INTEGRATED CIRCUITS DATA SHEET 74ALVC14 Hex inverting Schmitt trigger Product specification 2003 Feb 03 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 FEATURES DESCRIPTION * Wide supply voltage range from 1.65 to 3.6 V The 74ALVC14 is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. * Complies with JEDEC standard: JESD8-7 (1.65 to 1.95 V) JESD8-5 (2.3 to 2.7 V) JESD8B/JESD36 (2.7 to 3.6 V). The 74ALVC14 provides six inverting buffers with Schmitt-trigger action. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. * 3.6 V tolerant inputs/outputs * CMOS low power consumption * Direct interface with TTL levels (2.7 to 3.6 V) * Power-down mode * Unlimited input rise and fall times * Latch-up performance exceeds 250 mA * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C. SYMBOL tPHL/tPLH PARAMETER propagation delay input nA to output nY CI input capacitance CPD power dissipation capacitance per buffer CONDITIONS UNIT VCC = 1.8 V; CL = 30 pF; RL = 1 k 2.9 ns VCC = 2.5 V; CL = 30 pF; RL = 500 2.2 ns VCC = 2.7 V; CL = 50 pF; RL = 500 2.8 ns VCC = 3.3 V; CL = 50 pF; RL = 500 2.4 ns 3.5 pF 25 pF VCC = 3.3 V; notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total switching outputs; (CL x VCC2 x fo) = sum of the outputs. 2. The condition is VI = GND to VCC. 2003 Feb 03 TYPICAL 2 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 ORDERING INFORMATION PACKAGE TYPE NUMBER PINS PACKAGE MATERIAL CODE 74ALVC14D 14 SO14 plastic SOT108-1 74ALVC14PW 14 TSSOP14 plastic SOT402-1 FUNCTION TABLE See note 1. INPUT OUTPUT nA nY L H H L Note 1. H = HIGH voltage level; L = LOW voltage level. PINNING PIN SYMBOL DESCRIPTION 1 1A data input 2 1Y data output 3 2A data input 4 2Y data output 5 3A data input 6 3Y data output 7 GND ground (0 V) 8 4Y data output 9 4A data input 10 5Y data output 11 5A data input 12 6Y data output 13 6A data input 14 VCC supply voltage 2003 Feb 03 3 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 handbook, halfpage 1A 1 14 VCC 1Y 2 13 6A 2A 3 12 6Y 2Y 4 3A 5 11 5A 14 handbook, halfpage A 10 5Y 3Y 6 9 GND 7 8 4Y Y MNA205 4A MNA203 Fig.1 Pin configuration. Fig.2 Logic diagram (one Schmitt-trigger). handbook, halfpage 1 3 5 9 11 13 1A 1Y 2A 2Y 3A 3Y 4A 4Y 5A 5Y 6A 6Y 2 4 6 8 10 12 MNA204 Fig.3 Logic symbol. 2003 Feb 03 4 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage 1.65 3.6 V VI input voltage 0 3.6 V VO output voltage VCC = 1.65 to 3.6 V 0 VCC V VCC = 0 V; Power-down mode 0 3.6 V Tamb operating ambient temperature -40 +85 C tr, tf input rise and fall times VCC = 1.65 to 2.7 V 0 20 ns/V VCC = 2.7 to 3.6 V 0 10 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER VCC supply voltage IIK input diode current VI input voltage IOK output diode current VO output voltage CONDITIONS VI < 0 VO > VCC or VO < 0 MIN. MAX. UNIT -0.5 +4.6 V - -50 mA -0.5 +4.6 V - 50 mA notes 1 and 2 -0.5 VCC + 0.5 V Power-down mode; note 2 -0.5 +4.6 V VO = 0 to VCC - 50 mA IO output source or sink current ICC, IGND VCC or GND current - 100 mA Tstg storage temperature -65 +150 C Ptot power dissipation SO package above 70 C derate linearly with 8 mW/K - 500 mW TSSOP package above 60 C derate linearly with 5.5 mW/K - 500 mW Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation. 2003 Feb 03 5 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER MIN. OTHER TYP.(1) MAX. UNIT VCC (V) Tamb = -40 to +85 C VOL VOH LOW-level output voltage HIGH-level output voltage VI = VIH or VIL IO = 100 A 1.65 to 3.6 - - 0.2 V IO = 6 mA 1.65 - 0.11 0.3 V IO = 12 mA 2.3 - 0.17 0.4 V IO = 18 mA 2.3 - 0.25 0.6 V IO = 12 mA 2.7 - 0.16 0.4 V IO = 18 mA 3.0 - 0.23 0.4 V IO = 24 mA 3.0 - 0.30 0.55 V VI = VIH or VIL IO = -100 A 1.65 to 3.6 VCC - 0.2 - - V IO = -6 mA 1.65 1.25 1.51 - V IO = -12 mA 2.3 1.8 2.10 - V IO = -18 mA 2.3 1.7 2.01 - V IO = -12 mA 2.7 2.2 2.53 - V IO = -18 mA 3.0 2.4 2.76 - V IO = -24 mA 3.0 2.2 2.68 - V ILI input leakage current VI = 3.6 V or GND 3.6 - 0.1 5 A Ioff power OFF leakage current VI or VO = 3.6 V 0.0 - 0.1 10 A ICC quiescent supply current VI = VCC or GND; IO = 0 3.6 - 0.2 10 A ICC additional quiescent supply current per input pin VI = VCC - 0.6 V; IO = 0 3.0 to 3.6 - 5 750 A Note 1. All typical values are measured at Tamb = 25 C. 2003 Feb 03 6 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 TRANSFER CHARACTERISTICS Voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER MIN. WAVEFORMS TYP.