R08DS0013EJ0200 Rev.2.00 Page 1 of 19
Sep 07, 2011
PIN CONNECTION
(Top View)
1. Anode
2. Cathode
3. Cathode
4. NC
5. VEE
6. VEE
7. VO
8. VCC
1234
8765
SHIELD
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
Preliminary Data Sheet
PS9305L,PS9305L2
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN SDIP PHOTOCOUPLER
DESCRIPTION
The PS9305L and PS9305L2 are optically coupled isolators containing a GaAlAs LED on the input side and a photo
diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9305L and PS9305L2 are designed specifically for high common mode transient immunity (CMR), high output
current and high switching speed.
The PS9305L and PS9305L2 are suitable for driving IGBTs and MOS FETs.
FEATURES
• Long creepage distance (8 mm MIN.)
• Large peak output current (2.5 A MAX., 2.0 A MIN.)
• High speed switching (tPLH, tPHL = 0.25
μ
s MAX.)
• UVLO (Under Voltage Lock Out) protection with hysteresis
• High common mode transient immunity (CMH, CML = ±25 kV/
μ
s MIN.)
• Embossed tape product: PS9305L-E3, PS9305L2-E3: 2 000 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved: No. 1115598
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
APPLICATIONS
• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• IH (Induction Heating)
R08DS0013EJ0200
Rev.2.00
Sep 07, 2011
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PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 2 of 19
Sep 07, 2011
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) for Surface Mount
8
1
5
4
5.85±0.25
6.8±0.25
(0.82)
(7.62)
9.7±0.3
0.84±0.25
0.2±0.15
0.25±0.15
3.5±0.2
3.7±0.25
1.27
0.4±0.1
0.25
M
PS9305L
Lead Bending Type (Gull-wing) for Long Clearance Distance (Surface Mount)
8
1
5
4
5.85±0.25
6.8±0.25
(0.82)
3.5±0.2
3.7±0.25
1.27
0.4±0.1
0.25 M
11.5±0.3
0.75±0.25
(7.62)
0.25±0.15
0.2±0.15
PS9305L2
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PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 3 of 19
Sep 07, 2011
PHOTOCOUPLER CONSTRUCTION
Parameter PS9305L PS9305L2
Air Distance (MIN.) 7 mm 8 mm
Outer Creepage Distance (MIN.) 8 mm 8 mm
Isolation Distance (MIN.) 0.4 mm 0.4 mm
FUNCTIONAL DIAGRAM
8
7
6
5
1
2
3
LED Output
ON H
OFF
Tr. 1
ON
OFF
Tr. 2
OFF
ON L
Input
H
L
(Tr. 2)
(Tr. 1)
SHIELD
MARKING EXAMPLE
9305
R
N131
1N 31
No. 1 pin
Mark
Year Assembled
(Last 1 Digit)
Rank Code
Week Assembled
Assembly Lot
Type Number
Company Initial
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PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 4 of 19
Sep 07, 2011
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
Packing Style Safety Standard
Approval
Application
Part Number*1
PS9305L PS9305L-AX 20 pcs (Tape 20 pcs cut)
PS9305L-E3 PS9305L-E3-AX Embossed Tape 2 000 pcs/reel
PS9305L
PS9305L2 PS9305L2-AX 20 pcs (Tape 20 pcs cut)
PS9305L2-E3 PS9305L2-E3-AX Embossed Tape 2 000 pcs/reel
Standard
products
(UL, CSA, SEMKO
approved) PS9305L2
PS9305L-V PS9305L-V-AX 20 pcs (Tape 20 pcs cut)
PS9305L-V-E3 PS9305L-V-E3-AX Embossed Tape 2 000 pcs/reel
PS9305L
PS9305L2-V PS9305L2-V-AX 20 pcs (Tape 20 pcs cut)
PS9305L2-V-E3 PS9305L2-V-E3-AX
Pb-Free
(Ni/Pd/Au)
Embossed Tape 2 000 pcs/reel
DIN EN60747-5-2
(VDE0884 Part2)
approved (Option)
PS9305L2
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current IF 25 mA
Peak Transient Forward Current (Pulse Width < 1
μ
s) IF (TRAN) 1.0 A
Reverse Voltage VR 5 V
Power Dissipation *1 PD 45 mW
Detector High Level Peak Output Current *2 IOH (PEAK) 2.5 A
Low Level Peak Output Current *2 IOL (PEAK) 2.5 A
Supply Voltage (VCC - VEE) 0 to 35 V
Output Voltage VO 0 to VCC V
Power Dissipation *3 PC 250 mW
Isolation Voltage *4 BV 5 000 Vr.m.s.
