LM4808
LM4808 Dual 105 mW Headphone Amplifier
Literature Number: SNAS051C
LM4808
Dual 105 mW Headphone Amplifier
General Description
The LM4808 is a dual audio power amplifier capable of
delivering 105mW per channel of continuous average power
into a 16Ωload with 0.1% (THD+N) from a 5V power supply.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components using surface mount packaging. Since
the LM4808 does not require bootstrap capacitors or snub-
ber networks, it is optimally suited for low-power portable
systems.
The unity-gain stable LM4808 can be configured by external
gain-setting resistors.
Key Specifications
nTHD+N at 1kHz at 105mW continuous average output
power into 16Ω0.1% (typ)
nTHD+N at 1kHz at 70mW continuous average output
power into 32Ω0.1% (typ)
nOutput power at 0.1% THD+N at 1kHz into 32Ω70mW
(typ)
Features
nLLP, MSOP, and SOP surface mount packaging
nSwitch on/off click suppression
nExcellent power supply ripple rejection
nUnity-gain stable
nMinimum external components
Applications
nHeadphone Amplifier
nPersonal Computers
nPortable electronic devices
Typical Application
Boomer®is a registered trademark of National Semiconductor Corporation.
10127601
*Refer to the Application Information Section for information concerning proper selection of the input and output coupling capacitors.
FIGURE 1. Typical Audio Amplifier Application Circuit
August 2001
LM4808 Dual 105 mW Headphone Amplifier
© 2001 National Semiconductor Corporation DS101276 www.national.com
Connection Diagrams
LLP Package
10127657
Top View
Order Number LM4808LD
See NS Package Number LDA08B
SOP & MSOP Package
10127602
Top View
Order Number LM4808M, LM4808MM
See NS Package Number M08A, MUA08A
LM4808
www.national.com 2
Absolute Maximum Ratings (Note 3)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage 6.0V
Storage Temperature −65˚C to +150˚C
Input Voltage −0.3V to V
DD
+ 0.3V
Power Dissipation (Note 4) Internally limited
ESD Susceptibility (Note 5) 3500V
ESD Susceptibility (Note 6) 250V
Junction Temperature 150˚C
Soldering Information (Note 1)
Small Outline Package
Vapor Phase (60 seconds) 215˚C
Infrared (15 seconds) 220˚C
Thermal Resistance
θ
JC
(MSOP) 56˚C/W
θ
JA
(MSOP) 210˚C/W
θ
JC
(SOP) 35˚C/W
θ
JA
(SOP) 170˚C/W
θ
JC
(LLP) 15˚C/W
θ
JA
(LLP) 117˚C/W (Note 9)
θ
JA
(LLP) 150˚C/W (Note 10)
Operating Ratings
Temperature Range
T
MIN
≤T
A
≤T
MAX
−40˚C ≤T
A
≤85˚C
Supply Voltage 2.0V ≤V
DD
≤5.5V
Note 1: See AN-450 “Surface Mounting and their Effects on Product Reli-
ability” for other methods of soldering surface mount devices.
Electrical Characteristics (Notes 2, 3)
The following specifications apply for V
DD
= 5V unless otherwise specified, limits apply to T
A
= 25˚C.
Symbol Parameter Conditions LM4808 Units
(Limits)
Typ (Note
7) Limit (Note
8)
V
DD
Supply Voltage 2.0 V (min)
5.5 V (max)
I
DD
Supply Current V
IN
= 0V, I
O
= 0A 1.2 3.0 mA (max)
P
tot
Total Power Dissipation V
IN
= 0V, I
O
= 0A 6 16.5 mW (max)
V
OS
Input Offset Voltage V
IN
= 0V 10 50 mV (max)
Ibias Input Bias Current 10 pA
V
CM
Common Mode Voltage 0V
4.3 V
G
V
Open-Loop Voltage Gain R
L
=5kΩ67 dB
Io Max Output Current THD+N <0.1 % 70 mA
R
O
Output Resistance 0.1 Ω
V
O
Output Swing R
L
=32Ω, 0.1% THD+N, Min .3 V
R
L
=32Ω, 0.1% THD+N, Max 4.7
PSRR Power Supply Rejection Ratio Cb = 1.0µF, Vripple = 100mV
PP
,
f = 100Hz 89 dB
Crosstalk Channel Separation R
L
=32Ω75 dB
THD+N Total Harmonic Distortion + Noise f=1kHz
R
L
=16Ω,
V
O
=3.5V
PP
(at 0 dB) 0.05 %
66 dB
R
L
=32Ω,
V
O
=3.5V
PP
(at 0 dB) 0.05 %
66 dB
SNR Signal-to-Noise Ratio V
O
= 3.5V
pp
(at 0 dB) 105 dB
f
G
Unity Gain Frequency Open Loop, R
L
=5kΩ5.5 MHz
P
o
Output Power THD+N = 0.1%,f=1kHz
R
L
=16Ω105 mW
R
L
=32Ω70 60 mW
THD+N = 10%,f=1kHz
R
L
=16Ω150 mW
R
L
=32Ω90 mW
C
I
Input Capacitance 3 pF
LM4808
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Electrical Characteristics (Notes 2, 3) (Continued)
The following specifications apply for V
DD
= 5V unless otherwise specified, limits apply to T
A
= 25˚C.
Symbol Parameter Conditions LM4808 Units
(Limits)
Typ (Note
7) Limit (Note
8)
C
L
Load Capacitance 200 pF
SR Slew Rate Unity Gain Inverting 3 V/µs
Electrical Characteristics (Notes 2, 3)
The following specifications apply for V
DD
= 3.3V unless otherwise specified, limits apply to T
A
= 25˚C.
Symbol Parameter Conditions Conditions Units
(Limits)
Typ (Note
7) Limit (Note
8)
I
DD
Supply Current V
IN
= 0V, I
O
= 0A 1.0 mA (max)
V
OS
Input Offset Voltage V
IN
= 0V 7 mV (max)
P
o
Output Power THD+N = 0.1%,f=1kHz
R
L
=16Ω40 mW
R
L
=32Ω28 mW
THD+N = 10%,f=1kHz
R
L
=16Ω56 mW
R
L
=32Ω38 mW
Electrical Characteristics (Notes 2, 3)
The following specifications apply for V
DD
= 2.6V unless otherwise specified, limits apply to T
A
= 25˚C.
Symbol Parameter Conditions Conditions Units
(Limits)
Typ (Note
7) Limit (Note
8)
I
DD
Supply Current V
IN
= 0V, I
O
= 0A 0.9 mA (max)
V
OS
Input Offset Voltage V
IN
= 0V 5 mV (max)
P
o
Output Power THD+N = 0.1%,f=1kHz
R
L
=16Ω20 mW
R
L
=32Ω16 mW
THD+N = 10%,f=1kHz
R
L
=16Ω31 mW
R
L
=32Ω22 mW
Note 2: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 3:
Absolute Maximum Ratings
indicate limits beyond which damage to the device may occur.
Operating Ratings
indicate conditions for which the device is
functional, but do not guarantee specific performance limits.
Electrical Characteristics
state DC andAC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature TA. The maximum
allowable power dissipation is P DMAX =(T
JMAX −T
A
)/θ
JA. For the LM4808, TJMAX = 150˚C, and the typical junction-to-ambient thermal resistance, when board
mounted, is 210˚C/W for package MUA08A and 170˚C/W for package M08A.
Note 5: Human body model, 100 pF discharged through a 1.5 kΩresistor.
Note 6: Machine Model, 220 pF–240 pF discharged through all pins.
Note 7: Typicals are measured at 25˚C and represent the parametric norm.
Note 8: Tested limits are guaranteed to National’sAOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are guaranteed by design, test,
or statistical analysis.
Note 9: The given θJA is for an LM4808 packaged in an LDA08B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to
that of the Exposed-DAP itself.
Note 10: The given θJA is for an LM4808 packaged in an LDA08B with the Exposed-DAP not soldered to any printed circuit board copper.
LM4808
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External Components Description (
Figure 1
)
Components Functional Description
1. R
i
The inverting input resistance, along with R
f
, set the closed-loop gain. R
i
, along with C
i
, form a high
pass filter with f
c
= 1/(2πR
i
C
i
).
2. C
i
The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. C
i
, along with R
i
,
create a highpass filter with f
C
= 1/(2πR
i
C
i
). Refer to the section, Selecting Proper External
Components, for an explanation of determining the value of C
i
.
3. R
f
The feedback resistance, along with R
i
, set closed-loop gain.
4. C
S
This is the supply bypass capacitor. It provides power supply filtering. Refer to the Application
Information section for proper placement and selection of the supply bypass capacitor.
5. C
B
This is the half-supply bypass pin capacitor. It provides half-supply filtering. Refer to the section,
Selecting Proper External Components, for information concerning proper placement and selection
of C
B
.
