3
9
Notice for TAIYO YUDEN products 
Please read this notice before using the TAIYO YUDEN products.
△
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！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
1
INFORMATION ON THE GENERAL CATALOG
REMINDERS
■ Product information in this catalog is as of October 2008. All of the contents specified herein are
subject to change without notice due to technical improvements, etc. Therefore, please check for the
latest information carefully before practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment
incorporating such products, which are caused under the conditions other than those specified in this
catalog or individual specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual
specification is available.
■ Please conduct validation and verification of products in actual condition of mounting and operating
environment before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and
intended for use in general electronics equipment.(for AV, office automation, household, office supply,
information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the
components or devices into any equipment in the field such as transportation,( automotive control, train
control, ship control), transportation signal, disaster prevention, medical, public information network
(telephone exchange, base station) etc. which may have direct influence to harm or injure a human
body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear
control, submarine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic
equipment, if the equipment or the electric circuit require high safety or reliability function or
performances, a sufficient reliability evaluation check for safety shall be performed before commercial
shipment and moreover, due consideration to install a protective circuit is strongly recommended at
customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices
or distributors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that
may occur in connection with a third party's intellectual property rights and other related rights arising
from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign
Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations, and
other applicable regulations. Should you have any question or inquiry on this matter, please contact our
sales staff.
Should you have any question or inquiry on this matter, please contact our sales staff.
特長 FEATURES
形名表記法 ORDERING CODE
用途 APPLICATIONS
92 △
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！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
E 4 K 2 1 2 B J 1 0 4 M D _T△
6
7
8
5
4
3
2
1
9
10
11
・高効率な実装を実現
・内部電極には、信頼性とコストパフォーマンスに優れたNiを使用してい
ます。
・High density and high efficiency mounting.
・Internal electrode is nickel for increased cost performance and reliability.
アレイ形積層セラミックコンデンサ
ARRAY TYPE MULTILAYER CERAMIC
CAPACITOR
M ±20%
K ±10%
F ±1pF
K Plated
3
End termination
7
Capacitance tolerance
ー Standard products
9
8
4
Dimensions（case size）（mm）
10
096（0302） 0.9×0.6
110（0504） 1.4×1.0
212（0805） 2.0×1.25
096（0302） 0.9×0.6
110（0504） 1.4×1.0
212（0805） 2.0×1.25
M ±20%
K ±10%
F ±1pF
K メッキ品
3 7
容量許容差
ー 標準
個別仕様
9
6
公称静電容量（pF）
4
形状寸法（EIA）L×W（mm）
10
4 4連積層コンデンサ
2 2連積層コンデンサ
2
シリーズ名
例
104 100,000
105 1,000,000
2
Series name
Special code
・General electronic equipment
・Communication equipment （mobile phone, PHS, cordless phone, etc.）
・一般電子機器用
・通信機器用 （携帯電話、PHS、コードレス電話etc）
6
Nominal capacitance（pF）
example
104 100,000
105 1,000,000
端子電極
J 6.3
L 10
E 16
T 25
U 50
1
定格電圧（VDC）
J 6.3
L 10
E 16
T 25
U 50
1
Rated voltage（VDC）
P 0.3
K 0.45
V 0.5
B 0.6
A 0.8
D 0.85
Thickness（mm）
P 0.3
K 0.45
V 0.5
B 0.6
A 0.8
D 0.85
製品厚み（mm）
8
当社管理記号
11
△ 標準品
△＝スペース
11
Internal code
△ Standard products
△＝ Blank space
5
Code
Temp.characteristics
Operating temp. range
OPERATING TEMP.
BJ B−25〜＋85℃
X5R* −55〜＋85℃
B7X7R−55〜＋125℃
CH C0H−55〜＋125℃
CG C0G−55〜＋125℃
5
*個別仕様の取交しにより、X7R 仕様に対応している場合があります。
*We may provide X7R for some items according to the individual specification.
温度特性
BJ B
X5R
B7X7R
CH C0H
CG C0G
Temperature characteristics code
BJ B
X5R
B7X7R
CH C0H
CG C0G
包装
T
φ178mm テーピング
（4mmピッチ）
110, 212形状
F
φ178mm テーピング
（2mmピッチ）
096形状
Packaging
T
φ178mm Taping
（4mm pitch）
0504, 0805Type
F
φ178mm Taping
（2mm pitch）
0302Type
4 4 circuit multilayer
capacitors
2 2 circuit multilayer
capacitors
外形寸法 EXTERNAL DIMENSIONS
CAPACITORS
4
93
△
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
Cap
[μF]
0.001
0.0022
0.0047
0.01
0.022
0.047
0.1
0.22
0.47
1.0
2.2
Cap
[pF]
10
12
15
18
22
27
33
39
47
56
68
82
100
Type
Temp.Char
VDC
[pF:3digits]
102
222
472
103
223
473
104
224
474
105
225
Type
Temp.Char
VDC
[pF:3digits]
100
120
150
180
220
270
330
390
470
560
680
820
101
096 2連
□2K096
110 2連
□2K110
212 2連
□2K212
212 4連
□4K212
B/X5R
X5R
10V 6.3V 50V 25V 16V 16V10V25V50V 10V
P
K
K
K
B
B
B
B
B
B
B
B
B
B
B
B
16V
B
B
B
A
B
V
A
AD
D
D D
D
D
D
D
B/X7R
B/X7R
6.3V 25V 10V 25V
X5R
10V
X5R
B/X5R
B/X5R X5R CH / CG
25V
P
P
P
P
P
P
P
P
P
P
P
P
P
CH / CG
50V
B
B
B
B
B
B
B
B
B
B
B
B
B
10V16V
B/X5R
096 2連
□2K096
110 2連
□2K110
CH / C0H/CG（C0G）BJ/ X7R, BJ/ X5R
P.94 P.97 P.98 P.102 P.108
P.12
概略バリエーション AVAILABLE CAPACITANCE RANGE
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信頼性
Reliability Data
使用上の注意
Precautions
セレクションガイド
Selection Guide
etc
※グラフ記号は製品厚みを表します。 Letters in the table indicate thickness.
E1
E2
E1
E2
※
グラフ記号は製品厚みを表します。
Letters in the table indicate thickness.
