Reflowable Thermal Protection
Device
PRODUCT: RTP200R060SA
DOCUMENT: SCD28104
REV LETTER: C
REV DATE: NOVEMBER 1, 2011
PAGE NO.: 1 OF 5
Specification Status: Released
PIN CONFIGURATION A ND DESCRIPTION:
Pin Configuration
(Bottom View of Device)
(Top View of Device)
TABLE 1. DIMENSIONS:
A B C
MIN MAX MIN MAX MIN MAX
mm 11.60 12.00 6.00 6.35 5.25 5.50
in: (0.46) (0.47) (0.24) (0.25) (0.21) (0.22)
TABLE 2. ABSOLUTE MAX RATINGS:
Absolute Max Ratings Max Units
Max DC Open Voltage 1 32 VDC
@ 16 VDC 200
@ 24 VDC 130
Max DC Interrupt Current 1
@ 32 VDC
100
A
ESD rating (Human Body Model) 25 KV
Max Reflow Temperature (pre-arming) 260 °C
Operating temperature limits, post-arming,
non-opening -55
+175 °C
1. Performance capability at these conditions can be influenced by board design. Performance should be
verified in the user’s system.
A
C
Note:
A2 is product code
хххх is Batch Code
P1 indicated by inmolded mark
P1 PTH ARM
B
A2 хххх
(Side View of Device)
Reflowable Thermal Protection
Device
PRODUCT: RTP200R060SA
DOCUMENT: SCD28104
REV LETTER: C
REV DATE: NOVEMBER 1, 2011
PAGE NO.: 2 OF 5
TABLE 3. PERFORMANCE CHARACTERISTICS (Typical unless otherwise specified):
Resistance and Open Characteristics
P1 to PTH Min Typ Max Units
@ 23+/-3°C 0.6 0.8
RPP (Resistance from P1 to PTH) @ 175+/-3°C 0.8 1.2 mΩ
Operating Voltage 32 VDC
Open Temperature, post-arming IPP = 0 196 205 213 °C
Thermal Resistance: Junction to Case Case = PTH pad 0.5 °C/W
@ 23+/-3°C 32 34
@ 100+/-3°C 27 28
Installation dependent Operating Current, post-
arming 2, 3 @ 175+/-3°C 10
A
Moisture Sensitivity Level Rating 4 1
2. Results obtained on 44.4mm x 57.2mm x 1.6mm single layer FR4 boards with 2oz Cu traces, a 645 sq.
mm, 2oz Cu heat spreader connected to the PTH pad, and a 387 sq. mm Cu heat spreader connected
to the P1 pad of the RTP device. (See RTP test board drawing in the RTP Datasheet). Results are
highly installation-dependent. Users should confirm for their own applications.
3. Operating current is measured on the RTP test board (see the RTP Datasheet) at the specified
temperature. It is a highly installation dependent value. Users should confirm for their own
applications.
4. As per JEDEC J-STD-020C
TABLE 4. ARMING CHARACTERISTICS:
Arming Characteristics
ARM Min Typ Max Units
Arming Type Electronically Armed
Pre-Arming 300 mΩ
RARM (Resistance from ARM to P1 or PTH) Post-Arming 10 KΩ
Arming Current (IARM) 5 @ 23 +/-3°C 2 5 A
@ 2A 0.10
Arming Time (@23 +/-3°C) 5 @ 5A 0.01 Sec
5. Results obtained on 44.4mm x 57.2mm x 1.6mm single layer FR4 boards with 2oz, Cu traces, a 645
sq. mm 2oz Cu heat spreader connected to the PTH pad, and a 387 sq. mm Cu heat spreader
connected to the P1 pad of the RTP device. (See RTP test board drawing in the RTP Datasheet.)
Results are highly installation dependent. Users should confirm for their own applications.
Reflowable Thermal Protection
Device
PRODUCT: RTP200R060SA
DOCUMENT: SCD28104
REV LETTER: C
REV DATE: NOVEMBER 1, 2011
PAGE NO.: 3 OF 5
Solder Reflow Recommendation:
Recommended Pad Layout:
mm
Reflowable Thermal Protection
Device
PRODUCT: RTP200R060SA
DOCUMENT: SCD28104
REV LETTER: C
REV DATE: NOVEMBER 1, 2011
PAGE NO.: 4 OF 5
Package Information:
E F W P1 P0 P2
mm
(in)
1.75±0.10
(0.069±0.004)
11.50±0.10
(0.453±0.004)
24.00±0.30
(0.945±0.012)
12.00±0.10
(0.472±0.004)
4.00±0.10
(0.157±0.004)
2.00±0.10
(0.079±0.004)
D0 D1 T A0 B0 K0
mm
(in)
1.50+0.10/-0.00
(0.059+0.004/-0.000)
1.50±0.10
(0.059±0.004)
0.46±0.046
(0.018±0.002)
5.70±0.18
(0.224±0.007)
12.40±0.18
(0.488±0.007)
6.50±0.18
(0.256±0.007)
B W1 W
2 Max
mm
(inch)
102.0 ± 2.0
(4.0 ± 0.079)
24
(0.945)
29
(1.14)
Reflowable Thermal Protection
Device
PRODUCT: RTP200R060SA
DOCUMENT: SCD28104
REV LETTER: C
REV DATE: NOVEMBER 1, 2011
PAGE NO.: 5 OF 5
Precedence: This specification takes precedence over documents referenced herein.
Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid.
MATERIALS INFORMATION
RoHS Compliant ELV Compliant Pb-Free Halogen Free*
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test
each product selected for their own applications. Tyco Electronics Corporation and its affiliates in the TE Connectivity Ltd. group of
companies (“TE”) reserves the right to change or update, without notice, any information contained in this publication; to change,
without notice, the design, construction, processing, or specification of any product; and to discontinue or limit production or distribution
of any product. This publication supersedes and replaces all information previously supplied. Without expressed or written consent by
an officer of TE, TE does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in
critical life support devices or systems. TE expressly disclaims all implied warranties regarding the information contained herein,
including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. TE’ only obligations are those
in the TE Standard Terms and Conditions of Sale and in no case will TE be liable for any incidental, indirect, or consequential damages
arising from the sale, resale, use, or misuse of its products.
© 2011 Tyco Electronics Corporation, a TE Connectivity Ltd. company. All rights reserved.
HF
