CM1450-08CP - ON Semiconductor

LCD and Camera EMI Filter Array

with ESD Protection

CM1450

April 2010 Rev. 2 CM1450/D

Features

• High bandwidth, high RF rejection filter array

• Six and eight channels of EMI filtering

• Utilizes Praetorian® inductor-based design

technology for true L-C filter implementation

• OptiGuard™ coating for improved reliability

• ±15kV ESD protection on each channel

(IEC 61000-4-2 Level 4, contact discharge)

• ±30kV ESD protection on each channel (HBM)

• Better than 40dB of attenuation at 1GHz

• Maintains signal integrity for signals that have a

risetime and falltime as fast as 2ns

• Chip Scale Package features extremely low

lead inductance for optimum filter and ESD

performance

• 15-bump, 3.006mm x 1.376mm footprint

Chip Scale Package (CM1450-06CS/CP)

• 20-bump, 4.006mm x 1.376mm footprint

Chip Scale Package (CM1450-08CS/CP)

• RoHS-compliant, lead-free finishing

Applications

• LCD and Camera data lines in mobile handsets

• I/O port protection for mobile handsets, notebook

computers, PDAs, etc.

• EMI filtering for data phones in cell phones,

PDAs or notebook computers

• Wireless handsets / cell phones

• Handheld PCs/PDAs

• LCD and camera modules

Product Description

The CM1450 comprises a family of inductor-capacitor

(L-C) based EMI filter arrays with integrated ESD

protection in a CSP form factor. The CM1450-06 and

CM1450-08 are configured in 6 and 8 channel

formats respectively. Each EMI filter channel of the

CM1450 is implemented as a 5-pole L-C filter where

the component values are 14pF-17nH-14pF-17nF-

14pF. The CM1450's roll-off frequency at -10dB

attenuation is 400MHz and can be used in

applications where the data rates are as high as

160Mbps while providing greater than 35dB over the

800MHz to 2.7GHz frequency range. The parts

integrate ESD protection diodes on every pin, which

provide a very high level of protection for sensitive

electronic components that may be subjected to

electrostatic discharge (ESD). The ESD protection

diodes connected to the filter ports safely dissipate

ESD strikes of ±15kV, exceeding the Level 4

requirement of the IEC61000-4-2 international

standard. Using the MIL-STD-883 (Method 3015)

specification for Human Body Model (HBM) ESD, the

pins are protected for contact discharges at greater

than ±30kV.

This device is particularly well-suited for portable

electronics (e.g. wireless handsets, PDAs) because

of its small package format and easy-to-use pin

assignments. In particular, the CM1450 is ideal for

EMI filtering and protecting data and control lines for

the LCD display and camera interface in wireless

handsets while maintaining the integrity of signals

that have rise/fall times as fast as 2ns.

The CM1450 incorporates OptiGuard™ which results

in improved reliability at assembly. The CM1450 is

available in a space-saving, low-profile Chip Scale

Package with lead-free finishing.

CM1450

Rev. 2 | Page 2 of 16 | www.onsemi.com

CM1450

Rev. 2 | Page 3 of 16 | www.onsemi.com

PIN DESCRIPTIONS

CM1450-06 CM1450-08 CM1450-06 CM1450-08

PIN(s) PIN(s) NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION

A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1

A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2

A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3

A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4

A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5

A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6

- A7 FILTER7 Filter Channel 7 - C7 FILTER7 Filter Channel 7

- A8 FILTER8 Filter Channel 8 - C8 FILTER8 Filter Channel 8

B1-B3 B1-B4 GND Device Ground

Ordering Information

PART NUMBERING INFORMATION

Standard Finish Lead-free Finish2

Bumps Package Ordering Part

Number1 Part Marking

Ordering Part

Number1 Part Marking

15 CSP CM1450-06CS N506 CM1450-06CP N506

20 CSP CM1450-08CS N508 CM1450-08CP N508

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.

CM1450

Rev. 2 | Page 4 of 16 | www.onsemi.com

Specifications

ABSOLUTE MAXIMUM RATINGS

PARAMETER RATING UNITS

Storage Temperature Range -65 to +150 °C

Current per Inductor 30 mA

DC Package Power Rating 500 mW

STANDARD OPERATING CONDITIONS

PARAMETER RATING UNITS

Operating Temperature Range -40 to +85 °C

CM1450

Rev. 2 | Page 5 of 16 | www.onsemi.com

ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

LTOT Total Channel Inductance (L1 + L2) 34 nH

L1, L2 Inductance 17 nH

RDC IN-OUT DC Channel Resistance 18 Ω

CTOT Total Channel Capacitance (C1+ C2 + C3 ) At 2.5V DC, 1MHz,

30mV AC, Note 3

33.6 42 50.4 pF

C1, C2, C3 Capacitance At 2.5V DC, 1MHz,

30mV AC, Note 3

11.2 14 16.8 pF

fC Cut-off Frequency

ZSOURCE=50Ω, ZLOAD=50Ω

137

MHz

fRO Roll-off Frequency at -10dB Attenuation

ZSOURCE=50Ω, ZLOAD=50Ω

400

MHz

VDIODE Diode Standoff Voltage IDIODE=10μA 6.0 V

ILEAK Diode Leakage Current (reverse bias) VDIODE=+3.3V 0.1 1.0

μA

VSIG Signal Voltage

Positive Clamp

Negative Clamp

ILOAD = 10mA

5.6

-1.5

6.8

-0.8

9.0

-0.4

VESD In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883,

Method 3015

b) Contact Discharge per IEC 61000-4-2

Level 4

Note 2

±30

±15

RDYN Dynamic Resistance

Positive

Negative

2.30

0.90

Note 1: TA=25°C unless otherwise specified.

