IL715/IL716/IL717 High Speed/High Temperature Four-Channel Digital Isolators Functional Diagrams Features IN1 OUT1 IN2 OUT2 IN3 OUT3 IN4 OUT4 IL715 IN1 OUT1 IN2 OUT2 OUT3 IN3 OUT4 IN4 IL716 IN1 OUT1 IN2 OUT2 IN3 OUT3 OUT4 IN4 IL717 * * * * * * * * * * * * * +5 V / +3.3 V CMOS/TTL Compatible High Speed: 110 Mbps High Temperature: -40C to +125C (IL715T/IL716T/IL717T) 2500 VRMS Isolation (1 min.) 2 ns Typical Pulse Width Distortion 100 ps Typical Pulse Jitter 4 ns Typical Propagation Delay Skew 10 ns Typical Propagation Delay 30 kV/s Typical Common Mode Rejection Low EMC Footprint 2 ns Channel-to-Channel Skew 0.3" and 0.15" 16-pin SOIC Packages UL1577 and IEC 61010-2001 Approved Applications * * * * * * * * * * * * ADCs and DACs Digital Fieldbus RS-485 and RS-422 Multiplexed Data Transmission Data Interfaces Board-to-Board Communication Digital Noise Reduction Operator Interface Ground Loop Elimination Peripheral Interfaces Parallel Bus Logic Level Shifting Description NVE's IL715, IL716, and IL717 four-channel high-speed digital isolators are CMOS devices manufactured with NVE's patented* IsoLoop(R) spintronic Giant Magnetoresistive (GMR) technology. All transmit and receive channels operate at 110 Mbps over the full temperature and supply voltage range. The symmetric magnetic coupling barrier provides a typical propagation delay of only 10 ns and a pulse width distortion of 2 ns, achieving the best specifications of any isolator. Typical transient immunity of 30 kV/s is unsurpassed. Available in 0.15" SOIC packages, the four-channel devices provide the highest channel density available. Typical transient immunity of 30 kV/s is unsurpassed. High channel density makes these devices ideal for isolating ADCs and DACs, parallel buses and peripheral interfaces. The IL715, IL716, and IL717 are available in 0.3" and 0.15" 16-pin SOIC packages and performance is specified over the temperature range of -40C to +100C without derating. The IL715T, IL716T, and IL717T are specified over -40C to +125C; the widest temperature range digital couplers available. IsoLoop is a registered trademark of NVE Corporation. *U.S. Patent numbers 5,831,426; 6,300,617 and others. NVE Corporation 11409 Valley View Road, Eden Prairie, MN 55344-3617 REV. R Phone: (952) 829-9217 Fax: (952) 829-9189 www.IsoLoop.com (c)NVE Corporation IL715/IL716/IL717 Absolute Maximum Ratings Parameters Storage Temperature Ambient Operating Temperature(1) IL715T, IL716T, and IL717T Supply Voltage Input Voltage Output Voltage Output Current Drive Lead Solder Temperature ESD Symbol TS Min. -55 TA -55 VDD1, VDD2 VI VO IO -0.5 -0.5 -0.5 Typ. Max. 150 125 135 7 VDD+0.5 VDD+0.5 10 260 Units C Max. Units 100 125 5.5 VDD 0.8 1 C C V V V s Max. Units 2 Test Conditions C V V V mA C kV 10 sec. HBM Recommended Operating Conditions Parameters Ambient Operating Temperature IL715, IL716, and IL717 IL715T, IL716T, and IL717T Supply Voltage Logic High Input Voltage Logic Low Input Voltage Input Signal Rise and Fall Times Symbol Min. TA TA VDD1, VDD2 VIH VIL tIR, tIF -40 -40 3.0 2.4 0 Symbol Min. Typ. Test Conditions Insulation Specifications Parameters Creepage Distance 0.15" SOIC 0.3" SOIC Leakage Current(5) Barrier Impedance(5) Typ. 4.03 8.08 mm mm A || pF 0.2 >1014||3 Test Conditions 240 VRMS, 60 Hz Package Characteristics Parameters Capacitance (Input-Output)(5) Thermal Resistance 0.15" SOIC 0.3" SOIC Package Power Dissipation Symbol CI-O Min. Typ. 4 JC JC Max. 41 28 150 PPD Units pF Test Conditions f = 1 MHz C/W C/W mW Thermocouple at center underside of package f = 1 MHz, VDD = 5 V Safety and Approvals IEC61010-1 TUV Certificate Numbers: N1502812, N1502812-101 Classification as Reinforced Insulation Model IL715, IL716, and IL717 IL715-3, IL716-3, and IL717-3 Package 0.3" SOIC 0.15" SOIC UL 1577 Component Recognition Program File Number: E207481 Rated 2500VRMS for 1 minute Soldering Profile Per JEDEC J-STD-020C, MSL=2 2 Pollution Degree II II Material Group III III Max. Working Voltage 300 