3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M™ CP2 Press-Fit Socket
2 mm Type A 110 Signal Contacts Right Angle CP2 Series
25mm basic system unit
50mm module
Designed according to IEC 61076-4-101 and IEC 60352-5
Standards
2 mm grid spacing allows for high signal density at low cost
“Eye of the Needle” compliant pin press-t design reduces
manufacturing time and cost
Additional grounding row available for improved ground bounce
and EMI immunity
Mates with 5 row 3M™ MetPak™ HM, and CP2 headers
End-to-end stackable with 5 row 3M™ MetPak™ HSHM, HM, and
CP2 sockets
See Regulatory Information Appendix (RIA) for chemical
compliance information
Date Modified: February 15, 2008 TS-2266-A
Sheet 1 of 2
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Physical
Insulation:
Material: High Temperature Thermoplastic (LCP)
Flammability: UL94V-0
Contact:
Material: Copper Alloy
Plating: See Ordering Information
Mechanical
Mating Force: ≤ 0.75N/PIN
Withdrawl Force: ≥ 0.15N/PIN
Mating and Un-mating Operations: 50
Electrical
Contact Resistance: ≤ 20 mΩ
Insulation Resistance: ≥ 10,000 MΩ
Test Voltage: 750 VACRMS
Environmental
Temperature Ratings: -55°C to +125°C
PCB Data
Recommended PCB Plated Through Hole: Φ 0.6±0.05 mm
Drill Hole Diameter: Φ 0.7±0.02 mm
Hole platings: Cu 25~50 μm, Sn or SnPb<10 μm
PCB thickness: 1.4-4.2 mm
Press-In Force: ≤ 204N/pin on nominal hole diameter
Retention Force: ≥ 13.5N/pin on nominal hole diameter
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M™ CP2 Press-Fit Socket
2 mm Type A 110 Signal Contacts Right Angle CP2 Series
TS-2266-A
Sheet 2 of 2
Ordering Information
CP2-SA110-X1-XXXX
Shield Options
G= Upper Shield
Blank= No Shield
Recommended PCB Layout
• This diagram serves only for Part Number descriptive denitions.
PLEASE CONTACT YOUR LOCAL SALES REPRESENTATIVE FOR CUSTOMER SPECIFIC PROGUCT CONFIGURATIONS.
Plating Options
TG30= 30~40 μ“ Gold Contact Area
100~200 μ“ Bright Tin-Lead
50~80 μ“ Nickel Underplate
(RIA E2 & C2 apply)
FJ= 10~20 μ“ Gold Contact Area
200~300 μ“ Matte Tin
50~80 μ“ Nickel Underplate
(RIA E1 & C1 apply)
KR= 30~40 μ“ Gold Contact Area
200~300 μ“ Matte Tin
50~80 μ“ Nickel Underplate
(RIA E1 & C1 apply)
mm
[Inch]
0.13
1 0.3
Tolerance Unless Noted
0. .0 .00
mm
[ ] Dimensions for
Reference only