Note 2: ESD applied to input and output pins with respect to GND, one at a time.

CM1450

Rev. 2 | Page 6 of 16 | www.onsemi.com

Performance Information

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)

Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)

CM1450

Rev. 2 | Page 7 of 16 | www.onsemi.com

Performance Information (cont’d)

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)

Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)

CM1450

Rev. 2 | Page 8 of 16 | www.onsemi.com

Performance Information (cont’d)

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)

Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)

CM1450

Rev. 2 | Page 9 of 16 | www.onsemi.com

Performance Information (cont’d)

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4)

Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4)

CM1450

Rev. 2 | Page 10 of 16 | www.onsemi.com

Performance Information (cont’d)

D.C.Voltage

[pF]

Figure 9. Filter Capacitance vs. Input Voltage over Temperature

(normalized to capacitance at 2.5VDC and 25°C)

Transient Response Characteristics

Figure 10. Simulated Transient Response

(input signal risetime and falltime= 2ns, clocked at 25, 50 and 75 MHz,

15Ω Source Resistance, 5pF Load)

CM1450

Rev. 2 | Page 11 of 16 | www.onsemi.com

Application Information

PARAMETER VALUE

Pad Size on PCB 0.240mm

Pad Shape Round

Pad Definition Non-Solder Mask defined pads

Solder Mask Opening 0.290mm Round

Solder Stencil Thickness 0.125mm - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round

Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish OSP (Entek Cu Plus 106A)

Tolerance — Edge To Corner Ball +50μm

Solder Ball Side Coplanarity +20μm

Maximum Dwell Time Above Liquidous 60 seconds

Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder

Paste

260°C

Sold er Mask Openi ng

0.290mm DIA.

Non-S older Mask De fined Pad

0.240mm DIA.

Solder Stenci l Openi ng

0.300mm DIA.

Figure 5. Recommended No n-Solder Mask Defined Pad Illustration

Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile

CM1450

Rev. 2 | Page 12 of 16 | www.onsemi.com

Mechanical Details

CM1450-06 CSP Mechanical Specifications

The CM1450-06CS/CP is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.

For complete information, see the California Micro Devices CSP Package Information document.

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 15

Millimeters Inches

Dim

Min Nom Max Min Nom Max

A1 2.961 3.006 3.051 0.1166 0.1183 0.1201

A2 1.331 1.376 1.421 0.0524 0.0542 0.0559

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.203 0.253 0.303 0.0080 0.0100 0.0119

C2 0.203 0.253 0.303 0.0080 0.0100 0.0119

D1 0.575 0.644 0.714 0.0226 0.0254 0.0281

D2 0.368 0.419 0.470 0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Package Dimensions for

CM1450-06CS/CP Chip Scale Package

CM1450

Rev. 2 | Page 13 of 16 | www.onsemi.com

CSP Tape and Reel Specifications

PART NUMBER CHIP SIZE (mm)

POCKET SIZE (mm)

B0 X A0 X K0

TAPE WIDTH

REEL

DIAMETER

QTY PER

REEL P0 P

CM1450-06 3.006 X 1.376 X

0.644

3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm

Figure 14. Tape and Reel Mechanical Data

CM1450

Rev. 2 | Page 14 of 16 | www.onsemi.com

Mechanical Details (cont’d)

CM1450-08 Mechanical Specifications

The package dimensions for the CM1450-08CS/CP are presented below.

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 20

Millimeters Inches

Dim

Min Nom Max Min Nom Max

A1 3.961 4.006 4.051 0.1559 0.1577 0.1595

A2 1.331 1.376 1.421 0.0524 0.0542 0.0559

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.203 0.253 0.303 0.0080 0.0100 0.0119

C2 0.203 0.253 0.303 0.0080 0.0100 0.0119

D1 0.575 0.644 0.714 0.0226 0.0254 0.0281

D2 0.368 0.419 0.470 0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Package Dimensions for

CM1450-08CS/CP Chip Scale Package

CM1450

Rev. 2 | Page 15 of 16 | www.onsemi.com

CSP Tape and Reel Specifications

PART NUMBER CHIP SIZE (mm)

POCKET SIZE (mm)

B0 X A0 X K0

TAPE

WIDTH

REEL

DIAMETER

QTY PER

REEL P0 P

CM1450-08 4.006 X 1.376 X 0.644 4.11 X 1.57 X 0.76 12mm 330mm (13") 3500 4mm 4mm

Figure 15. Tape and Reel Mechanical Data

CM1450

Rev. 2 | Page 16 of 16 | www.onsemi.com

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any

products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising

out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”

parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating

parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the

rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to

support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or

use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors

harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such

unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action

Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada

Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

N. American Technical Support: 800-282-9855

Toll Free USA/Canada

Europe, Middle East and Africa Technical

Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81-3-5773-3850

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative