1CGD15FB45P1 Rev - , 10/2015
Six Channel SiC MOSFET Driver
Gate Driver for 1200V SiC MOSFET Power Module
Features
6 output channels
Isolated power supply
Direct mount low inductance design
Short circuit protection
Over temperature protection
Under voltage protection
For use with Cree Module
45mm, six-pack CCS020M12CM2
45mm, six-pack CCS050M12CM2
Applications
Driver for SiC MOSFET modules in two-level,
three-phase inverter applications
DC Bus voltage up to 1000VDC
Absolute Maximum Ratings
Symbol Parameter Value Unit Test Conditions
Note
Vs Power Supply Voltage 16 V Vs ramp rate >50V/sec
ViH Input signal voltage HIGH 5 V
ViL Input signal voltage LOW 0 V
IO.pk Output peak current ±9 (±2) A Rg limited
PO_AVG Ouput power per gate 1.2 W
FMax Max. Switching frequency 250 kHz Vg=+20/-5, Rg=10Ω
VDS Max. Drain to source voltage 1200 V
Visol Input to output isolation
voltage
±1200 V
dv/dt
Rate of change of output to
input voltage
50,000 V/μs
W Weight 223 g
MTBF Mean time between failure 1.5 106h
Top Operating temperature -35 to 85 ºC
Tstg Storage temperature -40 to 85 ºC
Part Number Package Marking
CGD15FB45P1 PCBA CGD15FB45P1
2CGD15FB45P1 Rev - , 10/2015
Characteristics
Symbol Parameter
Value
Unit Test Conditions Notes
Min
Typ
Max
VS Supply voltage 14 15.0 16 V
V
Input signal voltage on/off 5/0 V
ISO
Supply current (no load)
Supply current (max.)
Supply current (max.)
230
mA
25C
460
780
f=100khz, 25C
f=250khz, 25C
ViT+
Input threshold voltage
HIGH
3.5 V
ViT-
Input threshold voltage
LOW
1.5 V
Input resistance
48
k
Coupling capacitance
30
pf
Tdon Turn on propogation delay 300 nS
Time from when input pin
goes high until driver output
goes high
Fig. 3, 4
Tdoff Turn off propogation delay 300 nS
Time from when input pin
goes low until driver output
goes low
Fig. 3, 4
TRout Output voltage rise time 65 nS
VOUT time from 10% to 90%
with RG = 0ohms, CLOAD =
40,000pf
Fig. 5
TFout Output voltage fall time 50 nS
V
OUT
time from 90% to 10%
with RG = 0ohms, CLOAD =
40,000pf
Fig. 5
Turn-on gate resistor
10
Ω
Turn-off gate resistor
10
Ω
Gate voltage at turn-on
+20
V
Gate voltage at turn-off
-5
V
TSC Short Circuit Response
Time 2.34 μS
Total time from when short
circuit current begins flowing
until it is interrupted
VDS,TRIP VDS monitoring threshold 4.7 V
V
DS
value that causes the
driver to trip on overcurrent
TFLT_DLY Fault Delay Time 425 nS
Time from when desat
pin=9V until the gate output
begins turning off
TFLT_SIG Transmission delay of fault
state 2.25 μS
Time delay from desat
pin=9V until fault status pin
is pulled low
Terr Pulse width for resetting
fault
800 nS Time reset pin must be held
low to reset driver
Test voltage (60Hz/1min),
Primary to secondary
4000 V
Test voltage (60Hz/1min),
Secondary to secondary
4000 V
Creepage distance, Primary
to secondary
9.0 mm
Creepage distance,
Secondary to secondary 7.0 mm
Clearance distance,
Primary to secondary
6.0 mm
Clearance distance,
Secondary to secondary
7.0 mm
3CGD15FB45P1 Rev - , 10/2015
Figure 1. Driver Overview
Figure 2. Block Diagram
Note: Default gate resistor for Rg is 10 for gate ON and OFF. The user can control the gate turn ON and OFF
speed by changing Rg to a lower value and gain better MOSFET switching efficiency. The user can also control the
Gate turn-ON and OFF speed independently by populating Rg.off and D1. Cs is made up of 3x 2.2nF, 1.2kV film
capacitors.
