KAF-0402 IMAGE SENSOR 768 (H) X 512 (V) FULL FRAME CCD IMAGE SENSOR JULY 20, 2012 DEVICE PERFORMANCE SPECIFICATION REVISION 1.0 PS-0028 KAF-0402 Image Sensor TABLE OF CONTENTS Summary Specification ......................................................................................................................................................................................... 4 Description .................................................................................................................................................................................................. 4 Applications ................................................................................................................................................................................................. 4 Ordering Information ............................................................................................................................................................................................ 5 Device Description ................................................................................................................................................................................................. 6 Architecture................................................................................................................................................................................................. 6 Microlenses .................................................................................................................................................................................................. 7 Output Structure ..................................................................................................................................................................................... 7 Dark Reference Pixels ............................................................................................................................................................................ 8 Dummy Pixels ........................................................................................................................................................................................... 8 Image Acquisition....................................................................................................................................................................................... 8 Charge Transport ....................................................................................................................................................................................... 8 Physical Description .................................................................................................................................................................................. 9 Pin Description and Device Orientation ............................................................................................................................................ 9 Imaging Performance .......................................................................................................................................................................................... 10 Specifications ........................................................................................................................................................................................... 10 Electro-Optical ...................................................................................................................................................................................... 10 Typical Performance Curves ............................................................................................................................................................................ 11 Defect Definitions ................................................................................................................................................................................................ 12 Specifications ........................................................................................................................................................................................... 12 Operation .................................................................................................................................................................................................................. 13 Absolute Maximum Ratings.................................................................................................................................................................. 13 DC Bias Operating Conditions ............................................................................................................................................................. 13 AC Operating Conditions ...................................................................................................................................................................... 