DATA SHEET
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
NEC Compound Semiconductor Devices 1997, 2003
BIPOLAR DIGITAL INTEGRATED CIRCUIT
µ
µµ
µ
PB1510GV
3.0 GHz INPUT DIVIDE BY 4 PRESCALER IC
FOR DBS TUNERS
The mark •
••
• shows major revised poi nts.
Document No. PU10311EJ01V0DS (1st edition)
(Previous No. P12752EJ2V0DS00)
Date Published January 2003 CP(K)
Printed in Japan
DESCRIPTION
The
µ
PB1510GV is a 3.0 GHz input divide by 4 prescaler IC for DBS tuner applications. This IC is suitable for use
of frequency divider for PLL synthesizer block. This IC is a shrink package version of the
µ
PB585G so that this small
package contributes to reduce the mounting space.
This IC is manufactured using our 20 GHz fT NESAT IV silicon bipolar process. This process uses silicon nitride
passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent
corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• High operating frequency : fin = 0.5 to 3.0 GHz
• High-density surface mounting : 8-pin plastic SSOP (4.45 mm (175) )
• Low current consumption : ICC = 14 mA TYP. @ VCC = 5 V
• Fixed division : ÷ 4
APPLICATIONS
• Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler
• DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer
ORDERING INFORMATION
Part Number Package Marking Supplyi ng Form
µ
PB1510GV-E 1 8-pin plast i c SSOP
(4.45 mm (175) ) 1510 •Embossed tape 8 mm wi de
•Pin 1 indicates pul l -out di rection of tape
•Qty 1 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
µ
PB1510GV
Data Sheet PU10311EJ01V0DS
2
µ
µµ
µ
PB1510GV
PIN CONNECTIONS
Pin No. Pin Name
1V
CC
2IN
3IN
4GND
5GND
6NC
7OUT
2
3
4
1
7
6
5
8
(Top View)
8NC
INTERNAL BLOCK DIAGRAM
D
Q
CLK
CLK Q
D
Q
CLK Q
IN
IN OUT
Amp.
SYSTEM APPLICATION EXAMPLE
RF unit block of DBS tuners
1st IF Input
(from DBS Converter) MIX. Baseband Output
OSC
PB1510GV
µ
LPF
PLL Synthesizer
for VHF/UHF Band
÷4 Prescaler
SAWBPF AGC Amp. FM Demod.
Data Sheet PU10311EJ01V0DS 3
µ
µµ
µ
PB1510GV
PIN EXPLANATION
Pin No. Pin Name Applied Vol tage
(V) Pin V ol tage
(V) Functi on and Application
1V
CC 4.5 to 5.5 −Supply v ol tage pin.
This pin must be equipped with bypass capac i t or (example: 1 000
pF) to minim i ze ground impedanc e.
2IN −1.7 to 4.95 Signal input pi n.
This pin s houl d be coupled to s i gnal source wit h capacit or (example:
1 000 pF) for DC cut.
3IN −1.7 to 4.95 Signal input bypass pi n.
This pin must be equipped with bypass capac i t or (example: 1 000
pF) to minim i ze ground impedanc e.
4, 5 GND 0 −Ground pin.
Ground pattern on the board should be form ed as wi de as poss i bl e
to minim i ze ground impedanc e.
6, 8 NC −−
Non connect i on pi ns .
These pins should be opened.
7OUT −1.0 to 4.7 Divided frequency output pin.
This pin is designed as em i tter fol l ower output. Thi s pin can be
connect ed t o i nput of prescaler withi n PLL synthesiz er through DC
cut c apac i tor.
Data Sheet PU10311EJ01V0DS
4
µ
µµ
µ
PB1510GV
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Test Condit i ons Ratings Unit
Supply V ol tage VCC TA = +25°C6.0V
Power Dissipati on PDTA = +85°CNote 250 mW
Operating Ambient Temperature TA−40 to +85 °C
Storage Temperature Tstg −55 to +150 °C
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter Symbol MIN. TYP. MAX. Unit
Supply V ol tage VCC 4.5 5.0 5.5 V
Operating Ambient Temperature TA−40 +25 +85 °C
ELECTRICAL CHARACTERISTICS (TA = −
−−
−40 to +85°
°°
°C, VCC = 4.5 to 5.5 V, ZS = ZL = 50 Ω
ΩΩ
Ω)
Parameter Symbol Test Condit i ons MIN. TYP. MAX. Unit
Circuit Current ICC No Signal s 10.5 14 17 mA
Upper Limit Operating Frequency 1 fin (U)1 Pin = −10 to +6 dBm 3.0 −−
GHz
Upper Limit Operating Frequency 2 fin (U)2 Pin = −15 to +6 dBm 2.7 −−
GHz
Lower Limit Operating Frequency fin (L) Pin = −15 to +6 dBm −−
0.5 GHz
Input P ower 1 Pin1 fin = 2.7 t o 3. 0 GHz −10 −+6 dBm
Input P ower 2 Pin2 fin = 0.5 t o 2. 7 GHz −15 −+6 dBm
Output Power Pout Pin = 0 dBm, f in = 2.0 GHz −12 −7−dBm
Data Sheet PU10311EJ01V0DS 5
µ
µµ
µ
PB1510GV
TYPICAL CHARACTERISTICS (TA = +25°
°°
°C, VCC = 5 V, unless otherwise specified)
No signal
1234567
20
15
10
5
0
Supply Voltage V
CC
(V)
Circuit Current I
CC
(mA)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
T
A
= +85˚C
+25˚C
–40˚C
T
A
= +25˚C
Input Frequency f
in
(GHz)
Input Power P
in
(dBm)
INPUT POWER vs. INPUT FREQUENCY
0.1 0.50.3 1 3 5 10
10
0
–10
–20
–30
–40
–50
20
Guaranteed
operating range
V
CC
= 4.5 to 5.5 V
V
CC
= 5.0 V
P
in
= 0 dBm
Z
L
= 50 Ω
Input Frequency f
in
(GHz)
Output Power P
out
(dBm)
OUTPUT POWER vs. INPUT FREQUENCY
0.1 0.50.3 1 3 5 10
–5
–10
–15
0
T
A
= +85˚C
+25˚C
–40˚C
V
CC
= 5.0 V
Input Frequency f
in
(GHz)
Input Power P
in
(dBm)
INPUT POWER vs. INPUT FREQUENCY
0.1 0.50.3 1 3 5 10
10
0
–10
–20
–30
–40
–50
20
Guaranteed
operating range
T
A
= –40˚C
+25˚C
+85˚C
+25˚C
–40˚C
+85˚C
T
A
= +25˚C
P
in
= 0 dBm
Z
L
= 50 Ω
Input Frequency f
in
(GHz)
Output Power P
out
(dBm)
OUTPUT POWER vs. INPUT FREQUENCY
0.1 0.50.3 1 3 5 10
–5
–10
–15
0
V
CC
= 5.5 V
5.0 V
4.5 V
Data Sheet PU10311EJ01V0DS
6
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µµ
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PB1510GV
TA = +85˚C
Pin = 0 dBm
ZL = 50 Ω
Input Frequency fin (GHz)
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT FREQUENCY
0.1 0.50.3 1 3 5 10
–5
–10
–15
0
VCC = 5.5 V
5.0 V
4.5 V
TA = –40˚C
Pin = 0 dBm
ZL = 50 Ω
Input Frequency fin (GHz)
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT FREQUENCY
0.1 0.50.3 1 3 5 10
–5
–10
–15
0
VCC = 5.5 V
5.0 V
4.5 V
Remark The graphs indicate nominal characteristics.
S11 vs. INPUT FREQUENCY
VCC = 5.0 V, TA = +25°C, ZO = 50 Ω
START 0.500000000 GHz
STOP 3.000000000 GHz
S
11
Z
REF 1.0 Units
4 200.0 mUnits/
27.159 Ω–27.582 Ω
hp
1 : 500 MHz
2 : 1 000 MHz
3 : 2 000 MHz
4 : 3 000 MHz
4
3
1
2
MARKER 4
3 GHz
Frequency (MHz) S11 (Ω)
500 37.1−j207.8
1 000 14.2−j105.1
2 000 7.9−j35.8
3 000 27.1−j27.5
Data Sheet PU10311EJ01V0DS 7
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µµ
µ
PB1510GV
S22 vs. OUTPUT FREQUENCY
VCC = 5.0 V, fin = 500 MHz, TA = +25°C, ZO = 50 Ω
START 0.125000000 GHz
STOP 0.750000000 GHz
S
22
Z
REF 1.0 Units
4 200.0 mUnits/
60.925 Ω104.77 Ω
hp
1 : 125 MHz
2 : 250 MHz
3 : 500 MHz
4 : 750 MHz
3
1
2
4
MARKER 4
750 MHz
VCC = 5.0 V, fin = 3.0 GHz, TA = +25°C, ZO = 50 Ω
START 0.125000000 GHz
STOP 0.750000000 GHz
S
22
Z
REF 1.0 Units
4 200.0 mUnits/
15.613 Ω98.168 Ω
hp
1 : 125 MHz
2 : 250 MHz
3 : 500 MHz
4 : 750 MHz
MARKER 4
750 MHz
4
3
2
1
Frequency (MHz) S22 (Ω)
125 55.5+j6.7
250 53.7+j30.4
500 55.0+j60.3
750 60.9+j104.8
Frequency (MHz) S22 (Ω)
125 28.5+j11.5
250 27.6+j23.6
500 20.5+j50.7
750 15.6+j98.2
Data Sheet PU10311EJ01V0DS
8
µ
µµ
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PB1510GV
TEST CIRCUIT
50 Ω
1 000 pF
C11 000 pF
1 000 pF
OPEN
OPEN
1 000 pF 50 Ω
Counter HP5350B
(Spectrum Analyzer)
C2
C3
C4
1 000 pF
HP8665A
Signal Generator
Supply Voltage
5±0.5 V
2
3
4
1
7
6
5
8
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PU10311EJ01V0DS 9
µ
µµ
µ
PB1510GV
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
,,,
,,,,,
,,,,,
,,,,
,,
,
,,
IN OUT
C1
C3
C2 C4
IN
OUT
1P
PB1506/08/09GV
µ
V
CC
Notes
(1) 35 m thick double-sided copper-clad 50 × 50 × 0.4 mm polyimide board.
(2) Back side : GND pattern
(3) Solder plated on pattern
(4) : Through holes
(5) of pin 3: Pattern should be removed.
(6) of pin 5: Short chip must be attached to be grounded.
µ
,,
,,
,
,,,
COMPONENT LIST
Value
C1 to C4 1 000 pF
Data Sheet PU10311EJ01V0DS
10
µ
µµ
µ
PB1510GV
PACKAGE DIMENSIONS
8-PIN PLASTIC SSOP (4.45 mm (175) ) (UNIT: mm)
1.5±0.1
0.575 MAX.
0.10
M
1.8 MAX.
0.1±0.1
0.3
+0.10
–0.05
detail of lead end
3˚
+7˚
–3˚
0.65
8
5
14
2.9±0.1
4.94±0.2
0.5±0.2
0.87±0.2
3.2±0.1
0.15
+0.10
–0.05
0.15
Data Sheet PU10311EJ01V0DS 11
µ
µµ
µ
PB1510GV
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Soldering Condit i ons Condition Symbol
Infrared Refl ow Peak tem perature (package surface temperature) : 260°C or below
Time at peak temperature : 10 sec onds or l ess
Time at t em perature of 220°C or higher : 60 sec onds or l ess
Preheating t i m e at 120 to 180°C : 120±30 sec onds
Maximum number of ref l ow processes : 3 tim es
Maximum chlorine content of rosin f l ux (% mas s) : 0.2%(Wt .) or below
IR260
VPS Peak tem perature (package surface temperature) : 215°C or below
Time at t em perature of 200°C or higher : 25 to 40 seconds
Preheating t i m e at 120 to 150°C : 30 to 60 seconds
Maximum number of ref l ow processes : 3 tim es
Maximum chlorine content of rosin f l ux (% mas s) : 0.2%(Wt .) or below
VP215
Wave Solderi ng Peak tem perature (molt en s ol der temperature) : 260°C or below
Time at peak temperature : 10 sec onds or l ess
Preheating t em perature (package surface temperature) : 120°C or below
Maximum number of f l ow processes : 1 t i m e
Maximum chlorine content of rosin f l ux (% mas s) : 0.2%(Wt .) or below
WS260
Partial Heating Peak tem perature (pin tem perat ure) : 350°C or below
Soldering ti me (per side of device) : 3 sec onds or l ess
Maximum chlorine content of rosin f l ux (% mas s) : 0.2%(Wt .) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10311EJ01V0DS
12
µ
µµ
µ
PB1510GV
M8E 00. 4 - 0110
The information in this document is current as of January, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
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Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
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•
•
•
•
•
•
NEC Compound Semiconductor Devices Hong Kong Limited
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
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TEL: +1-408-988-3500 FAX: +1-408-988-0279
0209
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Business issue
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Sales Engineering Group, Sales Division
E-mail: techinfo@csd-nec.com FAX: +81-44-435-1918
Technical issue
µ
µµ
µ
PB1510GV