6. C
O
This is the output coupling capacitor. It blocks the DC voltage at the amplifier’s output and forms a high
pass filter with R
L
at f
O
= 1/(2πR
L
C
O
)
7. R
B
This is the resistor which forms a voltage divider that provides 1/2 V
DD
to the non-inverting input of the
amplifier.
Typical Performance
Characteristics
THD+N vs Frequency THD+N vs Frequency
10127603 10127604
THD+N vs Frequency THD+N vs Frequency
10127605 10127606
LM4808
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Typical Performance Characteristics (Continued)
THD+N vs Frequency THD+N vs Frequency
10127607 10127608
THD+N vs Frequency THD+N vs Frequency
10127609 10127610
THD+N vs Frequency THD+N vs Frequency
10127611 10127612
LM4808
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Typical Performance Characteristics (Continued)
THD+N vs Output Power THD+N vs Output Power
10127613 10127614
THD+N vs Output Power THD+N vs Output Power
10127615 10127616
THD+N vs Output Power THD+N vs Output Power
10127617 10127618
LM4808
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Typical Performance Characteristics (Continued)
THD+N vs Output Power THD+N vs Output Power
10127619 10127620
THD+N vs Output Power Output Power vs
Load Resistance
10127621 10127622
Output Power vs
Load Resistance Output Power vs
Load Resistance
10127623 10127624
LM4808
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Typical Performance Characteristics (Continued)
Output Power vs
Supply Voltage Output Power vs
Power Supply
10127625 10127626
Output Power vs
Power Supply Clipping Voltage vs
Supply Voltage
10127627 10127628
Power Dissipation vs
Output Power Power Dissipation vs
Output Power
10127629 10127630
LM4808
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Typical Performance Characteristics (Continued)
Power Dissipation vs
Output Power Channel Separation
10127631 10127632
Channel Separation Noise Floor
10127633
10127634
Power Supply Rejection Ratio Open Loop
Frequency Response
10127635
10127650
LM4808
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Typical Performance Characteristics (Continued)
Open Loop
Frequency Response Open Loop
Frequency Response
10127651 10127638
Supply Current vs
Supply Voltage Frequency Response vs
Output Capacitor Size
10127644
10127645
Frequency Response vs
Output Capacitor Size Frequency Response vs
Output Capacitor Size
10127646 10127647
LM4808
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Typical Performance Characteristics (Continued)
Typical Application
Frequency Response Typical Application
Frequency Response
10127648 10127649
LM4808
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Application Information
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATION
The LM4808’s exposed-dap (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air.
The LD package should have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad may be con-
nected to a large plane of continuous unbroken copper. This
plane forms a thermal mass, heat sink, and radiation area.
However, since the LM4808 is designed for headphone ap-
plications, connecting a copper plane to the DAP’s PCB
copper pad is not required. The LM4808’s Power Dissipation
vs Output Power Curve in the Typical Performance Char-
acteristics shows that the maximum power dissipated is just
45mW per amplifier with a 5V power supply and a 32Ωload.
Further detailed and specific information concerning PCB
layout, fabrication, and mounting an LD (LLP) package is
available from National Semiconductor’s Package Engineer-
ing Group under application note AN1187.
POWER DISSIPATION
Power dissipation is a major concern when using any power
amplifier and must be thoroughly understood to ensure a
successful design. Equation 1 states the maximum power
dissipation point for a single-ended amplifier operating at a
given supply voltage and driving a specified output load.