14 Clock Levels ........................................................................................................................................................................................... 14 Timing ......................................................................................................................................................................................................................... 15 Requirements and Characteristics ...................................................................................................................................................... 15 Frame Timing............................................................................................................................................................................................ 16 Line Timing and Pixel Timing ................................................................................................................................................................ 16 Storage and Handling .......................................................................................................................................................................................... 17 Storage Conditions ................................................................................................................................................................................. 17 ESD .............................................................................................................................................................................................................. 17 Cover Glass Care and Cleanliness........................................................................................................................................................ 17 Environmental Exposure ....................................................................................................................................................................... 17 Soldering Recommendations ............................................................................................................................................................... 17 Mechanical Information ..................................................................................................................................................................................... 18 Completed Assembly ............................................................................................................................................................................. 18 Quality Assurance and Reliability .................................................................................................................................................................. 20 Quality and Reliability ............................................................................................................................................................................ 20 Replacement ............................................................................................................................................................................................ 20 Liability of the Supplier ......................................................................................................................................................................... 20 Liability of the Customer ....................................................................................................................................................................... 20 Test Data Retention ............................................................................................................................................................................... 20 Mechanical ................................................................................................................................................................................................ 20 Life Support Applications Policy .................................................................................................................................................................... 20 Revision Changes................................................................................................................................................................................................... 21 MTD/PS-0509 ........................................................................................................................................................................................... 21 www.truesenseimaging.com Revision 1.0 PS-0028 Pg 2 KAF-0402 Image Sensor PS-0028 ...................................................................................................................................................................................................... 21 TABLE OF FIGURES Figure 1: Block Diagram ................................................................................................................................................................................ 