1
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Key Features
•21-27 GHz Bandwidth
•21 dB Nominal Gain
•2.5 dB Nominal Noise Figure
•10 dBm Nominal P1dB
•Bias: 3.5 V, 60 mA
•Package Dimensions:
4.0 x 4.0 x 1.1 mm
(0.157 x 0.157 x 0.043 in)
Primary Applications
•Point-to-Point Radio
•Point-to-MultiPoint Radio
Measured Data
Bias Conditions: Vd = 3.5 V, Id = 60 mA
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
21 22 23 24 25 26
Freq (GHz)
NF (dB)
Product Description
The TriQuint TGA4506-SM is a
K-Band Packaged low noise amplifier.
The TGA4506-SM operates from 21-27
GHz and is designed using TriQuint’s
power pHEMT production process.
The TGA4506-SM typically provides
2.5 dB noise figure and 21 dB small
signal gain.
The TGA4506-SM is ideally suited for
Point-to-Point Radio and Point-to-
Multipoint Radio Communications.
Evaluation Boards are available upon
request.
Lead-Free & RoHS compliant.
K Band Packaged Low Noise Amplifier
Datasheet subject to change without notice
2
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
TABLE I
MAXIMUM RATINGS 1/
SYMBOL PARAMETER VALUE NOTES
Vd Drain Voltage 5 V 2/
Vg Gate Voltage Range -1.5 TO 0V
Id Drain Current 190 mA 2/
⏐Ig⏐ Gate Current 6 mA
PIN Input Continuous Wave Power 9 dBm
PD Power Dissipation 0.86 W 2/ 3/
TCH Operating Channel Temperature 200 °C 4/
Mounting Temperature (30 Seconds) 260 °C
TSTG Storage Temperature -65 to 150 °C
1/ These ratings represent the maximum operable values for this device.
2/ Combinations of supply voltage, supply current, input power, and output power shall not exceed PD.
3/ When operated at this bias condition with a package base plate temperature of 85 °C, the median life i
s
1.5E+3 hrs.
4/ Junction operating temperature will directly affect the device median time to failure (Tm). For maximu
m
life, it is recommended that junction temperatures be maintained at the lowest possible levels.
3
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
TABLE II
ELECTRICAL CHARACTERISTICS
(Ta = 25 0C Nominal)
PARAMETER TYPICAL UNITS
Drain Voltage, Vd 3.5 V
Drain Current, Id 60 mA
Gate Voltage, Vg -0.5 to 0.0 V
Small Signal Gain, S21 21 dB
Input Return Loss, S11 11 dB
Output Return Loss, S22 15 dB
Noise Figure, NF 2.5 dB
Output Power @ 1 dB Compression Gain, P1dB 10 dBm
4
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
TABLE III
THERMAL INFORMATION
Parameter Test Conditions TCH
(°C)
θ
JC
(°C/W)
Tm
(HRS)
θJC Thermal
Resistance
(channel to backside
of package)
Vd = 3.5V
ID = 0.06 A
Pdiss = 0.21 W
113
133
1.5E+6
Note: Package backside on board at 85 °C.
Median Lifetime (Tm) vs. Channel Temperature
5
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Measured Data
Bias Conditions: Vd = 3.5 V, Id =60 mA
6
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Measured Data
Bias Conditions: Vd = 3.5 V, Id =60 mA
7
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Measured Data
Bias Conditions: Vd = 3.5 V, Id =60 mA
8
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Package Pinout Diagram
Top View
Dot indicates Pin 1
Bottom View
Pin Description
1, 5, 6, 10, 11, 15, 16,
20, 21
GND
2, 4, 8, 9, 12, 14, 17, 18 NC
3RF Input
19 Vg1
13 RF O utput
7Vd1
TGA
4506
Date Code
Lot code
9
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Mechanical Drawing
(Bottom Side)
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
10
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Recommended Board Layout Assembly
All measurements were made with the part soldered to 0.008 in thick RO4003
25.0
25.0
25.0
25.0
100 pF
100 pF
Tuning
Stub
Tuning
Stub
1 uF
1 uF
10 ohm
10 ohm
Vg ~ -0.5V
Adjust Vg to obtain
Id=60mA
Vd = 3.5V
40.0
40.0
11
TGA4506-SM
Sep 2009 © Rev A
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Compatible with high volume surface mount assembly processes using no-clean flux
Typical Solder Reflow Profiles
Reflow Profile SnPb Pb Free
Ramp-up Rate 3 °C/sec 3 °C/sec
Activation Time and
Temperature 60 – 120 sec @ 140 – 160 °C 60 – 180 sec @ 150 – 200 °C
Time above Melting Point 60 – 150 sec 60 – 150 sec
Max Peak Temperature 240 °C 260 °C
Time within 5 °C of Peak
Temperature 10 – 20 sec 10 – 20 sec
Ramp-down Rate 4 – 6 °C/sec 4 – 6 °C/sec
Ordering Information
Part Package Style
TGA4506-SM QFN 4x4 Surface Mount