P
DMAX
=(V
DD
)
2
/(2π
2
R
L
) (1)
Since the LM4808 has two operational amplifiers in one
package, the maximum internal power dissipation point is
twice that of the number which results from Equation 1. Even
with the large internal power dissipation, the LM4808 does
not require heat sinking over a large range of ambient tem-
perature. From Equation 1, assuming a 5V power supply and
a32Ωload, the maximum power dissipation point is 40mW
per amplifier. Thus the maximum package dissipation point
is 80mW. The maximum power dissipation point obtained
must not be greater than the power dissipation that results
from Equation 2:
P
DMAX
=(T
JMAX
−T
A
)/θ
JA
(2)
For package MUA08A, θ
JA
= 210˚C/W. T
JMAX
= 150˚C for
the LM4808. Depending on the ambient temperature, T
A
,of
the system surroundings, Equation 2 can be used to find the
maximum internal power dissipation supported by the IC
packaging. If the result of Equation 1 is greater than that of
Equation 2, then either the supply voltage must be de-
creased, the load impedance increased or T
A
reduced. For
the typical application of a 5V power supply, with a 32Ωload,
the maximum ambient temperature possible without violating
the maximum junction temperature is approximately 133.2˚C
provided that device operation is around the maximum
power dissipation point. Power dissipation is a function of
output power and thus, if typical operation is not around the
maximum power dissipation point, the ambient temperature
may be increased accordingly. Refer to the Typical Perfor-
mance Characteristics curves for power dissipation infor-
mation for lower output powers.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. Applications that employ a 5V regulator typically
use a 10µF in parallel with a 0.1µF filter capacitors to stabi-
lize the regulator’s output, reduce noise on the supply line,
and improve the supply’s transient response. However, their
presence does not eliminate the need for a local 0.1µF
supply bypass capacitor, C
S
, connected between the
LM4808’s supply pins and ground. Keep the length of leads
and traces that connect capacitors between the LM4808’s
power supply pin and ground as short as possible. Connect-
ing a 1.0µF capacitor, C
B
, between the INA(+) / IN B(+) node
and ground improves the internal bias voltage’s stability and
improves the amplifier’s PSRR. The PSRR improvements
increase as the bypass pin capacitor value increases. Too
large, however, increases the amplifier’s turn-on time. The
selection of bypass capacitor values, especially C
B
, depends
on desired PSRR requirements, click and pop performance
(as explained in the section, Selecting Proper External
Components), system cost, and size constraints.
SELECTING PROPER EXTERNAL COMPONENTS
Optimizing the LM4808’s performance requires properly se-
lecting external components. Though the LM4808 operates
well when using external components with wide tolerances,
best performance is achieved by optimizing component val-
ues.
The LM4808 is unity-gain stable, giving a designer maximum
design flexibility. The gain should be set to no more than a
given application requires. This allows the amplifier to
achieve minimum THD+N and maximum signal-to-noise ra-
tio. These parameters are compromised as the closed-loop
gain increases. However, low gain demands input signals
with greater voltage swings to achieve maximum output
power. Fortunately, many signal sources such as audio
CODECs have outputs of 1V
RMS
(2.83V
P-P
). Please refer to
the Audio Power Amplifier Design section for more infor-
mation on selecting the proper gain.
Input and Output Capacitor Value Selection
Amplifying the lowest audio frequencies requires high value
input and output coupling capacitors (C
I
and C
O
in
Figure 1
).
A high value capacitor can be expensive and may compro-
mise space efficiency in portable designs. In many cases,
however, the speakers used in portable systems, whether
internal or external, have little ability to reproduce signals
below 150Hz. Applications using speakers with this limited
frequency response reap little improvement by using high
value input and output capacitors.
Besides affecting system cost and size, C
i
has an effect on
the LM4808’s click and pop performance. The magnitude of
the pop is directly proportional to the input capacitor’s size.
Thus, pops can be minimized by selecting an input capacitor
value that is no higher than necessary to meet the desired
−3dB frequency.
As shown in
Figure 1
, the input resistor, R
I
and the input
capacitor, C
I
, produce a −3dB high pass filter cutoff fre-
quency that is found using Equation (3). In addition, the
output load R
L
, and the output capacitor C
O
, produce a -3db
high pass filter cutoff frequency defined by Equation (4).
f
I-3db
=1/2πR
I
C
I
(3)
f
O-3db
=1/2πR
L
C
O
(4)
LM4808
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Application Information (Continued)
Also, careful consideration must be taken in selecting a
certain type of capacitor to be used in the system. Different
types of capacitors (tantalum, electrolytic, ceramic) have
unique performance characteristics and may affect overall
system performance.
Bypass Capacitor Value
Besides minimizing the input capacitor size, careful consid-
eration should be paid to the value of the bypass capacitor,
C
B
. Since C
B
determines how fast the LM4808 settles to
quiescent operation, its value is critical when minimizing
turn-on pops. The slower the LM4808’s outputs ramp to their
quiescent DC voltage (nominally 1/2 V
DD
), the smaller the
turn-on pop. Choosing C
B
equal to 1.0µF or larger, will
minimize turn-on pops. As discussed above, choosing C
i
no
larger than necessary for the desired bandwith helps mini-
mize clicks and pops.