Type（EIA）L W E1E2P T
□2K096
（0302）
0.9±0.05
（0.035±0.002）
0.6±0.05
（0.024±0.002）
0.23±0.10
（0.009±0.004）
0.125±0.075
（0.005±0.003）
0.45±0.05
（0.018±0.002）
P0.30±0.03
（0.012±0.001）
K0.45±0.05
（0.018±0.002）
□2K110
（0504）
1.37±0.07
（0.054±0.003）
1.00±0.08
（0.039±0.003）
0.36±0.10
（0.014±0.004）
0.2±0.10
（0.008±0.004）
0.64±0.10
（0.025±0.004）
V0.5±0.05
（0.020±0.002）
B0.60±0.06
（0.024±0.003）
A0.80±0.08
（0.031±0.003）
□4K212
（0805）
2.00±0.10
（0.079±0.004）
1.25±0.10
（0.049±0.004）
0.25±0.10
（0.010±0.004）
0.25±0.15
（0.010±0.006）
0.50±0.10
（0.020±0.004）
D0.85±0.10
（0.033±0.004）
□2K212
（0805）
2.00±0.10
（0.079±0.004）
1.25±0.10
（0.049±0.004）
0.50±0.20
（0.020±0.008）
0.25±0.15
（0.010±0.006）
1.00±0.10
（0.039±0.004）
D0.85±0.10
（0.033±0.004）
Unit:mm（inch）
温度特性コード
Temp.char.Code
温度特性
Temperature characteristics
静電容量許容差
〔％〕
Capacitance tolerance
tanδ〔%〕
Dissipation factor
準拠規格
Applicable standard
温度範囲〔℃〕
Temperature range
基準温度〔℃〕
Ref. Temp.
静電容量変化率
Capacitance change
BJ JIS B−25〜＋85 20 ±10［％］±10（K）
±20（M）3.5, 5, 10 max.*EIA X5R−55〜＋85 25 ±15［％］
B7EIA X7R−55〜＋125 25 ±15［％］±10（K）
CH JIS CH −55〜＋125 20 ±60［ppm/℃］±10（K）0.1 max.**
EIA C0H−55〜＋125 25 ±60［ppm/℃］
CG JIS CG −55〜＋125 20 ±30［ppm/℃］±10（K）0.1 max.**
EIA C0G−55〜＋125 25 ±30［ppm/℃］
*：アイテムによって異なります。アイテム一覧表を参照下さい。
**：27pF以下 Q≧400+20・C     30pF以上 Q≧1000
*： Different depending on the item. Please refer to the part numbers list for the differences.
**：27pF or over Q≧400+20・C     30pF or over Q≧1000
94 △
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！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
PART NUMBERS
アイテム一覧
■ 096TYPE（0302 case size） 2連タイプ（2 circuit type）
【温度特性 Temp.char. BJ:B/X5R】
定格電圧
Rated Voltage
形  名
Ordering code
EHS
（Environmental
Hazardous
Substances）
公  称
静電容量
Capacitance
〔μF〕
温度特性
Temperature
characteristics
tanδ
Dissipation
factor
〔%〕Max.
実装条件
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
静電容量
許 容 差
Capacitance
tolerance
厚 み
Thickness
〔mm〕
（inch）
10V L2K096 BJ103□P RoHS 0.01 B/X5R
5R
±10%〔K〕
±20%〔M〕
0.3±0.03
（0.012±0.001）
6.3V
J2K096 BJ473□K*1 RoHS 0.047
X5R0.45±0.05
（0.018±0.002）
J2K096 BJ104□K*1RoHS 0.1
J2K096 BJ224MK*1RoHS 0.22 10 ±20%〔M〕
【温度特性 Temp.char. CH:CH/C0H】
定格電圧
Rated Voltage
形  名
Ordering code
EHS
（Environmental
Hazardous
Substances）
公  称
静電容量
Capacitance
〔pF〕
温度特性
Temperature
characteristics
Q
Symbol
実装条件
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
静電容量
許 容 差
Capacitance
tolerance
厚 み
Thickness
〔mm〕
（inch）
25V
T2K096 △100FP RoHS 10
CH（C0H）/
CG（C0G）
400+20・C
R
±1ｐF〔F〕
0.3±0.03
（0.012±0.001）
T2K096 △120KP RoHS 12
±10%〔K〕
T2K096 △150KP RoHS 15
T2K096 △180KP RoHS 18
T2K096 △220KP RoHS 22
T2K096 △270KP RoHS 27
T2K096 △330KP RoHS 33
1000
T2K096 △390KP RoHS 39
T2K096 △470KP RoHS 47
T2K096 △560KP RoHS 56
T2K096 △680KP RoHS 68
T2K096 △820KP RoHS 82
T2K096 △101KP RoHS 100
△ Please specify the temperature characteristic code.
注：形名の△には温度特性が入ります。
□ Please specify the capacitance tolerance code.
i
*1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage.
形名の□には静電容量許容差記号が入ります。
*1高温負荷試験の試験電圧は、定格電圧の1.5倍
CAPACITORS
4
95
△
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△ Please specify the temperature characteristic code.
PART NUMBERS
アイテム一覧
■ 110TYPE（0504 case size） 2連タイプ（2 circuit type）
【温度特性 Temp.char. BJ:B/X5R】
定格電圧
Rated Voltage
形  名
Ordering code
EHS
（Environmental
Hazardous
Substances）
公  称
静電容量
Capacitance
〔μF〕
温度特性
Temperature
characteristics
tanδ
Dissipation
factor
〔%〕Max.
実装条件
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
静電容量
許 容 差
Capacitance
tolerance
厚 み
Thickness
〔mm〕
（inch）
50V
U2K110 BJ102□B RoHS 0.001
B/X5R*23.5
R±10%〔K〕
±20%〔M〕
0.6±0.06
（0.024±0.002）
U2K110 BJ222□B RoHS 0.0022
U2K110 BJ472□B RoHS 0.0047
25V
T2K110 BJ103□B RoHS 0.01
T2K110 BJ223□B RoHS 0.022
T2K110 BJ104□B RoHS 0.1B/X5R5
16VE2K110 BJ473□B RoHS 0.047 B/X5R*23.5
E2K110 BJ104□B RoHS 0.1
5
10V
L2K110 BJ224□B RoHS 0.22 B/X5R
L2K110 BJ474□A RoHS 0.47 0.8±0.08
（0.031±0.003）
L2K110 BJ105□A*1RoHS 1.0
X5R10
6.3V
J2K110 BJ105□V*1RoHS 1.00.5±0.05
（0.02±0.002）
J2K110 BJ225□A*1RoHS 2.20.8±0.08
（0.031±0.003）
【温度特性 Temp.char. B7:X7R】
定格電圧
Rated Voltage
形  名
Ordering code
EHS
（Environmental
Hazardous
Substances）
公  称
静電容量
Capacitance
〔μF〕
温度特性
Temperature
characteristics
tanδ
Dissipation
factor
〔%〕Max.
実装条件
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
静電容量
許 容 差
Capacitance
tolerance
厚 み
Thickness
〔mm〕
（inch）
50V
U2K110 B7
102□B RoHS 0.001
X7R3.5R±10%〔K〕
±20%〔M〕
0.6±0.06
（0.024±0.002）
U2K110 B7
222□B RoHS 0.0022
U2K110 B7
472□B RoHS 0.0047
25VT2K110 B7
103□B RoHS 0.01
T2K110 B7
223□B RoHS 0.022
16VE2K110 B7
473□B RoHS 0.047
E2K110 B7
104□B RoHS 0.1 5
【温度特性 Temp.char. CH:CH/C0H】
定格電圧
Rated Voltage
形  名
Ordering code
EHS
（Environmental
Hazardous
Substances）
公  称
静電容量
Capacitance
〔pF〕
温度特性
Temperature
characteristics
Q
Symbol
実装条件
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
静電容量
許 容 差
Capacitance
tolerance
厚 み
Thickness
〔mm〕
（inch）
50V
U2K110 △100FB RoHS 10
CH（C0H）/
CG（C0G）
400+20・C
R
±1ｐF〔F〕
0.6±0.06
（0.024±0.002）
U2K110 △120KB RoHS 12
±10%〔K〕
U2K110 △150KB RoHS 15
U2K110 △180KB RoHS 18
U2K110 △220KB RoHS 22
U2K110 △270KB RoHS 27
U2K110 △330KB RoHS 33
1000
U2K110 △390KB RoHS 39
U2K110 △470KB RoHS 47
U2K110 △560KB RoHS 56
U2K110 △680KB RoHS 68
U2K110 △820KB RoHS 82
U2K110 △101KB RoHS 100
△ Please specify the temperature characteristic code.
注：形名の△には温度特性が入ります。
□ Please specify the capacitance tolerance code.
i
*1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage.
*2 We may provide X7R for some items according to the individual specifi-
cation.
形名の□には静電容量許容差記号が入ります。
*1高温負荷試験の試験電圧は、定格電圧の1.5倍
*2個別仕様の取交しにより、X7R仕様に対応している場合があります。
□ Please specify the capacitance tolerance code.
i
*1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage.
□ Please specify the capacitance tolerance code.
i形名の□には静電容量許容差記号が入ります。
96 △
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
PART NUMBERS
アイテム一覧
■ 212TYPE（0805 case size） 2連タイプ（2 circuit type）
【温度特性 Temp.char. BJ:B/X5R】
定格電圧
Rated Voltage
形  名
Ordering code
EHS
（Environmental
Hazardous
Substances）
公  称
静電容量
Capacitance
〔μF〕
温度特性
Temperature
characteristics
tanδ
Dissipation
factor
〔%〕Max.
実装条件
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
静電容量
許 容 差
Capacitance
tolerance
厚 み
Thickness
〔mm〕
（inch）
25V T2K212 BJ105□D RoHS 1.0 B/X5R5R
±10%〔K〕
±20%〔M〕0.85±0.1
（0.033±0.004）
10V L2K212 BJ225MD*1RoHS 2.2X5R10 ±20%〔M〕
■ 212TYPE（0805 case size） 4連タイプ（4 circuit type）
【温度特性 Temp.char. BJ:B/X5R】
定格電圧
Rated Voltage
形  名
Ordering code
EHS
（Environmental
Hazardous
Substances）
公  称
静電容量
Capacitance
〔μF〕
温度特性
Temperature
characteristics
tanδ
Dissipation
factor
〔%〕Max.
実装条件
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
静電容量
許 容 差
Capacitance
tolerance
厚 み
Thickness
〔mm〕
（inch）
25V T4K212 BJ104□D RoHS 0.1B/X5R
5R±10%〔K〕
±20%〔M〕
0.85±0.1
（0.033±0.004）
16V E4K212 BJ104□D RoHS 0.1B/X5R*2
10V
L4K212 BJ224□D RoHS 0.22 B/X5R
L4K212 BJ474□D RoHS 0.47
L4K212 BJ105□D*1RoHS 1X5R10
□ Please specify the capacitance tolerance code.
i
*1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage.
形名の□には静電容量許容差記号が入ります。
*1高温負荷試験の試験電圧は、定格電圧の1.5倍
【温度特性 Temp.char. B7:X7R】
定格電圧
Rated Voltage
形  名
Ordering code
EHS
（Environmental
Hazardous
Substances）
公  称
静電容量
Capacitance
〔μF〕
温度特性
Temperature
characteristics
tanδ
Dissipation
factor
〔%〕Max.
実装条件
Soldering method
R:リフロー Reflow soldering
W: フロー Wave soldering
静電容量
許 容 差
Capacitance
tolerance
厚 み
Thickness
〔mm〕
（inch）
16V E4K212 B7
104□D RoHS 0.1X7R5R±10%〔K〕
±20%〔M〕
0.85±0.1
（0.033±0.004）
□ Please specify the capacitance tolerance code.
i
*1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage.
*2 We may provide X7R for some items according to the individual specifi-
cation.
形名の□には静電容量許容差記号が入ります。
*1高温負荷試験の試験電圧は、定格電圧の1.5倍
*2個別仕様の取交しにより、X7R仕様に対応している場合があります。
□ Please specify the capacitance tolerance code.
i形名の□には静電容量許容差記号が入ります。
CAPACITORS
4
97
△
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
インピーダンス・ESR– 周波数特性例 Example of Impedance ESR vs. Frequency characteristics
・当社積層セラミックコンデンサ例 (Taiyo Yuden multilayer ceramic capacitor)
10000
100000
1000000
1000
100
1
0.1
0.01
1 10 100 1000 10000
10
ESR
Impedance
〔MHz〕
〔MHz〕
L2K110BJ105MA
1000
100
10
0.1
0.01
0.001
0.1 1 10 100 1000 10000 100000
1
E2K110BJ104MB/E2K110B7104MB
1000
10000
100000
100
10
0.1
0.01
0.001
0.1 1 10 100 1000 10000 100000
1
J2K096BJ104MK
0.1 1 10 100 1000 10000 100000
T2K096CH101KP
10000
100000
1000000
1000
100
1
0.1
0.01
1 10 100 1000 10000
10
L2K096BJ103MP
1000
10000
100000
100
1
0.1
0.01
0.1 1 10 100 1000 10000 100000
10
1000
10000
100000
100
1
0.1
0.01
10
T2K110BJ103MB/T2K110B7103MB
1000
10000
1000000
100000
100
10
0.1
0.01
0.001
0.1 1 10 100 1000 10000 100000
1
J2K110BJ225MA
100
10000
1000
10
1
0.01
0.001
0.1 1 10 100 1000 10000 100000
0.1
Ｌ4K212BJ105KD
100
10000
1000
10
1
0.01
0.001
0.1 1 10 100 1000 10000 100000
0.1
ESR
Impedance
T2K096CH100FP
特性図 ELECTRICAL CHARACTERISTICS
□ Please specify the capacitance tolerance code.
i
*1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage.
98 △
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
C
0.2（0.008）
0.3（0.012）
0.3（0.012）
0.45（0.018）
0.3（0.012）
0.5（0.020）
0.5（0.020）
0.8（0.031）
0.8（0.031）
0.5（0.020）
0.6（0.024）
0.45（0.018）
0.85（0.033）
1.25（0.049）
0.85（0.033）
0.85（0.033）
0.85（0.033）
1.15（0.045）
1.25（0.049）
1.6（0.063）
0.85（0.033）
1.15（0.045）
1.5（0.059）
1.9（0.075）
2.0max（0.079）
2.5（0.098）
2.5（0.098）
■テーピング梱包  Taped packaging 
P
P
P
K
V, W
W
□MK063（0201）
□
□WK105（0204）
2K096（0302）
□MK042（
01005
）
□MK105（0402）
□VK105（0402）
mm（inch）code
製品厚み
Thickness
形式（EIA ）
Type
15000
15000
10000
10000
10000
標準数量
Standard quantity
[ pcs ]
紙テープ
paper
エンボステープ
Embossed tape
A
B
A
K
D
G
D
D
D
F
G
L
D
F
H
N
Y
M
□WK107（0306）
□MK107（0603）
□2K110（0504）
□MK212（0805）
□WK212（0508）
□4K212（0805）
□2K212（0805）
□MK316（1206）
□MK325（1210）
□MK432（1812）
3000
3000
2000
2000
2000
500
500（Ｔ）,
1000（Ｐ）
V
V
4000
0.45（0.018）
4000K
4000
4000
4000
4000
4000
4000
4000
4000
4000
M
梱包 PACKAGING
②テーピング材質 Taping material
※□WK
Unit：mm （inch）
105, 107, 212形状で個別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement accord-
ing to dimensions 0402, 0603, 0805.(inch)
③バルクカセット Bulk Cassette
①最小受注単位数 Minimum Quantity
※プレスポケットタイプは、
 ボトムテープ無し。
CAPACITORS
4
99
△
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
梱包 PACKAGING
③テーピング寸法 Taping dimensions 
 紙テープ Paper Tape（8mm幅）（0.315inches wide）
2.0±0.052.0±0.05
T1
部品挿入角穴
Unit：mm（inch）
Unit：mm（inch）
Type
チップ挿入部 挿入ピッチ テープ厚み
（EIA）
Chip cavity
Insertion Pitch
Tape Thickness
A B F K T
3.7
4.9
8.0±0.1
0.6max.
□MK432（1812）
（0.146）
（0.193）
（0.315±0.004）
4.0max.
（0.024max.）
（0.157max.）
エンボステープ Embossed tape（8mm幅）（0.315inches wide）
Unit：mm（inch）
エンボステープ Embossed tape（12mm幅）（0.472inches wide）
Type チップ挿入部 挿入ピッチ テープ厚み
（EIA）
Chip Cavity
Insertion Pitch
Tape Thickness
A B F T
□MK107（0603） 1.0 1.8 4.0±0.1 1.1max.
□WK107（0306）
（0.039） （0.071）
（0.157±0.004） （0.043max.）
□2K110（0504）
1.15 1.55 4.0±0.1 1.0max.
（0.045） （0.061）
（0.157±0.004） （0.039max.）
□MK212（0805）
□WK212（0508）
1.655 2.4
□4K212（0805） （0.065） （0.094）
4.0±0.1 1.1max.
□2K212（0805）
（0.157±0.004） （0.043max.）
□MK316（1206）
2.0 3.6
（0.079） （0.142）
Unit：mm（inch）
Type チップ挿入部 挿入ピッチ テープ厚み
（EIA）
Chip Cavity
Insertion Pitch
Tape Thickness
A B F T
□2K096（0302）
0.72 1.02 52.0±0.05
0.45max.(0.018max)
（0.028） （0.040）
（0.079±0.002）
0.6max.(0.024max)
□MK105（0402） 0.655 1.155 52.0±0.05 0.8max.
□VK105（0402） （0.026） （0.045）
（0.079±0.002） （
0.031max.）
2.0±0.052.0±0.05
部品挿入角穴
Type チップ挿入部 挿入ピッチ テープ厚み
（EIA）
Chip cavity
Insertion Pitch
Tape Thickness
A B F K T
□WK107（0306）
1.0 1.8
1.3max.
0.25±0.1
（0.039） （0.071）
（0.051max.）
（0.01±0.004）
□MK212（0805）
1.655 2.4
（0.065） （0.094） 4.0±0.1
□MK316（1206）
2.0 3.6
（0.157±0.004）
3.4max. 0.6max.
（0.079） （0.142）
（0.134max.） （0.024max.）
□MK325（1210）
2.8 3.6
（0.110） （0.142）
Type
（ＥＩＡ）
チップ挿入部
Chip Cavity
挿入ピッチ
Insertion Pitch
テープ厚み
Tape Thickness
Ａ Ｂ Ｆ Ｔ
T1
□MK042（01005）0.25
（0.010）
0.45
（0.018）
2.0±0.05
（0.079±0.002）
0.36max.
（0.014）
0.27max.
（0.011）
□MK063（0201）0.37
（0.016）
0.67
（0.027）
2.0±0.05
（0.079±0.002）
0.45max.
（0.018）
0.42max.
（0.017）
□WK105（0204）0.65
（0.026）
1.15
（0.045）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
0.42max
（0.017max）
Unit：mm（inch）
100 △
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
④リーダー部／空部 Leader and Blank portion 
160mm以上
（6.3inches or more
）
引き出し方向
Direction of tape feed
100mm以上
（3.94inches or more）
400mm以上
（15.7inches or more）
⑤リール寸法 Reel size 
⑥トップテープ強度 Top Tape Strength 
トップテープのはがし力は下図矢印方向にて0.1〜0.7Nとなります。
The top tape requires a peel-off force of 0.1〜0.7N in the direction of the
arrow as illustrated below.
梱包 PACKAGING
CAPACITORS
4
103
△
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
BJ: ±10%, ±20%
F： %
BJ:
2.5% max.（50V, 25V）
F:
5.0% max. （50V, 25V）
Note 4
BJ：±10％
（−25〜85℃）
F： ％
（−25〜85℃）
BJ（X7R）：±15％
F（Y5V）：  ％
RELIABILITY DATA 1/3
Item Temperature Compensating （Class 1）
Standard
Specified Value
Test Methods and RemarksHigh Permitivity （Class 2）
High ValueStandard Note1
−55 to ＋125℃
−55 to ＋125℃
50VDC,25VDC,
16VDC
No breakdown or
damage
10000 MΩ min.
0.5 to 5 pF: ±0.25 pF
1 to 10pF: ±0.5 pF
5 to 10 pF: ±1 pF
11 pF or over: ± 5%
±10%
105TYPER△, S△, T△, U△ only
0.5〜2pF
: ±
0.1pF
2.2〜20pF
: ±
5
%
Under 30 pF
: Q≧400 ＋ 20C
30 pF or over : Q≧1000
C= Nominal capacitance
CK：0±250
CJ：0±120
CH：0±60
CG：0±30
RH：−220±60
SK：−330±250
SJ：−330±120
SH：−330±60
TK：−470±250
TJ：−470±120
UK：−750±250
UJ：−750±120
S L ：
＋350 t o ー1000
（ppm/℃）
Appearance:
No abnormality
Capacitance change:
Within ±5% or ±0.5 pF,
whichever is larger.
BJ：−55 to ＋125℃
F：−25 to ＋85℃
BJ：−55 to ＋125℃
F：−25 to ＋85℃
50VDC,25VDC
−25 to ＋85℃
−25 to ＋85℃
50VDC,35VDC,25VDC
16VDC,10VDC,6.3VDC
4DVC, 2.5VDC
16VDC
50VDC
No abnormality No breakdown or damage
500 MΩμF. or 10000 MΩ., whichever is the
smaller.
Note 5
0.5 to 2 pF : ±0.1 pF
2.2 to 5.1 pF : ±5%
Refer to detailed
specification
CH：0±60
RH：−220±60
（ppm/℃）
Appearance:
No abnormality
Capacitance change:
Within±0.5 pF
Appearance:
No abnormality
Capacitance change:
BJ：Within ±12.5%
F：Within ±30%
High Frequency Type
1.Operating Temperature
Range
2.Storage Temperature
Range
3.Rated Voltage
4.Withstanding Voltage
Between terminals
5.Insulation Resistance
6.Capacitance （Tolerance）
7.
Q or Tangent of Loss Angle
（tan δ）
8.Temperature
Characteristic
of Capacitance
9.Resistance to Flexure of
Substrate
（Without
voltage ap-
plication）
Multilayer Ceramic Capacitor Chips
BJ：±10％、±20％
F：−20％／＋80％
BJ：2.5％ max.
F：7％ max.
Note 4
BJ：±10％
  （−25〜＋85℃）
F：＋30％／−80％
  （−25〜＋85℃）
BJ（X7R、X5R）：
  ±15％
F（Y5V）：
  ＋22％／−82％
＋80
−20
＋30
−80
According to JIS C 5102 clause 7.12.
Temperature compensating:
Measurement of capacitance at 20℃ and 85℃ shall be
made to calculate temperature characteristic by the fol-
lowing equation.
（C85ー C20） × 106 （ppm/℃）
C20×△T
High permitivity:
Change of maximum capacitance deviation in step 1 to 5
Temperature at step 1: ＋20℃
Temperature at step 2: minimum operating temperature
Temperature at step 3: ＋20℃ （Reference temperature）
Temperature at step 4: maximum operating temperature
Temperature at step 5: ＋20℃
Reference temperature for X7R, X5R, Y5U and Y5V shall be ＋25℃
High Capacitance Type BJ（X7R）：−55〜＋125℃, BJ（X5R）：−55〜＋85℃
E（Y5U）：−30〜＋85℃, F（Y5V）：−30〜＋85℃
High Capacitance Type BJ（X7R）：−55〜＋125℃, BJ（X5R）：−55〜＋85℃
E（Y5U）：−30〜＋85℃, F（Y5V）：−30〜＋85℃
＋22
−82
Warp: 1mm
Testing board: glass epoxyーresin substrate
Thickness: 1.6mm （063 TYPE : 0.8mm）
The measurement shall be made with board in the bent position.
Applied voltage: Rated voltage×3 （Class 1）
Rated voltage×2.5 （Class 2）
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max. （Class 1,2）
Applied voltage: Rated voltage
Duration: 60±5 sec.
Charge/discharge current: 50mA max.
Measuring frequency：
Class1： 1ＭHz±10%（C≦1000pF）
1ｋHz±10%（C＞1000pF）
Class2： 1ｋHz±10%（C≦10μF）
120Hz±10Hz（C＞10μF）
Measuring voltage：
Note 4 Class1：0.5〜5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
Class2： 1±0.2Vrms（C≦10μF）
0.5±0.1Vrms（C＞10μF）
Bias application: None
Multilayer:
Measuring frequency：
Class1： 1ＭHz±10%（C≦1000pF）
1ｋHz±10%（C＞1000pF）
Class2： 1ｋHz±10%（C≦10μF）
120Hz±10Hz（C＞10μF）
Measuring voltage：
Note 4     Class1：0.5〜5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
Class2： 1±0.2Vrms（C≦10μF）
0.5±0.1Vrms（C＞10μF）
Bias application: None
HighーFrequencyーMultilayer:
Measuring frequency: 1GHz
Measuring equipment: HP4291A
Measuring jig: HP16192A
CAPACITORS
4
105
△
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
RELIABILITY DATA 2/3
10.Body Strength
11.Adhesion of Electrode
12.Solderability
13.Resistance to soldering
14.Thermal shock
15.
Damp Heat （steady state）
No mechanical dam-
age.
Appearance: No ab-
normality
Capacitance change:
Within ±2.5%
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
（between terminals）:
No abnormality
Appearance: No ab-
normality
Capacitance change:
Within ±0.25pF
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
（between terminals）:
No abnormality
Appearance: No ab-
normality
Capacitance change:
Within ±0.5pF,
Insulation resistance:
1000 MΩ min.
Appearance: No abnormality
Capacitance change: Within ±7.5% （BJ）
Within ±20% （F）
tan δ: Initial value Note 4
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No
abnormality
Appearance: No abnormality
Capacitance change: Within ±7.5% （BJ）
Within ±20% （F）
tan δ: Initial value Note 4
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No
abnormality
Appearance: No ab-
normality
Capacitance change:
W i t h i n ±2.5% o r
±0.25pF, whichever is
larger.
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
（between terminals）:
No abnormality
Appearance: No ab-
normality
Capacitance change:
W i t h i n ±2.5% o r
±0.25pF, whichever is
larger.
Q: Initial value
Insulation resistance:
Initial value
Withstanding voltage
（between terminals）:
No abnormality
Appearance: No ab-
normality
Capacitance change:
Within ±5% or ±0.5pF,
whichever is larger.
Q:
C≧30 pF : Q≧350
10 ≦C＜30 p F : Q ≧
275 ＋ 2.5C
C＜10 pF : Q≧200
＋ 10C
C: Nominal capacitance
Insulation resistance:
1000 MΩ min.
No separation or indication of separation of electrode.
At least 95% of terminal electrode is covered by new solder.
