(0,80mm) .0315"
MEC8-DV SERIES
WWW.SAMTEC.COM
MEC8 POSITIONS
PER ROW
PLATING
OPTION
1
10, 20, 30, 40, 50, 60, 70
OTHER
OPTION
–A
= Alignment
Pin
–K
= (5,50)
.217" DIA
Polyimide Pick
& Place Pad
DV
Note: Some sizes, styles and
options are non-standard,
non-returnable.
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC8-DV
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(4,22mm) .166" to
(5,66mm) .223"
Current Rating:
1.8A @ 30°C Temperature Rise
Voltage Rating:
265 VAC
RoHS Compliant:
Ye s
Processing:
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max (10-50)
(0,15mm) .006" max (60-70)
–L
= 10µ" (0,25µm) Gold on contact,
Matte Tin on tail
(8,50)
.335
(0,80) .0315 (8,80) .346
(8,65)
.341
No. of Positions x (0,80) .0315 + (4,60) .181
No. of Positions x (0,80) .0315 + (1,40) .055
(1,80)
.071
01
02
(7,00)
.276
(0,90)
.035 DIA
(1,35)
.053
(4,00) .157
(2,00) .0787
No. of Positions x (0,80) .0315 + (7,80) .307
B
A
–A
OPTION
Mates with:
(1,60mm) .062" thick cards
APPLICATIONS
–EM to –DV –DV to –DV
POSITIONS
PER ROW
40
50
60
70
A
(18,90)
.744
(22,90)
.902
(26,90)
1.059
(30,90)
1.217
B
(36,60)
1.441
(44,60)
1.756
(52,60)
2.071
(60,60)
2.386
02
APPLICATION
SPECIFIC
OPTION
• 1mm mating card
thickness option
• Locking clip
Call Samtec.
SPECIFICATIONS
F-211 SUPPLEMENT
MINI EDGE CARD VERTICAL SOCKET
0,80mm MEC8-DV Rated @ 3dB Insertion Loss
8,65mm Stack Height
Single-Ended Signaling 7.0 GHz / 14 Gbps
Differential Pair Signaling 7.0 GHz / 14 Gbps
For complete test data go to www.samtec.com?MEC8-DV
or contact sig@samtec.com
Mates with (1,60mm)
.062" thick card
Variety of
lead counts
(0,80mm)
.0315"
pitch
MEC8–110–02–L–DV–A
MEC8–120–02–L–DV–A
MEC8–140–02–L–DV–A
