Pin Functions
Output (Pin 5): Reference Output.
Input (Pin 4):Positive Supply.
Ground (Pin 2):Negative Supply or Ground Connection.
Application Hints
The standard application circuit for the LM4125 is shown in
Figure 1. It is designed to be stable with ceramic output
capacitors in the range of 0.022µF to 0.1µF. Note that
0.022µF is the minimum required output capacitor. These
capacitors typically have an ESR of about 0.1 to 0.5Ω.
Smaller ESR can be tolerated, however larger ESR can not.
The output capacitor can be increased to improve load tran-
sient response, up to about 1µF. However, values above
0.047µF must be tantalum. With tantalum capacitors, in the
1µF range, a small capacitor between the output and the
reference pin is required. This capacitor will typically be in
the 50pF range. Care must be taken when using output
capacitors of 1µF or larger. These application must be thor-
oughly tested over temperature, line and load.
An input capacitor is typically not required. However, a 0.1µF
ceramic can be used to help prevent line transients from
entering the LM4125. Larger input capacitors should be
tantalum or aluminium.
The typical thermal hysteresis specification is defined as the
change in +25˚C voltage measured after thermal cycling.
The device is thermal cycled to temperature -40˚C and then
measured at 25˚C. Next the device is thermal cycled to
temperature +125˚C and again measured at 25˚C. The re-
sulting V
OUT
delta shift between the 25˚C measurements is
thermal hysteresis. Thermal hysteresis is common in preci-
sion references and is induced by thermal-mechanical pack-
age stress. Changes in environmental storage temperature,
operating temperature and board mounting temperature are
all factors that can contribute to thermal hysteresis.
INPUT CAPACITOR
Noise on the power-supply input can effect the output noise,
but can be reduced by using an optional bypass capacitor
between the input pin and the ground.
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATION
The mechanical stress due to PC board mounting can cause
the output voltage to shift from its initial value. References in
SOT packages are generally less prone to assembly stress
than devices in Small Outline (SOIC) package.
To reduce the stress-related output voltage shifts, mount the
reference on the low flex areas of the PC board such as near
to the edge or the corner of the PC board.
20069832
FIGURE 1.
LM4125
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