16-916/Y2C-FQ1R2B/3C - EVERLIGHT ELECTRONICS

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Technical Data Sheet

Chip LED with Right Angle Lens

16-916/Y2C-FQ1R2B/3C

Features

․Package in 8mm tape on 7〞diameter reel.

․Compatible with automatic placement equipment.

․Compatible with infrared and vapor phase reflow

solder process.

․Mono-color type.

․Pb-free.

․The product itself will remain within RoHS

compliant version.

Descriptions

․The 16-916 SMD LED is much smaller than lead

frame type components, thus enable smaller board

size, higher packing density, reduced storage space

and finally smaller equipment to be obtained.

․Besides, lightweight makes them ideal for

miniature applications. etc.

Applications

․Telecommunication: indicator and backlighting in

telephone and fax.

․Flat backlight for LCD, switch and symbol.

․General use.

Device Selection Guide

Chip

Part No.

Material Emitted Color

Resin Color

16-916/Y2C-FQ1R2B/3C AlGaInP Brilliant Yellow Water Clear

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Package Outline Dimensions

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Rating Unit

Reverse Voltage VR5 V

Forward Current IF25 mA

Peak Forward Current

(Duty 1/10 @1KHz) IFP 60 mA

Power Dissipation Pd 60 mW

Electrostatic Discharge(HBM) ESD 2000 V

Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40 ~ +90 ℃

Soldering Temperature Tsol Reflow Soldering : 260 for 10 sec.℃

Hand Soldering : 350 for 3 sec.℃

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Electro-Optical Characteristics (Ta=25 )℃

Parameter Symbol Min. Typ. Max. Unit Condition

Luminous Intensity Iv 72.0 ----- 180 mcd

Viewing Angle 2θ1/2 ----- 125 ----- deg

Peak Wavelength λp----- 591 ----- nm

Dominant Wavelength λd586 ----- 594 nm

Sp

ectrum Radiation

Bandwidth △λ ----- 15 ----- nm

Forward Voltage VF1.75 ----- 2.35 V

IF=20mA

Reverse Current IR----- ----- 10 μAVR=5V

Notes:

1.Tolerance of Luminous Intensity ±11%

2.Tolerance of Dominant Wavelength ±1nm

3.Tolerance of Forward Voltage ±0.1V

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Bin Range Of Luminous Intensity

Bin Min Max Unit Condition

Q1 72.0 90.0

Q2 90.0 112

R1 112 140

R2 140 180

mcd IF=20mA

Bin Range Of Dom. Wavelength

Group Bin Min Max Unit Condition

DD1 586 588

DD2 588 590

DD3 590 592

F

DD4 592 594

nm IF=20mA

Bin Range Of Forward Voltage

Group Bin Min Max Unit Condition

0 1.75 1.95

1 1.95 2.15

B

2 2.15 2.35

nm IF=20mA

Notes:

1.Tolerance of Luminous Intensity ±11%

2.Tolerance of Dominant Wavelength ±1nm

3.Tolerance of Forward Voltage ±0.1V

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Typical Electro-Optical Characteristics Curves

500

25

0

50

75

100

550 600 650 700

Ta=25°C

1.2

Relative luminous intensity

Ambient Temperature Ta (°C)

-60

Forward Current Derating Curve

Ambient Temperature Ta (°C)

0

Forward Current

10

0

20

30

25

F

I (mA)

40

50

1

10

40

20 60 10085

0.7

0.9

0.8

1.0

-20-40 0 20 60

40 10080

Relative luminous intensity

100

%)

(

1000

()

%

0

Forward Current

Rel. Luminous Intensity vs.

Ambient Temperature

10

20

25

I (mA)

F

30

40

50

Spectrum Distribution

0.40.30.5 0.1 0.2

70°

0.6

80°

90°

50°

60°

40°

Radiation Diagram

0° 10°

Ta=25°C

20°

30°

Forward Voltage

2.82.01.6 2.4 3.0

Ta=25°C

Forward Current vs.

10

Relative luminous intensity

1

10

100

%)

(

1000

Forward Current

10 10

I (mA)

F

Ta=25°C

Rel. Luminous Intensity vs

Duty=1/10

f=1KHz

Forward Current

Forward Voltage V (V)

Wavelength λ (nm) F

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Label Explanation

CAT: Luminous Intensity Rank

HUE: Dom. Wavelength Rank

REF: Forward Voltage Rank

Reel Dimensions

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

RoHS

Pb

CPN :

PN : XXXXXXXXXXXXX

XXXXXXXXXXXXX

QTY : XXX

LOT NO : XXXXXXXXXX

Reference : XXXXXXXX

CAT : XXX

HUE : XXX

REF : XXX

EVERLIGHT

MADE IN TAIWAN

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

Moisture Resistant Packaging

Label Desiccant Label

Aluminum moisture-proof bag

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below.

Confidence level：90%

LTPD：10%

No. Items Test Condition Test

Hours/Cycles Sample

Size Ac/Re

1 Reflow Soldering Temp. : 260℃±5℃

Max. 10sec. 6 Min. 22 PCS. 0/1

2 Temperature Cycle H : +100℃ 15min

∫ 5 min

L : -40℃ 15min

300 Cycles 22 PCS. 0/1

3 Thermal Shock H : +100℃ 5min

∫ 10 sec

L : -10℃ 5min

300 Cycles 22 PCS. 0/1

4High Temperature

Storage Temp. : 100℃1000 Hrs. 22 PCS. 0/1

5Low Temperature

Storage Temp. : -40℃1000 Hrs. 22 PCS. 0/1

6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1

7High Temperature /

High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS. 0/1

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

Precautions For Use

1. Over-current-proof

Customer must apply resistors for protection, otherwise slight voltage shift will cause big

current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.

If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

Pre-heating

150~200°C

60~120sec.

3°C/sec.Max.

Above 217°C

60~150sec.

260°C Max.

10sec. Max.

6°C/sec.Max.

Above255°C

30sec.Max.

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

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Device No: DSE-0002998 Prepared date: 27-Sep-2012 Prepared by: Jack Chiu

4.Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within

once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do

soldering of each terminal. Be careful because the damage of the product is often started at the time of the

hand solder.

5.Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a

double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether

the characteristics of the LEDs will or will not be damaged by repairing.

EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936

Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306

Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com