RT9166/A
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DS9166/A-18 June 2007 www.richtek.com
Pin Configurations
300/600mA, Ultra-Fast Transient Response LDO Regulator
Ordering Information
Marking Information
For marking information, contact our sales representative
directly or through a RichTek distributor located in your
area, otherwise visit our website for detail.
General Description
The RT9166/A series are CMOS low dropout regulators
optimized for ultra-fast transient response. The devices are
capable of supplying 300mA or 600mA of output current
with a dropout voltage of 230mV or 580mV respectively.
The RT9166/A series are is optimized for CD/DVD-ROM,
CD/RW or wireless communication supply applications.
The RT9166/A regulators are stable with output capacitors
as low as 1μF. The other features include ultra low dropout
voltage, high output accuracy, current limiting protection,
and high ripple rejection ratio.
The devices are available in fixed output voltages range of
1.2V to 4.5V with 0.1V per step. The RT9166/A regulators
are available in 3-lead SOT-23, SOT-89, SOT-223, TO-92
and TO-252 packages.
Features
zz
zz
zLow Quie scent Current (Typically 220μμ
μμ
μA)
zz
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zGuaranteed 300/600mA Output Current
zz
zz
zLow Dropout Voltage : 230/580mV at 300/600mA
zz
zz
zWide Operating Voltage Ranges : 3V to 5.5V
zz
zz
zUltra-Fast T ransient Response
zz
zz
zTight Load and Line Regulation
zz
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zCurrent Limiting Protection
zz
zz
zThermal Shutdown Protection
zz
zz
zOnly Low-ESR Ceramic Capacitor Required for
Stability
zz
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zCustom Voltage Available
zz
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zRoHS Compliant and 100% Lead (Pb)-Free
Applications
zCD/DVD-ROM, CD/RW
zWireless LAN Card/Keyboard/Mouse
zBattery-Powered Equipment
zXDSL Router
zPCMCIA Card
(TOP VIEW)
1
2
3
VIN
GND
VOUT
TO-92
(RT9166/A)
12
3
GND VOUT
VIN
SOT-23-3 (L-Type)
(RT9166)
Note :
RichTek Pb-free and Green products are :
`RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
`Suitable for use in SnPb or Pb-free soldering processes.
`100%matte tin (Sn) plating.
RT9166/A-
Package Type
VL : SOT-23-3 (L-Type)
X : SOT-89
XL : SOT-89 (L-Type)
G : SOT-223
GL : SOT-223 (L-Type)
Z : TO-92
L : TO-252
Operating Temperature Range
P : Pb Free with Commercial Standard
G : Green (Halogen Free with Commer-
cial Standard)
Output Voltage
12 : 1.2V
13 : 1.3V
:
45 : 4.5V
1B : 1.25V
600mA Output Current
300mA Output Current
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DS9166/A-18 June 2007www.richtek.com
Typical Application Circuit
Functional Pin Description
Function Block Diagram
Note: To prevent oscillation, a 1μμ
μμ
μF minimum X7R or X5R dielectric is strongly recommended if ceramics are
used as input/output capacitors. When using the Y5V dielectric, the minimum value of the input/output
capacitance that can be used for stable over full operating temperature range is 3.3μμ
μμ
μF. (see Application
Information Section for further details)
Pin Name Pin Function
VIN Supply Input
VOUT Regulator Output
GND Common Ground
VIN
GND
VOUT
RT9166/A
COUT
1uF
CIN
1uF
VIN VOUT
Current
Limiting
Sensor
Thermal
Shutdown
+
-
Error
Amplifier
1.2V
Reference
VIN
GND
VOUT
SOT-223
123
GND
(TAB)
VINVOUT
123
GND
(TAB)
VIN
VOUT
SOT-89 SOT-89 (L-Type)
123
GND VIN
(TAB)
VOUT
231
GND
VIN
VOUT
TO-252
SOT-223 (L-Type)
123
GND VIN
(TAB)
VOUT
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DS9166/A-18 June 2007 www.richtek.com
Absolute Maximum Ratings (Note 1)
zSupply Input Voltage -------------------------------------------------------------------------------------------------- 6.5V
zPower Dissipation, PD @ TA = 25°C
SOT-23-3 ---------------------------------------------------------------------------------------------------------------- 0.4W
SOT-89 ------------------------------------------------------------------------------------------------------------------- 0.571W
SOT-223 ----------------------------------------------------------------------------------------------------------------- 0.740W
TO-252 ------------------------------------------------------------------------------------------------------------------- 1.470W
zPackage Thermal Resistance (Note 4)
SOT-23-3, θJA ----------------------------------------------------------------------------------------------------------- 250°C/W
SOT-89, θJA ------------------------------------------------------------------------------------------------------------- 175°C/W
SOT-89, θJC ------------------------------------------------------------------------------------------------------------- 58°C/W
SOT-223, θJA ------------------------------------------------------------------------------------------------------------ 135°C/W
SOT-223, θJC ----------------------------------------------------------------------------------------------------------- 15°C/W
TO-252, θJA ------------------------------------------------------------------------------------------------------------- 68°C/W
TO-252, θJC ------------------------------------------------------------------------------------------------------------- 7°C/W
zLead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260°C
zJunction Temperature ------------------------------------------------------------------------------------------------- 150°C
zStorage Temperature Range ---------------------------------------------------------------------------------------- – 65°C to 150°C
zESD Susceptibility (Note 2)
HBM (Human Body Mode) ------------------------------------------------------------------------------------------ 2kV
MM (Machine Mode) -------------------------------------------------------------------------------------------------- 200V
Electrical Characteristics
Recommended Operating Conditions (Note 3)
zSupply Input Voltage -------------------------------------------------------------------------------------------------- 2.8V to 5.5V
zJunction Temperature Range ---------------------------------------------------------------------------------------- – 40°C to 125°C
zAmbient Temperature Range ---------------------------------------------------------------------------------------- – 40°C to 85°C
(VIN = VOUT + 1V or VIN = 2.8V whichever is greater, CIN = 1μF, C OUT = 1μF, T A = 25° C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
Output Voltage Accuracy ΔVOUT IOUT = 1mA −1 -- +3 %
RT9166 300 -- --
Current Limit RT9166A
ILIM RLOAD = 1Ω 600 -- --
mA
Quiescent Current (Note 6) IQ I
OUT = 0mA -- 220 300 μA
RT9166 IOUT = 300mA -- 230 --
Dropout Voltage
(Note 7) RT9166A VDROP IOUT = 600mA -- 580 -- mV
Line Regulation ΔVLINE
VIN = (VOUT + 0.3V) to 5.5V,
IOUT = 1mA -- 0.2 -- %/V
RT9166 1mA < IOUT < 300mA -- 15 35
Load Regulation
(Note 5) RT9166A ΔVLOAD 1mA < IOUT < 600mA -- 30 55
mV
Power Supply Rejection Rate PSRR f = 1kHz, COUT = 1μF -- −55 -- dB
Thermal Shutdown Temperature TSD -- 170 --
°C
Thermal Shutdown Hysteresis ΔTSD -- 40 --
°C
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Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA is measured in the natural convection at TA = 25°C on a single layer low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 5. Regulation is measured at constant junction temperature by using a 20ms current pulse. Devices are tested for load
regulation in the load range from 1mA to 300mA and 600mA respectively.
Note 6. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under
no load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground
pin current.
Note 7.The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
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Typical Operating Characteristics
Output Noise
Output Noise Signal (μV)
Time (1ms/DIV)
400
200
0
-200
-400
VIN = 5V
CIN = 1uF
ILOAD = 100mA
COUT = 1uF
f = 10Hz to
Current Limit vs. Input voltage
700
750
800
850
900
33.544.555.5
Input voltage (V)
Current Limit (mA)
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5ΩRT9166-33CX
Current Limit vs. Input voltage
700
750
800
850
900
3 3.5 4 4.5 5 5.5
Input voltage (V)
Current Limit (mA)
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5ΩRT9166-33CVL
Power Supply Rejec tion Ratio
-60
-50
-40
-30
-20
-10
0
Frequency (Hz)
PSRR (dB)
VIN = 5V
CIN = 1uF
COUT = 1uF
100mA
1mA
10 100 1k 10k 100k 1M
Dropout Voltage vs. Loa d Current
0
100
200
300
400
500
600
700
0 100 200 300 400 500 600
Load Current (mA)
Dropout Voltage (mV)
CIN = 1uF
COUT = 1uF TJ = 125°C
TJ = 25°C
TJ = −40°C
Region of Stable COUT ESR vs. Load Current
0.00
0.01
0.10
1.00
10.00
100.00
0 100 200 300 400 500 600
Load Current (mA)
COUT ESR (Ω)
Instable
Instable
Stable
COUT = 1uF to 4.7uF
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Current Limit vs. Temp erature
700
750
800
850
900
-50 -25 0 25 50 75 100 125
Temperature
Current Limit (mA)
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5ΩRT9166-33CX
(°C)
-40
Current Limit vs. Temp erature
700
750
800
850
900
-50 -25 0 25 50 75 100 125
Temperature
Current Limit (mA)
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5ΩRT9166-33CVL
(°C)
-40
Quiescent Current vs. Temperature
140
160
180
200
220
240
260
-50-25 0 25 50 75100125
Temperature
Quiescent Current (uA) 1
VIN = 5V
CIN = 1uF
COUT = 1uF RT9166-33CX
(°C)
-40
Temperature Stability
3.2
3.25
3.3
3.35
3.4
-50 -25 0 25 50 75 100 125
Temperature
Output Voltage (V)
VIN = 5V
CIN = 1uF
COUT = 1uF RT9166-33CX
(°C)
-40
Quiescent Current vs. Temperature
140
160
180
200
220
240
260
-50 -25 0 25 50 75 100 125
Temperature
Quiescent Current (uA) 1
RT9166-33CVL
VIN = 5V
CIN = 1uF
COUT = 1uF
(°C)
-40
Temperature Stability
3.2
3.25
3.3
3.35
3.4
-50 -25 0 25 50 75 100 125
Temperature
Output Voltage (V)
RT9166-33CVL
VIN = 5V
CIN = 1uF
COUT = 1uF
(°C)
-40
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Load Transient Response
Time (100us/Div)
Load
Current (mA)
200
100
0
Output Voltage
Deviation (mV)
20
0
-20
RT9166-33CX
VIN = 5V, ILOAD = 1 to 150mA
CIN = COUT = 1uF (Ceramic, X7R)
Load Transient Response
Time (100us/Div)
Load
Current (mA)
200
100
0
Output Voltage
Deviation (mV)
20
0
-20 RT9166-33CVL
VIN = 5V, ILOAD = 1 to 150mA
CIN = COUT = 1uF (Ceramic, X7R)
Line Transient Response
Time (100us/Div)
Output Voltage
Deviation (mV)
20
0
-20
Input Voltage
Deviation (V)
5
4
VIN = 4 to 5V
CIN = 1uF
COUT = 1uF
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Application Information
Like any low-dropout regulator, the RT9166/A series
requires input and output decoupling capacitors. These
capacitors must be correctly selected for good performance
(see Capacitor Characteristics Section). Please note that
linear regulators with a low dropout voltage have high
internal loop gains which require care in guarding against
oscillation caused by insufficient decoupling capacitance.
Input Capacitor
An input capacitance of ≅ 1μF is required between the
device input pin and ground directly (the amount of the
capacitance may be increased without limit). The input
capacitor MUST be located less than 1 cm from the device
to assure input stability (see PCB Layout Section). A lower
ESR capacitor allows the use of less capacitance, while
higher ESR type (like aluminum electrolytic) require more
capacitance.
Capacitor types (aluminum, ceramic and tantalum) can be
mixed in parallel, but the total equivalent input capacitance/
ESR must be defined as above to stable operation.
There are no requirements for the ESR on the input
capacitor, but tolerance and temperature coefficient must
be considered when selecting the capacitor to ensure the
capacitance will be ≅ 1μF over the entire operating
temperature range.
Output Ca pa citor
The RT9166/A is designed specifically to work with very
small ceramic output capacitors. The recommended
minimum capacitance (temperature characteristics X7R or
X5R) is 1μF to 4.7μF range with 10mΩ to 50mΩ range
ceramic capacitor between LDO output and GND for
transient stability, but it may be increased without limit.
Higher capacitance values help to improve transient. The
output capacitor's ESR is critical because it forms a zero
to provide phase lead which is required for loop stability.
(When using the Y5V dielectric, the minimum value of the
input/output capacitance that can be used for stable over
full operating temperature range is 3.3μF.)
No Load Stability
The device will remain stable and in regulation with no
external load. This is specially important in CMOS RAM
keep-alive applications.
Input-Output (Dropout) Voltage
A regulator's minimum input-to-output voltage differential
(dropout voltage) determines the lowest usable supply
voltage. In battery-powered systems, this determines the
useful end-of-life battery voltage. Because the device uses
a PMOS, its dropout voltage is a function of drain-to-source
on-resistance, RDS(ON), multiplied by the load current :
VDROPOUT = VIN - VOUT = RDS(ON) x IOUT
Current Limit
The RT9166/A monitors and controls the PMOS' gate
voltage, minimum limiting the output current to 300mA for
RT9166 and 600mA for RT9166A. The output can be
shorted to ground for an indefinite period of time without
damaging the part.
Short-Circuit Protection
The device is short circuit protected and in the event of a
peak over-current condition, the short-circuit control loop
will rapidly drive the output PMOS pass element off. Once
the power pass element shuts down, the control loop will
rapidly cycle the output on and off until the average power
dissipation causes the thermal shutdown circuit to respond
to servo the on/off cycling to a lower frequency. Please
refer to the section on thermal information for power
dissipation calculations.
Ca pacitor Chara cteristics
It is important to note that capacitance tolerance and
variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required
amount of capacitance is provided over the full operating
temperature range. In general, a good tantalum capacitor
will show very little capacitance variation with temperature,
but a ceramic may not be as good (depending on dielectric
type).
Aluminum electrolytics also typically have large
temperature variation of capacitance value.
Equally important to consider is a capacitor's ESR change
with temperature: this is not an issue with ceramics, as
their ESR is extremely low. However, it is very important in
Tantalum and aluminum electrolytic capacitors. Both show
increasing ESR at colder temperatures, but the increase
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Ceramic :
For values of capacitance in the 10μF to 100μF range,
ceramics are usually larger and more costly than tantalums
but give superior AC performance for by-passing high
frequency noise because of very low ESR (typically less
than 10mΩ). However, some dielectric types do not have
good capacitance characteristics as a function of voltage
and temperature.
Z5U and Y5V dielectric ceramics have capacitance that
drops severely with applied voltage. A typical Z5U or Y5V
capacitor can lose 60% of its rated capacitance with half of
the rated voltage applied to it. The Z5U and Y5V also exhibit
a severe temperature effect, losing more than 50% of
nominal capacitance at high and low limits of the
temperature range.
X7R and X5R dielectric ceramic capacitors are strongly
recommended if ceramics are used, as they typically
maintain a capacitance range within ±20% of nominal over
full operating ratings of temperature and voltage. Of course,
they are typically larger and more costly than Z5U/Y5U
types for a given voltage and capacitance.
Tantalum :
Solid tantalum capacitors are recommended for use on
the output because their typical ESR is very close to the
ideal value required for loop compensation. They also work
well as input capacitors if selected to meet the ESR
requirements previously listed.
Tantalums also have good temperature stability: a good
quality tantalum will typically show a capacitance value
that varies less than 10~15% across the full temperature
range of 125°C to -40°C. ESR will vary only about 2X going
from the high to low temperature limits.
The increasing ESR at lower temperatures can cause
oscillations when marginal quality capacitors are used (if
the ESR of the capacitor is near the upper limit of the
stability range at room temperature).
Aluminum :
This capacitor type offers the most capacitance for the
money. The disadvantages are that they are larger in
physical size, not widely available in surface mount, and
have poor AC performance (especially at higher
frequencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic is
higher than either Tantalum or ceramic, and it also varies
greatly with temperature. A typical aluminum electrolytic
can exhibit an ESR increase of as much as 50X when going
from 25°C down to -40°C.
It should also be noted that many aluminum electrolytics
only specify impedance at a frequency of 120Hz, which
indicates they have poor high frequency performance. Only
aluminum electrolytics that have an impedance specified
at a higher frequency (between 20kHz and 100kHz) should
be used for the device. Derating must be applied to the
manufacturer's ESR specification, since it is typically only
valid at room temperature.
Any applications using aluminum electrolytics should be
thoroughly tested at the lowest ambient operating
temperature where ESR is maximum.
Thermal Considerations
Thermal protection limits power dissipation in RT9166/A.
When the operation junction temperature exceeds 170°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 40°C.
For continuous operation, do not exceed absolute
maximum operation junction temperature. The power
dissipation definition in device is :
PD = (VIN - VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD (MAX) = ( TJ(MAX) - TA ) / θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
in aluminum electrolytic capacitors is so severe they may
not be feasible for some applications.
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PCB Layout
Good board layout practices must be used or instability
can be induced because of ground loops and voltage drops.
The input and output capacitors MUST be directly
connected to the input, output, and ground pins of the
device using traces which have no other currents flowing
through them.
The best way to do this is to layout CIN and COUT near the
device with short traces to the VIN, VOUT, and ground pins.
The regulator ground pin should be connected to the
external circuit ground so that the regulator and its
capacitors have a “single point ground”.
It should be noted that stability problems have been seen
in applications where “vias” to an internal ground plane
were used at the ground points of the device and the input
and output capacitors. This was caused by varying ground
potentials at these nodes resulting from current flowing
through the ground plane. Using a single point ground
technique for the regulator and it’ s capacitors fixed the
problem. Since high current flows through the traces going
into VIN and coming from VOUT, Kelvin connect the capacitor
leads to these pins so there is no voltage drop in series
with the input and output capacitors.