(1) MAX. UNIT VCC (V) Tamb = -40 to +85 C VT+ VT- VH positive-going threshold see Figs 4 and 5 negative-going threshold see Figs 4 and 5 hysteresis (VT+ - VT-) see Figs 4 and 5 1.65 0.7 0.98 1.24 V 1.95 0.75 1.12 1.46 V 2.3 0.9 1.27 1.7 V 2.7 1.0 1.43 2.0 V 3.0 1.1 1.56 2.0 V 3.6 1.1 1.81 2.0 V 1.65 0.41 0.64 0.9 V 1.95 0.49 0.76 1.1 V 2.3 0.6 0.90 1.3 V 2.7 0.7 1.06 1.4 V 3.0 0.8 1.19 1.5 V 3.6 0.8 1.42 1.7 V 1.65 0.25 0.34 0.62 V 1.95 0.25 0.36 0.62 V 2.3 0.3 0.36 1.0 V 2.7 0.3 0.38 1.1 V 3.0 0.3 0.37 1.2 V 3.6 0.3 0.40 1.2 V Notes 1. All typical values are measured at Tamb = 25 C. 2. The VIH and VIL from the DC family characteristics are superseded by the VT+ and VT-. handbook, halfpage handbook, halfpage VI VO VT+ VH VT- VO MNA208 VH VT- VI VT+ MNA026 Where VT+ and VT- are between limits of 20% and 70%. Fig.4 Transfer characteristic. 2003 Feb 03 Fig.5 Definition of VT+, VT- and VH 7 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 MNA582 5 handbook, halfpage I CC (mA) 4 3 2 1 0 0 0.6 1.2 1.8 2.4 3 Vin (V) VCC = 3.0 V. Fig.6 Typical 74ALVC14 transfer characteristic AC CHARACTERISTICS TEST CONDITIONS SYMBOL PARAMETER MIN. WAVEFORMS TYP.(1) MAX. UNIT VCC (V) Tamb = -40 to +85 C tPHL/tPLH propagation delay nA to nY see Figs 7 and 8 Note 1. All typical values are measured at Tamb = 25 C. 2003 Feb 03 8 1.65 to 1.95 1.0 2.9 4.4 ns 2.3 to 2.7 1.0 2.2 3.7 ns 2.7 1.0 2.8 3.9 ns 3.0 to 3.6 1.0 2.4 3.4 ns Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 AC WAVEFORMS handbook, halfpage VM nA input tPHL tPLH VM nY output MNA209 INPUT VCC VM VI tr = tf 0.5 x VCC VCC 2.0 ns 2.3 to 2.7 V 0.5 x VCC VCC 2.0 ns 2.7 V 1.5 V 2.7 V 2.5 ns 3.0 to 3.6 V 1.5 V 2.7 V 2.5 ns 1.65 to 1.95 V Fig.7 Input nA to output nY propagation delay times. VEXT handbook, full pagewidth VCC VI PULSE GENERATOR RL VO D.U.T. CL RT RL MNA616 VCC VI CL RL VEXT tPLH/tPHL tPZH/tPHZ tPZL/tPLZ 1.65 to 1.95 V VCC 30 pF 1 k open GND 2 x VCC 2.3 to 2.7 V VCC 30 pF 500 open GND 2 x VCC 2.7 V 2.7 V 50 pF 500 open GND 6V 3.0 to 3.6 V 2.7 V 50 pF 500 open GND 6V RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.8 Load circuitry for switching times. 2003 Feb 03 9 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 APPLICATION INFORMATION MNA581 2.5 handbook, halfpage average I CC (mA) 2.0 positive-going edge R handbook, halfpage 1.5 negative-going edge 1.0 0.5 2.1 C MNA035 2.4 2.7 3.0 3.3 3.6 VCC (V) 3.9 1 1 f = --- ----------------------T 0.8 x RC Linear change of VI between 0.8 to 2.0 V. All values given are typical unless otherwise specified. Fig.9 Average ICC for ALVC Schmitt-trigger devices. 2003 Feb 03 VCC = 3.0 V. Fig.10 Relaxation oscillator using the ALVC14. 10 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.244 0.039 0.050 0.041 0.228 0.016 0.010 0.057 inches 0.069 0.004 0.049 0.028 0.024 0.01 0.01 0.028 0.004 0.012 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 2003 Feb 03 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 11 o 8 0o Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index Lp L 1 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 2003 Feb 03 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27 MO-153 12 o Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. To overcome these problems the double-wave soldering method was specifically developed. 2003 Feb 03 13 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable(3) DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(4), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP REFLOW(2) suitable suitable suitable not recommended(4)(5) suitable not recommended(6) suitable Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2003 Feb 03 14 Philips Semiconductors Product specification Hex inverting Schmitt trigger 74ALVC14 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Feb 03 15 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA75 (c) Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613508/01/pp16 Date of release: 2003 Feb 03 Document order number: 9397 750 10452 Philips Semiconductors - PIP - 74ALVC14; Hex inverting Schmitt trigger Your browser does not support script