54F169,74F169
54F169 74F169 4-Stage Synchronous Bidirectional Counter
Literature Number: SNOS161A
TL/F/9488
54F/74F169 4-Stage Synchronous Bidirectional Counter
November 1994
54F/74F169
4-Stage Synchronous Bidirectional Counter
General Description
The ’F169 is a fully synchronous 4-stage up/down counter.
The ’F169 is a modulo-16 binary counter. Features a preset
capability for programmable operation, carry lookahead for
easy cascading and a U/D input to control the direction of
counting. All state changes, whether in counting or parallel
loading, are initiated by the LOW-to-HIGH transition of the
clock.
Features
YAsynchronous counting and loading
YBuilt-in lookahead carry capability
YPresettable for programmable operation
Commercial Military Package Package Description
Number
74F169PC N16E 16-Lead (0.300×Wide) Molded Dual-In-Line
54F169DM (Note 2) J16A 16-Lead Ceramic Dual-In-Line
74F169SC (Note 1) M16A 16-Lead (0.150×Wide) Molded Small Outline, JEDEC
74F169SJ (Note 1) M16D 16-Lead (0.300×Wide) Molded Small Outline, EIAJ
Note 1: Devices also available in 13×reel. Use suffix eSCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix eDMQB.
Logic Symbols
TL/F/94883
IEEE/IEC
’F169
TL/F/94889
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Obsolete
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
TL/F/94881
Pin Assignment
for LCC
TL/F/94882
Unit Loading/Fan Out
54F/74F
Pin Names Description U.L. Input IIH/IIL
HIGH/LOW Output IOH/IOL
CEP Count Enable Parallel Input (Active LOW) 1.0/1.0 20 mA/b0.6 mA
CET Count Enable Trickle Input (Active LOW) 1.0/2.0 20 mA/b1.2 mA
CP Clock Pulse Input (Active Rising Edge) 1.0/1.0 20 mA/b0.6 mA
P0–P3Parallel Data Inputs 1.0/1.0 20 mA/b0.6 mA
PE Parallel Enable Input (Active LOW) 1.0/1.0 20 mA/b0.6 mA
U/D Up-Down Count Control Input 1.0/1.0 20 mA/b0.6 mA
Q0–Q3Flip-Flop Outputs 50/33.3 b1 mA/20 mA
TC Terminal Count Output (Active LOW) 50/33.3 b1 mA/20 mA
Functional Description
The ’F169 uses edge-triggered J-K type flip-flops and has
no constraints on changing the control or data input signals
in either state of the clock. The only requirement is that the
various inputs attain the desired state at least a setup time
before the rising edge of the clock and remain valid for the
recommended hold time thereafter. The parallel load opera-
tion takes precedence over other operations, as indicated in
the Mode Select Table. When PE is LOW, the data on the
P0–P3inputs enters the flip-flops on the next rising edge of
the clock. In order for counting to occur, both CEP and CET
must be LOW and PE must be HIGH; the U/D input then
determines the direction of counting. The Terminal Count
(TC) output is normally HIGH and goes LOW, provided that
CET is LOW, when a counter reaches zero in the Count
Down mode or reaches 15 for the ’F169 in the Count Up
mode. The TC output state is not a function of the Count
Enable Parallel (CEP) input level. Since the TC signal is de-
rived by decoding the flip-flop states, there exists the possi-
bility of decoding spikes on TC. For this reason the use of
TC as a clock signal is not recommended (see logic equa-
tions below).
1) Count Enable eCEP #CET #PE
2) Up: (’F169): TC eQ0#Q1#Q2#Q3#(Up) #CET
3) Down: TC eQ0#Q1#Q2#Q3#(Down) #CET
2
Obsolete
Logic Diagram
’F169
TL/F/94885
Please note that these diagrams are provided only for the understanding of logic operations and should not be used to estimate propagation delays.
Mode Select Table
PE CEP CET U/D Action on Rising
Clock Edge
HeHIGH Voltage Level
L X X X Load (Pn
x
Qn)LeLOW Voltage Level
H L L H Count Up (Increment) XeImmaterial
H L L L Count Down (Decrement)
H H X X No Change (Hold)
H X H X No Change (Hold)
State Diagram
’F169
TL/F/94887
3
Obsolete
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature b65§Ctoa
150§C
Ambient Temperature under Bias b55§Ctoa
125§C
Junction Temperature under Bias b55§Ctoa
175§C
Plastic b55§Ctoa
150§C
VCC Pin Potential to
Ground Pin b0.5V to a7.0V
Input Voltage (Note 2) b0.5V to a7.0V
Input Current (Note 2) b30 mA to a5.0 mA
Voltage Applied to Output
in HIGH State (with VCC e0V)
Standard Output b0.5V to VCC
TRI-STATEÉOutput b0.5V to a5.5V
Current Applied to Output
in LOW State (Max) twice the rated IOL (mA)
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military b55§Ctoa
125§C
Commercial 0§Ctoa
70§C
Supply Voltage
Military a4.5V to a5.5V
Commercial a4.5V to a5.5V
DC Electrical Characteristics
Symbol Parameter 54F/74F Units VCC Conditions
Min Typ Max
VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal
VCD Input Clamp Diode Voltage b1.2 V Min IIN eb
18 mA
VOH Output HIGH 54F 10% VCC 2.5 IOH eb
1mA
Voltage 74F 10% VCC 2.5 V Min IOH eb
1mA
74F 5% VCC 2.7 IOH eb
1mA
V
OL Output LOW 54F 10% VCC 0.5 V Min IOL e20 mA
Voltage 74F 10% VCC 0.5 IOL e20 mA
IIH Input HIGH 54F 20.0
mA Max VIN e2.7V
Current 74F 5.0
IBVI Input HIGH Current 54F 100
mA Max VIN e7.0V
Breakdown Test 74F 7.0
ICEX Output HIGH 54F 250
mA Max VOUT eVCC
Leakage Current 74F 50
VID Input Leakage 74F 4.75 V 0.0 IID e1.9 mA
Test All Other Pins Grounded
IOD Output Leakage 74F 3.75 mA 0.0 VIOD e150 mV
Circuit Current All Other Pins Grounded
IIL Input LOW Current b0.6 mA Max VIN e0.5V (except CET)
b1.2 VIN e0.5V (CET)
IOS Output Short-Circuit Current b60 b150 mA Max VOUT e0V
ICCL Power Supply Current 35 52 mA Max VOeLOW
4
Obsolete
’F169
AC Electrical Characteristics
74F 54F 74F
TAea
25§CTA,V
CC eMil TA,V
CC eCom
Symbol Parameter VCC ea
5.0V CLe50 pF CLe50 pF Units
CLe50 pF
Min Typ Max Min Max Min Max
fmax Maximum Count Frequency 90 60 70 MHz
tPLH Propagation Delay 3.0 6.5 8.5 3.0 12.0 3.0 9.5 ns
tPHL CP to Qn(PE HIGH or LOW) 4.0 9.0 11.5 4.0 16.0 4.0 13.0
tPLH Propagation Delay 5.5 12.0 15.5 5.5 20.0 5.5 17.5 ns
tPHL CP to TC 4.0 8.5 12.5 4.0 15.0 4.0 13.0
tPLH Propagation Delay 2.5 4.5 6.5 2.5 9.0 2.5 7.0 ns
tPHL CET to TC 2.5 8.5 11.0 2.5 12.0 2.5 12.0
tPLH Propagation Delay 3.5 8.5 11.5 3.5 16.0 3.5 12.5 ns
tPHL U/D to TC 4.0 8.0 12.0 4.0 14.0 4.0 13.0
AC Operating Requirements
74F 54F 74F
Symbol Parameter TAea
25§CTA,V
CC eMil TA,V
CC eCom Units
VCC ea
5.0V
Min Max Min Max Min Max
ts(H) Setup Time, HIGH or LOW 4.0 4.5 4.5
ts(L) Pnto CP 4.0 4.5 4.5 ns
th(H) Hold Time, HIGH or LOW 3.0 3.5 3.5
th(L) Pnto CP 3.0 3.5 3.5
ts(H) Setup Time, HIGH or LOW 7.0 8.0 8.0
ts(L) CEP or CET to CP 5.0 8.0 6.5 ns
th(H) Hold Time, HIGH or LOW 0 0 0
th(L) CEP or CET to CP 0.5 1.0 0.5
ts(H) Setup Time, HIGH or LOW 8.0 10.0 9.0
ts(L) PE to CP 8.0 10.0 9.0 ns
th(H) Hold Time, HIGH or LOW 1.0 1.0 1.0
th(L) PE to CP 0 0 0
ts(H) Setup Time, HIGH or LOW 11.0 14.0 12.5
ts(L) U/D to CP 7.0 12.0 8.5 ns
th(H) Hold Time, HIGH or LOW 0 0 0
th(L) U/D to CP 0 0 0
tw(H) CP Pulse Width 4.0 6.0 4.5 ns
tw(L) HIGH or LOW 7.0 9.0 8.0
5
Obsolete
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F 169 S C X
Temperature Range Family Special Variations
74F eCommercial X eDevices shipped in 13×reels
54F eMilitary QB eMilitary grade device with
environmental and burn-in
Device Type processing shipped in tubes
Package Code Temperature Range
PePlastic DIP CeCommercial (0§Ctoa
70§C)
DeCeramic DIP MeMilitary (b55§Ctoa
125§C)
SeSmall Outline Package SOIC JEDEC
SJ eSmall Outline SOIC EIAJ
Physical Dimensions inches (millimeters)
16-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J16A
6
Obsolete
Physical Dimensions inches (millimeters) (Continued)
16-Lead (0.150×Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M16A
16-Lead (0.300×Wide) Molded Dual-In-Line Package (P)
NS Package Number N16E
7
Obsolete
54F/74F169 4-Stage Synchronous Bidirectional Counter
Physical Dimensions inches (millimeters) (Continued)
16-Lead (0.300×Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M16D
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National Semiconductor National Semiconductor National Semiconductor National Semiconductor National Semiconductores National Semiconductor
Corporation GmbH Japan Ltd. Hong Kong Ltd. Do Brazil Ltda. (Australia) Pty, Ltd.
2900 Semiconductor Drive Livry-Gargan-Str. 10 Sumitomo Chemical 13th Floor, Straight Block, Rue Deputado Lacorda Franco Building 16
P.O. Box 58090 D-82256 F4urstenfeldbruck Engineering Center Ocean Centre, 5 Canton Rd. 120-3A Business Park Drive
Santa Clara, CA 95052-8090 Germany Bldg. 7F Tsimshatsui, Kowloon Sao Paulo-SP Monash Business Park
Tel: 1(800) 272-9959 Tel: (81-41) 35-0 1-7-1, Nakase, Mihama-Ku Hong Kong Brazil 05418-000 Nottinghill, Melbourne
TWX: (910) 339-9240 Telex: 527649 Chiba-City, Tel: (852) 2737-1600 Tel: (55-11) 212-5066 Victoria 3168 Australia
Fax: (81-41) 35-1 Ciba Prefecture 261 Fax: (852) 2736-9960 Telex: 391-1131931 NSBR BR Tel: (3) 558-9999
Tel: (043) 299-2300 Fax: (55-11) 212-1181 Fax: (3) 558-9998
Fax: (043) 299-2500
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
Obsolete
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated