Data Sheet
December 12, 2008
EQW012/020/023/025 Series Eighth-Brick DC-DC Converters:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output Current
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS03-74 ver. 1.23
PDF name: eqw_12-25-ds.pdf
Applications
Distributed power architectures
Wireless Networks
Enterprise Networks
Optical and Access Network Equipment
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications.
Options
Remote On/Off logic (positive or negative)
Surface Mount (-S Suffix)
Short pins
Alternative output voltage adjustment equations
(1.2V output only, -V Suffix)
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
Delivers up to 25A Output current
High efficiency – 88% at 3.3V full load (Vin = 48Vdc)
Low output ripple and noise
Surface mount or through hole
Industry standard Eight brick footprint
57.9mm x 22.8mm x 8.5mm(MAX)
(2.28in x 0.9in x 0.335in)
Constant switching frequency
Remote On/Off Positive logic (primary referenced)
Remote Sense
Adjustable output voltage (± 10%)
Output overvoltage and overcurrent protection
Input undervoltage lockout
Output overcurrent and overvoltage protection
Over-temperature protection
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1 Recognized, CSA† C22.2 No. 60950-1-
03 Certified, and VDE‡ 0805 (IEC60950, 3rd edition)
Licensed
ISO** 9001 and ISO14001 certified manufacturing
facilities
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for
Basic insulation rating per IEC60950 3rd edition
Description
The EQW series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 25A of output
current and provide a precisely regulated output voltage over a wide range of input voltages (Vi = 36 -75Vdc). The
modules achieve full load efficiency of 88% at 3.3V output voltage. The open frame modules construction, available
in both surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions.
Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and
overtemperature protection.
RoHS Compliant
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage EQW VIN -0.3 80 Vdc
Continuous
Transient (100ms) EQW VIN, trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation Voltage (100% factory Hi-Pot tested) All ⎯ ⎯ 1500 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current All IIN,max 3 Adc
(VIN=0V to 75V, IO=IO, max)
Input No Load Current All IIN,No load 75 mA
(Vin = 48Vdc, Io = 0, module enabled)
Input Stand-by Current All IIN,stand-by 3 mA
(Vin = 48Vdc, module disabled)
Inrush Transient All I2t 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; VIN=0V
to 75V, IO= IOmax ; see Test Configuration section)
All 13 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
EMC, EN55022 See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 6A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point 1.2 Vdc VO, set 1.18 1.2 1.22 Vdc
(VIN=VIN,nom, IO=IO, max, Tref=25°C) 1.5 Vdc VO, set 1.47 1.5 1.53 Vdc
1.8 Vdc VO, set 1.76 1.8 1.84 Vdc
2.5V dc VO, set 2.45 2.5 2.55 Vdc
3.3 Vdc VO, set 3.25 3.3 3.35 Vdc
5.0 Vdc VO, set 4.90 5.0 5.10 Vdc
Output Voltage 1.2 Vdc VO 1.16 ⎯ 1.24 Vdc
(Over all operating input voltage, resistive load, 1.5 Vdc VO 1.45 ⎯ 1.55 Vdc
and temperature conditions until end of life) 1.8 Vdc VO 1.74 ⎯ 1.86 Vdc
2.5V dc VO 2.42 ⎯ 2.57 Vdc
3.3 Vdc VO 3.2 ⎯ 3.4 Vdc
5.0 Vdc VO 4.85 ⎯ 5.15 Vdc
Adjustment Range 1.8Vdc VO -10 ⎯ +12 % VO, set
Selected by external resistor 2.5Vdc VO -10 ⎯ +20 % VO, set
3.3Vdc VO -20 ⎯ +10 % VO, set
All others VO -10.0 ⎯ +10 % VO, set
Output Regulation
Line (VIN=VIN, min to VIN, max) All
⎯ ⎯ 0.1 % VO, set
Load (IO=IO, min to IO, max) All
⎯ ⎯ 10 mV
Temperature (Tref=TA, min to TA, max) All
⎯ 0.2 ⎯ % VO, set
Output Ripple and Noise on nominal output
measured with 10μF Tantalum, 1μF ceramic
(VIN=VIN, nom and IO=IO, min to IO, max)
RMS (5Hz to 20MHz bandwidth) 5.0 Vdc ⎯ 18 35 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) 5.0 Vdc ⎯ 50 90 mVpk-pk
RMS (5Hz to 20MHz bandwidth) All others ⎯ 8 20 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All others ⎯ 40 75 mVpk-pk
External Capacitance* 5.0 Vdc CO, max 0 ⎯ 3000 μF
All others CO, max 0 ⎯ 5000 μF
Output Current 1.2 Vdc Io 0 ― 25.0 Adc
1.5 Vdc Io 0 ― 25.0 Adc
1.8 Vdc Io 0 ― 25.0 Adc
2.5V dc Io 0 ― 23.0 Adc
3.3 Vdc Io 0 ― 20.0 Adc
5.0 Vdc Io 0 ― 12.0 Adc
Output Current Limit Inception 1.2 Vdc IO, lim ⎯ 35 ⎯ Adc
(Vo = 90% of VO, set) 1.5 Vdc IO, lim ⎯ 35 ⎯ Adc
1.8 Vdc IO, lim ⎯ 35 ⎯ Adc
2.5V dc IO, lim ⎯ 30 ⎯ Adc
3.3 Vdc IO, lim ⎯ 25 ⎯ Adc
5.0 Vdc IO, lim ⎯ 15 ⎯ Adc
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 4
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Short-circuit Current 1.2 Vdc Io,sc ⎯ 42 ⎯ Adc
(Vo = 0.25V) 1.5 Vdc Io,sc ⎯ 42 ⎯ Adc
1.8 Vdc
Io,sc ⎯ 42 ⎯ Adc
2.5V dc
Io,sc ⎯ 40 ⎯ Adc
3.3 Vdc
Io,sc ⎯ 37 ⎯ Adc
5.0 Vdc
Io,sc ⎯ 25 ⎯ Adc
Efficiency 1.2 Vdc η ⎯ 81.0 ⎯ %
VIN=VIN, nom, TA=25°C 1.5 Vdc η ⎯ 81.0 ⎯ %
IO=IO, max , VO= VO,set 1.8 Vdc η ⎯ 84.0 ⎯ %
2.5V dc η ⎯ 87.0 ⎯ %
3.3 Vdc η ⎯ 88.0 ⎯ %
5.0 Vdc η ⎯ 91.0 ⎯ %
Switching Frequency All fsw ⎯ 285 ⎯ kHz
Dynamic Load Response
(ΔIo/Δt=0.1A/μs; Vin=Vin,set; TA=25°C) All Vpk ⎯ 200 ⎯ mV
Load Change from Io= 50% to 75% of Io,max;
10μF Tantalum, 1μF ceramic external capacitance
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts ⎯ 200 ⎯ μs
(ΔIo/Δt=0.1A/μs; Vin=Vin,set; TA=25°C) All Vpk ⎯ 200 ⎯ mV
Load Change from Io= 50% to 25% of Io,max;
10μF Tantalum, 1μF ceramic external capacitance
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts ⎯ 200 ⎯ μs
Isolation Specifications
Parameter Symbol Min Typ Max Unit
Isolation Capacitance CISO ⎯ 1000 ⎯ pF
Isolation Resistance RISO 10 ⎯ ⎯ MΩ
General Specifications
Parameter Device Min Typ Max Unit
MTBF F-S 3,287,361 Hours
Calculated Reliability Based upon Telcordia SR-
332 Issue 2: Method I, Case 1, (IO=80%IO, max,
TA=40°C, Airflow = 200 lfm), 90% confidence FIT F-S 304 109/Hours
Weight ⎯ 15.2 (0.6) ⎯ g (oz.)
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 5
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low Specification
Remote On/Off Current – Logic Low All Ion/off ⎯ 0.15 1.0 mA
On/Off Voltage:
Logic Low All Von/off -0.7 ⎯ 1.2 V
Logic High – (Typ = Open Collector) All Von/off ⎯ ⎯ 15 V
Logic High maximum allowable leakage current All Ion/off ⎯ ⎯ 10 μA
Turn-On Delay and Rise Times
(VI =48Vdc, IO=IO, max , VO to within ±1% of steady state)
Case 1: On/Off input is set to Logic high and then
input power is applied (delay from instant at
which VI = VI,min until Vo = 10% of Vo, set)
All Tdelay 20 msec
Case 2: Input power is applied for at least one
second and then the On/Off input is set to logic high
(delay from instant at which Von/Off = 0.9V until Vo
= 10% of Vo, set)
All Tdelay 12 msec
Output voltage Rise time (time for Vo to rise from
10% of Vo, set to 90% of Vo, set)
All Trise ― 0.9 ― msec
Output voltage overshoot
(Io = 80% of Io,max, VI = 48Vdc TA=25°C) All ― ― 5 %VO, set
Output Voltage Remote Sense
1.2, 1.5,
1.8Vdc ― ― 0.25 Vdc
2.5, 3.3,
5.0 Vdc ― ― 10 %VO, set
Output Overvoltage Protectionn (Clamp) 1.2 Vdc VO, limit ⎯ 2.0 2.8 Vdc
1.5 Vdc VO, limit ⎯ 2.3 3.2 Vdc
1.8 Vdc VO, limit ⎯ 2.3 3.2 Vdc
2.5V dc VO, limit ⎯ 3.1 3.7 Vdc
3.3 Vdc VO, limit ⎯ 4.0 4.6 Vdc
5.0 Vdc VO, limit ⎯ 6.1 7.0 Vdc
Overtemperature Protection All Tref ⎯ 125 ⎯ °C
(See thermal section)
Input Undervoltage Lockout
Turn-on Threshold All ― 32 36 Vdc
Turn-off Threshold
All 25 27 ― V
dc
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 6
Characteristic Curves
The following figures provide typical characteristics for the EQW025A0P1 (1.2V, 25A) at 25ºC. The figures are
identical for either positive or negative Remote On/Off logic.
70
72
74
76
78
80
82
84
86
0 5 10 15 2 0 2 5
Vin=75V
Vin=36V
Vin=48V
0
3
6
9
12
15
18
21
24
27
20 30 40 50 60 70 80 90
200 LFM
300 LFM
400 LFM
NC
100 LFM
EFFICIENCY (%)
OUTPUT CURRENT, Io (A)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 1. Typical Converter Efficiency Vs. Output
current at Room Tem per ature. Figure 4. . Derating Output Current versus Local
Ambient Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
TIME, t (1μs/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 2. Typical Output Ripple and Noise (Vin
=48Vdc, Io = 25A). Figure 5. Typical Start-Up with application of Vin (Vin =
48Vdc, Io = 25A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
TIME, t (100μs/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 3. Typical Transient Response to Dynamic
Load change Load from 50% to 75% to 50% of Full
load at 48 Vdc Input.
Figure 6. Typical Start-Up Using Remote On/Off,
negative logic versio n shown (Vin = 48Vdc, Io = 25A ).
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 7
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW025A0M (1.5V, 25A) at 25ºC. The figures are
identical for either positive or negative Remote On/Off logic.
70
72
74
76
78
80
82
84
86
88
0510152025
Vin=75V
Vin=36V
Vin=48V
0
3
6
9
12
15
18
21
24
27
20 30 40 50 60 70 80 90
200 LFM
300 LFM
400 LFM
NC
100 LFM
EFFICIENCY (%)
OUTPUT CURRENT, Io (A)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 7. Typical Converter Efficiency Vs. Output
current at Room Tem per ature. Figure 10. . Derating Output Current versus Local
Ambient Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
TIME, t (1μs/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 8. Typical Output Ripple and Noise (Vin
=48Vdc, Io = 25A). Figure 11. Typical Start-Up with application of Vin (Vin
= 48Vdc, Io = 25A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (5A/div) VO (V) (200mV/div)
TIME, t (100μs/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 9. Typical Transient Response to Dynamic
Load change Load from 50% to 75% to 50% of Full
load at 48 Vdc Input.
Figure 12. Typical Start-Up Using Remote On/Off,
negative logic versio n shown (Vin = 48Vdc, Io = 25A).
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 8
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW025A0Y (1.8V, 25A) at 25ºC. The figures are
identical for either positive or negative Remote On/Off logic.
72
74
76
78
80
82
84
86
88
90
0 5 10 15 20 25
Vin=75V
Vin=36V
Vin=48V
0
3
6
9
12
15
18
21
24
27
20 30 40 50 60 70 80 90
200 LFM
300 LFM
400 LFM
NC
100 LFM
EFFICIENCY (%)
OUTPUT CURRENT, Io (A)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 13. Typical Converter Efficiency Vs. Output
current at Room Tem per ature. Figure 16. . Derating Output Current versus Local
Ambient Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
TIME, t (1μs/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 14. Typical Output Ripple and Noise (Vin
=48Vdc, Io = 25A). Figure 17. Typical Start-Up with application of Vin (Vin
= 48Vdc, Io = 25A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
TIME, t (100μs/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 15. Typical Transient Response to Dynami c
Load change Load from 50% to 75% to 50% of Full
load at 48 Vdc Input.
Figure 18. Typical Start-Up Using Remote On/Off,
negative logic versio n shown (Vin = 48Vdc, Io = 25A).
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 9
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW023A0G (2.5V, 23A) at 25ºC. The figures are
identical for either positive or negative Remote On/Off logic.
74
76
78
80
82
84
86
88
90
92
0 5 10 15 2 0 2 5
Vin=75V
Vin=36V
Vin=48V
0
3
6
9
12
15
18
21
24
20 30 40 50 60 70 80 90
10 0 L F M
200 LFM
400 LFM
NC
300 LFM
EFFICIENCY (%)
OUTPUT CURRENT, Io (A)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 19. Typical Converter Efficiency Vs. Output
current at Room Tem per ature. Figure 22. . Derating Output Current versus Local
Ambient Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
TIME, t (1μs/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 20. Typical Output Ripple and Noise (Vin
=48Vdc, Io = 23A). Figure 23. Typical Start-Up with application of Vin (Vin
= 48Vdc, Io = 23A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
TIME, t (100μs/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 21. Typical Transient Response to Dynami c
Load change Load from 50% to 75% to 50% of Full
load at 48 Vdc Input.
Figure 24. Typical Start-Up Using Remote On/Off,
negative logic versio n shown (Vin = 48Vdc, Io = 23A).
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 10
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW020A0F (3.3V, 20A) at 25ºC. The figures are identical
for either positive or negative Remote On/Off logic.
70
73
76
79
82
85
88
91
048121620
Vin=48V
Vin=75V
Vin=36V
0
2
4
6
8
10
12
14
16
18
20
22
20 30 40 50 60 70 80 90
10 0 L F M
200 LFM
400 LFM
NC
300 LFM
EFFICIENCY (%)
OUTPUT CURRENT, Io (A)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 25. Typical Converter Efficiency Vs. Output
current at Room Tem per ature. Figure 28 . Derating Output Current versus Local
Ambient Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
TIME, t (1μs/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 26. Typical Output Ripple and Noise (Vin
=48Vdc, Io = 20A). Figure 29. Typical Start-Up with application of Vin (Vin
= 48Vdc, Io = 20A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
TIME, t (100μs/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div VO (V) (1V/div)
TIME, t (5ms/div)
Figure 27. Typical Transient Response to Dynami c
Load change Load from 50% to 75% to 50% of Full
load at 48 Vdc Input.
Figure 30. Typical Start-Up Using Remote On/Off,
negative logic versio n shown (Vin = 48Vdc, Io = 20A).
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 11
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW012A0A (5.0V, 12A) at 25ºC. The figures are
identical for either positive or negative Remote On/Off logic.
70
73
76
79
82
85
88
91
94
036912
Vin=75V
Vin=36V
Vin=48V
0
2
4
6
8
10
12
14
20 30 40 50 60 70 80 90
200 LFM
300 LFM
400 LFM
NC
10 0 L F M
EFFICIENCY (%)
OUTPUT CURRENT, Io (A)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 31. Typical Converter Efficiency Vs. Output
current at Room Tem per ature. Figure 34 . Derating Output Current versus Local
Ambient Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
TIME, t (1μs/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 32. Typical Output Ripple and Noise (Vin
=48Vdc, Io = 12A). Figure 35. Typical Start-Up with application of Vin (Vin
= 48Vdc, Io = 12A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
TIME, t (100μs/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (5ms/div)
Figure 33. Typical Transient Response to Dynami c
Load change Load from 50% to 75% to 50% of Full
load at 48 Vdc Input.
Figure 36. Typical Start-Up Using Remote On/Off,
negative logic versio n shown (Vin = 48Vdc, Io = 12A).
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 12
Test Configurations
E.S.R.
<0.1Ω
@ 100kHz
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1Ω
@ 20°C 100kHz
33μF
VIN(+)
VIN(-)
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 37. Input Reflected Ripple Current Test
Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
1uF
.
RESI STI V E
LO A D
SC O PE
COPPER STRIP
GROUND PLANE
10uF
Figure 38. Output Ripple and Noise Test Setup.
VO
COM
VIN
(
+
)
VIN
(
-
)
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 39. Outp ut Voltage and Effici ency Te st
Setup.
η =
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
The power module should be connected to a low
ac-impedance source. A highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 37, a
33μF electrolytic capacitor (ESR<0.7Ω at 100kHz),
mounted close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e., UL60950-1, CSA C22.2 No. 60950-1-
03 and VDE 0805 (IEC60950, 3rd Ed).
These converters have been evaluated to the spacing
requirements for Basic Insulation, per the above
safety standards; and 1500Vdc is applied from Vin to
Vout to 100% of outgoing production..
For end products connected to –48V dc, or –60Vdc
nominal DC MAINS (i.e. central office dc battery
plant), no further fault testing is required. *Note: -60V
dc nominal battery plants are not available in the U.S.
or Canada.
For all input voltages, other than DC MAINS, where
the input voltage is less than 60V dc, if the input
meets all of the requirements for SELV, then:
• The output may be considered SELV. Output
voltages will remain within SELV limits even with
internally-generated non-SELV voltages. Single
component failure and fault tests were performed
in the power converters.
• One pole of the input and one pole of the output
are to be grounded, or both circuits are to be kept
floating, to maintain the output voltage to ground
voltage within ELV or SELV limits.
For all input sources, other than DC MAINS, where
the input voltage is between 60 and 75V dc
(Classified as TNV-2 in Europe), the following must
be adhered to, if the converter’s output is to be
evaluated for SELV:
• The input source is to be provided with reinforced
insulation from any hazardous voltage, including
the AC mains.
• One Vi pin and one Vo pin are to be reliably
earthed, or both the input and output pins are to
be kept floating.
• Another SELV reliability test is conducted on the
whole system, as required by the safety
agencies, on the combination of supply source
and the subject module to verify that under a
single fault, hazardous voltages do not appear at
the module’s output.
The power module has ELV (extra-low voltage)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, and UL60950 A.2 for
reduced thickness. The input to these units is to be
provided with a maximum 6A time- delay in the
unearthed lead.
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 13
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the ON/OFF
terminal and the VIN(-) terminal (Figure 40). Logic low
is –0.7V ≤ Von/off ≤ 1.2V. The maximum Ion/off during
a logic low is 1mA, the switch should be maintain a
logic low level while sinking this current.
During a logic high, the typical Von/off generated by the
module is 15V, and the maximum allowable leakage
current at Von/off = 15V is 10μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
ON/OFF
VIN(+)
VIN
(
-
)
Ion/off
Von/off
VO
COM
Figure 40. Circuit configuration for using Remote
On/Off Implementation.
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 41). The voltage between
the remote-sense pins and the output terminals must
not exceed the output voltage sense range given in
the Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSSE
S
SUPPLY II
CONTACT
RESISTANCE
Figure 41. Effective Circuit Configuration for
remote sense operation.
Output Voltage Set-Point Adjustment (Trim)
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin (COM pin) .
