ACMD-7403
Miniature UMTS Band II / PCS Duplexer
Data Sheet
Description
The Avago Technologies’ ACMD-7403 is a miniature
duplexer designed for use in UMTS Band II and PCS
(Blocks A–F) handsets.
The ACMD-7403 enhances the sensitivity and dynamic
range of handset receivers by providing more than 54 dB
attenuation of the transmitted signal at the receiver input
and more than 44 dB rejection of transmit-generated
noise in the receive band.
Maximum Insertion Loss in the Tx channel is only 2.7 dB,
which minimizes current drain from the power amplier.
Insertion Loss in the Rx channel is a maximum of 3.2 dB,
thus improving receiver sensitivity.
The ACMD-7403 is designed with Avago Technologies’
Film Bulk Acoustic Resonator (FBAR) technology, which
makes possible ultra-small, high-Q lters at a fraction
of their usual size. The excellent power handling capa-
bility of the FBAR bulk-mode resonators supports the
high output power levels needed in PCS handsets while
adding virtually no distortion.
The ACMD-7403 also utilizes Avago Technologies’ innova-
tive Microcap bonded-wafer, chip scale packaging tech-
nology. This process allows the lters to be assembled in
a molded chip-on-board module that is less than 1.2 mm
high with a footprint of only 3.0 mm x 3.0 mm.
Features
• Miniature Size
• 3.0 x 3.0 mm Max footprint
• 1.2 mm Max height
• High Power Rating
• 33 dBm Abs Max Tx Power
• Lead-Free Construction
Specications
• Rx Band Performance, 1930.5-1989.5 MHz, – 30 to +85°C
• Rx Noise Blocking: 44 dB min
• Insertion Loss: 3.2 dB max
• Tx Band Performance, 1850.5-1909.5 MHz, – 30 to +85°C
• Tx Interferer Blocking: 52 dB min
• Insertion Loss: 2.7 dB max
Applications
Handsets or data terminals operating in the PCS (A–F)
frequency band.
Functional Block Diagram
2
ACMD-7403 Electrical Specications [2,3], Z0=50 Ω, TC [1] as indicated,
Symbol Parameter Units
– 30°C +25°C +85°C
Min Typ Max Min Typ Max Min Typ Max
Antenna Port to Receive Port
S23 Insertion Loss in Receive Band
1930.5 – 1931.5 MHz
1931.5 – 1989.5 MHz
dB 3.2
3.0
1.9
1.3
3.1
3.0
3.0
3.2
∆S23 Ripple (p-p) in Receive Band dB 1.7
S22 Return Loss of Receive Port
in Receive Band
dB 9.5 9.5 15 9.5
S23 Attenuation in Transmit Band
(1850.5 – 1909.5 MHz)
dB 52 52 59 52
S23 Attenuation 0 – 1600 MHz dB 20 29
S23 Attenuation in Receive 2nd Harmonic
Band (3861 – 3979 MHz)
dB 14 18
Transmit Port to Antenna Port
S31 Insertion Loss in Transmit Band
1850.5 – 1908.5 MHz
1908.5 – 1909.5 MHz
dB
2.5
2.5
1.0
1.4
2.1
2.3
2.5
2.7
∆S31 Ripple (p-p) in Transmit Band dB 1.3
S11 Return Loss of Transmit Port
in Transmit Band
dB 9.5 9.5 20 9.5
S31 Attenuation in Receive Band
(1930.5 – 1989.5 MHz)
dB 40 40 49 40
S31 Attenuation 0 – 1600 MHz dB 22 32
S31 Attenuation in GPS Rx Band
(1574.42 – 1576.42 MHz)
dB 23 27
S31 Attenuation in Transmit 2nd Harmonic
Band (3701 – 3819 MHz)
dB 5 9
Antenna Port
S33 Return Loss of Antenna Port in Receive
Band (1930.5 – 1989.5 MHz)
dB 9 9 16 9
S33 Return Loss of Antenna Port in Transmit
Band (1850.5 – 1909.5 MHz)
dB 9 9 17 9
Isolation Transmit Port to Receive Port
S21 Tx-Rx Isolation in Receive Band
(1930.5 – 1989.5 MHz)
dB 44 44 51 44
S21 Tx-Rx Isolation in Transmit Band
(1850.5 – 1909.5 MHz)
dB 54 54 61 54
Notes:
TC is the case temperature and is dened as the temperature of the underside of the Duplexer where it makes contact with the circuit board.
Min/Max specications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx
frequencies unless otherwise noted. Typical data is the average value of the parameter over the indicated band at the specied temperature. Typical
values may vary over time.
3
ACMD-7403
Absolute Maximum Ratings [1]
Parameter Unit Value
Storage temperature °C–65 to +125
Maximum RF Input Power to Tx Port dBm +33
Maximum Recommended Operating Conditions [2]
Parameter Unit Value
Operating temperature, Tc [3] ,
Tx Power ≤ 29 dBm
°C–40 to +100
Operating temperature, Tc [3] ,
Tx Power ≤ 30 dBm
°C–40 to +85
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. The device will function over the recommended range without
degradation in reliability or permanent change in performance, but
is not guaranteed to meet electrical specications.
3. TC is dened as case temperature, the temperature of the underside
of the duplexer where it makes contact with the circuit board.
Characterization
A test circuit similar to the one shown in Figure 1 was
used to measure typical device performance. This circuit
is designed to interface with Air Coplanar (ACP), Ground-
Signal-Ground (GSG) RF probes of the type commonly
used to test semiconductor wafers.The PCB test circuit
uses multiple vias to create a well-grounded pad to
which the device under test (DUT) is solder-attached.
Short lengths of 50-ohm microstripline connect the DUT
to ACP probe patterns on the board.
A test circuit with ACMD-7403 mounted in place is shown
in Figure 2. S-parameters are then measured using a
network analyzer and calibrated ACP probe set.
Phase data for s-parameters measured with ACP probe
circuits are adjusted to place the reference plane at the
edge of the duplexer.
Figure 1. ACP Probe Test Circuit. Figure 2. Test Circuit with Duplexer.
4
-3.0
-2.0
-1.0
0.0
1850 1860 1870 1880 1890 1900 1910
Frequency (MHz)
Insertion Loss (dB)
-3.0
-2.0
-1.0
0.0
Frequency (MHz)
Insertion Loss (dB)
-25
-20
-15
-10
-5
0
1750 1800 1850 1900 1950 2000 2050 2100
Fre
q
uenc
y (
MHz
)
Return Loss (dB)
-60
-50
-40
-30
-20
-10
0
Frequency (MHz)
Insertion Loss (dB)
-80
-75
-70
-65
-60
-55
-50
-45
-40
-35
1750 1800 1850 1900 1950 2000 2050 2100
Frequency (MHz)
Insertion Loss (dB)
-25
-20
-15
-10
-5
0
1750 1800 1850 1900 1950 2000 2050 2100
Frequency (MHz)
Return Loss (dB)
1930 1940 1950 1960 1970 1980 1990
1750 1800 1850 1900 1950 2000 2050 2100
ACMD-7403 Typical Performance at Tc = 25°C
Figure 3. Tx–Ant Insertion Loss Figure 4. Ant–Rx Insertion Loss
Figure 5. Tx and Rx Port Return Loss Figure 6. Tx Rejection in Rx Band and Rx Rejection in Tx Band
Figure 7. Tx–Rx Isolation Figure 8. Antenna Port Return Loss
5
-60
-50
-40
-30
-20
-10
0
0.0 1.0 2.0 3.0 4.0 5.0 6.0
Frequency (GHz)
Insertion Loss (dB)
-20
-15
-10
-5
0
Frequency (MHz)
Ins ertion Los s (dB )
-60
-50
-40
-30
-20
-10
0
Frequency (GHz)
Insertion Loss (dB)
-60
-50
-40
-30
-20
-10
0
Frequency (GHz)
Insertion Loss (dB)
3700 3720 3740 3760 3780 3800 3820
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
ACMD-7403 Typical Performance at Tc = 25°C
Figure 9. Tx–Ant and Ant–Rx Wideband Insertion Loss Figure 10. Tx–Ant Rejection at Tx Second Harmonic
Figure 11. Tx–Ant Low Frequency Rejection Figure 12. Ant–Rx Low Frequency Rejection
6
0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 20 50
0.4
0.6
0.8 1
1.5
2
3
4
5
10
20
50
-0.4
-0.6
-0.8 -1
-1.5
-2
-3
-4
-5
-10
-20
-50
0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 20 50
0.4
0.6
0.8 1
1.5
2
3
4
5
10
20
50
-0.4
-0.6
-0.8 -1
-1.5
-2
-3
-4
-5
-10
-20
-50
0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 20 50
0.4
0.6
0.8 1
1.5
2
3
4
5
10
20
50
-0.4
-0.6
-0.8 -1
-1.5
-2
-3
-4
-5
-10
-20
-50
0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 20 50
0.4
0.6
0.8 1
1.5
2
3
4
5
10
20
50
-0.4
-0.6
-0.8 -1
-1.5
-2
-3
-4
-5
-10
-20
-50
Figure 13. Tx Port Impedance in Tx Band Figure 14. Rx Port Impedance in Rx Band
Figure 15. Ant Port Impedance in Tx Band Figure 16. Ant Port Impedance in Rx Band
7
Figure 17. Package Outline Drawing
ANT
PACKAGE
ORIENTATION
TXRX
H = ACMD -7403
FB = Avago ID
Y = Year
WW = Work Week
DC = Date Code
NNNN = Lot Number
Figure 18. Product Marking
PACKAGE
ORIENTATION
ANT
TX RX
PRODUCT
MARKING
TOP VIEW
Notes:
1. Dimensions in millimeters
Tolerance: X.X ± 0.1 mm
X.XX ± 0.05 mm
Angles 45°, unless otherwise noted
2. Dimensions nominal unless otherwise noted
3. I/O Pads (3 ea)
Size: 0.35 X 0.35 mm
Spacing to ground metal: 0.30 mm
4. Signal Vias (2 ea), Ø 0.25; covered with 0.40 Ø solder mask.
Shown for reference only. PCB metal under
signal via does not need to be voided.
5. Contact areas are gold plated
3.0
MAX 1.2
MAX
+
2.45
2.80
2.80
1.40
BOTTOM VIEWSIDE VIEW
3.0
MAX
2.45
0.61
0.05
0.43
0.33
0.25
SIGNAL VIA
(2 PLS)
0.35
0.35
DETAIL OF IO PAD AREA
0.30
0.30
0.25
0.25
0.05 0.05
0.075
0.075
8
Notes:
1. Dimensions in mm
2. Transmission line Gap (G) adjusted for Zo = 50 ohms
3. I/O Pads (3 ea) 0.35 X 0.35, corner chamfer 0.03
4. Ground vias positioned to maximize port-to-port isolation
5. Preferred Tx connection on buried metal layer
Figure 19. PCB Layout
2.10
2.28
G
0.35
Ø 0.30 VIA ARRAY
HO RIZ PITC H = 0.40
VERT PITC H = 0.40
Ant
RxTx
G
0.30
0.25 0.30
0.25
0.35
Figure 20. ACMD-7403 Superposed on PCB Layout
Figure 21. Recommended Solder Mask
A PCB layout using the principles illustrated in Figure 19
is recommended to optimize performance of the ACMD-
7403.
It is particularly important to maximize isolation between
the Tx connection to the duplexer and the Rx port. High
isolation is achieved by: (1) maintaining a continuous
ground plane around the duplexer mounting area, (2)
surrounding the I/O ports with sucient ground vias to
enclose the connections in a “Faraday cage”, and (3) pref-
erably routing the Tx trace in a dierent metal layer than
the Rx.
2.90
2.90
> 0.30
TYP
0.45 0.45
0.20
0.20
> 0.30
TYP
Figure 22. ACMD-7403 Superposed on Solder Mask
The latter is especially useful, not only to maintain Tx-Rx
isolation of the duplexer, but also to prevent leakage of
the Tx signal into other components that could result in
the creation of intermodulation products and degrada-
tion of overall system performance.
A sucient number of vias should be used to ensure
excellent RF grounding as well as good heat sinking for
the device.
Note:
The two signal vias shown in Fig 17 are covered with solder mask and it
is not necessary to void the ground plane under them.
9
Stencil Opening ID Qty Width (mm) Length (mm)
I/O pad areas 3 0.35 0.35
All other openings 9 0.50 0.50
Notes:
1. Chamfer or radius all corners 0.05 mm min
2. Stencil openings aligned to Boundary rectangle or center lines
3. Non-I/O pad stencil openings aligned to 0.52 x 0.55 grid
(i.e., spacing between openings: 0.2 vertical, 0.5 horizontal)
Figure 23. Recommended Solder Stencil
Figure 24. Solder Stencil Overlaid on ACMD-7403 Bottom Metal Pattern
Figure 25. SMD Tape Packing
10
Figure 26. Unit Orientation in Tape
Figure 27. Reel Drawing, Front View
Figure 28. Reel Drawing, Back View
Package Moisture Sensitivity
Feature Test Method Performance
Moisture Sensitivity Level
(MSL) at 260°C
JESD22-A113D Level 3
Figure 29. Veried SMT Solder Prole
0 50 100 150 200 250 300
Time, seconds
0
50
100
150
200
250
300
Temperature, °C
Tested profile shown.
Ordering Information
Part Number No. of Devices Container
ACMD-7403-BLK 25 Anti-static Bag
ACMD-7403-TR1 1000 7-inch Reel
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved.
AV02-0627EN - April 10, 2008