SFH 3010
1Version 1.3 | 2019-07-16
Not for new design in automotive applications
Produktdatenblatt | Version 1.1
www.osram-os.com
Applications
SFH 3010
SMARTLED®
Silicon NPN Phototransistor
(not for new design in automotive applications)
—Access Control (IRIS/Vein Scan, Face Recog-
nition)
—Electronic Equipment
—Health Monitoring (Heart Rate Monitoring,
Pulse Oximetry)
Features:
—Package: Epoxy, di󰘯use
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—Very small package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm
—Large viewing angle ± 80°
—Available on tape and reel
—Spectral range of sensitivity: (typ) 420 ... 1100 nm
Ordering Information
Type Photocurrent Ordering Code
VCE = 5 V;
λ
= 950 nm; Ee = 0.5 mW/cm²
IPCE
SFH 3010-Z ≥ 25 µA Q65110A6458
SFH 3010
2Version 1.3 | 2019-07-16
Not for new design in automotive applications
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating temperature Top min.
max.
-40 °C
100 °C
Storage temperature Tstg min.
max.
-40 °C
100 °C
Collector-emitter voltage VCE max. 15 V
Collector-emitter voltage pulse
t ≤ 10 µs; TA = 25 °C
VCE pulse max. 30 V
Collector current ICmax. 15 mA
Collector surge current
τ ≤ 10 µs
ICS max. 75 mA
Emitter-collector voltage VEC max. 7 V
Total power dissipation Ptot max. 130 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
SFH 3010
3Version 1.3 | 2019-07-16
Not for new design in automotive applications
Characteristics
TA = 25 °C
Parameter Symbol Values
Wavelength of max sensitivity λS max typ. 860 nm
Spectral range of sensitivity λ10% typ. 420 ... 1100
nm
Dimensions of chip area L x W typ. 0.38 x 0.38
mm x mm
Radiant sensitive area A typ. 0.04 mm²
Half angle φtyp. 80 °
Dark current
VCE = 20 V; E = 0
ICE0 typ.
max.
1 nA
50 nA
Rise time
IC = 1 mA; VCC = 5 V; RL = 1 kΩ
trtyp. 7 µs
Fall time
IC = 1 mA; VCC = 5 V; RL = 1 kΩ
tftyp. 7 µs
Collector-emitter saturation voltage 1)
IC = 10 µA, Ee = 0.5 mW / cm², λ = 950 nm
VCEsat typ. 140 mV
Capacitance
VCE = 0 V; f = 1 MHz; E = 0
CCE typ. 1.3 pF
Thermal resistance junction ambient real RthJA max. 450 K / W
Thermal resistance junction solder point real RthJS max. 250 K / W
SFH 3010
4Version 1.3 | 2019-07-16
Not for new design in automotive applications
Relative Spectral Sensitivity 2), 3)
Srel = f (λ)
OHF00593
0
λ
rel
S
%
400 500 600 700 800 900 nm 1100
10
20
30
40
50
60
70
80
90
100
Directional Characteristics 2), 3)
Srel = f (φ)
OHF00614
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 3010
5Version 1.3 | 2019-07-16
Not for new design in automotive applications
Photocurrent 2), 3)
IPCE = f (VCE); Ee = Parameter
OHF00612
00
I
PCE
CE
V
50
100
150
200
250
300
350
µA
450
10 15 20 25 30V5
1 mW/cm
2
0.5 mW/cm
2
0.25 mW/cm
2
0.1 mW/cm
2
Dark Current 2), 3)
ICE0 = f (VCE) ; E = 0 ;
V
OHF02420
R
R
I
-2
10 0
10
-1
10
0
10
1
V
nA
5 10 15 20 25 30
Collector-Emitter Capacitance 2), 3)
CCE = f (VCE); f = 1 MHz; E = 0
OHF00592
0V
CE
C
pF
-2
10
-1
10 10
0
10
1
10
2
0.5
1.0
1.5
2.0
2.5
3.0
V
CE
SFH 3010
6Version 1.3 | 2019-07-16
Not for new design in automotive applications
Dark Current 2)
ICE0 = f (TA); VCE = 20 V; E = 0
T
OHF01530
A
CEO
Ι
-1
10
10
0
10
1
10
2
10
3
-25
nA
0 25 50 75 100
˚C
Photocurrent 2)
IPCE,rel = f (TA); VCE = 5 V
T
OHF01524
A
0
-25
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 25 50 75 100
Ι
PCE
PCE
Ι
25
C
Power Consumption
Ptot = f (TA)
T
OHF00613
A
0
tot
P
020 40 60 80 C 100
mW
20
40
60
80
100
120
140
SFH 3010
7Version 1.3 | 2019-07-16
Not for new design in automotive applications
Dimensional Drawing 4)
GPLY7036
0.8 (0.031) ±0.1 (0.004)
Package
+0.05 (0.002)
-0.03 (0.001)
0.125 (0.005)
1.7 (0.067) ±0.1 (0.004)
7˚ max
+0.02 (0.001)
-0.05 (0.002)
0.65 (0.026)
5˚
1.3 (0.051) ±0.1 (0.004)
marking marking
Package
±0.05 (0.002)
0.7 (0.028)
Further Information
Approximate Weight: 2.1 mg
Package marking: Collector
SFH 3010
8Version 1.3 | 2019-07-16
Not for new design in automotive applications
Recommended Solder Pad 4)
0.8 (0.031)
0.7 (0.028)
OHAPY606
0.8 (0.031)
0.8 (0.031)
Recommended Solder Pad 4)
OHPY3832
0.8 (0.031)
0.7 (0.028)
0.8 (0.031)
0.05 (0.002)
0.6 (0.024)
Solder stencil aperture
0.05 (0.002)
0.7 (0.028)
Copper solder pad
SFH 3010
9Version 1.3 | 2019-07-16
Not for new design in automotive applications
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the speci󰘰ed peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range
SFH 3010
10 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Taping 4)
OHAY1491
1.5 (0.059) 4 (0.157)
2 (0.079) 0.9 (0.035)
3.5 (0.138)
1.75 (0.069)
8 (0.315)
1.8 (0.071)
A
C
0.8 (0.031)
SFH 3010
11 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Tape and Reel 5)
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel Dimensions
A W Nmin W1W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 5000
SFH 3010
12 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Barcode-Product-Label (BPL)
Dry Packing Process and Materials 4)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
SFH 3010
13 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Schematic Transportation Box 4)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of Transportation Box
Width Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
SFH 3010
14 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device speci󰘰ed in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding e󰘯ect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal 󰘰lled materials including silver.
Metal 󰘰lled materials can be a󰘯ected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
SFH 3010
15 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version on the OSRAM OS website.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not quali󰘰ed at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and buyer and/or customer.
SFH 3010
16 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Glossary
1) IPCEmin: IPCEmin is the min. photocurrent of the speci󰘰ed group.
2) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
3) Testing temperature: TA = 25°C (unless otherwise speci󰘰ed)
4) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
5) Tape and Reel: All dimensions and tolerances are speci󰘰ed acc. IEC 60286-3 and speci󰘰ed in mm.
SFH 3010
17 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Revision History
Version Date Change
1.3 2019-07-15 Discontinued
SFH 3010
18 Version 1.3 | 2019-07-16
Not for new design in automotive applications
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.