55
Cartridge and Axial Lead Fuses
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Revised: July 18, 2008
374 Series
TR5® > Time Lag > 374 Series
Materials
#BTF$BQ#SPXO5IFSNPQMBTUJD
1PMZBNJEF1"6-7
3PVOE1JOT$PQQFS5JOQMBUFE
Lead Pull Strength /&/
Solderability $õ4FD8BWF
$õ4FD4PMEFSJOHJSPO
Soldering Heat
Resistance $4FD*&$
Product Characteristics
Operating Temperature $UP$DPOTJEFSEFSBUJOH
Climatic Category $$EBZT
&/
Stock Conditions
$UP$
3)õZFBSMZBWFSBHFXJUIPVU
EFXNBYJNVNWBMVFGPSEBZT
95%
Vibration Resistance
DZDMFTBUNJOFBDI
&/
)[BUNNBNQMJUVEF
)[BU(TBDDFMFSBUJPO
Dimensions
8.5
0.5 min
max. 8L
0.6
5.08
1 +0.1
)PMFTJO1$#
-POH-FBET-NN
4IPSU-FBET-NN
Part Numbering System
Packaging Code Packing Option Quantity
000 5BQF"NNPQBDL
4IPSU-FBET
Packaging
374 0050
Series
Amp. Code
000
Packaging Code
(See Electrical Characteristics Chart)
000 Tape/Ammopack (1,000 pcs.)
041 Short Leads - Bulk (1,000 pcs.)
Soldering Parameters
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
%FQFOETPO'MVY"DUJWBUJPO5FNQFSBUVSF 5ZQJDBM*OEVTUSZ3FDPNNFOEBUJPO
5FNQFSBUVSF.JOJNVN 100° C
5FNQFSBUVSF.BYJNVN 150° C
1SFIFBU5JNF TFDPOET
Solder Pot Temperature: ° $.BYJNVN
Solder Dwell Time: TFDPOET
Recommended Hand-Solder Parameters:
4PMEFS*SPO5FNQFSBUVSF¡$¡$
)FBUJOH5JNFTFDPOETNBY
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters: