July 2007 Rev 10 1/12
12
BTA24, BTB24, BTA25
BTA26, BTB26, T25
25 A standard and Snubberless™ triacs
Features
■High current triac
■Low thermal resistance with clip bonding
■High commutation (4 quadrant) or very high
commutation (3 quadrant) capability
■BTA series UL1557 certified (File ref: 81734)
■Packages are RoHS (2002/95/EC) compliant
Applications
Applications include the ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits, etc.,
or for phase control operation in light dimmers,
motor speed controllers, and silmilar.
The snubberless versions (BTA/BTB...W and T25
series) are especially recommended for use on
inductive loads, due to their high commutation
performances. The BTA series provides an
insulated tab (rated at 2500 VRMS).
Description
Available either in through-hole or surface-mount
packages, the BTA24, BTB24, BTA25, BTA26,
BTB26 and T25 triac series is suitable for general
purpose mains power AC switching.
TM: Snubberless is a trademark of STMicroelectronics
D2PAK
(T25)
RD91
(BTA25)
TOP3 Insulated
(BTA26)
TO-220AB Insulated
(BTA24)
TO-220AB
(BTB24)
G
A2
A1
G
A2
A2
A1
A2
A1
G
GA2
A1
G
A2
A1
A2
A2
G
A1
TOP3
(BTB26)
G
A2
A1
A2
Table 1. Device summary
Symbol Parameter BTA24(1)
1. Insulated packages
BTB24 BTA25(1) BTA26(1) BTB26 T25 Unit
IT(RMS)
RMS on-state
current 25 25 25 25 25 25 A
VDRM/VRRM
Repetitive peak
off-state voltage 600 / 800 600 / 800 600 / 800 600(2) / 800
2. 600 V version available only with IGT = 50 mA (Snubberless and Standard)
600 600 / 800 V
IGT (Snubberless) Triggering gate
current 35 / 50 35 / 50 50 35 / 50 - 35 mA
IGT (Standard) Triggering gate
current -50505050-mA
www.st.com
Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T25
2/12
1 Characteristics
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
IT(RMS) RMS on-state current (full sine wave)
TOP3 Tc = 105° C
25 A
D2PAK /
TO-220AB Tc = 100° C
RD91 Ins/
TOP3 Ins. Tc = 100° C
TO-220AB Ins. Tc = 75° C
ITSM
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25° C)
F = 50 Hz t = 20 ms 250 A
F = 60 Hz t = 16.7 ms 260
I²tI
²t Value for fusing tp = 10 ms 340 A²s
dI/dt Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz Tj = 125° C 50 A/µs
VDSM/VRSM
Non repetitive surge peak off-state
voltage tp = 10 ms Tj = 25° C VDRM/VRRM
+ 100 V
IGM Peak gate current tp = 20 µs Tj = 125° C 4 A
PG(AV) Average gate power dissipation Tj = 125° C 1 W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125 ° C
Table 3. Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless and
logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W
Symbol Test Conditions Quadrant
T25 BTA/BTB
Unit
T2535 CW BW
IGT(1)
VD = 12 V RL = 33 Ω
I - II - III MAX. 35 35 50 mA
VGT I - II - III MAX. 1.3 V
VGD
VD = VDRM RL = 3.3 kΩ
Tj = 125° C I - II - III MIN. 0.2 V
IH(2) IT = 500 mA MAX. 50 50 75 mA
ILIG = 1.2 IGT
I - III MAX. 70 70 80 mA
II 80 80 100
dV/dt (2) VD = 67 %VDRM gate open Tj = 125° C MIN. 500 500 1000 V/µs
(dI/dt)c (2) Without snubber Tj = 125° C MIN. 13 13 22 A/ms
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Characteristics
3/12
Table 4. Electrical characteristics (Tj = 25° C, unless otherwise specified),
standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B
Symbol Test Conditions Quadrant Value Unit
IGT (1)
VD = 12 V RL = 33 Ω
I - II - III MAX. 50 mA
IV 100
VGT ALL MAX. 1.3 V
VGD VD = VDRM RL = 3.3 kΩ Tj = 125° C ALL MIN. 0.2 V
IH(2))I
T = 500 mA MAX. 80 mA
ILIG = 1.2 IGT
I - III - IV MAX. 70 mA
II 160
dV/dt(2) VD = 67 %VDRM gate open Tj = 125° C MIN. 500 V/µs
(dV/dt)c (2) (dI/dt)c = 13.3 A/ms Tj = 125° C MIN. 10 V/µs
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
Table 5. Static characteristics
Symbol Test Conditions Value Unit
VTM (1) ITM = 35 A tp = 380 µs Tj = 25° C MAX. 1.55 V
Vt0 (1) Threshold voltage Tj = 125° C MAX. 0.85 V
Rd (1) Dynamic resistance Tj = 125° C MAX. 16 mΩ
IDRM
IRRM
VDRM = VRRM
Tj = 25° C MAX. 5µA
Tj = 125° C 3 mA
1. for both polarities of A2 referenced to A1.
