Pb
RoHS
EB13C5J2H-28.63636M TR
EB13C5 J 2 H -28.63636M TR
Series
RoHS Compliant (Pb-free) Low Current 3.3V 4 Pad
3.2mm x 5mm Ceramic SMD LVCMOS Oscillator
Frequency Tolerance/Stability
±25ppm over -40°C to +85°C
Duty Cycle
50 ±5%
Packaging Options
Tape & Reel
Nominal Frequency
28.63636MHz
Logic Control / Additional Output
Tri-State
ELECTRICAL SPECIFICATIONS
Nominal Frequency 28.63636MHz
Frequency Tolerance/Stability ±25ppm over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability
over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at
25°C, Shock, and Vibration)
Supply Voltage 3.3Vdc ±10%
Input Current 5mA Maximum
Output Voltage Logic High (Voh) 90% of Vdd Minimum
Input Current Logic High (Ioh) -1.6mA
Output Voltage Logic Low (Vol) 10% of Vdd Maximum
Input Current Logic Low (Iol) +1.6mA
Rise/Fall Time 4nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle 50 ±5% (Measured at 50% of waveform)
Load Drive Capability 15pF Maximum
Output Logic Type CMOS
Logic Control / Additional Output Tri-State
Tri-State Input Voltage (Vih and Vil) 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High
Impedance)
Standby Current 10µA Maximum (Disabled Output: High Impedance)
One Sigma Clock Period Jitter 25pSec Maximum
Start Up Time 10 mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, MEthod 1010
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 1 of 6
EB13C5J2H-28.63636M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.20
±0.20
5.00
±0.20
1.3
MAX 2.20
±0.15
1.20
±0.20
(x4)
1.00 ±0.20 (x4) 1.20 ±0.20 (x4)
2.54
±0.15
1
2
3
4
MARKING
ORIENTATION
PIN CONNECTION
1 Tri-State
2 Ground
3 Output
4 Supply Voltage
LINE MARKING
1E28.636
E=Ecliptek Designator
2XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
1.14
1.0
1.2 (X4)
1.4 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 2 of 6
EB13C5J2H-28.63636M TR
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80% of Waveform
50% of Waveform
20% of Waveform
Fall
Time
Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUT TRI-STATE INPUT
Supply
Voltage
(VDD)
Test Circuit for CMOS Output
Output
No Connect
or Tri-State
Ground
+ +
+_
__
Power
Supply 0.01µF
(Note 1) 0.1µF
(Note 1) CL
(Note 3)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Voltage
Meter
Current
Meter
Oscilloscope Frequency
Counter
Probe
(Note 2)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 3 of 6
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
EB13C5J2H-28.63636M TR
12.0 ±0.2
5.5 ±0.1
6.5 ±0.1
4.0 ±0.1
2.0 ±0.1
8.0 ±0.1 B0*
DIA 1.5 +0.1/-0.0
A0*
0.30 ±0.05
K0*
18.4 MAX
180 MAX
Quantity Per Reel: 1,000 units
12.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 4 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EB13C5J2H-28.63636M TR
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 5 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EB13C5J2H-28.63636M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 8/12/2010 | Page 6 of 6