Philips Semiconductors Home Product Buy MySemiconductors Contact catalogonline Product Information 74ALVC14; Hex inverting Schmitt trigger Products MultiMarket Semiconductors " Product Selector Catalog by " Function Catalog by " System " Cross-reference " Packages End of Life " information Distributors Go " Here! " Models " SoC solutions " General description Block diagram Products & packages Information as of 2003-04-22 My.Semiconductors.COM. Your personal service from Philips Semiconductors. Please register now ! Features Buy online Parametrics Use right mouse button to download datasheet Download datasheet Stay informed Applications Support & tools Similar products Datasheet Email/translate General description top The 74ALVC14 is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. The 74ALVC14 provides six inverting buffers with Schmitt-trigger action. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. Features top Wide supply voltage range from 1.65 to 3.6 V Complies with JEDEC standard: JESD8-7 (1.65 to 1.95 V) JESD8-5 (2.3 to 2.7 V) JESD8B/JESD36 (2.7 to 3.6 V). 3.6 V tolerant inputs/outputs CMOS low power consumption Direct interface with TTL levels (2.7 to 3.6 V) Power-down mode Unlimited input rise and fall times Latch-up performance exceeds 250 mA ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. Applications top AN240: Interfacing 3 Volt and 5 Volt Applications Download PDF File file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74ALVC14D.html (1 of 3) [5ay-14-2003 2:02:45 PM] Philips Semiconductors - PIP - 74ALVC14; Hex inverting Schmitt trigger Datasheet top Type number 74ALVC14 Title Publication release date Hex inverting 2/3/2003 Schmitt trigger Datasheet status Product specification Page count 16 File size (kB) Datasheet Download Download PDF File 86 Parametrics top Type number Package Description Propagation Voltage No. Delay(ns) of Pins Hex SOT108-1 Inverting 2~4 Low 14 74ALVC14D Schmitt (SO14) Trigger Hex SOT402-1 Inverting 2~4 Low 14 74ALVC14PW (TSSOP14) Schmitt Trigger Power Logic Output Dissipation Switching Drive Considerations Levels Capability Low Power or Battery Applications TTL Medium Low Power or Battery Applications TTL Medium Products, packages, availability and ordering top Type number 74ALVC14D North American type number Ordering code (12NC) 9352 697 22112 Marking/Packing Standard Marking * Tube Standard Marking * Reel Pack, SMD, 13" Standard Marking * 9352 697 23112 Tube Standard Marking * 9352 697 23118 Reel Pack, SMD, 13" 9352 697 22118 74ALVC14PW Package Device status IC packing info Download PDF File Buy online SOT108-1 (SO14) Full production - SOT108-1 (SO14) Full production - SOT402-1 (TSSOP14) Full production - SOT402-1 (TSSOP14) Full production - Similar products top 74ALVC14 links to the similar products page containing an overview of products that are similar in Products similar or related to the type number(s) as listed on this page. The similar products page includes products function to the same catalog tree(s), relevant selection guides and products from the same functional category. from 74ALVC14 Support & tools top Innovative Low Voltage Logic Solutions(date 01-Aug-00) Download PDF New MultiMarket Products quarterly highlights 2.1(date 19-Feb-03) Download File PDF File file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74ALVC14D.html (2 of 3) [5ay-14-2003 2:02:45 PM] Philips Semiconductors - PIP - 74ALVC14; Hex inverting Schmitt trigger Email/translate this product information top Email this product information. Translate this product information page from English to: French Translate The English language is the official language used at the semiconductors.philips.com website and webpages. All translations on this website are created through the use of Google Language Tools and are provided for convenience purposes only. No rights can be derived from any translation on this website. About this Web Site | Copyright (c) 2003 Koninklijke Philips N.V. All rights reserved. | Privacy Policy | | Koninklijke Philips N.V. | Access to and use of this Web Site is subject to the following Terms of Use. | file:///G|/imaging/BITTING/CPL/20030424/04232003_9/PHGL/_HTML04232003/74ALVC14D.html (3 of 3) [5ay-14-2003 2:02:45 PM]