6 Figure 2: Microlens ......................................................................................................................................................................................... 7 Figure 3: Output Schematic ......................................................................................................................................................................... 7 Figure 4: Pinout Diagram .............................................................................................................................................................................. 9 Figure 5: Typical Spectral Response .........................................................................................................................................................11 Figure 6: Active Pixel Region .....................................................................................................................................................................12 Figure 7: Example Output Structure Load Diagram .............................................................................................................................13 Figure 8: Frame Timing Diagram ...............................................................................................................................................................16 Figure 9: Line and Pixel Timing Diagrams ...............................................................................................................................................16 Figure 10: Completed Assembly (1 of 2) .................................................................................................................................................18 Figure 11: Completed Assembly (2 of 2) .................................................................................................................................................19 www.truesenseimaging.com Revision 1.0 PS-0028 Pg 3 KAF-0402 Image Sensor Summary Specification KAF-0402 Image Sensor DESCRIPTION The KAF-0402 Image Sensor is a high performance area CCD (charge-coupled device) image sensor with 768H x 512V photoactive pixels designed for a wide range of image sensing applications. The sensor incorporates true two-phase CCD technology, simplifying the support circuits required to drive the sensor as well as reducing dark current without compromising charge capacity. The sensor also utilizes the TRUESENSE Transparent Gate Electrode to improve sensitivity compared to the use of a standard front side illuminated polysilicon electrode. Optional microlenses focus the majority of the light through the transparent gate, increasing the optical response further. APPLICATIONS Digitization Medical Scientific Parameter Typical Value Architecture Full Frame CCD; Enhanced Response Total Number of Pixels 784 (H) x 520 (V) Number of Active Pixels 768 (H) x 512 (V) = approx. 0.4M Pixel Size 9.0 m (H) x 9.0 m (V) Imager Size 6.91(H) mm x 4.6 (V) mm Die Size 8.4 mm (H) x 5.5 mm (V) Aspect Ratio 3:2 Saturation Signal 100,000 electrons Quantum Efficiency (with microlens) Peak: 77% 400 nm: 45% Quantum Efficiency (no microlens) Peak: 65% 400 nm: 30% Output Sensitivity 10 V/e- Read Noise 15 electrons Dark Current <10 pA/cm2 at 25 C Dark Current Doubling Temperature 6.3 C Dynamic Range 76 dB Charge Transfer Efficiency >0.99999 Blooming Suppression None Maximum Data Rate 10 MHz Package CERDIP Package (sidebrazed) Cover Glass Clear or AR coated, 2 sides Parameters above are specified at 25 C, unless otherwise noted. www.truesenseimaging.com Revision 1.0 PS-0028 Pg 4 KAF-0402 Image Sensor Ordering Information Catalog Number Product Name Description 4H0332 KAF- 0402-AAA-CB-B1 Monochrome, No Microlens, CERDIP Package (sidebrazed), Clear Cover Glass (no coatings), Grade 1 4H0334 KAF- 0402-AAA-CB-AE Monochrome, No Microlens, CERDIP Package (sidebrazed), Clear Cover Glass (no coatings), Engineering Sample 4H0238 KAF- 0402-AAA-CP-B1 Monochrome, No Microlens, CERDIP Package (sidebrazed), Taped Clear Cover Glass, no coatings, Grade 1 4H0239 KAF- 0402-AAA-CP-B2 Monochrome, No Microlens, CERDIP Package (sidebrazed), Taped Clear Cover Glass, no coatings, Grade 2 4H0240 KAF- 0402-AAA-CP-AE Monochrome, No Microlens, CERDIP Package (sidebrazed), Taped Clear Cover Glass, no coatings, Engineering Sample 4H0234 KAF- 0402-ABA-CD-B1 Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Clear Cover Glass with AR coating (both sides), Grade 1 4H0235 KAF- 0402-ABA-CD-B2 Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Clear Cover Glass with AR coating (both sides), Grade 2 4H0236 KAF- 0402-ABA-CD-AE Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Clear Cover Glass with AR coating (both sides), Engineering Sample 4H0230 KAF- 0402-ABA-CP-B1 Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Taped Clear Cover Glass, no coatings, Grade 1 4H0231 KAF- 0402-ABA-CP-B2 Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Taped Clear Cover Glass, no coatings, Grade 2 4H0232 KAF- 0402-ABA-CP-AE Monochrome, Telecentric Microlens, CERDIP Package (sidebrazed), Taped Clear Cover Glass, no coatings, Engineering Sample 4H0077 KEK-4H0077-KAF-0402-12-5 Evaluation Board (Complete Kit) Marking Code KAF- 0402-AAA S/N KAF- 0402-ABA S/N N/A See Application Note Product Naming Convention for a full description of the naming convention used for Truesense Imaging image sensors. For reference documentation, including information on evaluation kits, please visit our web site at www.truesenseimaging.com. Please address all inquiries and purchase orders to: Truesense Imaging, Inc. 1964 Lake Avenue Rochester, New York 14615 Phone: (585) 784-5500 E-mail: info@truesenseimaging.com Truesense Imaging reserves the right to change any information contained herein without notice. All information furnished by Truesense Imaging is believed to be accurate. www.truesenseimaging.com Revision 1.0 PS-0028 Pg 5 KAF-0402 Image Sensor Device Description ARCHITECTURE 4 Dark lines V1 V2 KAF - 0402 Usable Active Image Area 768 (H) x 512 (V) 9 x 9 m pixels Guard 3:2 aspect ratio Vrd R Vdd Vout Vss Sub 4 Dark lines 768 Active Pixels/Line 12 Dark 4 Dark H1 H2 2 Inactive 10 Inactive Vog Figure 1: Block Diagram The sensor consists of 784 parallel (vertical) CCD shift registers each 520 elements long. These registers act as both the photosensitive elements and as the transport circuits that allow the image to be sequentially read out of the sensor. The parallel (vertical) CCD registers transfer the image one line at a time into a single 796-element (horizontal) CCD shift register. The horizontal register transfers the charge to a single output amplifier. The output amplifier is a two-stage source follower that converts the photo-generated charge to a voltage for each pixel. www.truesenseimaging.com Revision 1.0 PS-0028 Pg 6 KAF-0402 Image Sensor MICROLENSES Microlenses are formed along each row. They are effectively half of a cylinder centered on the transparent gates, extending continuously in the row direction. They act to direct the photons away from the polysilicon gate and through the transparent gate. This increases the response, especially at the shorter wavelengths (< 600 nm). Microlens V1 electrode V2 electrode Silicon Figure 2: Microlens H1 H2 H1 HCCD Charge Transfer VDD H2 Vog R Vrd Floating Diffusion Vout Source Follower #1 Source Follower #2 Figure 3: Output Schematic Output Structure Charge presented to the floating diffusion is converted into a voltage and current amplified in order to drive off-chip loads. The resulting voltage change seen at the output is linearly related to the amount of charge placed on the floating diffusion. Once the signal has been sampled by the system electronics, the reset gate (R) is clocked to remove the signal and the floating diffusion is reset to the potential applied by Vrd (see Figure 3). More signal at the floating diffusion reduces the voltage seen at the output pin. In order to activate the output structure, an off-chip load must be added to the Vout pin of the device such as shown in Figure 4. www.truesenseimaging.com Revision 1.0 PS-0028 Pg 7 KAF-0402 Image Sensor Dark Reference Pixels There are 4 light shielded pixels at the beginning of each line, and 12 at the end. There are 4 dark lines at the start of every frame and 4 dark lines at the end of each frame. Under normal circumstances, these pixels do not respond to light. However, dark reference pixels in close proximity to an active pixel can scavenge signal depending on light intensity and wavelength and therefore will not represent the true dark signal. Dummy Pixels Within the horizontal shift register are 10 leading additional pixels that are not associated with a column of pixels within the vertical register. These pixels contain only horizontal shift register dark current signal and do not respond to light. A few leading dummy pixels may scavenge false signal depending on operating conditions. There are two more dummy pixels at the end of each line. IMAGE ACQUISITION An electronic representation of an image is formed when incident photons falling on the sensor plane create electronhole pairs within the sensor. These photon induced electrons are collected locally by the formation of potential wells at each photogate or pixel site. The number of electrons collected is linearly dependent on light level and exposure time and non-linearly dependent on wavelength. When the pixel's capacity is reached, excess electrons will leak into the adjacent pixels within the same column. This is termed blooming. During the integration period, the V1 and V2 register clocks are held at a constant (low) level. See Figure 9. CHARGE TRANSPORT Referring again to Figure 9, the integrated charge from each photogate is transported to the output using a two-step process. Each line (row) of charge is first transported from the vertical CCD to the horizontal CCD register using the V1 and V2 register clocks. The horizontal CCD is presented a new line on the falling edge of V2 while H1 is held high. The horizontal CCD then transports each line, pixel by pixel, to the output structure by alternately clocking the H1 and H2 pins in a complementary fashion. On each falling edge of H2 a new charge packet is transferred onto a floating diffusion and sensed by the output amplifier. www.truesenseimaging.com Revision 1.0 PS-0028 Pg 8 KAF-0402 Image Sensor PHYSICAL DESCRIPTION Pin Description and Device Orientation 24 N/C 23 Guard 3 22 V1 VRD 4 21 V1 R 5 20 V2 VSS 6 19 V2 H1 7 18 V2 H2 8 17 V2 N/C 9 16 V1 N/C 10 15 V1 Vsub 11 14 Vsub N/C 13 N/C VOG 1 Vout 2 VDD Pin 1 Pixel 1,1 12 Figure 4: Pinout Diagram Pin Name Description Pin Name Description 1 OG Output Gate 24 N/C No Connection 2 VOUT Video Output 23 GUARD Guard Ring 3 VDD Amplifier Supply 22 V1 Vertical CCD Clock - Phase 1 4 VRD Reset Drain 21 V1 Vertical CCD Clock - Phase 1 5 R Reset Clock 20 V2 Vertical CCD Clock - Phase 2 6 VSS Amplifier Supply Return 19 V2 Vertical CCD Clock - Phase 2 7 H1 Horizontal CCD Clock - Phase 1 18 V2 Vertical CCD Clock - Phase 2 8 H2 Horizontal CCD Clock - Phase 2 17 V2 Vertical CCD Clock - Phase 2 9 N/C No Connection 16 V1 Vertical CCD Clock - Phase 1 10 N/C No Connection 15 V1 Vertical CCD Clock - Phase 1 11 VSUB Substrate 14 VSUB Substrate 12 N/C No Connection 13 N/C No Connection www.truesenseimaging.com Revision 1.0 PS-0028 Pg 9 KAF-0402 Image Sensor Imaging Performance SPECIFICATIONS Electro-Optical All values measured at 25 C and nominal operating conditions. These parameters exclude defective pixels. Description Saturation Signal Vertical CCD capacity Horizontal CCD capacity Output Node capacity Symbol Min. Nom. Max Nsat 85000 170000 190000 100000 200000 220000 240000 Units Notes design9 electrons/pixel 1 Quantum Efficiency (see Figure 5) design9 Photoresponse Non-Linearity PRNL 1.0 Photoresponse NonUniformity PRNU 0.8 Dark Signal Jdark 15 6 Dark Signal Doubling Temperature Dark Signal Non-Uniformity DSNU % 2 % 3 die8 30 10 electrons/pixel/sec pA/cm2 4 die8 6.3 7 C 15 30 electrons/pixel/sec 5 die8 dB 6 design9 Dynamic Range DR 72 76 Charge Transfer Efficiency CTE 0.99997 0.99999 Output Amplifier DC Offset Vodc Vrd Vrd + 0.5 Output Amplifier Sensitivity Output Amplifier Output Impedance Noise Floor Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. Verification Plan - 2.0 design9 die8 Vrd + 1.0 design9 V - V/e design9 design9 Vout/Ne 9 10 Zout 180 200 220 Ohms 15 20 electrons ne- 7 For pixel binning applications, electron capacity up to 330000 can be achieved with modified CCD inputs. Worst case deviation from straight line fit, between 2% and 90% of Vsat. One Sigma deviation of a 128 x 128 sample when CCD illuminated uniformly at half of saturation. Average of all pixels with no illumination at 25 C. Average dark signal of any of 11 x 8 blocks within the sensor (each block is 128 x 128 pixels). 20log (Nsat/ne ) at nominal operating frequency and 25 C. Noise floor is specified at the nominal pixel frequency and excludes any dark or pattern noises. It is dominated by the output amplifier power spectrum with a bandwidth = 5 * pixel rate. A parameter that is measured on every sensor during production testing. A parameter that is quantified during the design verification activity. www.truesenseimaging.com Revision 1.0 PS-0028 Pg 10 KAF-0402 Image Sensor Typical Performance Curves KAF-0402 Spectral Response 1 0.9 Absolute Quantum Efficiency 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 800 900 1000 Wavelength (nm) KAF-0402 (with microlenses) KAF-0402 (no microlenses) Figure 5: Typical Spectral Response www.truesenseimaging.com Revision 1.0 PS-0028 Pg 11 KAF-0402 Image Sensor Defect Definitions SPECIFICATIONS Defect tests performed at T = 25 C. Grade Point Defect Cluster Defect Column Defect C1 <5 0 0 C2 <10 <4 0 Dark Defects A pixel which deviates by more than 6% from neighboring pixels when illuminated to 70% of saturation Bright Defect A pixel whose dark current >5000 electrons/pixel/second at 25 C Cluster Defect A grouping of not more than 5 adjacent point defects Column Defect A grouping of >5 contiguous point defects along a single column A column containing a pixel with dark current >12,000 electrons/pixel/second at 25 C (Bright Column) A column that does not meet the minimum vertical CCD charge capacity (Low charge capacity column) A column that loses >250 electrons under 2 Ke- (trap defect) Neighboring Pixels The surrounding 128 x 128 pixels of 64 columns/rows Defect Separation Column and cluster defects are separated by no less than 2 pixels in any direction (excluding single pixel defects. 1,512 768,512 1,1 768,1 Figure 6: Active Pixel Region www.truesenseimaging.com Revision 1.0 PS-0028 Pg 12 KAF-0402 Image Sensor Operation ABSOLUTE MAXIMUM RATINGS Description Symbol Minimum Maximum Units Notes Diode Pin Voltages Vdiode 0 20 V 1,2 Gate Pin Voltages Vgate1 -16 Output Bias Current Output Load Capacitance Notes: 1. 2. 3. 4. 5. 