AUDIO POWER AMPLIFIER DESIGN
Design a Dual 70mW/32ΩAudio Amplifier
Given:
Power Output 70mW
Load Impedance 32Ω
Input Level 1Vrms (max)
Input Impedance 20kΩ
Bandwidth 100Hz–20kHz ±0.50dB
The design begins by specifying the minimum supply voltage
necessary to obtain the specified output power. One way to
find the minimum supply voltage is to use the Output Power
vs Supply Voltage curve in the Typical Performance Char-
acteristics section. Another way, using Equation (5), is to
calculate the peak output voltage necessary to achieve the
desired output power for a given load impedance. To ac-
count for the amplifier’s dropout voltage, two additional volt-
ages, based on the Dropout Voltage vs Supply Voltage in the
Typical Performance Characteristics curves, must be
added to the result obtained by Equation (5). For a
single-ended application, the result is Equation (6).
(5)
V
DD
≥(2V
OPEAK
+(V
OD
TOP +V
OD
BOT)) (6)
The Output Power vs Supply Voltage graph for a 32Ωload
indicates a minimum supply voltage of 4.8V. This is easily
met by the commonly used 5V supply voltage. The additional
voltage creates the benefit of headroom, allowing the
LM4808 to produce peak output power in excess of 70mW
without clipping or other audible distortion. The choice of
supply voltage must also not create a situation that violates
maximum power dissipation as explained above in the
Power Dissipation section. Remember that the maximum
power dissipation point from Equation (1) must be multiplied
by two since there are two independent amplifiers inside the
package. Once the power dissipation equations have been
addressed, the required gain can be determined from Equa-
tion (7).
(7)
Thus, a minimum gain of 1.497 allows the LM4808 to reach
full output swing and maintain low noise and THD+N perfro-
mance. For this example, let A
V
=1.5.
The amplifiers overall gain is set using the input (R
i
) and
feedback (R
f
) resistors. With the desired input impedance
set at 20kΩ, the feedback resistor is found using Equation
(8).
A
V
=R
f
/R
i
(8)
The value of R
f
is 30kΩ.
The last step in this design is setting the amplifier’s −3db
frequency bandwidth. To achieve the desired ±0.25dB pass
band magnitude variation limit, the low frequency response
must extend to at lease one−fifth the lower bandwidth limit
and the high frequency response must extend to at least five
times the upper bandwidth limit. The gain variation for both
response limits is 0.17dB, well within the ±0.25dB desired
limit. The results are an
f
L
= 100Hz/5 = 20Hz (9)
and a
f
H
= 20kHz*5 = 100kHz (10)
As stated in the External Components section, both R
i
in
conjunction with C
i
, and C
o
with R
L
, create first order high-
pass filters. Thus to obtain the desired low frequency re-
sponse of 100Hz within ±0.5dB, both poles must be taken
into consideration. The combination of two single order filters
at the same frequency forms a second order response. This
results in a signal which is down 0.34dB at five times away
from the single order filter −3dB point. Thus, a frequency of
20Hz is used in the following equations to ensure that the
response is better than 0.5dB down at 100Hz.
C
i
≥1/(2π*20kΩ* 20 Hz) = 0.397µF; use 0.39µF.
C
o
≥1/(2π*32Ω* 20 Hz) = 249µF; use 330µF.
The high frequency pole is determined by the product of the
desired high frequency pole, f
H
, and the closed-loop gain,
A
V
. With a closed-loop gain of 1.5 and f
H
= 100kHz, the
resulting GBWP = 150kHz which is much smaller than the
LM4808’s GBWP of 900kHz. This figure displays that if a
designer has a need to design an amplifier with a higher
gain, the LM4808 can still be used without running into
bandwidth limitations.
LM4808
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Demonstration Board Layout
10127639
Recommended SO PC Board Layout:
Top Silkscreen
10127660
Recommended LD PC Board Layout:
Top Silkscreen
10127640
Recommended SOP PC Board Layout:
Top Layer
10127661
Recommended LD PC Board Layout:
Top Layer
10127642
Recommended SOP PC Board Layout:
Bottom Layer
10127662
Recommended LD PC Board Layout:
Bottom Layer
LM4808
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Physical Dimensions inches (millimeters)
unless otherwise noted
Order Number LM4808LD
NS Package Number LDA08B
Order Number LM4808M
NS Package Number M08A
LM4808
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Order Number LM4808MM
NS Package Number MUA08A
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whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
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can be reasonably expected to cause the failure of
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LM4808 Dual 105 mW Headphone Amplifier
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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