TFA9887UK/N2AZ - NXP SEMICONDUCTORS

1. General description

The TFA9887 is an audio system consisting of a high efficiency class-D audio amplifier,

and embedded DSP with a sophisticated speaker-boost and protection algorithm and an

intelligent DC-to-DC converter. It can safely deliver 2.65 W (RMS; THD = 1 %) output

power into a 4  speaker that is nominally only rated for 0.5 W. The integrated intelligent

DC-to-DC converter allows the system to deliver this power from a battery voltage of

3.6 V. The audio input interface is I2S and the contr o l settin gs are com m un ica te d via an

I2C-bus interface.

The TFA9887 guarantees safe speaker operation under all operating conditions. It

maximizes acoustic output while ensuring diaphragm displacement and voice coil

temperature do not exceed rated limits. The processing is capable of providing a

significant improvement in sound volum e and quality, while also ensuring reliable

operation. This function is based on and adaptive model that operates in all loudspeaker

environments (e.g. free air, closed box or vented box). Furthermore, advanced signal

processing ensures the quality of the audio signal is always optimized.

Adaptive DC-to-DC conversion boost s the supply volt ag e only when necessar y (when the

output signal level is high). This maximizes the output power of the class-D audio amplifie r

while limiting quiescent power consumption. The TFA9887 also adapts the amplifier gain

to limit battery current when the battery voltage is low.

The device features low RF susceptibility because it has a digital input interface that is

insensitive to clock jitter. The second order closed loop architecture used in a class-D

audio amplifier provides excellent audio performance and high supply voltage ripple

rejection.

The TFA9887 is available in a 29-bump WLCSP (Wafer Level Chip-Size Package) with a

400 m pitch.

2. Features and benefits

Sophisticated speaker-boost and protection algorithm that maximizes speaker

performance while protecting the speaker:

Fully embedded software, no additional license fee or porting required.

Tot al integrated solution that inclu des DSP, amplifier, DC-to-DC, sensing and more.

Adaptive excursion control - guarantees that the speaker membrane excursion never

exceeds its rated limit

Real-time temperature protection - direct measurement ensures that voice coil

temperature never exceeds its rated limit

TFA9887

Audio system with adaptive sound maximizer and speaker

protection

Rev. 1 — 11 July 2012 Product short data sheet

Product short data sheet Rev. 1 — 11 July 2012 2 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

Environmentally aware - automatically adapts speaker parameters to aco us tic an d

thermal changes including compensation for speaker-box leakage

Output power: 2.65 W (RMS) into 4  at 3.6 V supply voltage (THD = 1 %)

Clip avoidance - DSP algorithm prevents clipping even with sagging supply voltage

Bandwidth extension option to increase low frequency response

Intelligent DC-to-DC converter maximizes audio headroom from any supply level and

limits current consumption at low battery voltages

Compatible with standard Acoustic Echo Cancellers (AECs)

High efficiency and low-power dissipation

Wide supply voltage range (fully operational from 2.5 V to 5.5 V)

Two I2S inputs to support two audio sources

I2C-bus control interface (400 kHz)

Dedicated speech mode with speech activity detector

Speaker current and voltage monitoring (via the I2S-bus) for Acoustic Echo

Cancellation (AEC ) at th e ho st

Fully short-circuit proof across the load and to the supply lines

Sample frequencies from 8 kHz to 48 kHz supported

3 bit clock/word select ratios supported (32x, 48x, 64x)

Option to route I2S input direct to I2S output to allow a second I2S output slave device

to be used in combination with the TFA9887

TDM interface supported

Volume control

Low RF susceptibility

Input clock jitter insensitive interface

Thermally protected

‘Pop noise' free at all mode transitions

3. Applications

Mobile phones

Tablets

Ultrabooks and Notebooks

Portable gaming devices

Portable Navigation Devices (PND)

MP3 players and portable media players

Product short data sheet Rev. 1 — 11 July 2012 3 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

4. Quick reference data

5. Ordering information

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VBAT battery supply voltage on pin VBAT 2.5 - 5.5 V

VDDD digital supply voltage on pin VDDD 1.65 1.8 1.95 V

IBAT battery supply current on pin VBAT and in DC-to-DC converter coil;

operating modes with load; DC-to-DC

converter in Adaptive boost mode

-1.55-mA

on pin VBAT and in DC-to-DC converter coil;

Power-down mode --1A

IDDD digital supply current on pin VDDD; operating modes;

speaker-boost and protection activated -20-mA

on pin VDDD; operating modes; CoolFlux

DSP bypassed -4.8-mA

on pin VDDD; Power-down mode;

BCK1= WS1=DATAI1 =BCK2= WS2=

DATAI2 = DATAI3 = 0 V

-10-A

Po(RMS) RMS outpu t po w e r CLIP = 00

RL=4 ; fs= 48 kHz - 2.55 - W

RL=4 ; fs= 32 kHz - 2.65 - W

RL=8 ; fs= 48 kHz - 1.5 - W

RL=8 ; fs= 32 kHz - 1.65 - W

Table 2. Ordering informatio n

Type number Package

Name Description Version

TFA9887UK WLCSP29 wafer level chip-size package; 29 bumps; 3.19  2.07  mm TFA9887

Product short data sheet Rev. 1 — 11 July 2012 4 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

6. Block diagram

Fig 1. Block diagra m

I2C

INTERFACE

VDDD

TFA9887

SDA

SCL

PROTECTION:

OTP

OVP

UVP

OCP

IDP

ADS1

010aaa719

ADS2

VBAT

INB

OUTA

OUTB

CLASS-D

AUDIO

AMPLIFIER

WS1

PWM

SPEAKER

PROTECTION

ALGORITHM

AND VOLUME

CONTOL

(CoolFlux DSP)

DATAI3 A4

A3DATAI1

BCK1 C2

I2S

INPUT

INTERFACE

(x2)

RAM/ROM

MEMORY

ADAPTIVE

DC-to-DC

CONVERTER

D7 GNDB

BST

DATAO A2

I2S

OUTPUT

INTERFACE

GNDP

TEMP SENSE

VBAT SENSE

C6 D6

VDDP

REGISTERS

B4 C4

GNDD TEST1 TEST2 TEST3 TEST4 TEST5

ADC

CURRENT-

SENSING

PROCESSOR

current sensing

D1, E1

n.c.

CLIPPER

R 1/2

DSP

out

Isense

WS2 B1

A1DATAI2

BCK2 C1

gain

L 1/2

R 3

L 3

gain

I2SDOC

CHS3

without pilot tone

HPF

PLL

IPLL

Product short data sheet Rev. 1 — 11 July 2012 5 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

7. Pinning information

7.1 Pinning

a. Bottom view b. Transparent top view

Fig 2. Bump conf igu r ation

010aaa734

bump A1

index area

123

567

123

bump A1

index area 456

010aaa735

Transparent top view

Fig 3. Bump mapping

DATAO DATAI1 DATAI3 ADS1

234 5

WS1 TEST3

BCK1 TEST4

SCL

ADS2 OUTB

VDDP GNDP

TEST1 OUTA

TEST2 GNDB

SDA GNDD VBAT

VDDD

010aaa736

BST INB

TEST5

DATAI2

BCK2C

n.c.D

n.c.E

WS2

Product short data sheet Rev. 1 — 11 July 2012 6 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

Table 3. Pinning

Symbol Pin Type Description

DATAI2 A1 I digital audio data input 2

DATAO A2 O digital audio data output

DATAI1 A3 I digital audio data input 1

DATAI3 A4 I digital audio data input 3

ADS1 A5 I address select input 1

ADS2 A6 I address select input 2

OUTB A7 O inverting output

WS2 B1 I digital audio word select input 2

WS1 B2 I digital audio word select input 1

TEST3 B4 I test signal input 3; for test purposes only, connect to PCB ground

VDDP B6 P power supply voltage

GNDP B7 P power ground

BCK2 C1 I digital audio bit clock input 2

BCK1 C2 I digital audio bit clock input 1

TEST4 C4 O test signal input 4; for test purposes only, connect to PCB ground

TEST1 C6 I test signal input 1; for test purposes only, connect to BST

OUTA C7 O non-inverting output

n.c. D1 - not connected; connect to D2 or to PCB ground

SCL D2 I I2C-bus clock input

TEST5 D4 I test signal input 5; for test purposes only, connect to PCB ground

TEST2 D6 I test signal input 2; for test purposes only, connect to BST

GNDB D7 P boosted ground

n.c. E1 - not connected; connect to E2 or to PCB ground

SDA E2 I/O I2C-bus data input/output

VDDD E3 P digital supply voltage

GNDD E4 P digital ground

VBAT E5 I battery supply voltage sense input

VBST E6 O boosted supply voltage output

INB E7 P DC-to-DC boost converter input

Product short data sheet Rev. 1 — 11 July 2012 7 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

8. Functional description

The TFA9887 is a highly efficient mono Bridge Tied Load (BTL) class-D audio amplifier

with a sophisticated speaker-boost protection algorithm. Figure 1 is a block diagram of the

TFA9887.

The device contains three I2S input in terfaces and one I2S output interface. One of I2S

inputs DATAI1 and DATAI2 can b e selecte d as the a udio input stream . The thir d I2S i nput,

DATAI3, is provided to support stereo application s and the I2S pass-through option. The

pass-through option is provided to allow an I2S output slave device (for example, a

CODEC), connected in parallel with the TFA9887, to be routed directly to the audio host

via the I2S output.

The I2S output signal on DATAO can be configured to transmit the DSP output signal,

amplifier output current information, DATAI3 Left or Right sig nal information or amplifier

gain information. The gain information can be used to facilitate communication between

two devices in stereo applications.

The speaker-boost protection algorithm, running on a CoolFlux Digital Signal Processor

(DSP) core, maximizes the acoustical output of the speaker while limiting membrane

excursion and voice coil temperature to a safe level. The mechanical protection

implemented guara ntee s that sp eaker me mbr ane excur sion n ever exceeds its rated limit,

to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature

never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal

processing ensures the audio quality remains acceptable at all times.

The speaker-boost protection algorithm boosts the output sound pressure level within

given mechanical, thermal and quality limits. An optional Bandwidth extension mode

extends the low frequency re sponse up to a predefin ed limit before maximizing the output

level. This mode is suitable for listening to high-quality music in quiet environments.

The frequency response of the TFA9887 can be modified via ten fully programmable

cascaded second-order biquad filters. The first two biquads are processed with 48-bit

double precision; biquads 3 to 8 are processed with 24-bit single precision.

At low battery voltage levels, the gain is automatically reduced to limit battery current.

The output volum e can be con tro lle d by the sp eaker-boost protection algorithm or by the

host application (external). In the latter case, the boost features of the speaker-b oost

protection algorithm must be disabled to avoid neutralizing external volume control.

The speaker-boost protection algorithm output is converted into two pulse width

modulated (PWM) signals which are then injected into the class-D audio amplifier. The

3-level PWM scheme su pp or ts filterless speaker drive.

The adaptive DC-to-DC con verter bo ost s th e battery su pply volt a ge in line with the output

of the speaker-boost protection algorithm. It switches to Follower mode (VBST = VBAT; no

boost) when the audio output voltage is lower than the battery voltage.

8.1 Protection mechanisms

The following protection circuits are included in the TFA9887:

•OverTemperature Protection (OTP)

Product short data sheet Rev. 1 — 11 July 2012 8 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

•OverVoltage Protection (OVP)

•UnderVoltage Protection (UVP)

•OverCurrent Protection (OCP)

•Invalid Data Protection (IDP)

The reaction of the device to fault conditions differs depending on the protection circuit

involved.

8.1.1 OverTemperature Protection (OTP)

OTP prevent s heat dama ge to the TFA9887. It is trigger ed when the junction te mperatur e

exceeds Tact(th_prot). Wh en this happens, the output st ages are set floating. OTP is cleared

automatically via an internal timer (approximately 200 ms), after which the output stages

will start to operate normally again.

8.1.2 Supply voltage protection (UVP and OVP)

UVP is activated, setting the outputs floating, if VBAT drops below the undervoltage

protection th re sh old, V P(uvp). When the supply voltage rises above VP(uvp) again, the

system will be restarted after approximately 200 ms .

OVP is activated, setting the power stages floating, if the power supply voltage (VDDP)

rises above the ov er vo ltage pro tec tio n thr e sho ld , VP(ovp). The power stages are

re-enabled as soon as the supply voltage drops below VP(ovp) again. The system will be

restarted after approximately 200 ms.