16 V 1,3,5 Iout -10 mA 4 Cload 15 pF 4 Referenced to pin Vsub or between each pin in this group. Includes pins: Vrd, Vdd, Vss, Vout. Includes pins: V1, V2, H1, H2, Vog, Vlg. R. Avoid shorting output pins to ground or any low impedance source during operation. This sensor contains gate protection circuits to provide some protection against ESD events. The circuits will turn on when greater than 16 volts appears between any two gate pins. Permanent damage can result if excessive current is allowed to flow under these conditions. Warning: This device contains limited protection against Electrostatic Discharge (ESD). Devices should be handled in accordance with strict ESD procedures for Class 0 devices (JESD22 Human Body Model) or Class A (Machine Model). Refer to Application Note Image Sensor Handling and Best Practices. DC BIAS OPERATING CONDITIONS Description Symbol Minimum Nominal Maximum Units Max DC Current (mA) 0.01 Reset Drain Vrd 10 11.0 11.5 V Output Amplifier Return Vss 1.5 2.0 2.5 V -0.5 Output Amplifier Supply Vdd 14.75 15 15.5 V Iout Substrate Vsub 0 0 0 V 0.01 Output Gate Vog 3.75 4 5 V 0.01 Guard Ring Vlg 8.0 9.0 12.0 V 0.01 Video Output Current Iout -5 -10 mA - Notes: 1. Notes 1 An output load sink must be applied to Vout to activate output amplifier - see Figure 7 below. +15V 0.1uF ~5ma Vout 2N3904 or equivalent Buffered Output 140 1k Figure 7: Example Output Structure Load Diagram www.truesenseimaging.com Revision 1.0 PS-0028 Pg 13 KAF-0402 Image Sensor AC OPERATING CONDITIONS Clock Levels Description Symbol Level Minimum Nominal Maximum Units Effective Capacitance Vertical CCD Clock - Phase 1 V1 Low -10.5 -10.0 -9.5 V 6 nF (all OV1 pins) Vertical CCD Clock - Phase 1 V1 High -0.5 0 1.0 V 6 nF (all OV1 pins) Vertical CCD Clock - Phase 2 V2 Low -10.5 -10.0 -9.5 V 6 nF (all OV1 pins) Vertical CCD Clock - Phase 2 V2 High -0.5 0 1.0 V 6 nF (all OV1 pins) Horizontal CCD Clock - Phase 1 H1 Low -4.5 -4.0 -3.5 V 50 pF Horizontal CCD Clock - Phase 1 H1 Amplitude 9.5 10.0 10.5 V 50 pF Horizontal CCD Clock - Phase 2 H2 Low -4.5 -4.0 -3.5 V 50 pF Horizontal CCD Clock - Phase 2 H2 Amplitude 9.5 10.0 10.5 V 50 pF Reset Clock R Low -3.0 -2.0 -1.75 V 5 pF Reset Clock R Amplitude 5.0 6.0 7.0 V 5 pF Notes: 1. 2. All pins draw less than 10 A DC current. Capacitance values relative to VSUB. www.truesenseimaging.com Revision 1.0 PS-0028 Pg 14 KAF-0402 Image Sensor Timing REQUIREMENTS AND CHARACTERISTICS Description Symbol Minimum Nominal Maximum Units Notes 4 10 MHz 1, 2, 3 H1, H2 Clock Frequency fH Pixel Period (1 Count) tpix 100 250 ns H1, H2 Set-up Time tHS 0.5 1 s V1, V2 Clock Pulse Width tV 1.5 2 s 2 Reset Clock Pulse Width Readout Time tR 10 20 ns 4 treadout 43.7 107 ms 5 84.1 206 s Integration Time tint Line Time tline Notes: 1. 2. 3. 4. 5. 6. 7. 6 7 50% duty cycle values. CTE may degrade above the nominal frequency. Rise and fall times (10/90% levels) should be limited to 5-10% of clock period. Crossover of register clocks should be between 40-60% of amplitude. R should be clocked continuously treadout = (520 * tline) Integration time (tint) is user specified. Longer integration times will degrade noise performance due to dark signal fixed pattern and shot noise tline = (3 * tV) + tHS + (796* te) + te www.truesenseimaging.com Revision 1.0 PS-0028 Pg 15 KAF-0402 Image Sensor FRAME TIMING Frame Timing tint Treadout 1 Frame = 520 Lines V1 Line V2 1 2 519 520 H1 H2 Figure 8: Frame Timing Diagram LINE TIMING AND PIXEL TIMING Line Timing Detail Pixel Timing Detail 1 line = 796 Pixels tV V1 tV tR R H1 V2 te tHS H1 1 count te H2 Vpix H2 Vout 796 counts Vsat R Vdark Vodc Vsub Line Content 1-10 11-14 15 - 782 Photoactive Pixels 783-794 795-796 Dummy Pixels Vsat Vdark Jdark Vpix Vodc Vsub Saturated pixel video output signal output signal in no light situation, not zero due to Video Pixel video output signal level, more electrons =more negative* Video level offset with respect to vsub Analog Ground * See Image Aquisition section (page 4) Dark Reference Pixels Figure 9: Line and Pixel Timing Diagrams www.truesenseimaging.com Revision 1.0 PS-0028 Pg 16 KAF-0402 Image Sensor Storage and Handling ENVIRONMENTAL EXPOSURE STORAGE CONDITIONS Description Symbol Storage Temperature TST Humidity RH Notes: 1. Minimum 5 Maximum Units 100 C 90 % Notes 1 T = 25 C. Excessive humidity will degrade MTTF. ESD 1. This device contains limited protection against Electrostatic Discharge (ESD). ESD events may cause irreparable damage to a CCD image sensor either immediately or well after the ESD event occurred. Failure to protect the sensor from electrostatic discharge may affect device performance and reliability. 2. Devices should be handled in accordance with strict ESD procedures for Class 0 (<250 V per JESD22 Human Body Model test), or Class A (<200 V JESD22 Machine Model test) devices. Devices are shipped in static-safe containers and should only be handled at static-safe workstations. 3. See Application Note Image Sensor Handling Best Practices for proper handling and grounding procedures. This application note also contains workplace recommendations to minimize electrostatic discharge. 4. Store devices in containers made of electroconductive materials. COVER GLASS CARE AND CLEANLINESS 1. The cover glass is highly susceptible to particles and other contamination. Perform all assembly operations in a clean environment. 