 250 VDC KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the "Information") in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation's ("KEMET") knowledge of typical operating conditions for such applications, but are not intended to constitute - and KEMET specifically disclaims - any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET's products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. (c) KEMET Electronics Corporation * KEMET Tower * One East Broward Boulevard Fort Lauderdale, FL 33301 USA * 954-766-2800 * www.kemet.com C1026_C0G_COTS_SMD * 9/15/2020 19