Table 6. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Junction to case (AC)
TOP 3 0.6
° C/W
D2PAK / TO-220AB 0.8
RD91 Insulated / TOP3 Insulated 0.9
TO-220AB Insulated 1.7
Rth(j-a) Junction to ambient
(1)S = 1 cm²D2PA K 4 5
° C/WTOP3 / TOP3 Insulated 50
TO-220AB / TO-220AB Insulated 60
1. S = Copper surface under tab.
Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T25
4/12
Figure 1. Maximum power dissipation versus
RMS on-state current (full cycle)
Figure 2. RMS on-state current versus case
temperature (full cycle)
0 5 10 15 20 25
0
5
10
15
20
25
30
P(W)
I (A)
T(RMS)
I (A)
T(RMS)
0
5
10
15
20
25
30
0 25 50 75 100 125
BTA24
BTB24 / T25xx /
BTA25 / BTA26
BTB26
T (°C)
C
Figure 3. D2PAK RMS on-state current versus
ambient temperature (printed
circuit board FR4, copper
thickness: 35µm) (full cycle)
Figure 4. Relative variation of thermal
impedance versus pulse
duration
0 25 50 75 100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
I (A)
T(RMS)
T (°C)
amb
DPAK
(S=1cm )
2
2
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
1E-3
1E-2
1E-1
1E+0
K=[Z /R
th th]
t (s)
p
Zth(j-c)
Z
BTA / BTB24 / T25
th(j-a)
Z
BTA26
th(j-a)
Figure 5. On-state characteristics
(maximum values)
Figure 6. Surge peak on-state current
versus number of cycles
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1
10
100
300
I (A)
TM
V (V)
TM
T = 25°C
j.
T max.
V = 0.85V
R = 16 m
j
to
dΩ
T=
jT max.
j
1 10 100 1000
0
50
100
150
200
250
300
I (A)
TSM
Number of cycles
t=20ms
One cycle
Non repetitive
T initial=25°C
j
Repetitive
T =75°C
C
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Characteristics
5/12
Figure 7. Non-repetitive surge peak on-state
current for a sinusoidal pulse with
width tp < 10 ms and corresponding
value of I2t
Figure 8. Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
0.01 0.10 1.00 10.00
100
1000
3000
I (A), I t (A s)
TSM 22
t (ms)
p
T initial=25°C
j
ITSM
dI/dt limitation:
50A/µs
I t
2
-40 -20 0 20 40 60 80 100 120 140
0.0
0.5
1.0
1.5
2.0
2.5
T (°C)
j
I,I,I[T] /
GT H L j I ,I ,I [T =25°C]
GT H L j
IGT
IH& IL
Figure 9. Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
Figure 10. Relative variation of critical rate of
decrease of main current versus Tj
Figure 11. D2PAK thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
0.1 1.0 10.0 100.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
(dV/dt)c (V/µs)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
T2535/CW/BW
B
0 25 50 75 100 125
0
1
2
3
4
5
6
(dI/dt)c [T ] / pecified]
j(dI/dt)c [T s
j
T (°C)
j
0 4 8 12 16 20 24 28 32 36 40
0
10
20
30
40
50
60
70
80
S(cm²)
R (°C/W)
th(j-a)
DPAK
2
Ordering information scheme BTA24, BTB24, BTA25, BTA26, BTB26, T25
6/12
2 Ordering information scheme
Figure 12. BTA and BTB series
Figure 13. T25 series
BT A 24 - 600 BW RG
Triac series
Insulation
Current
Voltage
Sensitivity and type
Packing mode
A = insulated
B = non insulated
24 = 25 A in TO-220AB
25 = 25 A in RD91
26 = 25 A in TOP3
600 = 600 V
800 = 800 V
B = 50 mA Standard
BW = 50 mA Snubberless
CW = 35 mA
RG = Tube
Snubberless
T 25 35 - 600 G (-TR)
Triac series
Sensitivity
Voltage
Package
Packing mode
Current
25 = 25 A
35 = 35 mA
600 = 600 V
800 = 800 V
G = D PAK
Blank = Tube
-TR = Tape and Reel
2
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Package information
7/12
3 Package information
●Epoxy meets UL94,V0
●Cooling method: C
●Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91)
●Maximum torque value for BTB24 is 0.5 Nm
Figure 14. D2PAK footprint dimensions (in millimeters)
Table 7. D2PAK dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 0° 8° 0° 8°
G
L
L3
L2
B
B2
E
2mm min.
