© Freescale Semiconductor, Inc., 2012, 2013. All rights reserved.
Freescale Semiconductor
Technical Data Sheet Document Number: MC13237
Rev. 1.3, 9/12/2013
1 Introduction
The MC13234/MC13237 is Freescale’s low cost
System-on-Chip (SoC) solution for the IEEE® 802.15.4
Standard that incorporates a complete, low power, 2.4
GHz radio frequency transceiver with TX/RX switch, an
8-bit HCS08 CPU, and a functional set of MCU
peripherals into a 48-pin LGA package. This product
targets wireless RF remote control and other
cost-sensitive applications ranging from home TV and
entertainment systems to medical and supports all
ZigBee node types. The MC13234/MC13237 is a highly
integrated solution, with very low power consumption.
The MC13234/MC13237 contains an RF transceiver that
is an 802.15.4 Standard 2006 compliant radio that
operates in the 2.4 GHz ISM frequency band. The
transceiver includes a low noise amplifier, 1 mW
nominal output power amplifier (PA), internal voltage
controlled oscillator (VCO), integrated transmit/receive
switch, on-board power supply regulation, 12-bit ADC
and full spread-spectrum encoding and decoding.
The on-chip CPU is based on the Freescale HCS08
family of microcontroller units (MCU). The onboard
MC13234/MC13237
Low Cost SoC Remote Control Platform for the 2.4 GHz IEEE®
802.15.4 Standard
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Integrated IEEE 802.15.4 Transceiver (radio
and modem) . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 HCS08 8-bit central processing unit (CPU) 11
5 System clocks . . . . . . . . . . . . . . . . . . . . . . . 12
6 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7 System and power management . . . . . . . . 12
8 MCU peripherals . . . . . . . . . . . . . . . . . . . . . . 14
9 Development Environment . . . . . . . . . . . . . 19
10Pin Assignment and Connections . . . . . . . 20
11Electrical Specifications . . . . . . . . . . . . . . . 26
12Applications Information . . . . . . . . . . . . . . . 42
13Mechanical Diagrams (Case 212 4-02,
Non-JEDEC) . . . . . . . . . . . . . . . . . . . . . . . . . 46
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
2Freescale Semiconductor
MCU peripheral set has been defined to support the targeted applications. A dedicated DMA block
transfers packet data between RAM and the transceiver to off-load the CPU and allow higher efficiency
and increased performance.
1.1 Ordering information
Table 1 provides ordering information to include RAM, flash, and feature detail differences associated
with the MC1323x family of devices
2Features
This section provides a simplified block diagram and highlights the MC13234/MC13237 features.
2.1 Block diagram
Figure 1 shows a simplified block diagram of the MC13234/MC13237.
Table 1. Orderable parts details
Device Operating
Temp Range
(TA.) Package Memory Options
MC13234CHT –40° to 85° C LGA-48 8 KB RAM, 128 KB flash
MC13234CHTR2 –40° to 85° C LGA-48
Tape and Reel 8 KB RAM, 128 KB flash
MC13237CHT –40° to 85° C LGA-48 8 KB RAM, 128 KB flash
MC13237CHTR2 –40° to 85° C LGA-48
Tape and Reel 8 KB RAM, 128 KB flash
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 3
Figure 1. MC13234/MC13237 simplified block diagram
2.2 Features summary
Fully compliant IEEE 802.15.4 Standard 2006 transceiver supports 250 kbps O-QPSK data in
5.0 MHz channels and full spread-spectrum encode and decode
2.4 GHz
Operates on one of 16 selectable channels per IEEE 802.15.4
Programmable output power with 0 dBm nominal output power , programmable from –30 dBm
to +2 dBm typical
Receive sensitivity of –93 dBm (typical) at 1% PER, 20-byte packet, much better than the IEEE
802.15.4 Standard requirement of –85 dBm
Partial power down (PPD_RX) Listen mode available to reduce current while in receive mode
and waiting for an incoming frame
Small RF footprint
Integrated transmit/receive switch
Differential input/output port (typically used with a balun)
Low external component count
Hardware acceleration for IEEE® 802.15.4 applications
DMA interface
Balun Switch
Analog
TX
Analog
RX
TX
Modem
RX
Modem
Digital
Modem
IEEE®802.15.4 Transceiver
RF Oscillator/PLL
&
Clock Generation
32 MHz 32.768 KHz
(Optional)
Clock &
Reset
Module
(CRM)
HCS08
Core
Bus
Interface &
Memory
Arbitrator
Interrupt
Controller
CPU Complex
5 KB / 8 KB
RAM
(4 Timers,
Each w/1Ch)
Timer
Module
Up to 32 GPIO
Data & Address Buses
Debug
Module
82 KB / 128 KB
FLASH
Keyboard
Interface
SCI/UART
Interface
CMT
(IR)
Module
I
2
C
Module
SPI
Interface
Low
Battery
TX/RX
e
12x12
MC1323x
Analog Pwr
Management
& Voltage Reg
Advanced
Security
Module
802.15.4
PHY
Sequence
Manager
12-Bit ADC
Module
12 x 12
128 KB
8 KB
28
NOTE: MC13237 Rev 1.1 does not support SPI module. It is planned to be fixed in a future revision.
The 12-Bit ADC module is available only in MC13237 and not available in MC13234.
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
4Freescale Semiconductor
AES-128 security module
16-bit random number generator
802.15.4 auto-sequence support
802.15.4 receiver frame filtering
32 MHz crystal reference oscillator; onboard load trim capability supplements external load
capacitors
Onboard 1 kHz oscillator for wake-up timing or an optional 32.768 kHz crystal for accurate low
power timing
Transceiver event timer module has 4 timer comparators available to help manage the
auto-sequencer and to supplement MCU TPM resources
HCS08 8-bit, 32 MHz CPU
Flash memory
131072dec bytes organized as 128 segments by 1024 bytes
Programmable over the full power supply range of 1.8 V–3.6 V
Automated program and erase algorithms
Flexible protection scheme to prevent accidental program or erase
Security feature to prevent unauthorized access to the flash
•RAM
8 KBytes of SRAM
Powerful in-circuit debug and flash programming available via on-chip module (BDM)
Two comparator and 9 trigger modes
Eight deep FIFO for storing change-of-flow addresses and event-only data
Tag and force breakpoints
In-circuit debugging with single breakpoint
Multiple low power modes (less than 1 A in Stop3)
Keyboard interrupt (KBI) modules
MC13234
Two keyboard control modules capable of supporting up to a 12 x 12 keyboard matrix
12 dedicated KBI pins support a 6 x 6 matrix without impacting other IO resources
12 KBI interrupts with selectable polarity
MC13237
One keyboard control module capable of supporting up to a 8 x 8 keyboard matrix
8 dedicated KBI pins support a 4 x 4 matrix without impacting other IO resources
8 KBI interrupts with selectable polarity
Serial communication interface (SCI)
Full duplex non-return to zero (NRZ)
Baud rates as high as 1 Mbps can be supported
LIN master extended break generation
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 5
LIN slave extended break detection
Wake-up on active edge
Serial peripheral interface (SPI)
Full-duplex or single-wire bidirectional
Double-buffered transmit and receive
Master or slave mode; MSB-first or LSB-first shifting
Inter-integrated circuit (IIC) interface
Up to 100 kbps baud rate with maximum bus loading
Baud rates as high as 800 kbps can be programmed
Multi-master operation
Programmable slave address
Interrupt driven byte-by-byte data transfer
Supports broadcast mode and 10-bit addressing
Four 16-bit timer/pulse width modulators (TPM[4:1]) — each TPM module has an assigned GPIO
pin and provides
Single channel capability
Input capture
Output compare
Buffered edge-aligned or center-aligned PWM
8-Channel, 12-bit resolution ADC (available only in MC13237)
11.2 Effective Number of Bits (ENOB)
2.5 s conversion time
Internal 1.7 mV/C temperature sensor
Internal bandgap reference
Operation in Stop3
Fully functional from 1.8 V to 3.6 V
Carrier modulator timer (CMT) — IR remote carrier generator, modulator, and transmitter.
Real-time counter (RTC)
16-bit modulus counter with binary or decimal based prescaler;
External clock source for precise time base, time-of-day, calendar or task scheduling functions
Capable of greater than one day interrupt.
System protection features
Programmable low voltage warning and interrupt (LVI)
Optional watchdog timer (COP)
Illegal opcode detection
1.8 V to 3.6 V operating voltage with on-chip voltage regulators.
Up to 32 GPIO
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
6Freescale Semiconductor
MC13234: 32 GPIOs
MC13237: 28 GPIOs
Hysteresis and selectable pullup resistors on all input pins
Configurable slew rate and drive strength on all output pins
–40°C to +85°C operating temperature range
RoHS-compliant 7 x 7 mm 48-pin LGA package
2.3 Software solutions
Freescale provides a powerful software environment called the Freescale BeeKit Wireless Connectivity
Toolkit. BeeKit is a comprehensive codebase of wireless networking libraries, application templates, and
sample applications. The BeeKit Graphical User Interface (GUI), part of the BeeKit W ireless Connectivity
Toolkit, allows users to create, modify, and update various wireless networking implementations. A wide
range of software functionality is available to complement the MC13234/MC13237 and these are provided
as codebases within BeeKit. The following sections describe the available tools, however due to
continuous updates that occur on FSL software inquiries to applications engineering is recommended.
Table 2. MC13234 and MC13237 Comparison
Feature MC13234 MC13237
Radio IEEE 802.15.4 compliant
CPU 32 MHz HCS08
Flash memory 128K
RAM 8K
BDM Yes
Low power modes Yes
KBI Two (12 interrupts) One (8 interrupts)
SCI Yes
SPI Yes
IIC Yes
TPM Yes
CMT Yes
RTC Yes
LVD Yes
COP Yes
ADC No Yes
GPIO 32 28
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 7
2.3.1 Simple Media Access Controller (SMAC)
The Freescale Simple Media Access Controller (SMAC) is a simple ANSI C based code stack available
as sample source code. The SMAC can be used for developing proprietary RF transceiver applications
using the MC13234/MC13237.
Supports point-to-point and star network configurations
Proprietary networks
Source code and application examples provided
2.3.2 IEEE® 802.15.4 2006 Standard-Compliant MAC
The Freescale 802.15.4 Standard-Compliant MAC is a code stack available as object code. The 802.15.4
MAC can be used for developing MC13234/MC13237 networking applications based on the full IEEE®
802.15.4 Standard that use custom Network Layer and application software.
Supports star, mesh, and cluster tree topologies
Supports beaconed networks
Supports GTS for low latency
Multiple power saving modes
AES-128 security module
802.15.4 sequence support
802.15.4 receiver frame filtering.
2.3.3 SynkroRF platform
The SynkroRF Network is a general purpose, proprietary networking layer that sits on top of the IEEE®
802.15.4 MAC and PHY layers. It is designed for wireless personal area networks (WPANs) and conveys
information over short distances among the participants in the network. It enables small, power ef ficient,
inexpensive solutions to be implemented for a wide range of applications. Some key characteristics of an
SynkroRF network are:
An over-the-air data rate of 250 kbps in the 2.4 GHz band.
3 independent communication channels in the 2.4 GHz band (15, 20, and 25).
2 network node types, controller and controlled nodes.
Channel agility mechanism.
Low latency TX mode automatically enabled in conditions of radio interference.
Fragmented mode transmission and reception, automatically enabled in conditions of radio
interference.
Robustness and ease of use.
Essential functionality to build and support a CE network.
The SynkroRF network layer uses components from the standard HC(S)08 Freescale platform, which is
also used by the Freescale’s implementations of 802.15.4. MAC and ZigBee™ layers. For more details
about the platform components, see the Freescale Platform Reference Manual.
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
8Freescale Semiconductor
2.3.4 BeeStack Consumer
Freescale’s ZigBee RF4CE stack, called BeeS tack Consumer, is a networking layer that sits on top of the
IEEE® 802.15.4 MAC and PHY layers. It is designed for standards-based wireless personal area networks
(WPANs) of home entertainment products and conveys information over short distances among the
participants in the network. It enables small, power ef ficient, inexpensive solutions to be implemented for
a wide range of applications. T argeted applications include DTV, set top box, A/V receivers, DVD players,
security, and other consumer products.
Some key characteristics of a BeeStack Consumer network are:
An over-the-air data rate of 250 kbps in the 2.4 GHz band
3 independent communication channels in the 2.4 GHz band
2 network node types, controller node and target node
Channel agility mechanism
Provides robustness and ease of use
Includes essential functionality to build and support a CE network
The BeeStack Consumer layer uses components from the standard HCS08 Freescale platform, which is
also used by the Freescale implementations of 802.15.4. MAC or ZigBee™ layers. For more details about
the platform components, see the Freescale Platform Reference Manual.
2.3.5 ZigBee-Compliant Network Stack
Freescale’s BeeStack architecture builds on the ZigBee protocol stack. Based on the OSI Seven-Layer
model, the ZigBee stack ensures inter-operability among networked devices. The physical (PHY), media
access control (MAC), and network (NWK) layers create the foundation for the application (APL) layers.
BeeS tack defines additional services to improve the communication between layers of the protocol stack.
At the application layer , the application support layer (ASL) facilitates information exchange between the
application support sub-layer (APS) and application objects. Finally, ZigBee Device Objects (ZDO), in
addition to other manufacturer- designed applications, allow for a wide range of useful tasks applicable to
home and industrial automation.
BeeS tack uses the IEEE 802.15.4-compliant MAC/PHY layer that is not part of ZigBee itself. The NWK
layer defines routing, network creation and configuration, and device synchronization. The application
framework (AF) supports a rich array of services that define ZigBee functionality. ZigBee Device Objects
(ZDO) implement application-level services in all nodes via profiles. A security service provider (SSP) is
available to the layers that use encryption (NWK and APS), i.e., Advanced Encryption Standard (AES)
128-bit security.
The complete Freescale BeeStack protocol stack includes the following components:
ZigBee Device Objects (ZDO) and ZigBee Device Profile (ZDP)
Application support sub-layer (APS)
Application framework (AF)
Network (NWK) layer
Security service provider (SSP)
IEEE 802.15.4-compliant MAC and Physical (PHY) layer
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 9
3 Integrated IEEE 802.15.4 Transceiver (radio and
modem)
The MC13234/MC13237 is a IEEE® 802.15.4 fully-compliant transceiver providing a complete 2.4 GHz
radio solution with 250 kbps offset-quadrature phase shift keying (O-QPSK) data in 5.0 MHz channel
spacings with full spread-spectrum encode and decode. The modem supports the full requirement of the
IEEE® 802.15.4 Standard functionality to transmit, receive, and do clear channel assessment (CCA),
energy detect (ED), and link quality indication (LQI). Some top level transceiver features supported are
listed below:
Programmable output power with 0 dBm nominal output power, programmable from –30 dBm to
+2 dBm typical
Receive sensitivity of –93 dBm (typical) at 1% PER, 20-byte packet
Differential bidirectional RF input/output port
Integrated transmit/receive switch
Receive current can be reduced while waiting or listening for an incoming frame using partial
power down (PPD) mode1 (see Table 11)
3.1 RF interface and usage
The MC13234/MC13237 RF interface provides a bidirectional, differential port that connects directly to
a balun. The balun connects directly to a single-ended antenna and converts that interface to a full
differential, bidirectional, on-chip interface with transmit/receive switch, LNA, and complementary PA
outputs. This combination allows for a small footprint and low cost RF solution to be realized.
3.2 Transceiver register interface and operation
The transceiver is controlled by set of interface registers that are memory-mapped into the CPU address
space. MC13234/MC13237 supports independent transmit, receive, or CCA/ED (energy detection) modes
of operation and combinations. Additional features of the transceiver include:
DMA function that moves data directly between RAM and transceiver buffers during diplexed
transmit and receive operation on a cycle-steal basis. This feature offloads the data transfer from
the CPU, thus providing higher performance.
Interrupt capability that is dependent on RX packet data availability. An interrupt can be generated
based on a programmed count of RX data bytes that have been received and moved to RAM. This
allows CPU filtering of RX data before completion of the packet reception to accelerate response
to the packet.
Four (4) transceiver event timer comparators to supplement MCU peripheral timer resources for
PHY and MAC timing requirements.
3.3 IEEE 802.15.4 acceleration hardware
MC13234/MC13237 transceiver has several hardware features to reduce the software stack size, offload
the function from the CPU, and improve performance. A list of features supported is provided below:
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
10 Freescale Semiconductor
2003 & 2006 versions of the IEEE® 802.15.4 standard is full supported.
Slotted and unslotted modes
Beacon enabled and non-beacon enabled networks
DMA data transfer between RAM and radio
Separate AES-128 security module
16-bit random number generator
802.15.4 sequence support
RX (conditionally followed by TXAck)
—TX
CCA (used for CCA and ED cycles)
TX/RX (TX followed by unconditional RX or RCACK)
Continuous CCA
802.15.4 receiver frame filtering
3.4 Partial Power Down Receive mode (PPD_RX)
The MC13234/MC13237 provides a unique Partial Power Down Receive (PPD_RX) mode. A summary
of PPD_RX mode of operation when selected is described below:
Whenever a receive cycle is initiated, the receiver is not turned fully on to save current until receive
energy of a preset level is detected
The receiver will turn fully on only when triggered by ener gy at a pre-determined preset level thus
enabling reception of the expected frame. Afterwards, the receiver will begin operating in the
full-on state that is considered to be the same as the standard receive state
The preset level can be programmed for various RX input power levels
Use of the PPD_RX mode provides two distinct advantages:
Reduced “Listen” mode current — The receive current is significantly reduced while waiting for
a frame. If a node is a coordinator, router, or gateway and it spends a significant percentage of its
RF-active time waiting for incoming frames from clients or other devices, the net power savings
can be significant.
Reduced sensitivity as a desired effect — The PPD_RX mode provi des different levels of reduced
sensitivity. If a node operates in a densely populated area, it may be desirable to de-sensitize the
receiver such that the device does not respond to incoming frames with an energy level below the
desired threshold. This could be useful for security, net efficiency, reduced noise triggering, and
many other purposes.
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 11
4 HCS08 8-bit central processing unit (CPU)
The onboard CPU is a 32 MHz 8-bit HCS08 core. It executes a super set of the 68HC08 instruction set
with added BGND instructions. The HCS08 CPU is fully source and object code compatible with the
M68HC08 CPU. Several instructions and enhanced addressing modes are added to improve C compiler
efficiency and to support a new background debug system. It has an 8-bit data bus, a 16-bit address bus,
and a 2-stage instruction pipe that facilitates the overlapping of instruction fetching and execution. There
are 29 vectors for internal interrupt sources and one vector for an external interrupt pin. The debug or BDM
module provides a serial one-wire interface for non-intrusive debugging of application programs.
Features of the HCS08 CPU include:
Object code fully upward-compatible with M68HC05 and M68HC08 Families
64-KB CPU address space with banked memory management unit for greater than 64 KB
16-bit stack pointer (any size stack anywhere in 64-KB CPU address space)
16-bit index register (H:X) with powerful indexed addressing modes
8-bit accumulator (A)
Many instructions treat X as a second general-purpose 8-bit register
Seven addressing modes:
Inherent — Operands in internal registers
Relative — 8-bit signed offset to branch destination
Immediate — Operand in next object code byte(s)
Direct — Operand in memory at 0x0000–0x00FF
Extended — Operand anywhere in 64-KB address space
Indexed relative to H:X — Five submodes including auto increment
Indexed relative to SP — Improves C efficiency dramatically
Memory-to-memory data move instructions with four address mode combinations
Overflow, half-carry, negative, zero, and carry condition codes support conditional branching on
the results of signed, unsigned, and binary-coded decimal (BCD) operations
Efficient bit manipulation instructions
Fast 8-bit by 8-bit multiply and 16-bit by 8-bit divide instructions
STOP and WAIT instructions to invoke low-power operating modes
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
12 Freescale Semiconductor
5 System clocks
The primary system reference frequency is a 32 MHz crystal oscillator. The crystal requirements for the
oscillator and oscillator performance must support a +/–40 ppm frequency accuracy to meet the IEEE®
802.15.4 Standard requirements. All system clocks are generated from this source. Features of the clock
system include:
The 32 MHz reference oscillator has onboard programmable capacitive loading that allows
software tuning of frequency accuracy
CPU clock as high as 32 MHz
Bus clock (and peripheral clock) equals 1/2 CPU clock
Clocks to individual peripherals can be independently disabled for best power management
CPU clock can be lowered to 500 kHz for lower power (250 kHz bus clock)
An optional 32.768 kHz crystal oscillator is available for accurate low power timing and the real time clock
(RTC). Also, an onboard, low accuracy 1 kHz oscillator is available for sleep timing wake-up.
6Memory
The MC13234/MC13237 memory resources consist of RAM, Flash program memory for nonvolatile data
storage, control/status registers for I/O, peripherals, management, and the transceiver. Features include:
128 Kbyte flash
8 Kbyte SRAM
Security circuitry to prevent unauthorized access to RAM and flash contents
7 System and power management
MC13234/MC13237 is a low power device that also supports extensive system control and power
management modes to maximize battery life and provide system protection.
7.1 Modes of operation
The MC13234/MC13237 modes of operation include:
Active background mode for code development
Run mode — CPU clocks can be run at full speed and the internal supply is fully regulated.
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 13
LPRun mode — CPU clock is set to 500 kHz and peripheral clocks (bus clock) to 250 kHz and the
internal voltage regulators are in standby
Wait mode — CPU shuts down to conserve power; system clocks are running and full regulation
is maintained
LPWait mode — CPU shuts down to conserve power; peripheral clocks are restricted to 250 kHz
and the internal voltage regulator is in standby
Stop modes — System clocks are stopped and voltage regulator is in standby
S top3 — All internal circuits are powered for fast recovery (32 MHz oscillator on-off optional)
NOTE: See Table 9 for further details on modes of operation
7.2 Power management
The MC13234/MC13237 power management is controlled through programming of the modes of
operation. Different modes allow for different levels of power-down. Additional features include:
The transceiver is powered as required
The analog radio is only powered-up as required to do a TX, RX, or CCA/ED operation
Peripheral control clock gating can be disabled on an MCU module-by-module basis to provide
lowest power
Programmed mode manages
Degree of chip power down
Retention of programmed parameters
Clock management
Power-down and wake-up (clocks and analog blocks) are gracefully controlled
RTC can be used as wake-up timer
Wake-up available through KBI and UART RX asynchronous interrupts
Real-time counter (RTC) module
16-bit modulus counter with binary or decimal based prescaler for precise time base,
time-of-day, calendar or task scheduling functions
Capable of greater than one day interrupt
Can also be used for device wake-up
7.3 System protection
The MC13234/MC13237 provides several vehicles to maintain security or a high level of system
robustness:
Watchdog computer operating properly (COP) reset with option to run from dedicated internal
clock source or bus clock
Low-voltage warning and detection with reset or interrupt; selectable trip points
Illegal opcode detection with reset
Flash block protection
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
14 Freescale Semiconductor
8 MCU peripherals
The MC13234/MC13237 has a functional set of MCU peripherals focused for intended applications. For
further information on application use-cases please refer to the Reference Manual.
8.1 Parallel input/output (GPIO)
MC13234 and MC13237 have 32 and 28 general purpose I/O signals, respectively. These GPIO signals
are distributed among four I/O ports (PTA, PTB, PTC, and PTD). Many of these pins are shared with
on-chip peripherals such as timer systems, communication ports, or keyboard interrupts. When these other
modules are not controlling the port pins, they revert to general-purpose I/O control. For each I/O pin, a
port data bit provides access to input (read) and output (write) data, a data direction bit controls the
direction of the pin, and a pullup enable bit enables an internal pullup device (provided the pin is
configured as an input), and a slew rate control bit controls the rise and fall times of the pins.
Parallel I/O features include:
A total of 32 or 28 general-purpose I/O pins in four ports (PTA2 is output only)
Hysteresis input buffers
Software-controlled pullups on each input pin
Software-controlled slew rate output buffers
8.2 Keyboard interrupt modules (KBI)
MC13234 has two (2) KBI modules; KBI1 shares eight (8) port B pins and KBI2 shares four (4) port C
pins. MC13237 has one (1) KBI module; KBI1 shares eight (8) port B pins. Any KBI pin can be enabled
as a keyboard input that can act as an interrupt request. As a result, the total 12 KBI inputs (MC13234)
allows as large as a 12x12 keyboard matrix. The total 8 KBI inputs (MC13237) allows as large as a 8x8
keyboard matrix with use of other GPIO pins as outputs to the matrix.
All enabled KBI inputs can be configured for edge-only sensitivity or edge-and-level sensitivity . They also
can be configured for either rising edge / high-level or falling-edge/low-level sensitivity. When enabled
for rising edge / high level sensitivity, a pulldown resistor is enabled, and when enabled for falling edge /
low level sensitivity, a pullup resistor is enabled.
The KBI features include:
KBI1 has eight (8) keyboard interrupt pins with individual pin enable bits.
KBI2 (available only in MC13234) has four (4) keyboard interrupt pins with individual pin enable
bits.
Supports up to a 12x12 (MC13234) or 8x8 (MC13237) keyboard matrix. An 8x8 matrix
(MC13234) or 4x4 (MC13237) matrix can be supported without impacting other I/O functions.
Each keyboard interrupt pin is programmable as falling edge (or rising edge) only, or both falling
edge and low level (or both rising edge and high level) interrupt sensitivity. pullups and pulldowns
enabled by selected mode.
Individual signal software enabled interrupts for KBI1 and KBI2.
Can be used for device wake-up
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 15
8.3 Serial communications interface (SCI) module
The MC13234/MC13237 has one serial communications interface module — sometimes called a universal
asynchronous receiver/transmitter (UART). Typically, this port is used to connect to the RS232 serial
input/output (I/O) port of a personal computer or workstation, and it can also be used to communicate with
other embedded controllers.
The SCI module has a single, flexible frac-N (13-bit modulo counter, 5-bit fractional counter) baud rate
generator used both for transmit and receive. With a maximum 16 MHz peripheral clock, baud rates as
high as 1 Mbps can be supported (standard is 921,600 baud).
This SCI system offers many advanced features not commonly found on other asynchronous serial I/O
peripherals on other embedded controllers. The receiver employs an advanced data sampling technique
that ensures reliable communication and noise detection. Hardware parity, receiver wake-up, and double
buffering on transmit and receive are also included.
Features of SCI module include:
Dedicated TXD and RXD pins
Full-duplex, standard non-return-to-zero (NRZ) format
Double-buffered transmitter and receiver with separate enables
Programmable high accuracy baud rates (frac-N generator)
Interrupt-driven or polled operation:
Transmit data register empty and transmission complete
Receive data register full
Receive overrun, parity error, framing error, and noise error
Idle receiver detect
Active edge on receive pin
Break detect supporting LIN
Hardware parity generation and checking
Programmable 8-bit or 9-bit character length
Receiver wake-up by idle-line or address-mark
Optional 13-bit break character generation / 11-bit break character detection
Selectable transmitter output polarity
8.4 Serial peripheral interface (SPI) module
The MC13234/MC13237 has one serial peripheral interface module. The SPI is a synchronous serial data
input/output port used for interfacing with serial memories, peripheral devices, or other processors. The
SPI allows an 8-bit serial bit stream to be shifted simultaneously into and out of the device at a
programmed bit-transfer rate (called 4-wire mode). There are four (4) pins associated with the SPI port
(SPICLK, MOSI, MISO, and SS).
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
16 Freescale Semiconductor
The SPI module can be programmed for master or slave operation. It also supports a 3-wire mode where
for master mode the MOSI becomes MOMI, a bidirectional data pin, and for slave mode the MISO
becomes SISO, a bidirectional data pin. In 3-wire mode, data is transferred in only one direction at a time.
The SPI bit clock is derived from the peripheral input clock with a maximum 16 MHz operation. A
programmable prescaler (maximum divide-by-8) drives a second baud rate programmable divider
(maximum divide-by-256) to develop the bit clock. The maximum SPI transfer rate is 8 MHz.
Features of the SPI module include:
Master or slave mode operation
Full-duplex or single-wire bidirectional option
8-bit only transfer size
Programmable transmit bit rate (8 MHz max)
Double-buffered transmit and receive
Serial clock phase and polarity options (supports all 4 options)
Optional slave select output
Selectable MSB-first or LSB-first shifting
8.5 Inter-integrated circuit (IIC) interface module
The MC13234/MC13237 has one inter-integrated circuit interface module that provides a method of
communication between a number of other integrated circuits. The IIC Bus interface provides a
bidirectional, 2-pin (SDA bus data and SCL bus clock) serial bus designed to operate up to 100 kbps with
maximum bus loading and timing. The module is capable of operating at higher baud rates, up to a
maximum of peripheral clock/20 (800 kbps), with reduced bus loading.
Features of IIC module include:
Compatible with IIC bus standard
Multi-master operation
Software programmable clock frequencies
Software selectable acknowledge bit
Interrupt driven byte-by-byte data transfer
Arbitration lost interrupt with automatic mode switching from master to slave
Calling address identification interrupt
START and STOP signal generation/detection
Repeated START signal generation
Acknowledge bit generation/detection
Bus busy detection
General call recognition
10-bit address extension
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 17
8.6 Timer/PWM (TPM) modules
The MC13234/MC13237 has four (4) independent timer/PWM modules, each with one channel. Each
TPM module is based on a 16-bit counter and provides input capture, output compare, and Pulse Width
Modulation (PWM). Each TPM module has one associated I/O pin for input capture or counter/PWM
output.
TPM module features include:
Each TPM may be configured for buffered, center -aligned pulse-width modulation (CPWM) on all
channels
Module clock source is peripheral clock or reference oscillator divided-by-1024
Clock prescaler taps for divide by 1, 2, 4, 8, 16, 32, 64, or 128
16-bit free-running or up/down (CPWM) count operation
16-bit modulus register to control counter range
Module enable
One interrupt per channel plus a terminal count interrupt for each TPM module
Channel features:
Each channel may be input capture, output compare, or buffered edge-aligned PWM
Rising-edge, falling-edge, or any-edge input capture trigger
Set, clear, or toggle output compare action
Selectable polarity on PWM outputs
8.7 Carrier Modulator Timer (CMT) Module
The MC13234/MC13237 Carrier Modulator Timer module is intended as an IR LED driver for remote
control “blaster” applications. The module consists of a carrier generator, modulator, and transmitter that
drives data to package pin # 31 (PTD4/CMT/AD3) either in baseband or in FSK mode. The CMT.../IRO
pin drives (modulates) the IR diode directly or through a buffer depending on the applications current
requirement. The current drive capability of this pin is specified for 20mA.
The CMT module features include:
Four (4) modes of operation:
Time with independent control of high and low times
Baseband
Frequency Shift Key (FSK)
Direct software control of CMT....IRO pin
Extended space operation in time, baseband, and FSK modes
Module clock source is peripheral clock (16 MHz max)
Interrupt on end of cycle
Ability to disable CMT...IRO pin and use as timer interrupt
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
18 Freescale Semiconductor
8.8 Real Time Counter (RTC) Module
The MC13234/MC13237 Real Time Counter module consists of one(1) 16-bit counter, one(1) 16-bit
comparator, several binary-based and decimal-based prescaler dividers, three (3) clock sources, and one(1)
programmable periodic interrupt. This module can be used for time-of-day, calendar or any task
scheduling functions. It can also serve as a cyclic wake-up from low power modes (Stop2, Stop3, and
Wait). RTC can be clocked from bus clock, the optional 32.768 kHz oscillator or the onboard 1 kHz low
power oscillator.
Features of the RTC module include:
16-bit up-counter
16-bit modulo match limit
Software controllable periodic interrupt on match
Three software selectable clock sources for input to prescaler with programmable 16 bit prescaler
32.768 kHz optional crystal oscillator.
32 MHz reference oscillator
1 kHz low power RC oscillator
Useful for time base tick or time-of-day clock
Can be used for device wake-up; capable of greater than one day time-out period.
8.9 12-Bit Analog-to-Digital Conversion (ADC) Module
The MC13237 integrates an 8 channel, 12-bit resolution Successive Approximation Register (SAR)
analog-to-digital conversion (ADC) module. The analog input channels are shared/multiplexed with
standard GPIO pins as shown in Figure 3. The ADC module is available in MC13237 only; not available
in MC13234.
Features of the ADC module include:
11.2 Effective Number of Bits (ENOB)
Linear successive approximation algorithm with 12-bits resolution
Operation in Stop3 mode
2.5 s conversion time
Internal bandgap reference
Operation over full VBATT voltage range
Internal 1.7 mV/°C temperature sensor
Output data can be formatted in 8-, 10-, or 12-bit justified format
Single or continuous conversion
Configurable sample time and conversion speed / power.
Auto compare for less-than, greater than, or equal to programmable value
Converter subsystem shut-down
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 19
9 Development Environment
Development support for the HCS08 on the MC13234/MC13237 includes the background debug
controller (BDC) and the on-chip debug module (DBG). The BDC provides a single-wire (signal BKGD)
debug interface to the MCU that provides a convenient interface for programming the on-chip flash and
other storage. The BDC is also the primary debug interface for development and allows non-intrusive
access to memory data and traditional debug features such as CPU register modify , breakpoints, and single
instruction trace commands.
Address and data bus signals are not available on external pins. Debug is done through commands fed into
the MCU via the single-wire background debug interface. The debug module provides a means to
selectively trigger and capture bus information so an external development system can reconstruct what
happened inside the MCU on a cycle-by-cycle basis without having external access to the address and data
signals. Features include:
Single-wire background debug interface
Breakpoint capability to allow single breakpoint setting during in-circuit debugging (plus two
more breakpoints in on-chip debug module)
On-chip in-circuit emulator (ICE) debug module containing three comparators and nine trigger
modes.
Eight deep FIFO for storing change-of-flow addresses and event-only data. Debug module
supports both tag and force breakpoints.
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
20 Freescale Semiconductor
10 Pin Assignment and Connections
10.1 Device Pin Assignments
Figure 2. MC13234 Pinout
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
10
11
12
16 24
21
20
19
18 23
22
PTC6/MISO
PTD7
VBATT_1
VREG_ANA
RF_BIAS
EXTAL_32M
PTB3/KBIP3
15 17
PTC0/KBI2P0
PTA5/SDA
PTA7/BKGD/MS
PTC5/SS
RF_P
PTA2
PTA3/IRQ
PTA0/XTAL_32K
VBATT_4
PTA6/SCL
PTC4/SPICLK
PTC1/KBI2P1
PTC2/KBI2P2
RESET
9
8
33
34
36
35
39 38 37
40
4748 4243
45 44 4146
14
13
VREG_LO2
NC
VBATT_2
RF_N
NC
VDD_ANA
VREG_VCO
VBATT_3
PTB4/KBIP4
PTB7/KBIP7
PTB5/KBIP5
PTB6/KBIP6
XTAL_32M
PTC7/MOSI
PTD6/RXD
PTD5/TXD
PTD4/CMT
PTD1/TPM1
PTD0/TPM0
PTC3/KBI2P3
PTA1/EXTAL_32K
PTA4/XTAL_32KOUT
PTB2/KBI1P2
PTB1/KBI1P1
PTB0/KBI1P0
MC13234CHT
PTD2/TPM2
PTD3/TPM3
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 21
Figure 3. MC13237 Pinout
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
10
11
12
16 24
21
20
19
18 23
22
PTC6/MISO
PTD7/AD6
VBATT_1
VREG_ANA
RF_BIAS
EXTAL_32M
PTB3/KBIP3
15 17
PTC5/SS/AD7
PTA5/SDA
PTA7/BKGD/MS
PTC4/SPICLK
RF_P
PTA2
PTA3/IRQ
PTA0/XTAL_32K
VBATT_4
PTA6/SCL
VDDA_ADC
VSSA_ADC
VREFL
RESET
9
8
33
34
36
35
39 38 37
40
47
48 4243
45 44 4146
14
13
VREG_LO2
NC
VBATT_2
RF_N
NC
VDD_ANA
VREG_VCO
VBATT_3
PTB4/KBIP4
PTB7/KBIP7
PTB5/KBIP5
PTB6/KBIP6
XTAL_32M
PTC7/MOSI
PTD6/RXD/AD5
PTD5/TXD/AD4
PTD4/CMT/AD3
PTD1/TPM1/AD0
PTD0/TPM0
VREFH
PTA1/EXTAL_32K
PTA4/XTAL_32KOUT
PTB2/KBI1P2
PTB1/KBI1P1
PTB0/KBI1P0
MC13237CHT
PTD2/TPM2/AD1
PTD3/TPM3/AD2
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
22 Freescale Semiconductor
10.2 Pin Definitions
Table 4 details the MC13234 pinout and functionality.
Table 3. MC13234 Pin Function Description
Pin # Pin Name Type Description Functionality
1 PTA0/XTAL_32K Digital Input/Output Port A Bit 0 / 32.768 kHz oscillator
output
2 PT A1/EXT AL_32K Digital Input/Output Port A Bit 1 / 32.768 kHz oscillator input For normal use, 10 kOhm resistor
to ground recommended
3 RESET Digital Input/Output Device asynchronous hardware reset.
Active low. Onboard Pullup Normally input; gets driven low for
a period af ter a reset
4 PTA2 Digital Output Port A Bit 2 / Test Mode enable. TM mode input. Must be biased
low exiting POR for normal
operation
5 PTA3/ IRQ Digital Input/Output Port A Bit 3 / IRQ.
6PTA4/
XTAL_32KOUT Digital Input/Output Port A Bit 4 / Buffered 32.768 kHz clock
output Optional 32.768 kHz output clock
for measuring 32 kHz oscillator
accuracy (ppm)
7 PTA5/SDA Digital Input/Output Port A Bit 5 / IIC Bus data Defaults to open drain for IIC
8 PTA6/SCL Digital Input/Output Port A Bit 6 / IIC Bus clock Defaults to open drain for IIC
9 PT A7/BKGD/MS Digital Input/Output Port A Bit 7 / Background / Mode Select Debug signal
10 PTB0/KBI1P0 Digital Input/Output Port B Bit 0 / KBI1 Input Bit 0 Wake-up capability
11 PTB1/KBI1P1 Digital Input/Output Port B Bit 1 / KBI1 Input Bit 1 Wake-up capability
12 PTB2/KBI1P2 Digital Input/Output Port B Bit 2 / KBI1 Input Bit 2 Wake-up capability
13 PTB3/KBI1P3 Digital Input/Output Port B Bit 3 / KBI1 Input Bit 3 Wake-up capability
14 PTB4/KBI1P4 Digital Input/Output Port B Bit 4 / KBI1 Input Bit 4 Wake-up capability
15 PTB5/KBI1P5 Digital Input/Output Port B Bit 5 / KBI1 Input Bit 5 Wake-up capability
16 PTB6/KBI1P6 Digital Input/Output Port B Bit 6 / KBI1 Input Bit 6 Wake-up capability
17 PTB7/KBI1P7 Digital Input/Output Port B Bit 7 / KBI1 Input Bit 7 Wake-up capability
18 PTC0/KBI2P0 Digital Input/Output Port C Bit 0 / KBI2 Input Bit 0
19 VBATT_4 Power Input VDD supply input 1Connect to system VDD supply
20 PTC1/KBI2P1 Digital Input/Output Pot C Bit 1 / KBI2 Input Bit 1
21 PTC2/KBI2P2 Digital Input/Output Pot C Bit 2 / KBI2 Input Bit 2
22 PTC3/KBI2P3 Digital Input/Output Pot C Bit 3 / KBI2 Input Bit 3
23 PTC4/SPICLK Digital Input/Output Port C Bit 4 / SPI clock
24 PTC5/SS Digital Input/Output Port C Bit 5 / SPI slave select
25 PTC6/MISO Digital Input/Output Port C Bit 6 / SPI MISO
26 PTC7/MO SI/ 32M_O UT Digital Input/Output Port C Bit 7 / SPI MOSI / 32 MHz XT AL
output
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 23
27 PTD0/TPM0 Digital Input/Output Port D Bit 0 / TPM0 signal TPM0 timer output / gate input
signal
28 PTD1/TPM1 Digital Input/Output Port D Bit 1/ TPM1 signal TPM1 timer output / gate input
signal.
29 PTD2/TPM2 Digital Input/Output Port D Bit 2 / TPM2 signal TPM2 timer output / gate input
signal.
30 PTD3/TPM3 Digital Input/Output Port D Bit 3 / TPM3 signal TPM3 timer output / gate input
signal.
31 PTD4/CMT Digital Input/Output Port D Bit 4 / CMT output Hi drive output for IR diode.
32 PTD5/TXD Digital Input/Output Port D Bit 5 / UART TXD output UART has no hardware flow
control.
33 PTD6/RXD Digital Input/Output Port D Bit 6 / UART RXD input / AD5
signal UART has no hardware flow
control.
34 PTD7 Digital Input/Output Port D Bit 7
35 XTAL_32M Analog Output 32 MHz reference oscillator output
36 EXTAL_32M Analog input 32 MHz reference oscillator input
37 VBATT_3 Power Input VDD supply input1Connect to system VDD supply
38 VREG_VCO VCO Reg Out / in VCO regulator output and input to VCO
1.8 Vdc VDD Bypass to ground with 220 nF
capacitor.
39 VDD_ANA Analog Power Input Analog 1.8 Vdc Input Connect to VREG_ANA
40 NC No connection to device May be left open or connect to
ground
41 RF_N RF Input/Output Modem RF input/output negative Bi-directional RF port for the
internal LNA an d PA
42 RF_P RF Input/Output Modem RF input/output positive Bi-directional RF port for the
internal LNA an d PA
43 RF_BIAS RF Voltage Output Switched RF bias voltage (1.8 Vdc) High for TX; low for RX
44 VBATT_2 Power Input VDD supply input1Connect to system VDD supply
45 NC May be left open or connect to
ground
46 VREG_LO2 LO2 Reg Out LO2 regulator output @ 1.8 Vdc Bypass to ground with 220 nF
capacitor.
47 VREG_ANA ANA Reg Out Analog regulator output @ 1.8 Vdc Bypass to ground with 220 nF
capacitor. Connect to VDD_ANA
48 VBATT_1 Power Input VDD supply to Analog regulator1Connect to system VDD supply
Flag GND Power Input System ground
1VBATT_1, VBATT_2, VBATT_3 and VBATT_4 signals are not connected onboard MC13234/MC13237.
Table 3. MC13234 Pin Function Description (continue d)
Pin # Pin Name Type Description Functionality
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
24 Freescale Semiconductor
Table 4 details the MC13237 pinout and functionality.
Table 4. MC13237 Pin Function Description
Pin # Pin Name Type Description Functionality
1 PTA0/XTAL_32K Digital Input/Output Port A Bit 0 / 32.768 kHz oscillator
output
2 PTA1/EXTAL_32K Digital Input/Output Port A Bit 1 / 32.768 kHz oscillator
input For normal use, 10 kOhm resistor
to ground recommended
3 RESET Digital Input/Output Device asynchronous hardware reset.
Active low. Onboard Pullup Normally input; gets driven low for
a period after a reset
4 PTA2 Digital Output Port A Bit 2 / Test Mode enable. TM mode input. Must be biased
low exiting POR for normal
operation
5 PTA3/IRQ Digital Input/Output Port A Bit 3 / IRQ.
6PTA4/
XTAL_32KOUT Digital Input/Output Port A Bit 4 / Buffered 32.768 kHz
clock output Optional 32.768 kHz output clock
for measuring 32 kHz oscillator
accuracy (ppm)
7 PTA5/SDA Digital Input/Output Port A Bit 5 / IIC Bus data Defaults to open drain for IIC
8 PTA6/SCL Digit al Input/Output Port A Bit 6 / IIC Bus clock Defaults to open drain for IIC
9 PTA7/BKGD/MS Digital Input/Output Port A Bit 7 / Background / Mode
Select Debug signal
10 PTB0/KBI1P0 Digital Input/Output Port B Bit 0 / KBI1 Input Bit 0 Wake-up capability
11 PTB1/KBI1P1 Digital Input/Output Port B Bit 1 / KBI1 Input Bit 1 Wake-up capability
12 PTB2/KBI1P2 Digital Input/Output Port B Bit 2 / KBI1 Input Bit 2 Wake-up capability
13 PTB3/KBI1P3 Digital Input/Output Port B Bit 3 / KBI1 Input Bit 3 Wake-up capability
14 PTB4/KBI1P4 Digital Input/Output Port B Bit 4 / KBI1 Input Bit 4 Wake-up capability
15 PTB5/KBI1P5 Digital Input/Output Port B Bit 5 / KBI1 Input Bit 5 Wake-up capability
16 PTB6/KBI1P6 Digital Input/Output Port B Bit 6 / KBI1 Input Bit 6 Wake-up capability
17 PTB7/KBI1P7 Digital Input/Output Port B Bit 7 / KBI1 Input Bit 7 Wake-up capability
18 PTC5/SS/AD7 Digital Input/Outp ut Port C Bit 5 / SPI Slave Select / AD7
Signal
19 VBATT_4 Power Input VDD supply input 1Connect to system VDD supply
20 VSSA_ADC Digital Input/Output ADC analog ground
21 VREFL Digital Input/Output ADC low reference voltage
22 VREFH Digital Input/Output ADC high reference voltage
23 VDDA_ADC Digital Input/Output ADC analog power supply
24 PTC4/SPICLK Digital Input/Output Port C Bit 4 / SPI Clock
25 PTC6/MISO Digital Input/Output Port C Bit 6 / SPI MISO
26 PTC7/MOSI Digital Input/Output Port C Bit 7 / SPI MOSI
27 PTD0/TPM0 Digital Input/Output Port D Bit 0 / TPM0 signal TPM0 timer output / gate input
signal
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 25
28 PTD1/TPM1/AD0 Digital Input/Output Port D Bit 1/ TPM1 signal /AD0 signal TPM1 timer output / gate input
signal. ADC input 0
29 PTD2/TPM2/AD1 Digital Input/Output Port D Bit 2 / TPM2 signal /AD1 signal TPM2 timer output / gate input
signal. ADC input 1
30 PTD3/TPM3/AD2 Digital Input/Output Port D Bit 3 / TPM3 signal /AD2 signal TPM3 timer output / gate input
signal. ADC input 2
31 PTD4/CMT/AD3 Digital Input/Output Port D Bit 4/ CMT output / AD3 signal Hi drive output for IR diode. ADC
input 3
32 PTD5/TXD/AD4 Digital Input/Output Port D Bit 5 / UART TXD output / AD4
signal UART has no hardware flow
control. ADC input 4
33 PTD6/RXD/AD5 Digital Input/Output Port D Bit 6 / UART RXD input / AD5
signal UART has no hardware flow
control. ADC input 5
34 PTD7/AD6 Digital Input/Output Port D Bit 7 / AD6 signal ADC input 6
35 XTAL_32M Analog Output 32 MHz reference oscillator output
36 EXTAL_32M Analog input 32 MHz reference oscillator input
37 VBATT_3 Power Input VDD supply input1Connect to system VDD supply
38 VREG_VCO VCO Reg Out / in VCO regulator output and input to
VCO 1.8 Vdc VDD Bypass to ground with 220 nF
capacitor.
39 VDD_ANA Analog Power Input Analog 1.8 Vdc Input Connect to VREG_ANA
40 NC No connection to device May be left open or connect to
ground
41 RF_N RF Input/Output Modem RF input/output negative Bi-directional RF port for the
internal LNA and PA
42 RF_P RF Input/Output Modem RF input/output posi tive Bi-directional RF port for the
internal LNA and PA
43 RF_BIAS RF Voltage Output Switched RF bias voltage (1.8 Vdc) High for TX; low for RX
44 VBATT_2 Power Input VDD supply input1Connect to system VDD supply
45 NC Input No connection to device May be left open or connect to
ground
46 VREG_LO2 LO2 Reg Out LO2 regulator output @ 1.8 Vdc Bypass to ground with 220 nF
capacitor.
47 VREG_ANA ANA Reg Out Analog regulator output @ 1.8 Vdc Bypass to ground with 220 nF
capacitor. Connect to VDD_ANA
48 VBATT_1 Power Input VDD supply to Analog regulator1Connect to system VDD supply
Flag GND Power Input System ground
1VBATT_1, VBATT _2, VBATT_3 and VBATT_4 signals are not connected onboard MC13234/MC13237.
Table 4. MC13237 Pin Function Description (continue d)
Pin # Pin Name Type Description Functionality
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
26 Freescale Semiconductor
11 Electrical Specifications
This section details maximum ratings for the 48-pin LGA package, recommended operating conditions,
DC characteristics, and AC characteristics.
11.1 Package Maximum Ratings
Absolute maximum ratings are stress ratings only, and functional operation at the maximum rating is not
guaranteed. Stress beyond th e limits specified in Table 5 may affect device reliability or cause permanent
damage to the device. For functional operating conditions, refer to the remaining tables in this section.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for instance, either VSS or VBATT) or the
programmable pullup resistor associated with the pin is enabled.
Table 5 shows the maximum ratings for the 48-Pin LGA package.
11.2 ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less comm on on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latchup test testing is in conformity with the JESD78 IC Latch-Up Test.
Table 5. LGA Package Maximum Ratings
Rating Symbol Value Unit
Maximum Junction Temperature TJ125 C
Storage Temperature Range Tstg 125 C
Moisture Sensitivity Level MSL3-260
Reflow Soldering Temperature 260 C
Power Supply Voltage VBATT –0.3 to 3.7 Vdc
Digital Input Voltage Vin –0.3 to (VDD + 0.3) Vdc
RF Input Power Pmax 10 dBm
Note: Maximum Ratings are those va lues beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics
or Recommended Operati ng Conditions tables.
Note: All pins meets ESD Human Body Model (HBM) = 2 kV
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 27
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification.
11.3 Recommended Operating Conditions
NOTE
The MC13234/MC13237 transceiver provides an IEEE® 802.15.4 Standard
PHY compliant node over all recommended operating conditions.
Table 6. ESD and Latch-up Test Conditions1
1There is no equivalent circuit (model) for CDM per JESD22-C101-A.
Model Description Symbol Value Unit
Human
Body
Series resistance R1 1500
Storage capacitance C 100 pF
Number of pulses per pin2
2This number represents a minimum number for both positive pulse(s) and negative pulse(s)
—1
Machine
Series resistance R1 0
Storage capacitance C 200 pF
Number of pulses per pin2—1
Latch-up Minimum input voltage limit – 1.8 V
Maximum input voltage limit 4.32 V
Table 7. ESD and Latch-Up Protection Characteristics
No. Rating1,2
1Parameter is achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted.
2All package pins including RF pins.
Symbol Min Max Unit
1 Human body model (HBM) VHBM 2000 V
2 Machine model (MM) VMM 200 V
3 Charge device mo del (CDM) VCDM 750 V
4 Latch-up current at TA = 85CI
LAT 100 mA
Table 8. Recommended Operating Conditions
Characteristic Symbol Min Typ Max Unit
Power Supply Voltage (VBATT)V
BATT 1.812.7 3.6 Vdc
Input Frequency fin 2.405 2.480 GHz
Operating Temperature Ra nge TA–40 25 85 C
Logic Input Vo ltage Low VIL 0 30%
VBATT
V
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
28 Freescale Semiconductor
11.4 DC Electrical Characteristics
Logic Input Vo ltage High VIH 70%
VBATT
—V
BATT V
Output Load Current (with specified VOLmax and VOHmin)
All standard GPIO
CMT output IRO IO
3
20 mA
RF Input Power Pmax ——10dBm
Crystal Reference Oscillator Frequency (±40 ppm over operating
conditions to meet the 802.15.4 Standard.) fref 32 MHz Only
1Although the device functions at VDDmin, the supply must first rise above VLVDL. As the supply voltage rises, the LVD circuit
will hold the MCU in reset until the supply has risen above VLVDL.
Table 9. DC Electrical Characteristics1
(Typical conditions: VBATT = 2.7 V, TA = 25 °C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Power Supply Voltage (voltage applied to power input pins; VBATT_1,
VBATT_2, VBATT_3, VBATT_4 and VDDA_ADC) VDD 1.822.7 3.6 Vdc
Minimum CPU RUN voltage (Radio and peripherals not guaranteed
operational; CPU, RAM, and Flash operational) VDD_RUN 1.6 Vdc
ADC Voltage Reference High VREFH 1.8 2.7 VDDA_
ADC Vdc
ADC Voltage Reference Low VREFL VSSA_
ADC Vdc
Minimum RAM retention voltage (voltage applied to VBA TT power input pins) VRAM VPOR Vdc
Low-voltage detection threshold - high range (all conditio ns3)
VDD falling
VDD rising VLVDH 2.18
2.20 2.23
2.26 2.32
2.32 Vdc
Low-voltage detection threshold - low range (all conditions)
VDD falling
VDD rising VLVDL 1.67
1.68 1.70
1.77 1.80
1.96 Vdc
Low-voltage warning threshold - high range (all conditions)
VDD falling
VDD rising VLVWH 2.25
2.30 2.32
2.36 2.45
2.42 Vdc
Low-voltage warning threshold - low range (all conditions)
VDD falling
VDD rising VLVWL 1.79
1.74 1.81
1.84 1.91
1.99 Vdc
Power-on reset (POR) voltage VPOR 1.0 Vdc
High impedance (off-state) leakage current (per pin)
(VIn = VDD or VSS, all input/outputs, device must not be in lo w power
mode)
|IOZ| –1.0 1.0
A
Table 8. Recommended Operating Conditions (continued)
Characteristic Symbol Min Typ Max Unit
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 29
Input Current (VIN = 0 V or VDDINT) (VIn = VDD or VSS, all input/outputs,
device must not be in low power mode) IIN –1.0 +1.0 µA
Input Low Voltage (All digital inputs) VIL 0—30%
VBATT
V
Input High Voltage (all digital inputs) VIH 70%
VBATT
—V
BATT V
Input hysteresis (all digital inputs) Vhys 0.06
VDD
V
Internal pull up resistors4
(all port pins and IRQ except CMT) RPU —20—
kOhm
Internal CMT pull up resistor4 RPU —10—kOhm
Internal pull down resistors4
(KBI pins and IRQ) RPD —20—
kOhm
Output High Volt age
All standard GPIO = 3 mA
CMT output IRO = 20 mA
VOH 80%
VBATT
—V
BATT V
Output Low Voltage (All digital outputs)
All standard GPIO = 3 mA
CMT output IRO = 20 mA
VOL 0—20%
VBATT
V
Input capacitance (all non-supply pins) CIn —3—pF
1All ADC-related specifications apply only to the MC13237.
2Although the device functions at VDDmin, the supply must first rise about VLVDL. As the supply voltage rises, the LVD circuit
will hold the MCU in reset until the supply has risen above VLVDL.
3Denotes full voltage supply and temperature ranges.
4Measurement condition for pull resistors: VIN = VSS for pullup and VIN = VDD for pulldown.
Table 9. DC Electrical Characteristics1 (continued)
(Typical conditions: VBATT = 2.7 V, TA = 25 °C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
30 Freescale Semiconductor
11.5 Supply Current Characteristics
Table 10. Supply Current Charactertistics1
(Typical conditions: VBATT = 2.7 V, TA = 25 °C, unless othe rwise noted.)
Mode Details Min. Typ. Max. Unit
Stop3 • All internal circuitry off, RAM, I/O, internal
registers & selectable peripheral registers
retained, 32 MHz reference oscillator off, KBI
active, RTC off, LVD off. RF in reset.
—0.45uA
• All internal circuitry off, RAM, I/O, internal
registers & selectable peripheral registers
retained, 32 MHz reference oscillator off, KBI
active, RTC on with 1 kHz oscillator , LVD off. RF in
reset.
—0.55
• All internal circuitry off, RAM, I/O, internal
registers & selectable peripheral registers
retained, 32 MHz reference oscillator off, KBI
active, RTC on with 32.768 kHz oscillator , L VD of f.
RF in reset.
—2.65
• All internal circuitry off, RAM, I/O, internal
registers & selectable peripheral registers
retained, 32 MHz reference oscillator on, KBI
active, RTC on with 32 MHz oscillator, LVD of f. RF
in reset.
330
• All internal circuitry off, RAM, I/O, internal
registers & selectable peripheral registers
retained, 32 MHz reference oscillator on, KBI
active, RTC on with 32 MHz oscillator , LVD on. RF
in reset.
• ADC optionally on2.
450
Low Power Wait (LPWait) • Entered from LPRun.
• Processor off, bus clock @ 250 kHz, voltage
regulator in standby.
• Peripherals and modem clock disabled . RF in
reset.
0.50 0.56 0.62 mA
Wait Processor of f, system clocks are running and
voltage regulator on. RF in reset or active mode. —2.9mA
Low Power Run (LPRun) • Processor forced to 500 kHz and bus clock @
250 kHz.
• Peripheral state and RAM retained. Voltage
regulators in standby.
• Peripherals and modem clocks disabled. RF in
reset.
0.53 0.75 0.85 mA
Run • Processor running @ 32 MHz and peripheral
clock @ 16 MHz.
• All peripherals clocks disabled3 & RAM active,
voltage regulators fully on.
• RF in reset.
4.0 4.7 4.9 mA
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 31
Figure 4. Typical RUN Current versus CPU Clock (only 0.5, 1, 2, 4, 8, 16, and 32 MHz available)
11.6 RF AC Electrical Characteristics
NOTE
All specified RF parameters are referenced to the package pins and are the
result of measurements with instrumentation in the reference circuit shown
in Figure 5.
Transmit (TX) • MCU in LPRUN (peripheral clock@ 25 0 kHz)
• RF in transmit mode (nominal power out)421.3 26.6 28.2 mA
Receive Partial Power
Down (RX_PPD) • MCU in LPRUN (peripheral clock@ 250 kHz)
• RF in Receive Partial Power Down Mode —22.3—mA
Receive (RX) • MCU in LPRUN (p eripheral clock@ 250 kHz)
• RF in receive mode either 1) waiting @ full
sensitivity or 2) receiving an actual frame.
26.8 34.2 35 mA
1For ADC supply current specifications, see Table 24.
2Requires the asynchronous ADC clock. For St op3, L VD must be enabled to run in S top if converting bandgap channel.
3Register adjustment is per MC1323x Adva nce information, Rev 0.0 document: set SCGC1 and SCGC2 = 0X00
4TX output power set to nominal (0 dBm)
Table 10. Supply Current Charactertistics1 (continued)
(Typical conditions: VBATT = 2.7 V, TA = 25 °C, unless othe rwise noted.)