2. Touching the cover glass must be avoided. 3. Improper cleaning of the cover glass may damage these devices. Refer to Application Note Image Sensor Handling Best Practices. www.truesenseimaging.com 1. Extremely bright light can potentially harm CCD image sensors. Do not expose to strong sunlight for long periods of time, as the color filters and/or microlenses may become discolored. In addition, long time exposures to a static high contrast scene should be avoided. Localized changes in response may occur from color filter/microlens aging. For Interline devices, refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible lighting Conditions. 2. Exposure to temperatures exceeding maximum specified levels should be avoided for storage and operation, as device performance and reliability may be affected. 3. Avoid sudden temperature changes. 4. Exposure to excessive humidity may affect device characteristics and may alter device performance and reliability, and therefore should be avoided. 5. Avoid storage of the product in the presence of dust or corrosive agents or gases, as deterioration of lead solderability may occur. It is advised that the solderability of the device leads be assessed after an extended period of storage, over one year. SOLDERING RECOMMENDATIONS 1. The soldering iron tip temperature is not to exceed 370 C. Higher temperatures may alter device performance and reliability. 2. Flow soldering method is not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. Recommended method is by partial heating using a grounded 30 W soldering iron. Heat each pin for less than 2 seconds duration. Revision 1.0 PS-0028 Pg 17 KAF-0402 Image Sensor Mechanical Information COMPLETED ASSEMBLY Figure 10: Completed Assembly (1 of 2) www.truesenseimaging.com Revision 1.0 PS-0028 Pg 18 KAF-0402 Image Sensor Figure 11: Completed Assembly (2 of 2) www.truesenseimaging.com Revision 1.0 PS-0028 Pg 19 KAF-0402 Image Sensor Quality Assurance and Reliability QUALITY AND RELIABILITY All image sensors conform to the specifications stated in this document. This is accomplished through a combination of statistical process control and visual inspection and electrical testing at key points of the manufacturing process, using industry standard methods. Information concerning the quality assurance and reliability testing procedures and results are available from Truesense Imaging upon request. For further information refer to Application Note Quality and Reliability. REPLACEMENT All devices are warranted against failure in accordance with the Terms of Sale. Devices that fail due to mechanical and electrical damage caused by the customer will not be replaced. LIABILITY OF THE SUPPLIER A reject is defined as an image sensor that does not meet all of the specifications in this document upon receipt by the customer. Product liability is limited to the cost of the defective item, as defined in the Terms of Sale. LIABILITY OF THE CUSTOMER Damage from mishandling (scratches or breakage), electrostatic discharge (ESD), or other electrical misuse of the device beyond the stated operating or storage limits, which occurred after receipt of the sensor by the customer, shall be the responsibility of the customer. TEST DATA RETENTION Image sensors shall have an identifying number traceable to a test data file. Test data shall be kept for a period of 2 years after date of delivery. MECHANICAL The device assembly drawing is provided as a reference. Truesense Imaging reserves the right to change any information contained herein without notice. All information furnished by Truesense Imaging is believed to be accurate. Life Support Applications Policy Truesense Imaging image sensors are not authorized for and should not be used within Life Support Systems without the specific written consent of Truesense Imaging, Inc. www.truesenseimaging.com Revision 1.0 PS-0028 Pg 20 KAF-0402 Image Sensor Revision Changes MTD/PS-0509 Revision Number Description of Changes 1.0 Corrected Figure 4 Updated DC Operating Conditions, Section 2.4. Updated CCD Parameters Specific to Low Gain (high dynamic range) Output Amplifier (page 13) 2.0 Corrected Figure 4. (Pixel locations incorrect.) Updated DC Operating Conditions for Output Gate (Section 2.4). Updated CCD parameters Specific to Low Gain (High Dynamic Range) Output Amplifier for Dynamic Range (page 13). Removed appendix. 3.0 First version of the document in S9K. Formerly Revision 2 in hard copy format. Removed Class 0 from the Cosmetic Specification and UV coated device. (Section 3.2) Added ESD classification. (Section 2.3) Replaced Quality and Reliability notes with current format. (Section 4.2) 4.0 Update specification format Updated Completed Assembly Drawing 5.0 Removed 4H0333 PS-0028 Revision Number 1.0 Description of Changes Initial release with new document number, updated branding and document template Updated Storage and Handling and Quality Assurance and Reliability sections www.truesenseimaging.com (c)Truesense Imaging Inc., 2012. TRUESENSE is a registered trademark of Truesense Imaging, Inc. Revision 1.0 PS-0028 Pg 21