FLAT ZONE
A
C2
D
R
A2
V2
C
A1
16.90
10.30
8.90 3.70
5.08
1.30
Package information BTA24, BTB24, BTA25, BTA26, BTB26, T25
8/12
Table 8. RD91 dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 40.00 1.575
A1 29.90 30.30 1.177 1.193
A2 22.00 0.867
B 27.00 1.063
B1 13.50 16.50 0.531 0.650
B2 24.00 0.945
C 14.00 0.551
C1 3.50 0.138
C2 1.95 3.00 0.077 0.118
E3 0.70 0.90 0.027 0.035
F 4.00 4.50 0.157 0.177
I 11.20 13.60 0.441 0.535
L1 3.10 3.50 0.122 0.138
L2 1.70 1.90 0.067 0.075
N1 33° 43° 33° 43°
N2 28° 38° 28° 38°
A
E3
N2 N1
B
F
I
A1
B1
L1
A2
L2
B2
C
C2 C1
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Package information
9/12
Table 9. TOP3 (insulated and non_insulated) dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.4 4.6 0.173 0.181
B 1.45 1.55 0.057 0.061
C 14.35 15.60 0.565 0.614
D 0.5 0.7 0.020 0.028
E 2.7 2.9 0.106 0.114
F 15.8 16.5 0.622 0.650
G 20.4 21.1 0.815 0.831
H 15.1 15.5 0.594 0.610
J 5.4 5.65 0.213 0.222
K 3.4 3.65 0.134 0.144
ØL 4.08 4.17 0.161 0.164
P 1.20 1.40 0.047 0.055
R 4.60 0.181
R
H
K
G
F
E
D
B
A
C
JJ
P
ØL
Package information BTA24, BTB24, BTA25, BTA26, BTB26, T25
10/12
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 10. TO-220AB (insulated and non-insulated) dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
C
b2
c2
F
Ø I
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Ordering information
11/12
4 Ordering information
Note: xxx = voltage, y = sensitivity, z = type
5 Revision history
Table 11. Ordering information
Ordering type Marking Package Weight Base qty Delivery mode
BTA/BTB24-xxxyzRG BTA/BTB24 xxxyz TO-220AB 2.3 g 50 Tube
BTA25-xxxyz BTA25xxxyz RD91 20 g 25 Bulk
BTA26-xxxyRG BTA26xxxyz TOP3 Ins. 4.5 g 30 Tube
BTB26-600BRG BTB26600B TOP3 4.5 g 30 Tube
T2535-xxxG T2535 xxxG D2PAK 1.5 g 50 Tube
T2535-xxxG-TR T2535 xxxG 1000 Tape and reel
Table 12. Revision history
Date Revision Description of changes
Oct-2002 6A Previous update.
13-Feb-2006 7 TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
31-May-2006 8 Reformatted to current standard. Tc in figure 3 changed to Tamb
31-Jul-2006 9 Typing error corrected on page 1 (BTB124 instead of BTB24)
05-Jul-2007 10
Added BTB26-600BRG. Restructured cover page and section 2:
Ordering information scheme on page 6 to simplify product selection.
Thermal resistance values updated in Tabl e 6 and Figure 2. Graphic
for I2t updated in Figure 7.
BTA24, BTB24, BTA25, BTA26, BTB26, T25
12/12
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