Mode Details Min. Typ. Max. Unit
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
32 Freescale Semiconductor
Table 11. Receiver AC Electrical Characteristics for 802.15.4 Modulation Mode
(Typical conditions: VBATT = 2.7 V, TA = 25 °C, fref = 32MHz, unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
Sensitiv ity for 1% Packet Error Rate (PER) (+25 °C, @ package interface)1
1Measured at fc = 2450 MHz.
SENS25 °C —–93 dBm
Sensitiv it y for 1% Packet Error Rate (PER) (Over all conditions)2
2All conditions includes –40°C to +85°C, VBATT = 1.8 V to 3.6 V, and full frequency range
SENS –89 dBm
Saturation (maximum input level) SENSmax 10 dBm
Channel Rejection for 1% PER
+5 MHz (adjacent channel)3
–5 MHz (adjacent channel)3
+10 MHz (alternate channel)4
–10 MHz (alternate channel)4
>= 15 MHz5
3IEEE 802.15.4 Standard specifies minimum adjacent channel rejection as 0 dB
4IEEE 802.15.4 Standard specifies minimum alternate channel rejection as 30 dB
5This parameter represents an average of all readings across all channels
35
25
45
43
50
dB
Frequency Error Tolerance6
6Minimum set by IEEE 802.15.4 Standard
200 kHz
Symbol Rate Error Tolerance680 ppm
Table 12. Transmitter AC Elect rical Characteristics for 802.15.4 Modulation Mode
(Typical conditions: VBATT = 2.7 V, TA = 25 °C, fref = 32 MHz, unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
Nominal Output Power1
1Register sets output power to nominal (0 dBm).
Pout –2.5 0 2.3 dBm
Maximum Output Power2
2Register sets output power to maximum.
—+2— dBm
Error Vector Magn itude EVM <16 18 %
Output Power Control Range 30 dB
Over the Air Data Rate 250 kbps
2nd Harmonic3
3Measurements taken at output of evaluation circuit set for maximum power out and averaged over 100 ms.
–444
4With use of external filtering / harmonic tra p as implemented in reference circuit.
dBm/(100 kHz)
3rd Harmonic and greater3 –544 dBm/(100 kHz)
Spurious Emissions5
<1 GHz (quasi-peak detectio n mode)
>1 GHz (peak detection mode)
Lower Band Edge (peak detection mode)
Upper Band Edge (peak detection mode)
5Derived from measured radiated values in units of dBuV/m and converted to EIRP (dBm).
–66
–40
–34
–23
dBm
dBm/MHz
dBm/MHz
dBm/MHz
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 33
Figure 5. RF Parameter Reference Circuit
Table 13. RF Port Impedance, Pin RF_P and RF_N
11.7 Crystal Reference Clock Oscillator Characteristics
The reference oscillator model including external crystal in shown in Figure 6. The IEEE 802.15.4
Standard requires a frequency tolerance less than or equal to 40 ppm as shown in the oscillator
specification Table 14. With a suitable crystal (refer to Table 15), the device frequency tolerance can
typically trimmed to be held to 30 ppm over all conditions.
Description Frequency Symbol Typical Unit
Series equivalent effective device impedance
across the differential port derived from
characterization of match networ k
2.405 GHz
2.442 GHz
2.480 GHz Zin
22.2 – j74.8
20.6 – j89.9
20.2 – j98.4
Z_RF_N
RF_P
Z_RF_P
RF_N
RF_50
RF_BIAS
RF_BIAS
HARMONIC TRAP
L1
0.0033UH
L1
0.0033UH
1 2
Z1
50/50 OHMS
Z1
50/50 OHMS
5
1
6
2
3
4
C18
0.8PF
C18
0.8PF
U2
MC1323X
U2
MC1323X
RF_P 42
RF_N 41
NC/TINJ_N 45
RF_BIAS/TINJ_P 43
L3
3.9nH
L3
3.9nH
1 2
C2
10PF
C2
10PF
L2
0.0033UH
L2
0.0033UH
1 2
C6
10PF
C6
10PF
J1
SMA
J1
SMA
1
G1 G3
G2 G4
C7
2PF
C7
2PF
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
34 Freescale Semiconductor
Figure 6. 32MHz Reference Oscillator Model
Table 14. Reference Oscillator Specifications
Characteristic Symbol Min Typ Max Unit
Frequency (nominal) 32.000000 MHz
Oscillator frequency tolerance over temperature range. 30 40 ppm
External load capacitance CLext 8pF
Internal Osc startup time1
1This is part of device wake-up time.
tcst 800 s
Table 15. Recommended 32 MHz Crystal Specifications
Parameter Value Unit Condition
Frequency 32.000000 MHz
Frequency tolerance (cut tolerance) 10 ppm max at 25 °C
Frequency stability (temperature drift) 16–18 ppm Over desired temperature range
Aging 2 ppm max
Equivalent series resistance 60 max
Load capacitance 9 pF
Shunt capacitance <2 pF max
Mode of oscillation fundamental
Y1
CRYSTAL
Cstray
REFERENCE
OSCILLATOR
32 MHz
EXTAL_32M XTAL_32M
0-300 fF
with steps of 20 fF.
Cstray
Fine Tune [3:0] Fine Tune [3:0]
MC1323x
0-4.215 pF
with steps of 281 fF.
Coarse Tune [3:0] Coarse Tune [3:0]
CL1 CL2
0-300 fF
with steps of 20 fF.
0-4.215 pF
with steps of 281 fF.
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 35
11.8 Optional 32.768 kHz Crystal Oscillator Specifications
Figure 7. 32.768 kHz Oscillator Mode
l
11.9 Internal Low Speed Reference Oscillator Specifications
Table 16. 32.768 Oscillator Crystal Ty pi cal Specifications
Characteristic Symbol Min Typ Max Unit
Crystal frequency 32.768 kHz
Frequency tolerance @ 25 °C 20 ppm
Load capacitance 12 12.5 16 pF
Equivalent series resistance (ESR) 40 130 k
Shunt capacitance 2 pF
Tolerated drive level 1 W
Table 17. Internal 1 kHz Oscillator Specifications
Characteristic Symbol Min Typ Max Unit
Default Frequency @ 25 °C 0.80 1.0 1.40 kHz
Oscillator frequency variation over temperature1
Deviation at -40 °C from 25 °C frequency
Deviation at +85 °C from 25 °C frequency
1This percentage deviation is typical change from the individual de vice oscillator frequency at 25°C
–13
+6
%
Y1
CRYSTAL
Cstray1
32.768 kHz
OSCILLATOR
XTAL_32KEXTAL_32K
Cstray2 CL2CL1
Rf
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
36 Freescale Semiconductor
11.10 Control Timing and CPU Bus Specifications
11.11 SPI Timing
Figure 8. SPI Timing Diagram
Table 19 describes the timing requirements for the SPI system.
Table 18. MCU Control Timing
(Typical conditions: VBATT = 2.7 V, TA = 25 °C, fref = 32MHz, unless otherwise noted.)
Parameter Symbol Min Typical Max Unit
CPU frequency (tcyc = 1/RDIV) fCPU fref/641
1The 32 MHz reference clock.
—32
1MHz
Bus Frequency (always 1/2 CPU clock) (tcyc = fBUS) fBUS fCPU/2 MHz
External reset pulse width 100 ns
External asynchronous minimum interrupt pulse width
(KBI or IRQ)2
2Minimum pulse to recognize a asynchronous transition
100 ns
External synchronous minimum in terrupt pulse width
(KBI or IRQ)3 4
3Minimum pulse to recognize a level sensitive
4For determination of an actual key/push button in a matrix, this pulse with must remain present for the keyboard scan routine
duration. Thus, th e minimum pulse width would be determined by the software, not the detection hardware.
1.5 tcyc ——ns
Wake-up time from Stop3 800 s
SPI_SCK
SPI_MOSI (slave in)
SPI_SS (slave in)
SPI_MISO (master in)
t
XX_SU
t
XX_H
t
CYC
t
SS_SU
t
SS_H
t
MO,
t
SO
SPI_MOSI (master out)
SPI_MISO (slave out)
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 37
11.12 I2C Specifications
Table 20 describes the timing requirements for the I2C system.
The I2C module is driven by the peripheral bus clock (typically max 16 MHz) and the SCL bit clock is
generated from a prescaler.
Table 19. SPI Timing
Parameter Symbol Min Typical Max Unit
Master SPI_SCK Period tCYC bus_Clk*2 bus_Clk *256 ns
Slave SPI_SCK Period tCYC 10 ns
Slave SPI_SS Setup Time tSS_SU 10 ns
Slave SPI_SS Hold Time tSS_H 10 ns
Slave SPI_MOSI Setup Time tSI_SU 10 ns
Slave SPI_MOSI Hold Time tSI_H 10 ns
Master SPI_MISO Setup Time tMI_SU 20 ns
Master SPI_MISO Hold Time tMI_H 0ns
Master SPI_MOSI Output Time tMO 5ns
Slave SPI_MISO Output Time (with 15 pf load) tSO 20 ns
Table 20. I2C Signal DC Specifications (I2C_SDA and I2C_SCL)
Parameter Symbol Min Typical Max Unit
Input Low Voltage VIL –0.3 0.3 VDDINT V
Input High Voltage VIH 0.7 VBATT VBATT + 0.3 V
Input hysteresis Vhys 0.06 VBATT V
Output Low Voltage1 (IOL = 5 mA)
1SDA and SCL are open drain outputs
VOL 0 0.2 VBATT V
Input Current (VIN = 0 V or VDDINT)I
IN ——±1µA
Pin capacitance Cin ——<10pF
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
38 Freescale Semiconductor
Figure 9. I2C Timing Diagram
NOTE
The I2C timing limits reflect values that are necessary meet to the I2C Bus
specification.
Table 21. I2C Signal AC Specifications1
1All values referred to VIHmin and VILmax levels
Parameter Symbol Standard-Mode Fast-Mode Unit
Min Max Min Max
SCL clock frequency (when source) fSCL 0 100 0 150 kHz
Hold time (repeated) Start condition.
After this period, the first clock pulse is generated tHD;STA 4.0 0.6 s
LOW period of the SCL clock tLOW 4.7 1.3 s
HIGH period of the SCL clock tHIGH 4.0 0.6 s
Set-up time for a repeated Start condition tSU;STA 4.7 0.6 s
Data hold time tSHD;DAT 02
2A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL
signal) to bridge the undefined region of the falling edge of SCL.
3.453
3The maximum tHD;DAT has to be met only if the device do es not stre tch the LOW perio d (tLOW) of the SCL signal.
020.93s
Data setup time tSU:DAT 250 1004—ns
Rise time for both SDA and SCL signals tr 10 00 20 +
0.1Cb5300 ns
Fall time for both SDA and SCL signals tf 300 20 +
0.1Cb5300 ns
Bus free time between a Stop and Start condition tBUF 4.7 1.3 s
Capacitive load for each bus line Cb 400 400 pF
SDA
SCL
tf
tHD
tLOW tr
tHD;DAT
tSU;DAT
tHIGH
tf
SSr
tSU;STA
tHD:STA
P
trtBUF
S
tSU;STO
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 39
11.13 Flash Specifications
This section provides details about program/erase times and program-erase endurance for the flash
memory. Program and erase operations do not require any special power sources other than the normal
VDD supply. The flash is 131072 bytes organized as 128 pages by 1024 bytes.
NOTE
Flash erase and program may be executed only with CPU clock
programmed for 32 MHz (default). Flash operations are hardware state
machine controlled. User code need not count cycles. The following
information is supplied for calculating approximate time to program and
erase.
11.14 ADC Characteristics
ADC characteristics are applicable only to MC13237.
4A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns
must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal.
If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max
+ tSU;DAT = 1000 + 250 = 1250 ns (accordin g to the Standard-mode I2C-bus specification) before the SCL line is
released.
5Cb = total capacitance of one bus line in pF. If mixed with Hs-mode devices, the faster fall-times are allowed.
Table 22. Flash Characteristics
Characteristic Symbol Min Typical Max Unit
Supply voltage for program/erase/read operation VBATT 1.6 3.6 V
Byte program time (random location) tprog 40 s
Per Byte program time (burst mode) - excludes start/end
overhead tBurst 20 s
Sector erase time tSector 20 ms
Mass erase time tMass 20.1 ms
Program/erase endurance
TL to TH = –40C to + 85C
T = 25C20,000 100,000
cycles
Data retention @ 25Ct
D_ret 100 years
Table 23. 12-bit ADC Operating Conditions
Characteristic Conditions Symb Min Typ1Max Unit Comment
Supply voltage Absolute VDDA 1.8 3.6 V
Delta to VDD (VDD-VDDA)2VDDA –100 0 +100 mV
Ground voltage Delta to VSS (VSS-VSSA)2VSSA –100 0 +100 mV
Ref Voltage High VREFH 1.8 VDDA VDDA V
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
40 Freescale Semiconductor
Figure 10. ADC Input Impedance Equivalency Diagram
Ref Voltage Low VREFL VSSA VSSA VSSA V
Input Voltage VADIN VREFL —V
REFH V
Input
Capacitance CADIN —4.55.5
pF
Input Resistance RADIN —5 7k
Analog Source
Resistance 12 bit mode
fADCK > 4MHz
fADCK < 4MHz
RAS
2
5
k
External to MCU
10 bit mode
fADCK > 4MHz
fADCK < 4MHz
5
10
8 bit mode (all valid fADCK)—10
ADC Conversion
Clock Freq. High Speed (ADLPC=0) fADCK 0.4 8.0 MHz
Low Power (ADLPC=1) 0.4 4.0
1Typical values assume VDDA = 3.0V, Temp = 25C, fADCK=1.0MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2DC potential difference.
Table 23. 12-bit ADC Operating Conditions (continued)
Characteristic Conditions Symb Min Typ1Max Unit Comment
+
+
V
AS
R
AS
C
AS
V
ADIN
Z
AS
Pad
leakage
due to
input
protection
Z
ADIN
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
R
ADIN
ADC SAR
ENGINE
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
INPUT PIN
R
ADIN
C
ADIN
INPUT PIN
R
ADIN
INPUT PIN
R
ADIN
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 41
Table 24. 12-bit ADC Characteristics (VREFH = VDDASSA, VREFL = VSSA)
Characteristic Conditions Symb Min Typ1Max Unit Comment
Supply Current
ADLPC=1
ADLSMP=1
ADCO=1
IDDA —120
A
Supply Current
ADLPC=1
ADLSMP=0
ADCO=1
IDDA —202
A
Supply Current
ADLPC=0
ADLSMP=1
ADCO=1
IDDA —288
A
Supply Current
ADLPC=0
ADLSMP=0
ADCO=1
IDDA 0.532 1
mA
Supply Current Stop, Reset, Module Off IDDA 0.007 0.8 A
ADC
Asynchronous
Clock Source
High Speed (ADLPC=0) fADACK 23.3 5 MHz tADACK = 1/fADACK
Low Power (ADLPC=1) 1.25 2 3.3
Conversion Time
(Including
sample time)
Short Sample (ADLSMP=0) tADC 20 ADCK
cycles
Long Sample (ADLSMP=1) 40
Sample Time Short Sample (ADLSMP=0) tADS 3.5 ADCK
cycles
Long Sample (ADLSMP=1) 23.5
Total Unadjusted
Error 12-bit mode, 3.6> VDDA > 2.7 ETUE 2.0 4.5 LSB2Includes
Quantization
12-bit mode, 2.7> VDDA > 1.8V 2.0 4.5
10 bit mode 12.5
8 bit mode 0.5 ±1.0
Differential
Non-Linearity 12 bit mode DNL 0.7 –1.5 to +1.9 LSB2
10 bit mode30.5 1.0
8 bit mode30.3 0.5
Integral
Non-Linearity 12 bit mode INL 1.4 2.5 LSB2
10 bit mode 0.5 1.0
8 bit mode 0.3 0.5
Zero-Scale Error 12 bit mode EZS 0.5 0.5 LSB2VADIN = VSSA
10 bit mode 0.5 1.5
8 bit mode 0.5 0.5
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
42 Freescale Semiconductor
12 Applications Information
NOTE
Freescale provides a complete suite of design support material including
development hardware and software, reference manuals, and hardware
references designs for the MC13234/MC13237. The applications material
presented here is primarily for illustrative purposes.
Figure 11 and Figure 12 illustrate a basic applications circuit based on the MC13234 and MC13237 MRB
development boards. Features of the circuit include:
Full-Scale Error 12 bit mode EFS 1.0 –3.5 to 1.0 LSB2VADIN = VDDA
10 bit mode 0.5 1
8 bit mode 0.5 0.5
Quantization
Error 12 bit mode EQ –1 to 0 LSB2
10 bit mode 0.5
8 bit mode 0.5
Input Leakage
Error 12 bit mode EIL 2—LSB
2Pad leakage4 * RAS
10 bit mode 0.2 4
8 bit mode 0.1 1.2
Temp Sensor
Slope –40C to 25C m 1.646 mV/C
25C to 85C 1.769
Temp Sensor
Voltage 25CV
TEMP25 701.2 mV
Effective Number
Of Bits5ENOB 10.66 11.2 Bits
Spurious Free
Dynamic Range 12 bit mode 71 81 dB
1Typical values assume VDDA = 3.0V, Temp = 25C, fADCK=1.0 MHz unless otherwise stated. Typical valu es ar e for
reference only and are not tested in producti on.
21 LSB = (VREFH - VREFL)/2N
3Monotonicity and No-Missing-Codes guaranteed in 10 bit and 8 bit modes
4Based on input pad leakage current. Refer to pad electricals.
5Dynamic performance of the ADC @ VDDA = 3.0 V, Temp = 25C, fADCK=1.0 MHz and typical sampling rate values with
1 kHz sinewave applied @ the selected channel.
ENOB = (SINAD -1.76) / 6.02 where SINAD is Signal-to-Noise plus distortion. SINAD(dB) = 20 x log [SignalRMS / (Noise +
Distortion)RMS]
Table 24. 12-bit ADC Characteristics (VREFH = VDDASSA, VREFL = VSSA) (continued)
Characteristic Conditions Symb Min Typ1Max Unit Comment
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 43
32 MHz reference oscillator crystal (Y1) is required, and must meet defined specifications
Pulldown resistor on signal P T A2 assures that devices does not enter factory test mode on power-up
Power supply voltage (V_IC) can range from 1.8 Vdc to 3.6 Vdc (see Table 9 for usage notes)
RF Interface circuitry -
50/50 (unbal/bal) balun converts device differential, bidirectional RF port to single-ended
50-ohm antenna port
Control signal RF_Bias switches RF reference voltage to the balun as required for TX or RX
L1 provides impedance matching for MC1323x RF port
C4 and L2 network provides a harmonic trap for out-of-band harmonics and spurs on TX
A low-cost, copper pcb “F” antenna is shown. This is a common option, although other
antennas such as a chip antenna or antenna module may also be used
NOTE
RF circuitry at 2.4 GHz is very dependent on board layout and
component usage. Figure 11 shows a typical RF configuration, however
component value and use can vary based on customer application.
Mechanical design information for the MC1323x package and assembly
recommendations can be found in the Freescale IEEE 802.15.4 / ZigBee
Package and Har dwar e Layout Considerations Refer ence Manual, Doc
No. ZHDCRM.pdf
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
46 Freescale Semiconductor
13 Mechanical Diagrams (Case 2124-02, Non-JEDEC)
Figure 13. Mechanical Diagram (1 of 2)
MC13234/MC13237 Advance Information Data Sheet, Rev. 1.3
Freescale Semiconductor 47
Figure 14. Mechanical Diagram (2 of 2)
Document N umber: M C13237
Rev. 1.3
9/12/2013
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