8.1.3 OverCurrent Protection (OCP)

OCP will detect a short circuit across the load or between one of the amplifier outputs and

one of the supply lines. If the output current exceeds the overcurrent protection threshold

(IO(ocp)), it will be limited to IO(ocp) while the amplifier outputs are switching (the amplifier is

not powered down completely). This is called current limiting. The amplifier can

distinguish between an impedance drop at the loudspeaker and a low-ohmic short circuit

across the load or to one o f the supp ly lines. The impedance thre shold dep ends on which

supply voltage is being used:

8.1.4 Invalid Data Protection (IDP)

IDP checks if the word select signal is correctly connected to the TFA9887. It the bit

clock/word select (BCK-to-WS) ratio is not stable, the IDP alarm is raised and the

TFA9887 powers down.The TFA9887 start s up again automatically when the BCK-to-WS

ratio stabilizes.

8.2 Battery supply voltage monitor

The voltage level at the battery connected to the TFA9887 can be monitored via the

I2C-bus. Status bits BATS in the Battery status register.

Product short data sheet Rev. 1 — 11 July 2012 9 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

9. Limiting values

10. Thermal characteristics

11. Characteristics

11.1 DC Characteristics

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VBAT battery supply voltage on pin VBAT 0.3 +5.5 V

VDDP power supply voltage on pin VDDP 0.3 +5.5 V

VDDD digital supply voltage on pin VDDD 0.3 +1.95 V

Tjjunction temperature - +150 C

Tstg storage temperature 55 +150 C

Tamb ambient temperature 40 +85 C

VESD electrostatic discharge voltage according to Human Body Model (HBM) 2+2 kV

according to Charge Device Model (C DM) 500 +500 V

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to ambient in free air; natural convection -

4-layer application boa rd 60 K/W

Table 6. DC characteristics

All parameters are guaranteed for VBAT =3.6 V; V

DDD = 1.8 V; VDDP = VBST =5.3 V; L

BST =1



H[1]; RL = 4



[1]; LL = 20



H[1];

fi= 1 kHz; fs = 48 kHz; Tamb = 25



C; default settings, unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VBAT battery supply voltage on pin VBAT 2.5 - 5.5 V

VDDP power supply voltage on pin VDDP 2.5 - 5.5 V

VDDD digital supply voltage on pin VDDD 1.65 1.8 1.95 V

IBAT battery supply current on pin VBAT and in the DC-to-DC converter

coil; operating modes with load; DC-to-DC

converter in Adaptive boost mode

-1.55- mA

on pin VBAT and in the DC-to-DC converter

coil; Power-down mo de --1A

IDDD digital supply current on pin VDDD; operating modes;

speaker-boost protection activated -20- mA

on pin VDDD; operating modes; Coo lFlux

DSP bypassed -4.8- mA

on pin VDDD; Power-down mode ;

BCK1= WS1=DATAI1 =BCK2= WS2=

DATAI2 = DATAI3 = 0 V

-10- A

Pins BCK1, WS1, DATA1, BCK2, WS2, DATAI2, DATAI3, ADS1, ADS2, SCL, SDA

VIH HIGH-level input voltage 0.7VDDD -3.6 V

Product short data sheet Rev. 1 — 11 July 2012 10 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

[1] LBST = boot converter inductance; RL= load resistance; LL= load inductance (speaker).

VIL LOW-level input voltage - - 0.3VDDD V

Cin input capacitance - - 3 pF

ILI input leakage current 1.8 V on input pin - - 0.1 A

Pins DATAO, SDA

VOH HIGH-level output voltage IOH =4 mA - - V

DDD 

0.4 V

VOL LOW-level output voltage IOL =4 mA - - 400 mV

Pins OUTA, OUTB

RDSon drain-source on-state

resistance VDDP = 5.3 V - 100 - m

Protection

Tact(th_prot) thermal protection activation

temperature 130 - 150 C

VP(ovp) overvoltage protection supply

voltage protection on VDDP 5.5 - 6.0 V

VP(uvp) undervoltage protection supply

voltage protection on VBAT 2.3 - 2.5 V

IO(ocp) overcurrent protection output

current 1.45 - - A

DC-to-DC converter

VBST voltage on pin BST DCVO = 111; Boost mode 5.25 5.3 5.35 V

Table 6. DC characteristics …continued

All parameters are guaranteed for VBAT =3.6 V; V

DDD = 1.8 V; VDDP = VBST =5.3 V; L

BST =1



H[1]; RL = 4



[1]; LL = 20



H[1];

fi= 1 kHz; fs = 48 kHz; Tamb = 25



C; default settings, unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product short data sheet Rev. 1 — 11 July 2012 11 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

11.2 AC characteristics

[1] LBST = boot converter inductance; RL= load resistance; LL= load inductance (speaker).

Table 7. AC characteristics

All parameters are guaranteed for VBAT =3.6 V; V

DDD = 1.8 V; VDDP = VBST =5.3 V; L

BST =1



H[1]; RL = 4



[1]; LL = 20



H[1];

fi= 1 kHz; fs = 48 kHz; Tamb = 25



C; default settings, unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Amplifier output power

Po(RMS) RMS output power THD+N = 1 %; CLIP = 00

RL=4 ; fs= 48 kHz - 2.55 - W

RL=4 ; fs= 32 kHz - 2.65 - W

RL=8 ; fs= 48 kHz - 1.5 - W

RL=8 ; fs= 32 kHz - 1.65 - W

THD+N = 10 %; CLIP = 00

RL=4 ; fs= 48 kHz - 3.75 - W

RL=4 ; fs= 32 kHz - 3.75 - W

RL=8 ; fs= 48 kHz - 2 - W

RL=8 ; fs= 32 kHz - 2 - W

Amplifier output; pin s OUTA and OUTB

VO(offset)output offset volt age absolute value - - 1 mV

Amplifier performance

THD+N total harmonic distortion-plus-noise Po(RMS) = 100 mW; RL =8 ; LL=44H - 0.03 0.1 %

Vn(o) output noise voltage A-weighted; DATAI1 = DATAI2 = 0 V

CoolFlux DSP bypassed - 31 - V

CoolFlux DSP enabled - 45 - V

S/N signal-to-noise ratio VO = 4.5 V (peak); A-weighted

CoolFlux DSP bypassed - 100 - dB

CoolFlux DSP enabled - 97 - dB

PSRR power supply rejection ratio Vripple = 200 mV (RMS); fripple =217 Hz - 90 - dB

Amplifier powe r-up , pow er-d ow n an d propagation delays

td(on) turn-on delay time PLL locked on BCK (IPLL = 0)

fs = 8 kHz to 48 kHz - - 2 ms

PLL locked on WS (IPL L = 1)

fs =48 kHz - - 6 ms

td(off) turn-off delay time - - 10 s

td(mute_off) mute off delay time - 1 - ms

td(soft_mute) soft mute delay time - 1 - ms

Product short data sheet Rev. 1 — 11 July 2012 12 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

12. Application information

12.1 Application diagram

Fig 4. Typical mono application (simplified)

TFA9887

010aaa723

BASEBAND

PROCESSOR

OUTA

OUTB

speaker

4 Ω, 6 Ω or 8 Ω

VDDD

1.8 V

GNDD

TEST3

TEST4

ADS2

GNDB

GNDP

ADS1

A5 B7D7

TEST5

B4E4 D4C4

TEST1

E5 C6

TEST2

VDDP

VBAT

battery

D6 B6

CVDDP

22 μF

CVDDD

100 nF

BST

INB

CVBAT

10 μF

LBST 1 μH

SDA E2

n.c.

I2C

BCK1

DATAO

DATAI1 A3

I2S

SCL D2

n.c.

DATAI3 A4

BCK2 C1

DATAI2 A1

WS2 B1

WS1 B2

Product short data sheet Rev. 1 — 11 July 2012 13 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

13. Package outline

Fig 5. Package outline TFA9887 (WLCSP29)

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Product short data sheet Rev. 1 — 11 July 2012 14 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

14. Soldering of WLCSP packages

14.1 Introduction to soldering WLCSP packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note

AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface

mount reflow soldering description”.

Wave soldering is not suitable for this package.

All NXP WLCSP packages are lead-free.

14.2 Board mounting

Board mounting of a WLCSP requires several steps:

1. Solder paste printing on the PCB

2. Component placement with a pick and place machine

3. The reflow soldering itself

14.3 Reflow soldering

Key characteristics in reflow soldering are:

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 6) than a PbSn process, thus

reducing the process window

•Solder paste printing issues, such as smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature), and cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characterist ic) while be ing low enou g h th at th e packages an d/ or boa rd s ar e no t

damaged. The peak temperature of the package depends on package thickness and

volume and is classified in accordance with Table 8.

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 6.

Table 8. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product short data sheet Rev. 1 — 11 July 2012 15 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

For further information on temperature profiles, refer to application note AN10365

“Surface mount reflow soldering description”.

14.3.1 Stand off

The stand off between the substrate and the chip is determined by:

•The amount of printed solder on the substrate

•The size of the solder land on the substrate

•The bump height on the chip

The higher the stand off, the better the stresses are released due to TEC (Thermal

Expansion Coefficient) differences between substrate and chip.

14.3.2 Quality of solder joint

A flip-chip joint is considered to be a good joint when the entire solder land has been

wetted by the solder from the bump. The surface of the joint should be smooth and the

shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps

after reflow can occur during the reflow process in bumps with high ratio of bump diameter

to bump height, i.e. low bumps with large diameter. No failures have been found to be

related to these voids. Solder joint inspection after reflow can be done with X-ray to

monitor defects such as bridging, open circuits and voids.

14.3.3 Rework

In general, rework is not recommended. By rework we mean the process of removing the

chip from the substrate and replacing it with a new chip. If a chip is remo ved from the

substrate, most solder balls of the chip will be damaged. In that case it is recommended

not to re-use the chip again.

MSL: Moisture Sensitivity Level

Fig 6. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product short data sheet Rev. 1 — 11 July 2012 16 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

Device removal can be done when the substrate is heated until it is certain that all solder

joints are molten. The chip can then be carefully removed from the substrate without

damaging the tracks and solder lands on the substrate. Removing the device must be

done using plastic tweezers, because metal tweezers can damage the silicon. The

surface of the substrate should be carefully cleaned and all solder and flux residues

and/or underfill removed. When a new chip is placed on the substrate, use the flux

process instead of solder on th e solder land s. Ap ply flu x on th e bu mps at the chip side as

well as on the solder pads on the substrate. Place and align the new chip while viewing

with a microscope. To reflow the solder, use the solder profile shown in application note

AN10365 “Surface mount reflow soldering description”.

14.3.4 Cleaning

Cleaning can be done after reflow soldering.

Product short data sheet Rev. 1 — 11 July 2012 17 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

15. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TFA9887_SDS v.1 20120711 Product short data sheet - -

Product short data sheet Rev. 1 — 11 July 2012 18 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

16. Legal information

16.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The prod uct sta tus of device (s) descri bed in this d ocument m ay have cha nged since thi s docume nt was publish ed and ma y diffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

16.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expr essly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qua lification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product short data sheet Rev. 1 — 11 July 2012 19 of 20

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qua lified nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims result ing from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

16.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

I2C-bus — logo is a trademark of NXP B.V.

CoolFlux — is a trademark of NXP B.V.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors TFA9887

Audio system with adaptive sound maximizer and speaker protection

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 11 July 2012

Document identifier: TFA9 88 7_ SDS

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Functional description . . . . . . . . . . . . . . . . . . . 7

8.1 Protection mechanisms . . . . . . . . . . . . . . . . . . 7

8.1.1 OverTemperature Protection (OTP) . . . . . . . . . 8

8.1.2 Supply voltage protection (UVP and OVP). . . . 8

8.1.3 OverCurrent Protection (OCP) . . . . . . . . . . . . . 8

8.1.4 Invalid Data Protection (IDP) . . . . . . . . . . . . . . 8

8.2 Battery supply voltage monitor. . . . . . . . . . . . . 8

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 Thermal characteristics . . . . . . . . . . . . . . . . . . 9

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 9

11.1 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . 9

11.2 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 11

12 Application information. . . . . . . . . . . . . . . . . . 12

12.1 Application diagram . . . . . . . . . . . . . . . . . . . . 12

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

14 Soldering of WLCSP packages. . . . . . . . . . . . 14

14.1 Introduction to soldering WLCSP packages. . 14

14.2 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 14

14.3 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 14

14.3.1 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

14.3.2 Quality of solder joint . . . . . . . . . . . . . . . . . . . 15

14.3.3 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

14.3.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

17 Contact information. . . . . . . . . . . . . . . . . . . . . 19

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20