Appearance: No ab-
normality
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
tan δ: BJ: 5.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
50
MΩμF or 1000 MΩ
whichever is smaller.
Note 5
Appearance: No ab-
normality
Capacitance change:
BJ:Within ±12.5%
Note 4
tan δ:
BJ: 5.0% max. Note 4.
F: 11.0% max.
Insulation resistance:
50 MΩμF or 1000 MΩ
whichever is smaller.
Note 5
High Frequency Multilayer:
Applied force: 5N
Duration: 10 sec.
Applied force: 5N
Duration: 30±5 sec.
Solder temperature: 230±5℃
Duration: 4±1 sec.
Preconditioning: Thermal treatment （at 150℃ for 1 hr）
（Applicable to Class 2.）
Solder temperature: 270±5℃
Duration: 3±0.5 sec.
Preheating conditions: 80 to 100℃, 2 to 5 min. or 5 to 10 min.
150 to 200℃, 2 to 5 min. or 5 to 10 min.
Recovery: Recovery for the following period under the
standard condition after the test.
6〜24 hrs （Class 1）
24±2 hrs （Class 2）
Preconditioning: Thermal treatment （at 150℃ for 1 hr）
（Applicable to Class 2.）
Conditions for 1 cycle:
Step 1: Minimum operating temperature ℃ 30±3 min.
Step 2: Room temperature 2 to 3 min.
Step 3: Maximum operating temperature ℃ 30±3 min.
Step 4: Room temperature 2 to 3 min.
Number of cycles: 5 times
Recovery after the test: 6〜24 hrs （Class 1）
24±2 hrs （Class 2）
Item Temperature Compensating （Class 1）
Standard
Test Methods and RemarksHigh Permittivity （Class 2）
High ValueStandard Note1High Frequency Type
Specified Value
A
A
A
（LW Reverse）
Multilayer：
Preconditioning: Thermal treatment （at 150℃ for 1 hr）
（Applicable to Class 2.）
Temperature: 40±2℃
Humidity: 90 to 95% RH
Duration: 500 hrs
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
6〜24 hrs （Class 1）
24±2 hrs （Class 2）
HighーFrequency Multilayer:
Temperature: 60±2℃
Humidity: 90 to 95% RH
Duration: 500 hrs
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
6〜24 hrs （Class 1）
Multilayer Ceramic Capacitor Chips
＋24
−
0
＋24
−
0
＋
0
−
3
−
0
＋
3
（01005, 0201, 0302 TYPE 2N）
CAPACITORS
4
107
△
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
RELIABILITY DATA 3/3
According to JIS C 5102 Clause 9. 9.
Multilayer:
Preconditioning: Voltage treatment （Class 2）
Temperature: 40±2℃
Humidity: 90 to 95% RH
Duration: 500 hrs
Applied voltage: Rated voltage
Charge and discharge current: 50mA max. （Class 1,2）
Recovery: Recovery for the following period under the standard
condition after the removal from test chamber.
6〜24 hrs （Class 1）
24±2 hrs （Class 2）
HighーFrequency Multilayer:
Temperature: 60±2℃
Humidity: 90 to 95% RH
Duration: 500 hrs
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.
Recovery: 6〜24 hrs of recovery under the standard
condition after the removal from test chamber.
According to JIS C 5102 clause 9.10.
Multilayer:
Preconditioning: Voltage treatment （Class 2）
Temperature:125±3℃（Class 1, Class 2: B, BJ（X7R））
85±2℃ （Class 2: BJ,F）
Duration: 1000 hrs
Applied voltage: Rated voltage×2 Note 6
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
   6〜24 hrs （Class 1）
    24±2 hrs （Class 2）
HighーFrequency Multilayer:
Temperature: 125±3℃ （Class 1）
Duration: 1000 hrs
Applied voltage: Rated voltage×2
Recovery: 6〜24 hrs of recovery under the standard
condition after the removal from test chamber.
16.Loading under Damp Heat
17.
Loading at High Tempera-
ture
Appearance: No ab-
normality
Capacitance change:
C≦2 pF: Within ±0.4 pF
C＞2 pF: Within ±0.75
pF
C： Nominal capaci-
tance
Insulation resistance:
500 MΩ min.
Appearance: No ab-
normality
Capacitance change:
Within ±3% or ±
0.3pF, whichever is
larger.
Insulation resistance:
1000 MΩ min.
Appearance: No ab-
normality
Capacitance change:
Within ±7.5% or ±
0.75pF, whichever is
larger.
Q: C≧30 pF: Q≧200
C＜30 pF: Q≧100 ＋
10C/3
C： Nominal capaci-
tance
Insulation resistance:
500 MΩ min.
Appearance: No ab-
normality
Capacitance change:
Within ±3% or
±0.3pF, whichever is
larger.
Q: C≧30 pF : Q≧350
10≦C＜30 pF: Q≧275
＋ 2.5C
C＜10 pF: Q≧200 ＋
10C
C： Nominal
capacitance
Insulation resistance:
1000 MΩ min.
Appearance: No ab-
normality
Capacitance change:
BJ：Within±12.5％
F：Within±30％
Note 4
tanδ：
BJ：5.0％max.
F：11％max.
Note 4
Insulation resistance:
25 MΩμF or 500 MΩ,
whichever is the smaller.
Note 5
Appearance: No abnormality
Capacitance change:
BJ：Within±12.5％
Within±20％※※
Within±25％※※
F：Within±30％
Note 4
tanδ：
BJ：5.0％max.
F：11％max. 
Note 4
Insulation resistance:
50 MΩμF or 1000 MΩ,
whichever is smaller.
Note 5
Appearance: No ab-
normality
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
Note 4
tan δ: BJ: 5.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
25 MΩμF or 500 MΩ,
whichever is the smaller.
Note 5
Appearance: No ab-
normality
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
Note 4
tan δ:
BJ: 4.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
50 MΩμF or 1000 MΩ,
whichever is smaller.
Note 5
Item Temperature Compensating （Class 1）
Standard
Specified Value
Test Methods and RemarksHigh Permittivity （Class 2）
High ValueStandard Note1High Frequency Type
＋24
−
0
＋24
−
0
＋48
−
0
＋48
−
0
Multilayer Ceramic Capacitor Chips
Note 1 :For 105 type, specified in "High value".
Note 2 :Thermal treatment （Multilayer）: 1 hr of thermal treatment at 150 ＋0 /−10 ℃ followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement.
Note 3 :
Voltage treatment （Multilayer）: 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement.
Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications.
Note 6 :Some of the parts are applicable in rated voltage×1.5. Please refer to individual specifications.
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative
humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
PRECAUTIONS
CAPACITORS
4
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1/6
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
1.Circuit Design Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear
reactors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
used in such equipment may require higher safety and/or
reliability considerations and should be clearly differentiated
from components used in general purpose applications.
Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the
two peak voltages should be lower than the rated value of
the capacitor chosen. For a circuit where both an AC and a
pulse voltage may be present, the sum of their peak voltages
should also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time
is present in the circuit.
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.（larger fillets which extend above the component
end terminations）
Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip capacitor land patterns for PCBs
2.PCB Design Pattern configurations
（Design of Land-patterns）
1. When capacitors are mounted on a PCB, the amount of
solder used （size of fillet） can directly affect capacitor per-
formance. Therefore, the following items must be carefully
considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropri-
ate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
（2） When more than one part is jointly soldered onto the
same land or pad, the pad must be designed so that each
component's soldering point is separated by solder-resist.
Recommended land dimensions for wave-soldering （unit: mm）
Recommended land dimensions for reflow-soldering （unit: mm）
Type 107 212 316 325
1.6 2.0 3.2 3.2
0.8 51.25 1.6 2.5
A 0.8〜1.0 1.0〜1.4 1.8〜2.5 1.8〜2.5
B 0.5〜0.8 0.8〜1.5 0.8〜1.7 0.8〜1.7
C 0.6〜0.8 0.9〜1.2 1.2〜1.6 1.8〜2.5
L
W
Excess solder can affect the ability of chips to withstand mechanical stresses. There-
fore, please take proper precautions when designing land-patterns.
L
W
Size
L
W
Type
212（2 circuits）
110（2 circuits）
096（2 circuits）
2.0 1.37 0.9
1.25 1.0 0.6
a 0.5〜0.6 0.35〜0.45 0.25〜0.35
b 0.5〜0.6 0.55〜0.65 0.15〜0.25
c 0.5〜0.6 0.3〜0.4 0.15〜0.25
d 1.0 0.64 0.45
Type 042 063 105 107 212 316 325 432
0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15〜0.25 0.20〜0.30
0.45〜0.55
0.8〜1.0 0.8〜1.2 1.8〜2.5 1.8〜2.5 2.5〜3.5
B
0.10〜0.20 0.20〜0.30
0.40〜0.50
0.6〜0.8 0.8〜1.2 1.0〜1.5 1.0〜1.5 1.5〜1.8
C
0.15〜0.30 0.25〜0.40
0.45〜0.55
0.6〜0.8 0.9〜1.6 1.2〜2.0 1.8〜3.2 2.3〜3.5
Size
L
W
Type
212（4 circuits）
2.0
1.25
a 0.5〜0.6
b 0.5〜0.6
c 0.2〜0.3
d 0.5
Size
Size
PRECAUTIONS
CAPACITORS
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Size
2/6
（2） Examples of good and bad solder application2.PCB Design
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should
be located to minimize any possible mechanical stresses from board warp or deflection.
Not recommended Recommended
Deflection of
the board
Pattern configurations
（Capacitor layout on panelized [breakaway] PC boards）
1. After capacitors have been mounted on the boards, chips
can be subjected to mechanical stresses in subsequent
manufacturing processes （PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave
soldering the reflow soldered boards etc.） For this reason,
planning pattern configurations and the position of SMD ca-
pacitors should be carefully performed to minimize stress.
Items
Component
placement close
to the chassis
Not recommended Recommended
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the
amount of mechanical stresses given will vary depending on capacitor layout. The
example below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress
on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving,
and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB
splitting procedure.
Technical considerationsStages Precautions
Mixed mounting
of SMD and
leaded compo-
nents
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
LWDC Recommended land dimensions for reflow-soldering
（unit: mm）
L
W
Type 105 107 212
0.52 50.8 1.25
1.0 1.6 2.0
A
0.18〜0.22
0.25〜0.3 0.5〜0.7
B 0.2〜0.25 0.3〜0.4 0.4〜0.5
C 0.9〜1.1 1.5〜1.7 1.9〜2.1
PRECAUTIONS
CAPACITORS
4
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3/6
3.Considerations for auto-
matic placement
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the ca-
pacitors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
Technical considerationsStages Precautions
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
（1）The lower limit of the pick-up nozzle should be adjusted to the surface level of the
PC board after correcting for deflection of the board.
（2）The pick-up pressure should be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up
nozzle, supporting pins or back-up pins should be used under the PC board. The fol-
lowing diagrams show some typical examples of good pick-up nozzle placement:
Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
1. Some adhesives may cause reduced insulation resistance. The difference between
the shrinkage percentage of the adhesive and that of the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much
adhesive applied to the board may adversely affect component placement, so the fol-
lowing precautions should be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mount-
ing & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2）The recommended amount of adhesives is as follows;
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 〜120 μm
c Adhesives should not contact the pad
Selection of Adhesives
1. Mounting capacitors with adhesives in preliminary assembly,
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period.
Therefore, it is imperative to consult the manufacturer of the
adhesives on proper usage and amounts of adhesive to use.
Precautions on the use of Multilayer Ceramic Capacitors
PRECAUTIONS
CAPACITORS
4
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4/6
4. Soldering Selection of Flux
1. Since flux may have a significant effect on the performance
of capacitors, it is necessary to verify the following condi-
tions prior to use;
（1）Flux used should be with less than or equal to 0.1 wt%
（equivelent to chroline） of halogenated content. Flux
having a strong acidity content should not be applied.
（2）When soldering capacitors on the board, the amount of
flux applied should be controlled at the optimum level.
（3）When using water-soluble flux, special care should be
taken to properly clean the boards.
Soldering
Temperature, time, amount of solder, etc. are specified in ac-
cordance with the following recommended conditions.
Sn-Zn solder paste can affect MLCC reliability performance.
Please contact us prior to usage.
1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate
the flux, or highly acidic flux is used, an excessive amount of residue after soldering
may lead to corrosion of the terminal electrodes or degradation of insulation resis-
tance on the surface of the capacitors.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a
large amount of flux gas may be emitted and may detrimentally affect solderability. To
minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the
air, the residue on the surface of capacitors in high humidity conditions may cause a
degradation of insulation resistance and therefore affect the reliability of the compo-
nents. The cleaning methods and the capability of the machines used should also be
considered carefully when selecting water-soluble flux.
1-1. Preheating when soldering
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
Cooling: The temperature difference between the components and cleaning process
should not be greater than 100℃.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-
trated heating or rapid cooling. Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
Recommended conditions for soldering
[Reflow soldering]
Temperature profile
2. Because excessive dwell times can detrimentally affect solderability, soldering du-
ration should be kept as close to recommended times as possible.
[Wave soldering]
Temperature profile
Caution
1. The ideal condition is to have solder mass （fillet） controlled to 1/2 to 1/3 of the
thickness of the capacitor, as shown below:
Capacitor
PC board
Solder
Caution
1. Make sure the capacitors are preheated sufficiently.
2. The temperature difference between the capacitor and melted solder should not be
greater than 100 to 130℃
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the capacitors designated as for reflow sol-
dering only.
ピーク260℃以下
10秒迄
ピーク260℃以下
10秒迄
予熱150℃
60秒以上
350℃以下
3秒迄
120秒以上
60秒以上
予熱150℃
本加熱230℃以上
40秒迄
※チップ
とはんだ温度との差が100〜１３０℃以下になるよ
 うに十分予熱を行ってください。
※回数は２
回迄の保証となります。
※チップとはんだ温度との差が１００〜１３０℃以下になるよ
 うに十分予熱を行ってください。
※回数は１
回迄の保証となります。
※リフロー仕様アイテムは除きます。
（※⊿Ｔ≦190℃（3216タ
イプ以下）、⊿Ｔ≦130℃（3225以上）。）
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
  常にこれを推奨するものではございません。
温度（℃）
300
200
100
0
温度（℃）
300
200
100
0
温度（℃）
400
300
200
100
0
徐冷
徐冷
徐冷
Peak 260℃ max
10 sec max
Peak 260℃ max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
（※⊿Ｔ
≦190℃ （3216Type max）, ⊿Ｔ≦130℃ （3225
Type min））
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature（℃）
300
200
100
0
Temperature（℃）
300
200
100
0
Temperature（℃）
400
300
200
100
0
Preheating
150℃
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230℃
40 sec max
Preheating
150℃
120 sec min
350℃ max
3 sec max
60 sec min
⊿Ｔ
⊿Ｔ
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
ピーク260℃以下
10秒迄
ピーク260℃以下
10秒迄
予熱150℃
60秒以上
350℃以下
3秒迄
120秒以上
60秒以上
予熱150℃
本加熱230℃以上
40秒迄
※チップ
とはんだ温度との差が100〜１３０℃以下になるよ
 うに十分予熱を行ってください。
※回数は２
回迄の保証となります。
※チップとはんだ温度との差が１００〜１３０℃以下になるよ
 うに十分予熱を行ってください。
※回数は１
回迄の保証となります。
※リフロー仕様アイテムは除きます。
（※⊿Ｔ≦190℃（3216タ
イプ以下）、⊿Ｔ≦130℃（3225以上）。）
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
  常にこれを推奨するものではございません。
温度（℃）
300
200
100
0
温度（℃）
300
200
100
0
温度（℃）
400
300
200
100
0
徐冷
徐冷
徐冷
Peak 260℃ max
10 sec max
Peak 260℃ max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
（※⊿Ｔ
≦190℃ （3216Type max）, ⊿Ｔ≦130℃ （3225
Type min））
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature（℃）
300
200
100
0
Temperature（℃）
300
200
100
0
Temperature（℃）
400
300
200
100
0
Preheating
150℃
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230℃
40 sec max
Preheating
150℃
120 sec min
350℃ max
3 sec max
60 sec min
⊿Ｔ
⊿Ｔ
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
PRECAUTIONS
CAPACITORS
4
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5/6
[Hand soldering]
 Temperature profile
5.Cleaning Cleaning conditions
1. When cleaning the PC board after the capacitors are all
mounted, select the appropriate cleaning solution according
to the type of flux used and purpose of the cleaning （e.g.
to remove soldering flux or other materials from the produc-
tion process.）
2. Cleaning conditions should be determined after verifying,
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
1. The use of inappropriate solutions can cause foreign substances such as flux residue
to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a
degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions （insufficient or excessive cleaning） may detrimen-
tally affect the performance of the capacitors.
（1）Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause excessive vibra-
tion of the PC board which may lead to the cracking of the capacitor or the soldered
portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output Below 20 W/ℓ
Ultrasonic frequency Below 40 kHz
Ultrasonic washing period 5 min. or less
4. Soldering
6.Post cleaning processes 1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the hard-
ening period or while left under normal storage conditions
resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recom-
mended.
Breakaway PC boards （splitting along perforations）
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by us-
ing the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive me-
chanical shocks.
（1）If ceramic capacitors are dropped onto the floor or a
hard surface, they should not be used.
（2）When handling the mounted boards, be careful that the
mounted components do not come in contact with or
bump against other boards or components.
7.Handling
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
ピーク260℃以下
10秒迄
ピーク260℃以下
10秒迄
予熱150℃
60秒以上
350℃以下
3秒迄
120秒以上
60秒以上
予熱150℃
本加熱230℃以上
40秒迄
※チップ
とはんだ温度との差が100〜１３０℃以下になるよ
 うに十分予熱を行ってください。
※回数は２
回迄の保証となります。
※チップとはんだ温度との差が１００〜１３０℃以下になるよ
 うに十分予熱を行ってください。
※回数は１
回迄の保証となります。
※リフロー仕様アイテムは除きます。
（※⊿Ｔ≦190℃（3216タ
イプ以下）、⊿Ｔ≦130℃（3225以上）。）
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
  常にこれを推奨するものではございません。
温度（℃）
300
200
100
0
温度（℃）
300
200
100
0
温度（℃）
400
300
200
100
0
徐冷
徐冷
徐冷
Peak 260℃ max
10 sec max
Peak 260℃ max
10 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
（※⊿Ｔ
≦190℃ （3216Type max）, ⊿Ｔ≦130℃ （3225
Type min））
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature（℃）
300
200
100
0
Temperature（℃）
300
200
100
0
Temperature（℃）
400
300
200
100
0
Preheating
150℃
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230℃
40 sec max
Preheating
150℃
120 sec min
350℃ max
3 sec max
60 sec min
⊿Ｔ
⊿Ｔ
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
PRECAUTIONS
CAPACITORS
4
119
△
！当社カタログをご使用の際には「当社製品に関するお断り」を必ずお読みください。△
！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
6/6
8.Storage conditions Storage
1. To maintain the solderability of terminal electrodes and to
keep the packaging material in good condition, care must
be taken to control temperature and humidity in the storage
area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature Below 30℃
Humidity Below 70% RH
The ambient temperature must be kept below 40℃. Even
under ideal storage conditions capacitor electrode solder-
ability decreases as time passes, so should be used within
6 months from the time of delivery.
・Ceramic chip capacitors should be kept where no chlorine or
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
（type 2 &3） will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150℃ for 1hour will return the capacitance to its initial level.
1. If the parts are stored in a high temperature and humidity environment, problems
such as reduced solderability caused by oxidation of terminal electrodes and dete-
rioration of taping/packaging materials may take place. For this reason, components
should be used within 6 months from the time of delivery. If exceeding the above
period, please check solderability before using the capacitors.
Technical considerationsStages Precautions
Precautions on the use of Multilayer Ceramic Capacitors