Data SheetData Sheet
Multilayer ceramic capacitors
Date: October 2006
ã EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the
information contained therein without EPCOS’ prior express consent is prohibited.
Chip capacitors, MLSC, X7R
210/06
Please read Cautions and warnings and
Important notes at the end of this document.
General
The MLSC was developed for typical applications with a direct connection to the battery or gener-
ator in the automobile, as it satisfies the requirements of the automobile manufacturers for a series
connection of two capacitors for battery applications in a single component.
It not only represents the only real alternative to the series connection of discrete capacitors, but
also offers advantages over these and other possible solutions, which contain only a single capac-
itor.
Compared with a series circuit made up of conventional ceramic capacitors, it allows the number of
components to be reduced. This reduces the space requirement on the circuit board and shortens
the placement time. Because fewer components are used, the failure probability is additionally re-
duced.
The MLSC is based on proven MLCC technology, but has a more rugged design. This technology
offers highest reliability (ppb rate) on the basis of long field experience. Both undamaged and typi-
cally cracked MLSCs are characterized by a high breakdown voltage and high ESD and pulse
strength.
It may be used at temperatures of up to 150 °C with consideration of a voltage derating and with
brief temperature peaks of up to 175 °C without electrical stressing (refer to the Advanced series).
Like the capacitors of the Advanced series, the MLSC is also manufactured to the specifications of
the ppb level assurance system, and a bending strength of 2 mm is assured on the basis of the
rigorous piezoelectric method.
Chip
Multilayer serial ceramic capacitor (MLSC)
Multilayer ceramic capacitors
310/06
Please read Cautions and warnings and
Important notes at the end of this document.
Ordering code system
B37941 X 1 103 K 0 60
Packaging
60 cardboard tape, 180-mm reel
62 blister tape, 180-mm reel
70 cardboard tape, 330-mm reel
72 blister tape, 330-mm reel
^
^
^
^
Internal coding
Capacitance tolerance
K±10% (standard)
^
Capacitance, coded
(example)
103 10 · 103 pF = 10 nF
104 10 · 104 pF = 100 nF
223 22 · 103 pF = 22 nF
^
^
^
Rated voltage Rated voltage [VDC]
Code
50 100
51
Internal coding “X” indicates MLSC type
Type and size
Chip size
(inch / mm)
0603 / 1608
0805 / 2012
Temperature characteristic
X7R
B37931
B37941
Chip
Multilayer serial ceramic capacitor (MLSC); X7R
Multilayer ceramic capacitors
410/06
Please read Cautions and warnings and
Important notes at the end of this document.
Features
■Two series-connected ceramic capacitors
in a single component
■The MLSC thus satisfies the requirements
of the automobile manufacturers for applications
on the battery / generator (e.g. clamp 30 or clamp 15)
in a single component.
■Reduction of the effects of a
– bending fracture
– placement fracture
– solder-shock crack
thanks to a lower probability of a short circuit.
■Evaluation criteria: Insulation resistance >10 k after the following treatment
bending until crack
humidity tests (85 °C/85% RH, rated voltage), 14 days
■The breakdown voltage of MLSCs in the case of a typical bending crack
is still greater than five times the rated voltage.
■Both undamaged and cracked MLSCs are capable of fulfilling the requirements
to ISO7637 for 12 V automotive power systems, including load-dump and
jump-start requirements (24 V/1 h and 36 V/1 h).
■To AEC-Q200
Applications
■Automobile electronics
– for direct connection to the car battery or generator
– at positions with “stranding potential”
– as RF filters in small motors (e.g. electrically operated windows)
■Power electronics (e.g. DC/DC converters)
■Smoothing capacitors (e.g. on the rechargeable battery in mobile equipment)
Cautions
A short circuit cannot be completely excluded. The use of MLSCs does not therefore result in 100%
fail-safe operation, but in the event of a crack the probability of a short circuit can be greatly reduced.
In the event of an untypical (bending) crack formation (e.g. double-sided crack or extreme mounting
crack) and other mechanical or thermal damage to the capacitor, the capacitor may have a low
ohmic state.
KKE0427-P-E
Capacitor 2
Solder
Termination
Capacitor 1
KKE0387-F-E
Termination
Solder
Crack
Chip
MLSC; X7R
Multilayer ceramic capacitors
510/06
Please read Cautions and warnings and
Important notes at the end of this document.
MLSC
Multilayer ceramic capacitors
Termination
■For soldering: Nickel barrier termination (Ni)
Delivery mode
■Cardboard and blister tape (blister tape for chip thickness ³1.2 ±0.1 mm),
180-mm and 330-mm reel available
Electrical data
Temperature characteristic X7R
Max. relative capacitance change
within –55 °C to +125 °CDC/C ±15 %
Climatic category (IEC 60068-1) 55/125/56
Standard EIA
Dielectric Class 2
Rated voltage1) VR 50, 100 VDC
Test voltage Vtest 2.5 · VR/5 s VDC
Capacitance range / E series CR 1 nF … 100 nF (E6)
Dissipation factor (limit value) tan d < 25 · 10–3
Insulation resistance2) at + 25 °CR
ins >105MW
Insulation resistance2) at +125 °CR
ins >104MW
Time constant2) at + 25 °Ct >1000 s
Time constant2) at +125 °Ct >100 s
Operating temperature range Top –55 … +125 °C
Ageing3) yes
1) Note: No operation on AC line.
2) For CR >10 nF the time constant t = C · Rins is given.
3) Refer to chapter “General technical information”, “Ageing”.
MLSC; X7R
610/06
Please read Cautions and warnings and
Important notes at the end of this document.
MLSC Multilayer ceramic capacitors
Capacitance tolerances
Dimensional drawing
Dimensions (mm)
Tolerances to CECC 32101-801
Code letter K
(standard)
Tol eran ce ±10%
Case size (inch)
(mm)
0603
1608
0805
2012
l1.6
±0.15 2.00 ±0.20
b0.8
±0.10 1.25 ±0.15
s0.8
±0.10 1.35 max.
k 0.1 –0.40 0.13 –0.75
KKE0329-N
k
s
b
k
MLSC; X7R
710/06
Please read Cautions and warnings and
Important notes at the end of this document.
MLSC
Multilayer ceramic capacitors
Recommended solder pad
Recommended dimensions (mm) for reflow soldering
Recommended dimensions (mm) for wave soldering
Termination
Case size (inch/mm) Type A C D
0603/1608 single chip 0.6 … 0.7 1.8 … 2.2 0.6 … 0.8
0805/2012 single chip 0.6 … 0.7 2.2 … 2.6 0.8 … 1.1
Case size (inch/mm) Type A C D
0603/1608 single chip 0.8 … 0.9 2.2 … 2.8 0.6 … 0.8
0805/2012 single chip 0.9 … 1.0 2.8 … 3.2 0.8 … 1.1
KKE0308-1
D
A
C
BME: Base Metal Electrode
NME: Noble Metal Electrode
External electrode
Intermediate electrode
Substrate electrode
Inner electrode
BMENME
KKE0407-Y-E
Sn
Ni
Ag
Ni
Sn
Cu
NME
AgPd Ni
BME
Ceramic body
(nickel barrier)
Termination
MLSC; X7R
810/06
Please read Cautions and warnings and
Important notes at the end of this document.
MLSC Multilayer ceramic capacitors
Product range for MLSC chip capacitors, X7R
Size1)
inch
mm
0603
1608
0805
2012
Type B37931 B37941
50 50 100
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10 nF
15 nF
22 nF
33 nF
47 nF
68 nF
100 nF
1) l ´ b (inch) / l ´ b (mm)
VR (VDC)
CR
MLSC; X7R
910/06
Please read Cautions and warnings and
Important notes at the end of this document.
MLSC
Multilayer ceramic capacitors
Ordering codes and packing for X7R, 50 and 100 VDC, nickel barrier terminations
Chip
thickness
Cardboard tape,
Æ 180-mm reel
Cardboard tape,
Æ 330-mm reel
** 60 ** 70
CR1) Ordering code mm pcs/reel pcs/reel
Case size 0603, 50 VDC
1.0 nF B37931X5102K0** 0.8 ±0.1 4000 16000
1.5 nF B37931X5152K0** 0.8 ±0.1 4000 16000
2.2 nF B37931X5222K0** 0.8 ±0.1 4000 16000
3.3 nF B37931X5332K0** 0.8 ±0.1 4000 16000
4.7 nF B37931X5472K0** 0.8 ±0.1 4000 16000
6.8 nF B37931X5682K0** 0.8 ±0.1 4000 16000
10. nF B37931X5103K0** 0.8 ±0.1 4000 16000
Case size 0805, 50 VDC
33. nF B37941X5333K0** 0.8 ±0.1 4000 16000
47. nF B37941X5473K0** 0.8 ±0.1 4000 16000
68. nF B37941X5683K0** 1.25±0.1 30002) 120003)
100. nF B37941X5104K0** 1.25±0.1 30002) 120003)
Case size 0805, 100 VDC
1.0 nF B37941X1102K0** 0.8 ±0.1 4000 16000
1.5 nF B37941X1152K0** 0.8 ±0.1 4000 16000
2.2 nF B37941X1222K0** 0.8 ±0.1 4000 16000
3.3 nF B37941X1332K0** 0.8 ±0.1 4000 16000
4.7 nF B37941X1472K0** 0.8 ±0.1 4000 16000
6.8 nF B37941X1682K0** 0.8 ±0.1 4000 16000
10. nF B37941X1103K0** 0.8 ±0.1 4000 16000
15. nF B37941X1153K0** 0.8 ±0.1 4000 16000
22. nF B37941X1223K0** 0.8 ±0.1 4000 16000
1) Other capacitance values on request.
2) Blister tape, 180-mm reel, ordering code ** 62
3) Blister tape, 330-mm reel, ordering code ** 72
^
^
^ ^
MLSC; X7R; 0603 and 0805
10 10/06
Please read Cautions and warnings and
Important notes at the end of this document.
MLSC Multilayer ceramic capacitors
Typical characteristics1)
Capacitance change DC/C25 versus
temperature T
Capacitance change DC/C0 versus
superimposed DC voltage V
Impedance |Z| versus
frequency f for case size 0603
Impedance |Z| versus
frequency f for case size 0805
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
KKE0401-J
%
_
50
_
45
_
40
_
35
_
30
_
25
_
20
_
15
_
5
_
0
5
15
10
_
60
_
20
_
20 60 100 160
T
C
25
∆C
40
_
0 40 80 120 C
˚
KKE0402-S
V
%
_
70
_
0
C0
∆C
5 10 15 20 25 30 35 40 45 V
60
_
50
_
40
_
30
_
20
_
10
_
0
10
50
100 nF/50 V/size 0805
KKE0403-1
Z
f
100
2
10
_
10 1
_
100
101
102
103
Ω
10110210 3104
MHz
1 nF
10 nF
Case size 0603
KKE0404-9
Z
f
10
0
2
10
_
10
1
_
10
0
10
1
10
2
10
3
Ω
10
1
10
2
10
3
10
4
MHz
1 nF
10 nF
100 nF
Case size 0805
MLSC; X7R
11 10/06
Please read Cautions and warnings and
Important notes at the end of this document.
MLSC
Multilayer ceramic capacitors
Typical characteristics1)
Dissipation factor tan d versus
temperature T
Insulation resistance Rins versus
temperature T
Capacitance change DC/C1 versus
time t
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
KKE0430-X
T
60
tan δ
20
_
20 60 100 160C
˚
_
10
3
_
10
2
_
10
1
_
40
_
0 40 80 120
KKE0428-L
0
T
ins
8
10
Ω
10
6
10
5
10
4
10
3
10
2
M
R
C
˚
20 40 60 80 100 120 160
KKE0394-X
5
10
%
0
5
__
C
1
C∆
10
__
15
__
20
__
t
h
0
10
1
10
2
10 10
3
10
45
10
MLSC; X7R
12 10/06
Multilayer ceramic capacitors
Cautions and warnings
Notes on the selection of ceramic capacitors
In the selection of ceramic capacitors, the following criteria must be considered:
1. Depending on the application, ceramic capacitors used to meet high quality requirements should
at least satisfy the specifications to AEC-Q200. They must meet quality requirements going
beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of
critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS
and airbag equipment or durable industrial goods).
2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at
positions with stranding potential, to reduce the probability of short circuits following a fracture,
two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated
series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single
component.
3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the require-
ments to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R
ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these
capacitors should not be used as discrete components (see the chapter “Effects on mechanical,
thermal and electrical stress”, point 1.4).
4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the
chapter “Effects on mechanical, thermal and electrical stress”, point 1.4).
5. An application-specific derating or continuous operating voltage must be considered in order to
cushion (unexpected) additional stresses (see the chapter “Reliability”).
The following should be considered in circuit board design
1. If technically feasible in the application, preference should be given to components having an
optimal geometrical design.
2. At least FR4 circuit board material should be used.
3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.
4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the
circuit board. High bending forces may be exerted there when the panels are separated and dur-
ing further processing of the board (such as when incorporating it into a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit
board.
6. No screw connections should be used to fix the board or to connect several boards. Compo-
nents should not be placed near screw holes. If screw connections are unavoidable, they must
be cushioned (for instance by rubber pads).
13 10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
14 10/06
Multilayer ceramic capacitors
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third
parties in the event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as “hazardous”). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,
PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