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 42. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the Vo(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±0.1%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 14
Feature Description (Continued)
Output Voltage Set-Point Adjustment (Trim)
(Continued)
For output voltage: 1.2 V to 12V
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−
Δ
=− 2.10
%
510
downRtrim
Where
100
,
,
%×
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛−
=Δ setVoVdesiredsetVo
For example, to trim-down the output voltage of 2.5V
module (EQW023A0G1) by 8% to 2.3V, Rtrim-down
is calculated as follows:
8% =Δ
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−=− 2.10
8
510
downRtrim
ΚΩ=− 55.53downRtrim
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equations
determine the required external resistor value to
obtain a percentage output voltage change of Δ%:
For output voltage: 1.5 V to 12V
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−
Δ
−
Δ×
Δ+××
=− 2.10
%
510
%225.1 %)100(,1.5 setVo
upRtrim
For output voltage: 1.2
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−
Δ
−
Δ×
Δ+××
=− 2.10
%
510
%6.0 %)100(,1.5 setVo
upRtrim
Where
100
,,
%×
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛−
=Δ setVo setVoVdesired
For example, to trim-up the output voltage of 1.5V
module (EQW025A0M1) by 6% to 1.59V, Rtrim-up is
calculated is as follows:
6% =Δ
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−−
×
+××
=− 2.10
6
510
6225.1 )6100(5.11.5
upRtrim
ΚΩ=
−
12.15upRtrim
Alternative voltage programming for output
voltage: 1.2V (-V Option )
An alternative set of trimming equations is available
as an option for 1.0V and 1.2V output modules, by
ordering the –V option. These equations will reduce
the resistance of the external programming resistor,
making the impedance into the module trim pin lower
for applications in high electrical noise applications.
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−
Δ
=
−2
%
100
downtrim
R
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡
Δ
=
−%
100
uptrim
R
Where 100% ,
,×
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛−
=Δ
seto
setodesired
V
VV
For example, to trim-up the output voltage of 1.2V
module (EQW025A0P/P1-V) by 5% to 1.26V, Rtrim-up
is calculated is as follows:
5% =
Δ
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡
=
−5
100
uptrim
R
ΚΩ=
−0.20
uptrim
R
The value of the external trim resistor for the optional
–V 1.2V module is only 20% of the value required with
the standard trim equations.
At 48Vin (+/- 2.5V), EQW series modules can be trim
down to 20% over the entire temperature range. This
allows for margining the unit during manufacturing
process if the set point voltage is lower than the
standard output voltage. Please consult your local
Lineage Power field application engineer for
additional details.
The voltage between the Vo(+) and Vo(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (Maximum rated
power = Vo,set x Io,max).
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 15
Feature Description (Continued)
Overcurrent Protection
To provide protection in a fault (output overload)
condi¬tion, the module is equipped with internal
current-limiting circuitry, and can endure current
limiting continuously. At the instance of current-limit
inception, the output current begins to tail-out. When
an overcurrent condition exists beyond a few
seconds, the module enters a “hiccup” mode of
opera¬tion, whereby it shuts down and automatically
attempts to restart upon cooling. While the fault
condition exists, the module will remain in this hiccup
mode, and can remain in this mode until the fault is
cleared. The unit operates normally once the output
current is reduced back into its specified range.
Output Over Voltage Protection
The output overvoltage protection clamp consists of
control circuitry, independent of the primary regulation
loop, that monitors the voltage on the output
terminals. This control loop has a higher voltage set
point than the primary loop (See the overvoltage
clamp values in the Feature Specifications Table). In
a fault condition, the overvoltage clamp ensures that
the output voltage does not exceed Vo,ovsd, max.
This provides a redundant voltage-control that
reduces the risk of output overvoltage.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will begin to operate at an input voltage between the
undervoltage lockout limit and the minimum operating
input voltage.
Overtemperature Protection
To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point
Tref (Figure 43), exceeds 125oC (typical), but the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module will automatically restarts after it cools
down.
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, Tref used in the
specifications is shown in Figure 43. For reliable
operation this temperature should not exceed 115 oC.
The output power of the module should not exceed
the rated power for the module (Vo, set x Io, max).
Air Flow
Tref
Figure 43. Tref Temperature Measurement
Location.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
for natural convection and up to 2m/s (400 ft./min) are
shown in the respective Characteristics Curves
section.
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 16
EMC Considerations
The figure 44 shows a suggested configuration to
meet the conducted emission limits of EN55022 Class
B.
Vin+
EQW
Vin-
Vout+
Vout-
LC1
Cim
CX1
CX4
CX2 CX3
Ld1
CX5 CY1
CY2
Figure 44. Suggested Input Filter Configuration
for EN55022 Clas s B.
Filter components:
Cx1: 47uF aluminum electrolytic, 100V (Nichicon PW series)
Cx2: 2x1uF ceramic, 100V (TDK C4532X7R2A105M)
Cx3: 2x1uF ceramic, 100V (TDK C4532X7R2A105M)
Cx4: 2x1uF ceramic, 100V (TDK C4532X7R2A105M)
Cx5: 100uF aluminum electrolytic, 100V (Nichicon PW
series)
Cy3, Cy4: 3300pF ceramic, 1500V (AVX
1812SC332MAT1A)
Cim: 3300pF ceramic, 1500V (AVX 1812SC332MAT1A)
Lc1: 768 uH, 4.7A (Pulse Engineering P0422)
Ld1: 4.7 uH, 5.5A (Vishay IHLP-2525CZ)
0
10
20
30
40
50
60
70
80
Level [dBµV]
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
Frequency [Hz]
+
EN55022 C lass B Conducted Average dBuV
Figure 45. EMC signature using recommended
filter.
For further information on designing for EMC
compliance, please refer to the FLTR100V10 data
sheet (FDS01-043EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. Recommended SMT layout
shown in the mechanical section are for reference
only. SMT layout depends on the end PCB
configuration and the location of the load. For
additional layout guide-lines, refer to FLTR100V10
data sheet or contact your local Lineage Power field
application engineer.
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 17
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top View
Side View
* OPTIONAL PIN LENGTHS SHOWN IN TABLE 2 DEVICE OPTIONS
Bottom View
Pin Function
1 VI(+)
2 On/Off
3 VI(-)
4 Vo(-)
5 Sense(-)
6 Trim
7 Sense(+)
8 Vo(+)
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 18
Mechanical Outline for Surface Mount Power module.
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top View
Side View
Bottom View
Pin Function
1 VI(+)
2 On/Off
3 VI(-)
4 Vo(-)
5 Sense(-)
6 Trim
7 Sense(+)
8 Vo(+)
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 19
Recommended Pad Layout for Surface-Mount Modules
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Low Current
High Current
0
1.
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 20
Recommended Pad Layout for Through-Hole modules
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Component side
view
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 21
Packaging Details
The surface mount versions of the EQW surface
mount modules (suffix –S) are supplied as standard in
the plastic tray shown in Figure 46. The tray has
external dimensions of 135.1mm (W) x 321.8mm (L) x
12.42mm (H) or 5.319in (W) x 12.669in (L) x 0..489in
(H).
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012Ω/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1box of 4 full
trays)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.
Figure 46. Surface Mount Packaging Tray.
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 22
Through-Hole Soldering Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Surface Mount Information
Pick and Place
The SMT versions of the EQW series of DC-to-DC
power converters use an open-frame construction and
are designed for surface mount assembly within a
fully automated manufacturing process.
The EQW-S series modules are fitted with a Kapton
label designed to provide a large flat surface for pick
and placing. The label is located covering the center
of gravity of the power module. The label meets all
the requirements for surface-mount processing, as
well as meeting UL safety agency standards. The
label will withstand reflow temperatures up to 300°C.
The label also carries product information such as
product code, date and location of manufacture.
Figure 47. Pick and Place Location.
Z plane Height
The ‘Z’ plane height of the pick and place label is 9.15
mm (0.360 in) nominal with an RSS tolerance of +/-
0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional smt components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm. Oblong or oval nozzles
up to 11 x 9 mm may also be used within the space
available.
For further information please contact your local
Lineage Power Technical Sales Representative.
Reflow Soldering Information
The surface mountable modules in the EQW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 48 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.
EQW Board
Insulator
Solder Ball
End assembly PCB
Figure 48. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn63/Pb37) solder for non-Z codes, or
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 23
Surface Mount Information (continued)
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb
solder is shown in Figure 49 and 50. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP (°C)
0
50
10 0
15 0
200
250
300
Preheat zo ne
max 4
o
Cs
-1
Soak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Co oling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 49. Recommended Reflow Profile for Sn/Pb
Solder.
