The Allegro™ A1101-A1104 and A1106 Hall-effect switches
are next generation replacements for the popular Allegro
312x and 314x lines of unipolar switches. The A110x family,
produced with BiCMOS technology, consists of devices that
feature fast power-on time and low-noise operation. Device
programming is performed after packaging, to ensure increased
switchpoint accuracy by eliminating offsets that can be induced
by package stress. Unique Hall element geometries and low-
offset amplifiers help to minimize noise and to reduce the
residual offset voltage normally caused by device overmolding,
temperature excursions, and thermal stress.
The A1101-A1104 and A1106 Hall-effect switches include
the following on a single silicon chip: voltage regulator, Hall-
voltage generator, small-signal amplifier, Schmitt trigger, and
NMOS output transistor. The integrated voltage regulator
permits operation from 3.8 to 24 V. The extensive on-board
protection circuitry makes possible a ±30 V absolute maximum
voltage rating for superior protection in automotive and
industrial motor commutation applications, without adding
external components. All devices in the family are identical
except for magnetic switchpoint levels.
The small geometries of the BiCMOS process allow these
devices to be provided in ultrasmall packages. The package
styles available provide magnetically optimized solutions for
most applications. Package LH is an SOT23W, a miniature low-
profile surface-mount package, while package UA is a three-lead
ultramini SIP for through-hole mounting. Each package is lead
(Pb) free, with 100% matte-tin-plated leadframes.
A1101-DS, Rev. 17
• AEC-Q100 automotive qualified
• Continuous-time operation
□Fast power-on time
□Low noise
• Stable operation over full operating temperature range
• Reverse battery protection
• Solid-state reliability
• Factory-programmed at end-of-line for optimum
performance
• Robust EMC performance
• High ESD rating
• Regulator stability without a bypass capacitor
Continuous-Time Switch Family
Functional Block Diagram
A1101, A1102, A1103, A1104, and A1106
Amp
Regulator
GND
VCC
VOUT
OffsetGain
Trim
Control
To all subcircuits
FEATURES AND BENEFITS DESCRIPTION
PACKAGES:
Not to scale
3-pin SOT23W
(suffix LH)
3-pin SIP,
matrix HD style
(suffix UA)
3-pin SIP,
chopper style
(suffix UA)
NOT FOR
NEW DESIGN
October 27, 2016
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
2
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Part Number Packing [1] Mounting Ambient, TABRP (Min) BOP (Max)
A1101ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to 85°C
10 175
A1101ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1101EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1101LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to
150°C
A1101LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1101LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1102ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to 85°C
60 245
A1102ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1102EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1102LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to
150°C
A1102LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1102LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1103ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount –40°C to 85°C
150 355
A1103ELHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1103LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to
150°C
A1103LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1103LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1104EUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole –40°C to 85°C
25 450
A1104LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to
150°C
A1104LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1104LUA-T [2] Bulk, 500 pieces/bag 3-pin SIP through hole
A1106EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole –40°C to 85°C
160 430
A1106LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
–40°C to
150°C
A1106LLHLX-T 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount
A1106LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
1 Contact Allegro for additional packing options.
2 The chopper-style UA package is not for new design; the matrix HD style UA package is recommended for new designs.
SELECTION GUIDE
ABSOLUTE MAXIMUM RATINGS
Characteristic Symbol Notes Rating Units
Supply Voltage VCC 30 V
Reverse Supply Voltage VRCC –30 V
Output Off Voltage VOUT 30 V
Reverse Output Voltage VROUT –0.5 V
Output Current IOUTSINK 25 mA
Magnetic Flux Density B Unlimited G
Operating Ambient Temperature TA
Range E –40 to 85 °C
Range L –40 to 150 °C
Maximum Junction Temperature TJ(max) 165 °C
Storage Temperature Tstg –65 to 170 °C
SPECIFICATIONS
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
3
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Characteristic Symbol Test Conditions Min. Typ. Max. Units
Supply Voltage [1] VCC Operating, TJ < 165°C 3.8 – 24 V
Output Leakage Current IOUTOFF VOUT = 24 V, B < BRP – – 10 µA
Output On Voltage VOUT(SAT) IOUT = 20 mA, B > BOP – 215 400 mV
Power-On Time [2] tPO
Slew rate (dVCC/dt) < 2.5 V/μs, B > BOP + 5 G or B < BRP
– 5 G – – 4 µs
Output Rise Time [3] trVCC = 12 V, RLOAD = 820 Ω, CS = 12 pF – – 400 ns
Output Fall Time [3] tfVCC = 12 V, RLOAD = 820 Ω, CS = 12 pF – – 400 ns
Supply Current ICCON B > BOP – 4.1 7.5 mA
ICCOFF B < BRP – 3.8 7.5 mA
Reverse Battery Current IRCC VRCC = –30 V – – –10 mA
Supply Zener Clamp Voltage VZICC = 10.5 mA; TA = 25°C 32 – – V
Supply Zener Current [4] IZVZ = 32 V; TA = 25°C – – 10.5 mA
1 Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
2 For VCC slew rates greater than 250 V/μs, and TA = 150°C, the Power-On Time can reach its maximum value.
3 CS =oscilloscope probe capacitance.
4 Maximum current limit is equal to the maximum ICC(max) + 3 mA.
DEVICE QUALIFICATION PROGRAM
Contact Allegro for information.
EMC (ELECTROMAGNETIC COMPATABILITY) REQUIREMENTS
Contact Allegro for information.
1
3
2
GND
VOUT
VCC
Package UA, 3-pin SIP
Package LH
1
2
3
GND
VOUT
VCC
Terminal List
Number Name Description
Package LH Package UA
1 1 VCC Connects power supply to chip
2 3 VOUT Output from circuit
3 2 GND Ground
ELECTRICAL OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges,
unless otherwise noted
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
4
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Characteristic Symbol Test Conditions Min. Typ. Max. Units
Operate Point BOP
A1101 TA = 25°C 50 100 160 G
Operating Temperature Range 30 100 175 G
A1102 TA = 25°C 130 180 230 G
Operating Temperature Range 115 180 245 G
A1103 TA = 25°C 220 280 340 G
Operating Temperature Range 205 280 355 G
A1104 TA = 25°C 70 – 350 G
Operating Temperature Range 35 – 450 G
A1106 TA = 25°C 280 340 400 G
Operating Temperature Range 260 340 430 G
Release Point BRP
A1101 TA = 25°C 10 45 130 G
Operating Temperature Range 10 45 145 G
A1102 TA = 25°C 75 125 175 G
Operating Temperature Range 60 125 190 G
A1103 TA = 25°C 165 225 285 G
Operating Temperature Range 150 225 300 G
A1104 TA = 25°C 50 – 330 G
Operating Temperature Range 25 – 430 G
A1106 TA = 25°C 180 240 300 G
Operating Temperature Range 160 240 330 G
Hysteresis BHYS
A1101 TA = 25°C 20 55 80 G
Operating Temperature Range 20 55 80 G
A1102 TA = 25°C 30 55 80 G
Operating Temperature Range 30 55 80 G
A1103 TA = 25°C 30 55 80 G
Operating Temperature Range 30 55 80 G
A1104 TA = 25°C 20 55 – G
Operating Temperature Range 20 55 – G
A1106 TA = 25°C 70 105 140 G
Operating Temperature Range 70 105 140 G
1 Magnetic ux density, B, is indicated as a negative value for north-polarity magnetic elds, and as a positive value for south-polarity magnetic elds. This so-called alge-
braic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the eld is indicated by the absolute value of B, and the
sign indicates the polarity of the eld (for example, a –100 G eld and a 100 G eld have equivalent strength, but opposite polarity).
MAGNETIC OPERATING CHARACTERISTICS [1]: over full operating voltage and ambient temperature ranges,
unless otherwise noted
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
5
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Characteristic Symbol Test Conditions Value Units
Package Thermal Resistance RθJA
Package LH, 1-layer PCB with copper limited to solder pads 228 °C/W
Package LH, 2-layer PCB with 0.463 in.
2 of copper area each side
connected by thermal vias 110 °C/W
Package UA, 1-layer PCB with copper limited to solder pads 165 °C/W
6
7
8
9
2
3
4
5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
20 40 60 80 100 120 140 160 180
Temperature (ºC)
Maximum Allowable V
CC
(V)
TJ(max) = 165ºC; ICC = ICC(max)
Power Derating Curve
(R
θJA
= 228 ºC/W)
Package LH, 1-layer PCB
(R
θJA
= 110 ºC/W)
Package LH, 2-layer PCB
(R
θJA
= 165 ºC/W)
Package UA, 1-layer PCB
VCC(min)
VCC(max)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
20 40 60 80 100 120 140 160 180
Temperature (°C)
Power Dissipation, P
D
(mW)
Power Dissipation versus Ambient Temperature
(R
θJA
= 165 ºC/W)
Package UA, 1-layer PCB
(RθJA = 228 ºC/W)
Package LH, 1-layer PCB
(RθJA = 110 ºC/W)
Package LH, 2-layer PCB
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
6
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
CHARACTERISTIC DATA
(A1101/02/03/04/06)
T
A
(°C)
Supply Current (On) versus Ambient Temperature
V
CC
(V)
ICCON (mA)
24
3.8
(A1101/02/03/04/06)
T
A
(°C)
Supply Current (Off) versus Ambient Temperature
V
CC
(V)
ICCOFF (mA)
24
3.8
(A1101/02/03/04/06)
T
A
(°C)
Output Voltage (On) versus Ambient Temperature
V
CC
(V)
VOUT(SAT) (mV)
24
3.8
(A1101/02/03/04/06)
Supply Current (On) versus Supply Voltage
T
A
(°C)
ICCON (mA)
V
CC
(V)
–40
25
150
(A1101/02/03/04/06)
Supply Current (Off) versus Supply Voltage
T
A
(°C)
ICCOFF (mA)
V
CC
(V)
–40
25
150
(A1101/02/03/04/06)
Output Voltage (On) versus Supply Voltage
T
A
(°C)
VOUT(SAT) (mV)
V
CC
(V)
–40
25
150
0
1.0
2.0
3.0
4.0
5.0
7.0
6.0
8.0
0
1.0
2.0
3.0
4.0
5.0
7.0
6.0
8.0
0
1.0
2.0
3.0
4.0
5.0
7.0
6.0
8.0
0
1.0
2.0
3.0
4.0
5.0
7.0
6.0
8.0
–500 50 100150 0510 15 20 25
–500 50 100150 0510 15 20 25
–500 50 100150 0510 15 20 25
0
50
100
150
200
250
300
350
400
0
50
100
150
200
250
300
350
400
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
7
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
FUNCTIONAL DESCRIPTION
OPERATION
The output of these devices switches low (turns on) when a
magnetic field (south polarity) perpendicular to the Hall element
exceeds the operate point threshold, BOP. After turn-on, the output
is capable of sinking 25 mA and the output voltage is VOUT(SAT).
When the magnetic field is reduced below the release point,
BRP
, the device output goes high (turns off). The difference in
the magnetic operate and release points is the hysteresis, Bhys, of
the device. This built-in hysteresis allows clean switching of the
output, even in the presence of external mechanical vibration and
electrical noise.
Powering-on the device in the hysteresis region, less than BOP and
higher than BRP, allows an indeterminate output state. The correct
state is attained after the first excursion beyond BOP or BRP.
CONTINUOUS-TIME BENEFITS
Continuous-time devices, such as the A110x family, offer the fast-
est available power-on settling time and frequency response. Due
to offsets generated during the IC packaging process, continuous-
time devices typically require programming after packaging to
tighten magnetic parameter distributions. In contrast, chopper-
stabilized switches employ an offset cancellation technique on
the chip that eliminates these offsets without the need for after-
packaging programming. The tradeoff is a longer settling time and
reduced frequency response as a result of the chopper-stabiliza-
tion offset cancellation algorithm.
The choice between continuous-time and chopper-stabilized
designs is solely determined by the application. Battery manage-
ment is an example where continuous-time is often required. In
these applications, VCC is chopped with a very small duty cycle
in order to conserve power (refer to figure 2). The duty cycle
is controlled by the power-on time, tPO, of the device. Because
continuous-time devices have the shorter power-on time, they are
the clear choice for such applications.
For more information on the chopper stabilization technique,
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall
Sensing Using Dynamic Quadrature Offset Cancellation and
Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a
Track-and-Hold Signal Demodulator.
Figure 1: Switching Behavior of Unipolar Switches
On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength, and the B– direction indicates decreasing
south polarity field strength (including the case of increasing north polarity). This behavior can be exhibited when using a circuit such as that
shown in Panel B.
BOP
BRP
BHYS
VCC
VOUT
VOUT(SAT)
Switch to Low
Switch to High
B+
B–
V+
0
0
(A) (B)
VCC
V
S
Output
GND
VOUT
RL
A110x
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
8
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
ADDITIONAL APPLICATIONS INFORMATION
Extensive applications information for Hall-effect devices is
available in:
• Hall-Effect IC Applications Guide, Application Note 27701
• Hall-Effect Devices: Guidelines for Designing Subassemblies
Using Hall-Effect Devices, Application Note 27703.1
• Soldering Methods for Allegro’s Products – SMT and Through-
Hole, Application Note 26009
All are provided in Allegro Electronic Data Book, AMS-702,
and the Allegro Web site, www.allegromicro.com.
Figure 2: Continuous-Time Application, B < BRP
This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power. Position 1, power is applied to the
device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max). The case shown is where
the correct output state is HIGH
. Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is valid, a control unit
reads the output. Position 5, power is removed from the device.
VCC
VOUT
Output Sampled
1 5 4
2
t
t
t
PO(max)
3
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
9
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
POWER DERATING
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively
small component of RθJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN × IIN (1)
ΔT = PD × RθJA (2)
TJ = TA + ΔT (3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 4 mA, and RθJA = 140 °C/W, then:
PD = VCC × ICC = 12 V × 4 mA = 48 mW
ΔT = PD × RθJA = 48 mW × 140°C/W = 7°C
TJ = TA + ΔT = 25°C + 7°C = 32°C
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RθJA and TA.
Example: Reliability for VCC at TA
=
150°C, package UA, using
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
RθJA
=
165°C/W, TJ(max) =
165°C, VCC(max)
= 24 V, and
ICC(max) = 7.5 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
ΔTmax = TJ(max) – TA = 165
°C
–
150
°C = 15
°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = ΔTmax ÷ RθJA = 15°C ÷ 165°C/W = 91 mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max) = 91 mW ÷ 7.5 mA = 12.1 V
The result indicates that, at TA, the application and device can dis-
sipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
10
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Figure 3: Package LH, 3-Pin (SOT-23W)
A
B
C
D
C
For Reference Only –Not for Tooling Use
(Reference DWG-2840)
Dimensions in millimeters –NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Reference land pattern layout; all pads a minimum of 0.20 mm from all adjacent pads;
adjust as necessary to meet application process requirements and PCB layout tolerances
Active Area Depth, 0.28 mm
Hall elements, not to scale
=Temperature Code (Letter)T
Standard Branding Reference View
NNT
Branding scale and appearance at supplier discretion
Seating Plane
Gauge Plane PCB Layout Reference View
0.55 REF
0.25 BSC
0.95 BSC
0.95
1.00
0.70
2.40
2
1
B
A
Branded Face
2.90 +0.10
–0.20
4° ±4°
8X 10°
REF
0.180 +0.020
–0.053
0.05 +0.10
–0.05
0.25 MIN
1.91 +0.19
–0.06
2.98 +0.12
–0.08
1.00 ±0.13
0.40 ±0.10
D
D
D
1.49
0.96
3
= Last three digits of device part numberN
NNN
= Last three digits of device part numberN
A1101, A1102,
A1103, A1104,
and A1106
A1101, A1102,
A1103, A1104,
and A1106
CUSTOMER PACKAGE DRAWING
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
11
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Figure 4: Package UA, 3-Pin SIP, Matrix Style
2 31
1.27 NOM
1.02
MAX
0.51
REF
45°
C
45°
0.79 REF
B
E
E
E
2X10°
2.04
1.44
Gate and tie bar burr area
A
B
C
Dambar removal protrusion (6X)
A
D
D
E
Branding scale and appearance at supplier discretion
Hall element, not to scale
Active Area Depth, 0.50 mm REF
For Reference Only; not for tooling use (reference DWG-9013)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Standard Branding Reference View
NNT
1
Mold Ejector
Pin Indent
Branded
Face
= Supplier emblem
N = Last two digits of device part number
T = Temperature code
NNN
1
= Supplier emblem
N = Last three digits of device part number
4.09 +0.08
–0.05
0.41 +0.03
–0.06
3.02 +0.08
–0.05
0.43 +0.05
–0.07
14.99 ±0.25
1.52 ±0.05
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
12
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Figure 5: Package UA, 3-Pin SIP, Chopper Style
NOT FOR
NEW DESIGN
Continuous-Time Switch Family
A1101, A1102, A1103,
A1104, and A1106
13
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
For the latest version of this document, visit our website:
www.allegromicro.com
Revision History
Number Date Description
14 May 29, 2012 Add A1106 UA package drawing
15 January 1, 2015 Added the LX option to Selection Guide
16 September 30, 2015 Corrected LH package Active Area Depth value and LH package branding; added AEC-Q100
qualification under Features and Benefits
17 October 27, 2016 Chopper-style UA package designated as not for new design
Copyright ©2018, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.