VRMS 150 VRMS IL715/IL716/IL717 IL715 Pin Connections 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VDD1 GND1 IN1 IN2 IN3 IN4 NC GND1 GND2 NC OUT4 OUT3 OUT2 OUT1 GND2 VDD2 Supply voltage Ground return for VDD1 Data in, channel 1 Data in, channel 2 Data in, channel 3 Data in, channel 4 No connection Ground return for VDD1 Ground return for VDD2 No connection Data out, channel 4 Data out, channel 3 Data out, channel 2 Data out, channel 1 Ground return for VDD2 Supply voltage VDD1 VDD2 GND1 GND2 IN1 OUT1 IN2 OUT2 IN3 OUT3 IN4 OUT4 NC NC GND2 GND1 IL715 IL716 Pin Connections 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VDD1 GND1 IN1 IN2 OUT3 OUT4 NC GND1 GND2 NC IN4 IN3 OUT2 OUT1 GND2 VDD2 Supply voltage Ground Return for VDD1 Data in, channel 1 Data in, channel 2 Data out, channel 3 Data out, channel 4 No connection Ground Return for VDD1 Ground Return for VDD2 No connection Data in, channel 4 Data in, channel 3 Data out, channel 2 Data out, channel 1 Ground Return for VDD2 Supply voltage VDD1 VDD2 GND1 GND2 IN1 OUT1 IN2 OUT2 OUT3 IN3 OUT4 IN4 NC NC GND2 GND1 IL716 3 IL715/IL716/IL717 IL717 Pin Connections 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VDD1 GND1 IN1 IN2 IN3 OUT4 NC GND1 GND2 NC IN4 OUT3 OUT2 OUT1 GND2 VDD2 Supply voltage Ground return for VDD1 Data in, channel 1 Data in, channel 2 Data in, channel 3 Data out, channel 4 No connection Ground return for VDD1 Ground return for VDD2 No connection Data in, channel 4 Data out, channel 3 Data out, channel 2 Data out, channel 1 Ground return for VDD2 Supply voltage VDD1 VDD2 GND1 GND2 IN1 OUT1 IN2 OUT2 IN3 OUT3 OUT4 IN4 NC NC GND2 GND1 IL717 Timing Diagram Legend tPLH tPHL tPW tR tF 4 Propagation Delay, Low to High Propagation Delay, High to Low Minimum Pulse Width Rise Time Fall Time IL715/IL716/IL717 3.3 Volt Electrical Specifications Electrical specifications are Tmin to Tmax unless otherwise stated. Parameters Symbol Min. Typ. Max. DC Specifications Input Quiescent Supply Current IL715 16 20 IDD1 IL716 3.3 4 IL717 1.5 2 Output Quiescent Supply Current IL715 5.5 8 IDD2 IL716 3.3 4 3 6 IL717 Logic Input Current II -10 10 VDD - 0.1 VDD Logic High Output Voltage VOH 0.8 x VDD 0.9 x VDD 0 0.1 Logic Low Output Voltage VOL 0.5 0.8 Switching Specifications Maximum Data Rate 100 110 Pulse Width(7) PW 10 Propagation Delay Input to Output 12 18 tPHL (High to Low) Propagation Delay Input to Output 12 18 tPLH (Low to High) Pulse Width Distortion (2) PWD 2 3 Propagation Delay Skew (3) tPSK 4 6 Output Rise Time (10%-90%) tR 2 4 Output Fall Time (10%-90%) tF 2 4 Common Mode Transient Immunity |CMH|,|CML| 20 30 (Output Logic High or Logic Low)(4) Channel-to-Channel Skew tCSK 2 3 Dynamic Power Consumption(6) 140 240 Magnetic Field Immunity(8) (VDD2= 3V, 3V<VDD1<5.5V) Power Frequency Magnetic Immunity HPF 1000 1500 Pulse Magnetic Field Immunity HPM 1800 2000 Damped Oscillatory Magnetic Field HOSC 1800 2000 Cross-axis Immunity Multiplier(9) KX 2.5 5 Units Test Conditions A mA mA mA mA mA A V V Mbps ns IO = -20 A, V I = VIH IO = -4 mA, VI = VIH IO = 20 A, V I = VIL IO = 4 mA, VI = VIL CL = 15 pF 50% Points, VO ns CL = 15 pF ns CL = 15 pF ns ns ns ns CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF kV/s VCM = 300 V ns A/MHz CL = 15 pF per channel A/m A/m A/m 50Hz/60Hz tp = 8s 0.1Hz - 1MHz IL715/IL716/IL717 5 Volt Electrical Specifications Electrical specifications are Tmin to Tmax unless otherwise stated. Parameters Symbol Min. Typ. Max. DC Specifications Input Quiescent Supply Current IL715 24 30 IDD1 IL716 5 6 IL717 2 3 Output Quiescent Supply Current IL715 8 12 IDD2 IL716 5 6 6 9 IL717 Logic Input Current II -10 10 VDD - 0.1 VDD Logic High Output Voltage VOH 0.8 x VDD 0.9 x VDD 0 0.1 Logic Low Output Voltage VOL 0.5 0.8 Switching Specifications Maximum Data Rate 100 110 Pulse Width(7) PW 10 Propagation Delay Input to Output 10 15 tPHL (High to Low) Propagation Delay Input to Output 10 15 tPLH (Low to High) Pulse Width Distortion(2) PWD 2 3 Pulse Jitter(10) tJ 100 Propagation Delay Skew(3) tPSK 4 6 Output Rise Time (10%-90%) tR 1 3 Output Fall Time (10%-90%) tF 1 3 Common Mode Transient Immunity |CM |,|CM | 20 30 H L (Output Logic High or Logic Low)(4) Channel-to-Channel Skew tCSK 2 3 Dynamic Power Consumption(6) 200 340 Magnetic Field Immunity(8) (VDD2= 5V, 3V<VDD1<5.5V) Power Frequency Magnetic Immunity HPF 2800 3500 Pulse Magnetic Field Immunity HPM 4000 4500 Damped Oscillatory Magnetic Field HOSC 4000 4500 Cross-axis Immunity Multiplier(9) KX 2.5 Units Test Conditions A mA mA mA mA mA A V V Mbps ns IO = -20 A, V I = VIH IO = -4 mA, VI = VIH IO = 20 A, V I = VIL IO = 4 mA, VI = VIL CL = 15 pF 50% Points, VO ns CL = 15 pF ns CL = 15 pF ps ns ns ns CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF CL = 15 pF kV/s Vcm = 300 V ns A/MHz CL = 15 pF per channel A/m A/m A/m 50Hz/60Hz tp = 8s 0.1Hz - 1MHz Notes (apply to both 3.3 V and 5 V specifications): 1. Absolute maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not guarantee performance. 2. PWD is defined as |tPHL - tPLH|. %PWD is equal to PWD divided by pulse width. 3. tPSK is the magnitude of the worst-case difference in tPHL and/or tPLH between devices at 25C. 4. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common mode input voltage that can be sustained while maintaining VO < 0.8 V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. 5. Device is considered a two terminal device: pins 1-8 shorted and pins 9-16 shorted. 6. Dynamic power consumption is calculated per channel and is supplied by the channel's input side power supply. 7. Minimum pulse width is the minimum value at which specified PWD is guaranteed. 8. The relevant test and measurement methods are given in the Electromagnetic Compatibility section on p. 7. 9. External magnetic field immunity is improved by this factor if the field direction is "end-to-end" rather than to "pin-to-pin" (see diagram on p. 7). 10. 65,535-bit pseudo-random binary signal (PRBS) NRZ bit pattern with no more than five consecutive 1s or 0s; 800 ps transition time. 6 IL715/IL716/IL717 Application Information Electrostatic Discharge Sensitivity Power Supply Decoupling This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, NVE recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. Both power supplies to these devices should be decoupled with low ESR 47 nF ceramic capacitors. Ground planes for both GND1 and GND2 are highly recommended for data rates above 10 Mbps. Capacitors must be located as close as possible to the VDD pins. Signal Status on Start-up and Shut Down Electromagnetic Compatibility To minimize power dissipation, input signals are differentiated and then latched on the output side of the isolation barrier to reconstruct the signal. This could result in an ambiguous output state depending on power up, shutdown and power loss sequencing. Therefore, the designer should consider including an initialization signal in the start-up circuit. Initialization consists of toggling the input either high then low, or low then high. IsoLoop Isolators have the lowest EMC footprint of any isolation technology. IsoLoop Isolators' Wheatstone bridge configuration and differential magnetic field signaling ensure excellent EMC performance against all relevant standards. These isolators are fully compliant with generic EMC standards EN50081, EN50082-1 and the umbrella line-voltage standard for Information Technology Equipment (ITE) EN61000. NVE has completed compliance tests in the categories below: Data Transmission Rates The reliability of a transmission system is directly related to the accuracy and quality of the transmitted digital information. For a digital system, those parameters which determine the limits of the data transmission are pulse width distortion and propagation delay skew. EN50081-1 Residential, Commercial & Light Industrial Methods EN55022, EN55014 EN50082-2: Industrial Environment Methods EN61000-4-2 (ESD), EN61000-4-3 (Electromagnetic Field Immunity), EN61000-4-4 (Electrical Transient Immunity), EN61000-4-6 (RFI Immunity), EN61000-4-8 (Power Frequency Magnetic Field Immunity), EN61000-4-9 (Pulsed Magnetic Field), EN61000-4-10 (Damped Oscillatory Magnetic Field) ENV50204 Radiated Field from Digital Telephones (Immunity Test) Propagation delay is the time taken for the signal to travel through the device. This is usually different when sending a low-to-high than when sending a high-to-low signal. This difference, or error, is called pulse width distortion (PWD) and is usually in nanoseconds. It may also be expressed as a percentage: PWD% = Maximum Pulse Width Distortion (ns) Signal Pulse Width (ns) Immunity to external magnetic fields is even higher if the field direction is "end-to-end" rather than to "pin-to-pin" as shown in the diagram below: x 100% For example, with data rates of 12.5 Mbps: Cross-axis Field Direction PWD% = 3 ns x 100% = 3.75% 80 ns Dynamic Power Consumption This figure is almost three times better than any available optocoupler with the same temperature range, and two times better than any optocoupler regardless of published temperature range. IsoLoop isolators exceed the 10% maximum PWD recommended by PROFIBUS, and will run to nearly 35 Mb within the 10% limit. IsoLoop Isolators achieve their low power consumption from the way they transmit data across the isolation barrier. By detecting the edge transitions of the input logic signal and converting these to narrow current pulses, a magnetic field is created around the GMR Wheatstone bridge. Depending on the direction of the magnetic field, the bridge causes the output comparator to switch following Propagation delay skew is the signal propagation difference between two or more channels. This becomes significant in clocked systems because it is undesirable for the clock pulse to arrive before the data has settled. Short propagation delay skew is therefore especially critical in high data rate parallel systems for establishing and maintaining accuracy and repeatability. Worstcase channel-to-channel skew in an IL700 Isolator is only 3 ns, which is ten times better than any optocoupler. IL700 Isolators have a maximum propagation delay skew of 6 ns, which is five times better than any optocoupler. the input logic signal. Since the current pulses are narrow, about 2.5 ns, the power consumption is independent of mark-to-space ratio and solely dependent on frequency. This has obvious advantages over optocouplers, which have power consumption heavily dependent on mark-to-space ratio. 7 IL715/IL716/IL717 Application Diagrams Isolated Logic Level Shifters +5V +3.3V DO DI Sensor Controller ADC CLK CS IL717 GND 1 GND 2 Single-Channel Isolated Delta-Sigma A/D Converter Bridge Bias Delta Sigma A/D CS5532 Bridge + Bridge Isolation Boundary Serial Data Out Iso SD Out Serial Data In Iso SD In Data Clock Iso Data Clock Chip Select Iso CS IL717 Clock Generator OSC 2 This circuit illustrates a typical single-channel delta-sigma ADC. The A/D is located on the bridge with no signal conditioning electronics between the bridge sensor and the ADC. In this case, the IL717 is the best choice for isolation. It isolates the control bus from the microcontroller. The system clock is located on the isolated side of the system. 8 IL715/IL716/IL717 Package Drawings, Dimensions and Specifications 0.15" SOIC Package Dimensions in inches (mm) 0.152 (3.86) 0.157 (3.99) 0.013 (0.3) 0.020 (0.5) NOM 0.016 (0.4) 0.050 (1.3) 0.007 (0.2) 0.013 (0.3) 0.386 (9.8) 0.394 (10.0) Pin 1 identified by either an indent or a marked dot 0.228 (5.8) 0.244 (6.2) 0.054 (1.4) 0.072 (1.8) 0.040 (1.02) 0.050 (1.27) 0.040 (1.0) NOTE: Pin spacing is a BASIC 0.060 (1.5) dimension; tolerances do not accumulate 0.004 (0.1) 0.012 (0.3) 0.3" SOIC Package Dimensions in inches (mm) 0.013 (0.3) 0.020 (0.5) 0.287 (7.29) 0.300 (7.62) 0.007 (0.2) 0.013 (0.3) 0.397 (10.1) 0.413 (10.5) Pin 1 identified by either an indent or a marked dot 0.394 (10.00) 0.419 (10.64) NOM 0.016 (0.4) 0.050 (1.3) 0.092 (2.34) 0.105 (2.67) 0.08 (2.0) 0.10 (2.5) 0.040 (1.0) NOTE: Pin spacing is a BASIC 0.060 (1.5) dimension; tolerances do not accumulate 9 0.004 (0.1) 0.012 (0.3) IL715/IL716/IL717 Ordering Information and Valid Part Numbers IL 716 T - 3 E TR13 Valid Part Numbers Bulk Packaging Blank = Tube TR7 = 7'' Tape and Reel TR13 = 13'' Tape and Reel Package Blank = 80/20 Tin/Lead Plating E = RoHS Compliant Package Type Blank = 0.30'' 16-pin SOIC -3 = 0.15'' 16-pin SOIC IL715 IL715E IL715-3 IL715-3E IL715T IL715TE IL715T-3 IL715T-3E IL716 IL716E IL716-3 IL716-3E IL716T IL716TE IL716T-3 IL716T-3E IL717 IL717E IL717-3 IL717-3E IL717T IL717TE IL717T-3 IL717T-3E All IL715, IL716, and IL717 part types are available on tape and reel. Grade Blank = Standard T = High Temperature Base Part Number 715 = 4 Drive Channels 716 = 2 Drive Channels 2 Receive Channels 717 = 3 Drive Channels 1 Receive Channel Product Family IL = Isolators RoHS COMPLIANT 10 IL715/IL716/IL717 ISB-DS-001-IL715/6/7-R November 2009 Changes ISB-DS-001-IL715/6/7-Q Changes ISB-DS-001-IL715/6/7-P * * Added typical jitter specification at 5V. Added EMC details. Changes * Added magnetic field immunity and electromagnetic compatibility specifications. * Added notes on package drawings that pin-spacing tolerances are non-accumulating. ISB-DS-001-IL715/6/7-O Changes * Changed ordering information to reflect that devices are now fully RoHS compliant with no exemptions. ISB-DS-001-IL715/6/7-N Changes * Eliminated soldering profile chart ISB-DS-001-IL715/6/7-M Changes * Package drawings updated ISB-DS-001-IL715/6/7-L Changes * T-Grades added ISB-DS-001-IL715/6/7-K * Package drawings updated * Order information updated Changes * Update UL and IEC approvals * ISB-DS-001-IL715/6/7-J Package characteristics added Changes * Revision letter added. * Storage temperature changed from 175C max. to 150C max. * Lead soldering temperature changed from 180C max. to 260C max. * IEC 61010-1 Classification: "Reinforced Insulation" added. * Dynamic Power Consumption: units corrected from mA/mHz to mA/MHz. * Ordering Information. 5 Volt only option removed. The following valid part numbers removed. IL715B, IL715-3B, IL715BE, IL715-3BE IL716B, IL716-3B, IL716BE, IL716-3BE IL717B, IL717-3B, IL717BE, IL717-3BE 11 IL715/IL716/IL717 About NVE An ISO 9001 Certified Company NVE Corporation is a high technology components manufacturer having the unique capability to combine spintronic Giant Magnetoresistive (GMR) materials with integrated circuits to make high performance electronic components. Products include Magnetic Field Sensors, Magnetic Field Gradient Sensors (Gradiometer), Digital Magnetic Field Sensors, Digital Signal Isolators and Isolated Bus Transceivers. NVE is a leader in GMR research and in 1994 introduced the world's first products using GMR material, a line of GMR magnetic field sensors that can be used for position, magnetic media, wheel speed and current sensing. NVE is located in Eden Prairie, Minnesota, a suburb of Minneapolis. Please visit our Web site at www.nve.com or call (952) 829-9217 for information on products, sales or distribution. NVE Corporation 11409 Valley View Road Eden Prairie, MN 55344-3617 USA Telephone: (952) 829-9217 Fax: (952) 829-9189 Internet: www.nve.com e-mail: isoinfo@nve.com The information provided by NVE Corporation is believed to be accurate. However, no responsibility is assumed by NVE Corporation for its use, nor for any infringement of patents, nor rights or licenses granted to third parties, which may result from its use. No license is granted by implication, or otherwise, under any patent or patent rights of NVE Corporation. NVE Corporation does not authorize, nor warrant, any NVE Corporation product for use in life support devices or systems or other critical applications without the express written approval of the President of NVE Corporation. Specifications shown are subject to change without notice. ISB-DS-001-IL715/6/7-R November 2009 12