Optimum performance can only be achieved when the
device is mounted on a PC board according to the diagram
below :
For recommended operating conditions specification of
RT9166/A, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the operated
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-23-3
packages, the thermal resistance θJA is 250°C/W on the
standard JEDEC 51-3 single-layer thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by following formula :
PD (MAX) = ( 125°C − 25°C) / 250°C/W = 0.400W for
SOT-23-3 packages
PD (MAX) = ( 125°C − 25°C) / 175°C/W = 0.571W for
SOT-89 packages
PD (MAX) = ( 125°C − 25°C) / 135°C/W = 0.740W for
SOT-223 packages
PD (MAX) = ( 125°C − 25°C) / 68°C/W = 1.470W for
TO-252 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9166/A packages, Figure 1 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power allowed.
Figure 1. Derating Curves for RT9166/A Packages Figure 2. SOT-23-3 Board Layout
VIN
GND
VOUT
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
0 25 50 75 100 125
Ambient Temperature (°C)
Maximum Power Dissipation (mW)
SOT-223
SOT-89
SOT-23-3
Single Layer PCB
TO-252
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Outline Dimension
A
bA1
B
D
C
e
H
L
SOT-23-3 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.889 1.295 0.035 0.051
A1 0.000 0.152 0.000 0.006
B 1.397 1.803 0.055 0.071
b 0.356 0.508 0.014 0.020
C 2.591 2.997 0.102 0.118
D 2.692 3.099 0.106 0.122
e 1.803 2.007 0.071 0.079
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
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b
b1
b
H
A
B
D
C
e
e
C1
D1
A
3-Lead SOT-89 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 1.397 1.600 0.055 0.063
b 0.356 0.483 0.014 0.019
B 2.388 2.591 0.094 0.102
b1 0.406 0.533 0.016 0.021
C 3.937 4.242 0.155 0.167
C1 0.787 1.194 0.031 0.047
D 4.394 4.597 0.173 0.181
D1 1.397 1.753 0.055 0.069
e 1.448 1.549 0.057 0.061
H 0.356 0.432 0.014 0.017
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Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 1.450 1.803 0.057 0.071
A1 0.020 0.100
0.0008 0.0047
b 0.610 0.787 0.024 0.031
B 3.302 3.708 0.130 0.146
C 6.706 7.290 0.264 0.287
D 6.299 6.706 0.248 0.264
D1 2.896 3.150 0.114 0.124
e 2.261 2.362 0.089 0.093
H 0.229 0.330 0.009 0.013
L 1.550 1.950 0.061 0.077
L1 0.800 1.100 0.009 0.013
3-Lead SOT-223 Surface Mount Package
AA1
b
H
B
D
D1
C
L
e e
L1
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Dimensions In Millimeters Dimensions In In ches
Symbol Min Max Min Max
A 2.184 2.388 0.086 0.094
B 0.889 2.032 0.035 0.080
b 0.508 0.889 0.020 0.035
b1 1.016 Ref. 0.040 Ref.
b2 0.457 0.584 0.018 0.023
C 0.457 0.584 0.018 0.023
D 6.350 6.731 0.250 0.265
D1 5.207 5.461 0.205 0.215
E 5.334 6.223 0.210 0.245
e 2.108 2.438 0.083 0.096
L1 9.398 10.414 0.370 0.410
L2 0.508 Ref. 0.020 Ref.
L3 0.635 1.016 0.025 0.040
U 3.810 Ref. 0.150 Ref.
V 3.048 Ref. 0.120 Ref.
R 0.200 0.850 0.008 0.033
S 2.500 3.400 0.098 0.134
T 0.500 0.850 0.020 0.033
3-Lead TO-252 Surface Mount Package
A
C
b2
b
b1
D
B
E
L3
e
L1
L2
V
U
D1
S
T
R
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Richtek Technology Corporation
Headquarter
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Richtek Technology Corporation
Taipei Office (Marketing)
8F, No. 137, Lane 235, Paochiao Road, Hsintien City
Taipei County, Taiwan, R.O.C.
Tel: (8862)89191466 Fax: (8862)89191465
Email: marketing@richtek.com
DA
C
b
E
L
e
D1 A1
3-Lead TO-92 Plastic Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 3.175 4.191 0.125 0.165
A1 1.143 1.372 0.045 0.054
b 0.406 0.533 0.016 0.021
C 0.406 0.533 0.016 0.021
D 4.445 5.207 0.175 0.205
D1 3.429 5.029
0.135 0.198
E 4.318 5.334 0.170 0.210
e 1.143 1.397 0.045 0.055
L 12.700 0.500