Operating Frequency *5 f 50 kHz
Operating Ambient Temperature TA −40 to +110 °C
Storage Temperature Tstg −55 to +125 °C
*1 Reduced to 0.88 mW/°C at TA = 85°C or more.
*2 Maximum pulse width = 10
μ
s, Maximum duty cycle = 0.2%
*3 Reduced to 7.36 mW/°C at TA = 85°C or more.
*4 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
*5 I
OH (PEAK) ≤ 2.0 A (≤ 0.3
μ
s), IOL (PEAK) ≤ 2.0 A (≤ 0.3
μ
s)
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage (VCC - VEE) 15 30 V
Forward Current (ON) IF (ON) 7 10 16 mA
Forward Voltage (OFF) VF (OFF) −2 0.8 V
Operating Ambient Temperature TA −40 110 °C
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PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 5 of 19
Sep 07, 2011
ELECTRICAL CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter Symbol Conditions MIN. TYP.*1 MAX. Unit
Diode Forward Voltage VF IF = 10 mA, TA = 25°C 1.2 1.56 1.8 V
Reverse Current IR VR = 3 V, TA = 25°C 10
μ
A
Terminal Capacitance Ct f = 1 MHz, VF = 0 V, TA = 25°C 30 pF
Detector High Level Output Current IOH VO = (VCC − 4 V) *2 0.5 2.0 A
VO = (VCC − 15 V) *3 2.0
Low Level Output Current IOL VO = (VEE + 2.5 V) *2 0.5 2.0 A
VO = (VEE + 15 V) *3 2.0
High Level Output Voltage VOH IO = −100 mA *4 VCC − 3.0 VCC − 1.5 V
Low Level Output Voltage VOL IO = 100 mA 0.1 0.5 V
High Level Supply Current ICCH VO = open, IF = 10 mA 1.4 3.0 mA
Low Level Supply Current ICCL VO = open, VF = 0 to +0.8 V 1.3 3.0 mA
UVLO Threshold VUVLO+ VO > 5 V, IF = 10 mA 10.8 12.3 13.4 V
VUVLO− 9.5 11.0 12.5
UVLO Hysteresis UVLOHYS VO > 5 V, IF = 10 mA 0.4 1.3 V
Coupled Threshold Input Current
(L → H)
IFLH IO = 0 mA, VO > 5 V 2.0 5.0 mA
Threshold Input Voltage
(H → L)
VFHL IO = 0 mA, VO < 5 V 0.8 V
*1 Typical values at TA = 25°C.
*2 Maximum pulse width = 50
μ
s, Maximum duty cycle = 0.5%.
*3 Maximum pulse width = 10
μ
s, Maximum duty cycle = 0.2%
*4 V
OH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle =
20%).
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 6 of 19
Sep 07, 2011
SWITCHING CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter Symbol Conditions MIN. TYP.*1 MAX. Unit
Propagation Delay Time (L → H) tPLH Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, 0.07 0.25
μ
s
Propagation Delay Time (H → L) tPHL Duty Cycle = 50%*2, IF = 10 mA 0.10 0.25
μ
s
Pulse Width Distortion (PWD) |tPHL−tPLH| 0.03 0.1
μ
s
Propagation Delay Time (Difference
Between Any Two Products)
tPHL−tPLH −0.1 0.1
μ
s
Rise Time tr 50 ns
Fall Time tf 50 ns
UVLO (Turn On Delay) tUVLO ON VO > 5 V, IF = 10 mA 0.8
μ
s
UVLO (Turn Off Delay) tUVLO OFF VO < 5 V, IF = 10 mA 0.6
μ
s
Common Mode Transient Immunity at
High Level Output
|CMH| TA = 25°C, IF = 10 mA, VCC = 30 V,
VO (MIN.) = 26 V, VCM = 1.5 kV
25 kV/
μ
s
Common Mode Transient Immunity at
Low Level Output
|CML| TA = 25°C, IF = 0 mA, VCC = 30 V,
VO (MAX.) = 1 V, VCM = 1.5 kV
25 kV/
μ
s
*1 Typical values at TA = 25°C.
*2 This load condition is equivalent to the IGBT load at 1 200 V/75 A.
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PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 7 of 19
Sep 07, 2011
TEST CIRCUIT
Fig. 1 I
OH
Test Circuit Fig. 2 I
OL
Test Circuit
Fig. 3 V
OH
Test Circuit Fig. 4 V
OL
Test Circuit
Fig. 5 I
FLH
Test Circuit Fig. 6 UVLO Test Circuit
V
CC
= 15 to 30 V
2.5 V
0.1 F
μ
1
2
3
4
8
7
6
5
I
OL
I
F
V
CC
=
15 to 30 V
0.1 F
μ
1
2
3
4
8
7
6
5
V
O
> 5 V
I
F
= 10 mA
V
CC
0.1 F
μ
1
2
3
4
8
7
6
5
V
O
> 5 V
I
F
=
7 to 16 mA
V
CC
=
15 to 30 V
0.1 F
μ
1
2
3
4
8
7
6
5
V
OH
100 mA
V
CC
=
15 to 30 V
4 V
0.1 F
μ
I
F
=
7 to 16 mA
1
2
3
4
8
7
6
5
I
OH
1
2
3
4
8
7
6
5
V
CC
= 15 to 30 V
0.1 F
μ
V
OL
100 mA
SHIELD SHIELD
SHIELD SHIELD
SHIELD SHIELD
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 8 of 19
Sep 07, 2011
V
CC
= 15 to 30 V
I
F
= 10 mA
10 kHz
50% DUTY
CYCLE
0.1 F
μ
1
2
3
4
8
7
6
5
VO
500 Ω
10 Ω
10 nF
t
PHL
t
PLH
I
F
V
OUT
90%
50%
10%
t
r
t
f
V
CC
= 30 V
V
CM
= 1.5 kV
0.1 F
μ
1
A
B2
3
4
8
7
6
5
V
O
I
F
V
OH
26 V
1 V
V
OL
V
CM
0 V
V
O
(Switch A: I
F
= 10 mA)
V
O
(Switch B: I
F
= 0 mA)
Fig. 7 t
PLH
, t
PHL
, t
r
, t
f
Test Circuit and Wave Forms
Fig. 8 CMR Test Circuit and Wave Forms
Δ
t
=
δ
V
δ
t
V
CM
Δ
t
SHIELD
SHIELD
<R>
<R>
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 9 of 19
Sep 07, 2011
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Ambient Temperature T
A
(°C)
Diode Power Dissipation P
D
(mW)
DIODE POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Ambient Temperature T
A
(°C)
Detector Power Dissipation P
C
(mW)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Ambient Temperature T
A
(°C)
Threshold Input Current I
FLH
(mA)
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
20 40 60 80 120
100
0
60
50
40
30
20
10
20 40 60 80 120
100
0
300
250
200
150
100
50
5.0
4.0
3.0
2.0
1.0
0
V
CC
= 30 V,
V
EE
= GND,
V
O
> 5 V
V
CC
= 30 V,
V
EE
= GND
−40 −200 20406080100
Forward Current I
F
(mA)
Output Voltage V
O
(V)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
102435
35
30
25
20
15
10
5
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
1.0
0.01
0.1
1.0
10
100
1.2 1.4 1.6 1.8 2.0 2.2 2.4
T
A
= +100°C
+85°C
+50°C
+25°C
0°C
−40°C
High Level Output Voltage – Supply
Voltage V
OH
– V
CC
(V)
High Level Output Current I
OH
(A)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT
0 0.5 1.0 1.5 2.52.0
0
−8
−6
−4
−2
V
CC
= 30 V,
V
EE
= GND,
I
F
= 10 mA
−40°C
+25°C
T
A
= +110°C
Remark The graphs indicate nominal characteristics.
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 10 of 19
Sep 07, 2011
Forward Current IF (mA)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
Supply Voltage VCC (V)
Low Level Output Current IOL (A)
Low Level Output Voltage VOL (V)
LOW LEVEL OUTPUT VOLTAGE vs.
LOW LEVEL OUTPUT CURRENT
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
6 8 10 12 14 16 18
VCC = 30 V, VEE = GND,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
250
200
150
100
50
0
tPHL
PWD
tPLH
15 20 25 30
VEE = GND, IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
250
200
150
100
50
0
tPHL
PWD
tPLH
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
Load Capacitance Cg (nF)
10 20 30 40 50
VCC = 30 V, VEE = GND,
IF = 10 mA, Rg = 10 Ω,
f = 10 kHz, Duty cycle = 50%
250
200
150
100
50
0
tPHL
tPLH
PWD
0 0.5 1 1.5 2.52
8
6
4
2
VCC = 30 V,
VEE = GND,
IF = 0 mA
−40°C
+25°C
TA = +110°C
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
0 1020304050
VCC = 30 V, VEE = GND,
IF = 10 mA, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
250
200
150
100
50
0
tPHL
PWD
tPLH
Load Resistance Rg (Ω)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
Ambient Temperature TA (°C)
0−40 −20 20 40 60 80
VCC = 30 V, VEE = GND,
IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
250
200
150
100
50
0
tPHL
tPLH
100
PWD
Remark The graphs indicate nominal characteristics.
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 11 of 19
Sep 07, 2011
Ambient Temperature TA (°C)
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
20 0 20 40 8060−40
2.0
1.5
1.0
0.5 100
VCC = 30 V,
VEE = GND,
VO = OPEN
ICCH
(IF = 10 mA)
ICCL
(IF = 0 mA)
Ambient Temperature TA (°C)
Supply Voltage VCC (V)
SUPPLY CURRENT vs.
SUPPLY VOLTAGE
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
15 20 3025
2.0
0.5
1.0
1.5
VEE = GND,
VO = OPEN
ICCH
(IF = 10 mA)
ICCL
(IF = 0 mA)
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
−20 0 20 40 8060−40
0.0
−3.0
−2.5
−2.0
−1.5
−1.0
−0.5
100 −20 0 20 40 8060−40 100
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = –100 mA
Ambient Temperature TA (°C)
High Level Output Current IOH (A)
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
Ambient Temperature TA (°C)
Low Level Output Voltage VOL (V)
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
0.30
0.00
0.05
0.10
0.15
0.20
0.25
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = 100 mA
Ambient Temperature TA (°C)
Low Level Output Current IOL (A)
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
−20 0 20 40 8060−40 100
3.0
0.0
0.5
1.0
1.5
2.0
2.5
VCC = 30 V, VEE = GND,
IF = 10 mA, VCC–VO = 4 V
−20 0 20 40 8060−40 100
3.0
0.0
0.5
1.0
1.5
2.0
2.5
VCC = 30 V, VEE = GND,
IF = 10 mA, VO = 2.5 V
Remark The graphs indicate nominal characteristics.
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 12 of 19
Sep 07, 2011
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
Supply Voltage VCC – VEE (V)
Output Voltage VO (V)
0 5 10 15 20
14
12
10
8
6
4
2
0
UVLOHYS
VUVLO+
VUVLO−
(12.3 V)
(11.0 V)
Remark The graph indicates nominal characteristics.