4CGD15FB45P1 Rev - , 10/2015
X1 – Signal interface
VIN
VOUT
Tdon
50%
50%
TIMING DIAGRAM
VIN
VOUT
Tdoff
50%
50%
TIMING DIAGRAM
Turn-on propogation delay Turn-off propogation delay
Figure 3. Propagation Delays
IN+ OUT
V
IN
V
OUT
CGD15HB62P1
Figure 4. Propagation Delay Test Circuit
1
PWM_Upper_A (5V Logic)
2
COMMON
3
PWM_Lower_A (5V Logic)
4
5
PWM_Upper_B (5V Logic)
6
7
PWM_Lower_B (5V Logic)
8
9
PWM_Upper_C (5V Logic)
10
11
PWM_Lower_C (5V Logic)
12
13
/RST (normally hi)
14
15
RDY (normally hi)
16
17
DESAT FAULT (normally low)
18
19
OVER_TEMP_FLT (normally low)
20
21
PWR In (Vs)
22
23
24
25
26
LED Status Indicators
L1
RED led, illuminated when
Phase A upper switch has a
desat fault.
L2
RED led, illuminated when
Phase A lower switch has a
desat fault.
L3
RED led, illuminated when
Phase B upper switch has a
desat fault.
L4
RED led, illuminated when
Phase B lower switch has a
desat fault.
L5
RED led, illuminated when
Phase C upper switch has a
desat fault.
L6
RED led, illuminated when
Phase C lower switch has a
desat fault.
L7
GREEN led, illuminated when
power is present and all faults
are clear.
L8 RED led, illuminated when there
is an over temp fault.
CGD15FB45P1
5CGD15FB45P1 Rev - , 10/2015
90%
10%
T
Rout
90%
10%
T
Fout
VOUT VOUT
Figure 5. Output Voltage Rise and Fall Times
Fault Handling
Each of the six gate drive channels is protected by a desaturation (desat) circuit. In the event of a short
circuit, the voltage across the MOSFET (VDS) rises until it hits a threshold which causes the desat circuit
to drive all six gate drive channels to their off state. Pin 17 of the X1 signal connector toggles high when
a desat event occurs. There will also be a red LED (L1-L6) illuminated for the gate drive channel(s) that
activated the desaturation protection. Once the fault is cleared, the circuit can be reset with the onboard
reset button or remotely by driving pin 13 of the X1 connector to common.
There is an overtemperature protection circuit that turns off all the gates in the event an overtemperature
is detected. The overtemperature circuit reads the value of the six pack module’s onboard temperature
sensor. When the sensor reaches a value corresponding to 115°C, the overtemperature circuit is
activated and all six gate drive channels are driven to their low state. Pin 19 of the X1 connector is
toggled high when an overtemperature fault occurs.
Typical Application
6CGD15FB45P1 Rev - , 10/2015
Mechanical Instructions
Designed to directly mount to Cree 45 mm style power modules, the 6-ch gate driver also has several
other mounting holes to secure the assembly.
Attach the gate driver board to the power module via the 4x Module screw holes (see diagram below)
using the recommended hardware in Table 1. Then solder the 28x solder pins via the solder pin holes to
electrically connect the driver board to the power module. The soldering tip must not exceed 260ºC and
contact with the solder per pin must not exceed 10 seconds. The solder joints should be in accordance
with IPC A 610 Rev D (or later) – Class 3 to ensure an optimal connection between the module and gate
driver board.
The module plus driver board assembly must be further supported by securing the assembly to standoffs
via the 7x Mounting holes shown in the figure below.
Table 1 Hardware List
Ref
Description
Hardware
Locations
Torque
Module
screw holes
2.5mm clearance holes for mounting
screws to secure the module to the
printed circuit board assembly.
M2.5 x 4mm 4x 0.5 Nm
Mounting
holes
4.3mm clearance holes for screws to
secure the circuit assembly to stand-
offs for additional support.
6-32 x 5/6” Zinc Plated pan head
screw /w internal tooth washer. 9x 0.9 Nm
Access holes
10mm clearance hole to provide
access to the screw that secure the
module to the heatsink.
n/a 2x n/a
Solder pin
holes
1.6mm plated holes for solder pins
from power module.
Solder pins from power module 28x n/a
Power
terminals
6mm holes to secure power cables. ¼” or 6mm hardware 7x
7
This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications
in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation
of nuclear facilities, life-support machines, cardiac debrillators or similar emergency medical equipment, aircraft navigation or communication or
control systems or air trafc control systems.
Copyright © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks and Z-REC and Z-FET are trademarks of Cree, Inc.
7CGD15FB45P1 Rev - , 10/2015
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power
Mechanical Drawing (units in Inches) [mm]