Ver. 201207
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For High
HighHigh
High Current
CurrentCurrent
Current
RECOMMENDED LAND PATTERN
CIC10 Series (1608/ EIA 0603)
Part no. Thickness
(mm) Impedance
()±25%@100MHz DC Resistance
()Max. Rated Current
(mA) Max.
CIC10P080 0.80±0.15 8 0.03 3000
CIC10P220 0.80±0.15 22 0.025 3000
CIC10P300 0.80±0.15 30 0.025 3000
CIC10P330 0.80±0.15 33 0.025 3000
CIC10P600 0.80±0.15 60 0.05 2500
CIC10P800 0.80±0.15 80 0.05 2000
CIC10P101 0.80±0.15 100 0.05 2000
CIC10P121 0.80±0.15 120 0.05 2000
CIC10P151 0.80±0.15 150 0.09 1500
CIC10P181 0.80±0.15 180 0.09 1500
CIC10P221 0.80±0.15 220 0.10 1400
CIC10P301 0.80±0.15 300 0.12 1200
CIC10P331 0.80±0.15 330 0.14 1200
CIC10P471 0.80±0.15 470 0.15 1200
CIC10P601 0.80±0.15 600 0.15 1200
CIC10J080 0.80±0.15 8 0.02 3000
CIC10J300 0.80±0.15 30 0.03 3000
CIC10J470 0.80±0.15 47 0.05 2000
CIC10J600 0.80±0.15 60 0.05 2000
CIC10J800 0.80±0.15 80 0.10 2000
CIC10J121 0.80±0.15 120 0.10 2000
CIC10J151 0.80±0.15 150 0.15 1500
CIC10J221 0.80±0.15 220 0.15 1500
CIC10J301 0.80±0.15 300 0.15 800
CIC10J471 0.80±0.15 470 0.15 800
CIC10J601 0.80±0.15 600 0.15 750
Noise Suppression in power line
CIC series is used for high current. (~ 3A)
0.6~0.8mm
0.6~0.8mm 0.6~0.8mm
0.6~0.8mm
Ver. 201207
CHARACTERISTIC DATA
Ver. 201207
CHARACTERISTIC DATA
Ver. 201207
CI C 10 P 080 N C
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) For High current(C:~3A)
(3) Dimension (4) Material Code
(5) Nominal impedance (080:8, 221:220)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 4000
RECOMMENDED SOLDERING CONDITION
NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING