2017 Microchip Technology Inc. DS20005529B-page 1
DSC1001/3/4
Features
• Frequency Range: 1 MHz to 150 MHz
• Exceptional Stability over Temperature
- ±10 ppm, ±20 ppm, ±25 ppm, ±50 ppm
• Operating Voltage
- 1.7 to 3.6V
• Operating Temperature Range
- Ext. Industrial –40°C to 105°C
- Industrial –40°C to 85°C
- Commercial –20°C to 70°C
• Low Operating and Standby Current
-6 mA Operating (1 MHz)
-15 µA Standby (Max.)
• Ultra Miniature Footprint
-2.5 mm x 2.0 mm x 0.85 mm
-3.2 mm x 2.5 mm x 0.85 mm
-5.0 mm x 3.2 mm x 0.85 mm
-7.0 mm x 5.0 mm x 0.85 mm
• MIL-STD 883 Shock and Vibration Resistant
• Pb Free, RoHS, Reach SVHC Compliant
• AEC-Q100 Reliability Qualified
Applications
• Mobile Applications
• Consumer Electronics
• Portable Electronics
• DVR, CCTV, Surveillance Cameras
• Low Profile Applications
• Industrial Applications
Benefits
• Pin for Pin “Drop-In” Replacement for Industry
Standard Oscillators
• Semiconductor Level Reliability, Significantly
Higher than Quartz
• Short Mass Production Lead Times
• Longer Battery Life/Reduced Power Consumption
• Compact Plastic Package
• Cost Effective
General Description
The DSC1001/3/4 is a silicon MEMS based CMOS
family of oscillators that offers excellent jitter and
stability performance over a wide range of supply
voltages and temperatures. The device operates from
1 MHz to 150 MHz with supply voltages between 1.8 to
3.3 volts and temperature ranges up to –40°C to
105°C.
The DSC1001/3/4 incorporate an all silicon resonator
that is extremely robust and nearly immune to stress
related fractures, common to crystal based oscillators.
Without sacrificing the performance and stability
required of today’s systems, a crystal-less design
allows for a higher level of reliability, making the
DSC1001/3/4 ideal for rugged, industrial, and portable
applications where stress, shock, and vibration can
damage quartz crystal based systems.
Available in industry standard packages, the
DSC1001/3/4 can be “dropped-in” to the same PCB
footprint as standard crystal oscillators.
The DSC1003 and DSC1004 have the same
functionality and performance as the DSC1001, but
feature higher output drives of 25 pF and 40 pF,
respectively.
Package Types
DSC1001/3/4
CDFN/DFN
(Top View)
STANDBY# 1
2
4
3
GND
VDD
OUT
1.8V-3.3V Low-Power Precision CMOS Oscillators
DSC1001/3/4
DS20005529B-page 2 2017 Microchip Technology Inc.
Block Diagram
PFD VCO
FRAC-N
PLL
OUTPUTVDD
GND
(PIN1)
STANDBY#
PFD VCO
FRAC-N
PFD VCO
PLL
RESONATOR
VDD
GND
(PIN1)
2017 Microchip Technology Inc. DS20005529B-page 3
DSC1001/3/4
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage (VIN) ............................................................................................................................–0.3V to VDD + 0.3V
ESD Protection ....................................................................................................... 4 kV HBM, ±200V MM, 1.5 kV CDM
Recommended Operating Conditions
Supply Voltage (VDD) ................................................................................................................................ +1.7V to +3.6V
Output Load (ZL) ............................................................................................................................. R > 10 kΩ, C ≤ 15 pF
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
TABLE 1-1: DC CHARACTERISTICS
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters Sym. Min. Typ. Max. Units Conditions
Frequency F01 — 150 MHz Single Frequency
Frequency Tolerance ∆f
— — ±10
ppm
Includes frequency variations
due to initial tolerance,
temperature and power supply
voltage
— — ±20
— — ±25
— — ±50
Aging ∆f— — ±5 ppm 1 year @ +25°C
Supply Current, Standby IDD — — 15 µA T = +25°C
Output Startup Time
(Note 1) tSU —1.0 1.3 ms T = +25°C
Output Disable Time tDA —20 100 ns —
Output Duty Cycle SYM 45 —55 % —
Input Logic Level High VIH 0.75 x VDD — — V —
Input Logic Level Low VIL — — 0.25 x VDD V —
VDD = 1.8V
Supply Current, No Load IDD
—6.0 6.3
mA
1 MHz
CL = 0 pF,
RL = ∞,
T = +25°C
—6.5 7.1 27 MHz
—7.2 8.5 70 MHz
—8.3 11.9 150 MHz
Output Logic Level High VOH
0.8 x VDD — —
V
–6 mA, DSC1004, CL = 40 pF
0.8 x VDD — — –6 mA, DSC1003, CL = 25 pF
0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF
Output Logic Level Low VOL
— — 0.2 x VDD
V
6 mA, DSC1004, CL = 40 pF
— — 0.2 x VDD 6 mA, DSC1003, CL = 25 pF
— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
DSC1001/3/4
DS20005529B-page 4 2017 Microchip Technology Inc.
Output Transition Rise
Time tR
—1.4 3.0
ns
DSC1001, CL =
15 pF
T = +25°C,
20% to 80%
—1.5 3.0 DSC1003, CL =
25 pF
—1.8 3.0 DSC1004, C2 =
40 pF
Output Transition Fall
Time tF
—1.0 3.0
ns
DSC1001, CL =
15 pF
T = +25°C,
20% to 80%
—1.1 3.0 DSC1003, CL =
25 pF
—1.2 3.0 DSC1004, C2 =
40 pF
Jitter, Max.
Cycle-to-Cycle JCC —60 —ps f = 100 MHz (Note 2)
Period Jitter JP—10 15 psRMS f = 100 MHz (Note 2)
VDD = 2.5V
Supply Current, No Load IDD
—6.0 6.4
mA
1 MHz
CL = 0 pF,
RL = ∞,
T = +25°C
—6.7 7.5 27 MHz
—7.7 9.4 70 MHz
—9.6 13.9 150 MHz
Output Logic Level High VOH
0.9 x VDD — —
V
–6 mA, DSC1004, CL = 40 pF
0.8 x VDD — — –6 mA, DSC1003, CL = 25 pF
0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF
Output Logic Level Low VOL
— — 0.1 x VDD
V
6 mA, DSC1004, CL = 40 pF
— — 0.2 x VDD 6 mA, DSC1003, CL = 25 pF
— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF
Output Transition Rise
Time tR
—1.0 2.0
ns
DSC1001, CL =
15 pF
T = +25°C,
20% to 80%
—1.1 2.0 DSC1003, CL =
25 pF
—1.2 2.0 DSC1004, C2 =
40 pF
Output Transition Fall
Time tF
—0.9 2.0
ns
DSC1001, CL =
15 pF
T = +25°C,
20% to 80%
—1.0 2.0 DSC1003, CL =
25 pF
—1.1 2.0 DSC1004, C2 =
40 pF
TABLE 1-1: DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
2017 Microchip Technology Inc. DS20005529B-page 5
DSC1001/3/4
Jitter, Max.
Cycle-to-Cycle JCC —50 —ps f = 100 MHz (Note 2)
Period Jitter JP— 5 10 psRMS f = 100 MHz (Note 2)
VDD = 3.3V
Supply Current, No Load IDD
—6.0 6.5
mA
1 MHz
CL = 0 pF,
RL = ∞,
T = +25°C
—6.8 8.0 27 MHz
—8.2 10.5 70 MHz
—10.8 16.6 150 MHz
Output Logic Level High VOH
0.9 x VDD — —
V
–8 mA, DSC1004, CL = 40 pF
0.9 x VDD — — –6 mA, DSC1003, CL = 25 pF
0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF
Output Logic Level Low VOL
— — 0.1 x VDD
V
8 mA, DSC1004, CL = 40 pF
— — 0.1 x VDD 6 mA, DSC1003, CL = 25 pF
— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF
Output Transition Rise
Time tR
—1.0 2.0
ns
DSC1001, CL =
15 pF
T = +25°C,
20% to 80%
—1.1 2.0 DSC1003, CL =
25 pF
—1.2 2.0 DSC1004, C2 =
40 pF
Output Transition Fall
Time tF
—0.9 2.0
ns
DSC1001, CL =
15 pF
T = +25°C,
20% to 80%
—1.0 2.0 DSC1003, CL =
25 pF
—1.1 2.0 DSC1004, C2 =
40 pF
Jitter, Max.
Cycle-to-Cycle JCC —50 —ps f = 100 MHz (Note 2)
Period Jitter JP— 5 10 psRMS f = 100 MHz (Note 2)
TABLE 1-1: DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Temperature Range (T) TA
–40 —+105 °C Ordering Option L
–40 —+85 °C Ordering Option I
–20 —+70 °C Ordering Option E
Junction Operating Temperature TJ— — +150 °C —
Storage Temperature Range TA–55 —+150 °C —
Soldering Temperature Range TS— — +260 °C 40 sec. max
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DSC1001/3/4
DS20005529B-page 6 2017 Microchip Technology Inc.
2017 Microchip Technology Inc. DS20005529B-page 7
DSC1001/3/4
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1 and Table 2-2.
TABLE 2-1: CDFN PACKA GE PIN FU NCTION TABLE
Pin Number Symbol Description
1STANDBY# Standby input (Section 4.1 “Standby Fu nction”)
2GND Power supply ground
3 OUT Oscillator output
4VDD Positive power supply
TABLE 2-2: DFN PACKAGE PIN FUNCTION TABLE
Pin Number Symbol Description
1STANDBY# Standby input (Section 4.1 “Standby Function ” )
2 GND Power supply ground
3OUT Oscillator output
4VDD Positive power supply
Center Pad NC Tie to GND or do not connect.
DSC1001/3/4
DS20005529B-page 8 2017 Microchip Technology Inc.
3.0 NOMINAL PERFORMANCE CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 3-1: Supply Current.
FIGURE 3-2: Rise Time.
FIGURE 3-3: Rise Time.
FIGURE 3-4: Supply Current.
FIGURE 3-5: Fall Time.
FIGURE 3-6: Fall Time.
2017 Microchip Technology Inc. DS20005529B-page 9
DSC1001/3/4
4.0 OUTPUT WAVEFORM
VIL
1/fo
OUTPUT
STANDBY#
tEN
tDA
tF
tR
VIH
VOH
VOL
FIGURE 4-1: Output Waveform.
4.1 Standby Function
Standby# (Pin 1) Output (Pin 3)
High Level Output ON
Open (no connect) Output ON
Low Level High Impedance
DSC1001/3/4
DS20005529B-page 10 2017 Microchip Technology Inc.
5.0 TEST CIRCUIT
0.01μF
VDD 15pF
I
DD
*VSD
4
1
2
3
*VSD = Standby# Logic Level Input
FIGURE 5-1: DSC1001/3/4 Test Circuit.
2017 Microchip Technology Inc. DS20005529B-page 11
DSC1001/3/4
6.0 BOARD LAYOUT (RECOMMENDED)
FIGURE 6-1: Recommended Board Layout for DSC1001/3/4.
DSC1001/3/4
DS20005529B-page 12 2017 Microchip Technology Inc.
7.0 SOLDER REFLOW PROFILE
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
ReŇow
Cool
Time
Temperature (°C)
3C/Sec Max.
6C/Sec Max.
200
°
C
217
°
C
150
°
C
25
°
C
260
°
C
3C/Sec Max.
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
ReŇow
Cool
Time
Temperature (°C)
3C/Sec Max.
6C/Sec Max.
200
°
C
217
°
C
150
°
C
25
°
C
260
°
C
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
ReŇow
Cool
Time
Temperature (°C)
3C/Sec Max.
6C/Sec Max.
200
°
C
217
°
C
150
°
C
25
°
C
260
°
C
3C/Sec Max.
FIGURE 7-1: Solder Reflow Profile.
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max.
Preheat Time 150°C to 200°C 60 to 180 sec.
Time maintained above 217°C 60 to 150 sec.
Peak Temperature 255°C to 260°C
Time within 5°C of Actual Peak 20 to 40 sec.
Ramp-Down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 minutes max.
2017 Microchip Technology Inc. DS20005529B-page 13
DSC1001/3/4
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
Example
4-Lead CDFN/DFN*
XXXXXX
0SSS
DCPYYWW
0400000
0603
DCP1121
Legend: XX...X Product code, customer-specific information, or frequency in MHz
without printed decimal point
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
3
e
3
e
DSC1001/3/4
DS20005529B-page 14 2017 Microchip Technology Inc.
4-Lead DFN 7.0 mm x 5.0 mm Package Outline & Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2017 Microchip Technology Inc. DS20005529B-page 15
DSC1001/3/4
4-Lead CDFN 5.0 mm x 3.2 mm Package Outline & Recommended Land Pattern
DSC1001/3/4
DS20005529B-page 16 2017 Microchip Technology Inc.
4-Lead CDFN 3.2 mm x 2.5 mm Package Outline & Recommended Land Pattern
2017 Microchip Technology Inc. DS20005529B-page 17
DSC1001/3/4
4-Lead CDFN 2.5 mm x 2.0 mm Package Outline & Recommended Land Pattern
DSC1001/3/4
DS20005529B-page 18 2017 Microchip Technology Inc.
NOTES:
2017 Microchip Technology Inc. DS20005529B-page 19
DSC1001/3/4
APPENDIX A: REVISION HISTOR Y
Revision A (September 2017)
• Converted Micrel data sheet DSC1001 to Micro-
chip format data sheet DS20005529A.
• Minor text changes throughout.
• Added Ta b l e 2-2 for DFN package.
• Combined Micrel data sheet DSC1003 and
DSC1004 into this data sheet.
- Updated Section 1.0 “Electrical Character-
istics” to reflect this change.
- Updated General Description and Features
to reflect this change.
Revision B (November 2017)
• Updated VOH and VOL values in Ta b l e 1-1.
DSC1001/3/4
DS20005529B-page 20 2017 Microchip Technology Inc.
NOTES:
2017 Microchip Technology Inc. DS20005529B-page 21
DSC1001/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) DSC1001AE1-010.0000T:
1.8V - 3.3V Low-Power Pre-
cision CMOS Oscillator, 4-
Lead 7.0 mm x 5.0 mm
DFN, Ext. Commercial Tem-
perature Range, ±50 ppm,
10 MHz Output Fre-
quency, 1,000/Reel
b) DSC1003BL2-030.0000:
1.8V - 3.3V Low-Power Pre-
cision CMOS Oscillator, 4-
Lead 5.0 mm x 3.2 mm
CDFN, Ext. Industrial Tem-
perature Range, ±25 ppm,
30 MHz Output Fre-
quency, 110/Tube
c) DSC1001DE5-150.0000:
1.8V - 3.3V Low-Power Pre-
cision CMOS Oscillator, 4-
Lead 2.5 mm x 2.0 mm
CDFN, Ext. Commercial
Temperature Range,
±10 ppm, 150 MHz Output
Frequency, 110/Tube
d) DSC1004AI3-075.0000T:
1.8V - 3.3V Low-Power
Precision CMOS Oscilla-
tor, 4-Lead 7.0 mm x
5.0 mm DFN, Industrial
Temperature Range,
±20 ppm, 75 MHz
Output Frequency,
1,000/Reel
PART NO.
X
X
Package
Stability
Device
Device: DSC1001/3/4: 1.8V - 3.3V Low-Power Precision CMOS
Oscillator
Package: A = 4-Lead 7.0 mm x 5.0 mm DFN
B = 4-Lead 5.0 mm x 3.2 mm CDFN
C = 4-Lead 3.2 mm x 2.5 mm CDFN
D = 4-Lead 2.5 mm x 2.0 mm CDFN
Temperature
Range: E = –20C to +70C (Extended Commercial)
I = –40C to +85C (Industrial)
L = –40C to +105C (Extended Industrial)
Stability: 1 = ±50ppm
2 = ±25ppm
3=±20 ppm
5=±10 ppm
Frequency: xxx.xxxx = 1 MHz to 150 MHz (user-defined)
Packing Option: <blank>= 110/Tube
T = 1,000/Reel
X
Package
X
Temperature
Range
-XXX.XXXX
Frequency
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
DSC1001/3/4
DS20005529B-page 22 2017 Microchip Technology Inc.
NOTES:
2017 Microchip Technology Inc. DS20005529B-page 23
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2389-8
Note the following deta ils of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler an d
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, micro perip hera ls, n onvolat ile memory and
analog products. In addition, Microchip’s quality system for the d esign
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20005529B-page 24 2017 Microchip Technology Inc.
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Tel: 61-2-9868-6733
China - Beijing
Tel: 86-10-8569-7000
China - Chengdu
Tel: 86-28-8665-5511
China - Chongqing
Tel: 86-23-8980-9588
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
China - Hong Kong SAR
Tel: 852-2943-5100
China - Nanjing
Tel: 86-25-8473-2460
China - Qingdao
Tel: 86-532-8502-7355
China - Shanghai
Tel: 86-21-3326-8000
China - Shenyang
Tel: 86-24-2334-2829
China - Shenzhen
Tel: 86-755-8864-2200
China - Suzhou
Tel: 86-186-6233-1526
China - Wuhan
Tel: 86-27-5980-5300
China - Xian
Tel: 86-29-8833-7252
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
India - New Delhi
Tel: 91-11-4160-8631
India - Pune
Tel: 91-20-4121-0141
Japan - Osaka
Tel: 81-6-6152-7160
Japan - Tokyo
Tel: 81-3-6880- 3770
Korea - Daegu
Tel: 82-53-744-4301
Korea - Seoul
Tel: 82-2-554-7200
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Malaysia - Penang
Tel: 60-4-227-8870
Philippines - Manila
Tel: 63-2-634-9065
Singapore
Tel: 65-6334-8870
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Thailand - Bangkok
Tel: 66-2-694-1351
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
10/25/17