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 13 of 19
Sep 07, 2011
TAPING SPECIFICATIONS (UNIT: mm)
PS9305L-E3
330±2.0
100±1.0
2.0±0.5
13.0±0.2
R 1.0 21.0±0.8
2.0±0.5
17.5±1.0
21.5±1.0
2.0±0.1
4.0±0.1
6.35±0.1
8.0±0.1
1.5
+0.1
–0
1.75±0.1
4.5 MAX.
7.5±0.1
10.2±0.1
16.0±0.3
0.35
1.5
+0.1
–0
4.05±0.1
Outline and Dimensions (Tape)
Tape Direction
Outline and Dimensions (Reel)
Packing: 2 000 pcs/reel
15.9 to 19.4
Outer edge of
flange
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 14 of 19
Sep 07, 2011
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
Packing: 2 000 pcs/reel
330±2.0
100±1.0
2.0±0.5
13.0±0.2
R 1.0 21.0±0.8
2.0±0.5
23.9 to 27.4
Outer edge of
flange
25.5±1.0
29.5±1.0
2.0±0.1
4.0±0.1
6.35±0.1
8.0±0.1
2.0
+0.1
–0
1.5
+0.1
–0
+0.3
–0.1
4.05±0.1 1.75±0.1
24.0
4.5 MAX.
12.0±0.1
0.35
11.5±0.1
PS9305L2-E3
<R>
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 15 of 19
Sep 07, 2011
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
Part Number
PS9305L
PS9305L2
Lead Bending A
lead bending type (Gull-wing)
for surface mount
lead bending type (Gull-wing)
for long clearance distance (surface mount)
9.2
B
1.27
C
0.8
D
2.2
10.2 1.27 0.8 2.2
D
CB
A
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PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 16 of 19
Sep 07, 2011
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220°C
180°C
Package Surface Temperature T (°C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260°C MAX.
120°C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content
of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 17 of 19
Sep 07, 2011
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 0.1
μ
F is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pin 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
3. Make sure the rise/fall time of the forward current is 0.5
μ
s or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/
μ
s or less.
5. Avoid storage at a high temperature and high humidity.
<R>
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 18 of 19
Sep 07, 2011
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter Symbol Spec. Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1) 40/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
UIORM
Upr
1 130
1 695
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC
Upr 2 119 Vpeak
Highest permissible overvoltage UTR 8 000 Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) CTI 175
Material group (DIN EN 60664-1 VDE0110 Part 1) III a
Storage temperature range Tstg –55 to +125 °C
Operating temperature range TA –40 to +110 °C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
Ω
PS9305L,PS9305L2 Chapter Title
R08DS0013EJ0200 Rev.2.00 Page 19 of 19
Sep 07, 2011
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
All trademarks and registered trademarks are the property of their respective owners.
C - 1
Revision History PS9305L, PS9305L2 Data Sheet
Description
Rev. Date Page Summary
0.01 May 12, 2010 − First Edition issued
1.00 May 16, 2011 Throughout Preliminary Data Sheet -> Data Sheet
Throughout Safety standards approved
p.3 Modification of MARKING EXAMPLE
p.4 Addition of ORDERING INFORMATION
p.4 Modification of ABSOLUTE MAXIMUM RATINGS
p.5 Modification of ELECTRICAL CHARACTERISTICS ICCH, ICCL
p.6 Modification of SWITCHING CHARACTERISTICS |tPHL−tPLH|
pp.7, 8 Addition of TEST CIRCUIT
pp.9 to 12 Addition of TYPICAL CHARACTERISTICS
p.13 Addition of TAPING SPECIFICATIONS
p.14 Addition of RECOMMENDED MOUNT PAD DIMENSIONS
pp.15, 16 Addition of NOTES ON HANDLING
p.17 Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
2.00 Sep 07, 2011 Throughout Addition of PS9305L2
p.1 Addition of SEMKO approved
p.3 Modification of MARKING EXAMPLE
p.6 Modification of SWITCHING CHARACTERISTICS tPLH, tPHL, |tPHL−tPLH|
p.8
Modification of Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms, and
Fig. 8 CMR Test Circuit and Wave Forms
p.17 Modification of USAGE CAUTIONS 2. (2)
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