MAX TEMP SOLDER (°C)
200
205
210
215
220
225
230
235
240
0 102030405060
TIME LIMIT (S)
Figure 50. Time Limit, Tlim, Curv e Above 205oC
Reflow .
Lead Free Soldering
The –Z version SMT modules of EQW series are
lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 51.
Pe r J-STD-020 Re v. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Hea ting Zone
1°C/Second
Pe ak Temp 260°C
* Min. Time Above 235°C
15 Seco nds
*Time Above 217°C
60 Sec o nds
Cooling
Zone
Figure 51. Recommended linear reflow profile
using Sn/Ag/Cu solder .
MSL Rating
The EQW series SMT modules have a MSL rating of
2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Pow er Module s : Sold ering a nd Clean in g
Application Note (AN04-001).
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2
V
dc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 24
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product codes Input Voltage Output
Voltage Output
Current Efficiency Connector
Type Comcodes
EQW025A0P1 48V (36-75Vdc) 1.2 V 25 A 81.0 % Through hole 108981960
EQW025A0P1-V 48V (36-75Vdc) 1.2 V 25 A 81.0 % Through hole CC109120763
EQW025A0M1 48V (36-75Vdc) 1.5 V 25 A 81.0 % Through hole 108980632
EQW025A0Y1 48V (36-75Vdc) 1.8 V 25 A 84.0 % Through hole 108981978
EQW023A0G1 48V (36-75Vdc) 2.5V 23 A 87.0 % Through hole 108980624
EQW020A0F1 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole 108981952
EQW012A0A1 48V (36-75Vdc) 5.0 V 12 A 91.0 % Through hole 108984444
EQW023A0G1-S 48V (36-75Vdc) 2.5V 23 A 87.0 % SMT 108980921
EQW020A0F1-S 48V (36-75Vdc) 3.3 V 20 A 88.0 % SMT 108980905
EQW012A0A1-S 48V (36-75Vdc) 5.0 V 12 A 91.0 % SMT 108980889
EQW025A0P1Z 48V (36-75Vdc) 1.2 V 25 A 81.0 % Through hole CC109107083
EQW025A0M1Z 48V (36-75Vdc) 1.5 V 25 A 81.0 % Through hole CC109107067
EQW025A0Y1Z 48V (36-75Vdc) 1.8 V 25 A 84.0 % Through hole CC109107091
EQW020A0F1Z 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole CC109107050
EQW012A0A1Z 48V (36-75Vdc) 5.0 V 12 A 91.0 % Through hole CC109104972
EQW025A0P1-SZ 48V (36-75Vdc) 1.2 V 25 A 81.0 % SMT 109100187
EQW025A0M1-SZ 48V (36-75Vdc) 1.5 V 25 A 81.0 % SMT 109100204
EQW020A0F1-SZ 48V (36-75Vdc) 3.3 V 20 A 88.0 % SMT 109100170
EQW012A0A1-SZ 48V (36-75Vdc) 5.0 V 12 A 91.0 % SMT 109100162
Data Sheet
December 12, 2008 EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
Document No: DS03-74 ver. 1.23
PDF name: eqw_12-25-ds.pdf
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application. No rights under any patent accompany the sale of any such product(s) or information.
© 2008 Lineage Power Corporation, (Mesquite, Texas) All International Rights Reserved.
Table 2. Device Options
Option Suffix*
Negative remote on/off logic 1
Short Pins: 3.68 mm ± 0.25 mm (0.145 in ±0.010 in) 6
Short Pins: 2.79 mm ± 0.25 mm (0.110 in ±0.010 in) 8
Surface mount connections -S
Alternative Voltage Programming equations (1.0V and 1.2V modules only) -V
RoHS Compliant -Z
*Note: Legacy device codes may contain a –B option suffix to indicate 100% factory Hi-Pot tested to the isolation voltage specified
in the Absolute Maximum Ratings table. The 100% Hi-Pot test is now applied to all device codes, with or without the –B option
suffix. Existing comcodes for devices with the –B suffix are still valid; however, no new comcodes for devices containing the –B
suffix will be created.
