TGA4506-SM K Band Packaged Low Noise Amplifier Key Features * * * * * * 21-27 GHz Bandwidth 21 dB Nominal Gain 2.5 dB Nominal Noise Figure 10 dBm Nominal P1dB Bias: 3.5 V, 60 mA Package Dimensions: 4.0 x 4.0 x 1.1 mm (0.157 x 0.157 x 0.043 in) Measured Data Primary Applications Bias Conditions: Vd = 3.5 V, Id = 60 mA * Point-to-Point Radio * Point-to-MultiPoint Radio Product Description The TriQuint TGA4506-SM is a K-Band Packaged low noise amplifier. The TGA4506-SM operates from 21-27 GHz and is designed using TriQuint's power pHEMT production process. The TGA4506-SM typically provides 2.5 dB noise figure and 21 dB small signal gain. 4.5 4 3.5 The TGA4506-SM is ideally suited for Point-to-Point Radio and Point-toMultipoint Radio Communications. NF (dB) 3 2.5 2 1.5 1 Evaluation Boards are available upon request. 0.5 0 21 Lead-Free & RoHS compliant. 22 23 24 25 26 Freq (GHz) Datasheet subject to change without notice TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 1 TGA4506-SM TABLE I MAXIMUM RATINGS 1/ SYMBOL PARAMETER VALUE NOTES 5V 2/ Vd Drain Voltage Vg Gate Voltage Range Id Drain Current 190 mA Ig Gate Current 6 mA PIN Input Continuous Wave Power 9 dBm PD Power Dissipation 0.86 W 2/ 3/ TCH Operating Channel Temperature 200 C 4/ Mounting Temperature (30 Seconds) 260 C TSTG -1.5 TO 0V Storage Temperature 2/ -65 to 150 C 1/ These ratings represent the maximum operable values for this device. 2/ Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. 3/ When operated at this bias condition with a package base plate temperature of 85 C, the median life is 1.5E+3 hrs. 4/ Junction operating temperature will directly affect the device median time to failure (Tm). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 2 TGA4506-SM TABLE II ELECTRICAL CHARACTERISTICS (Ta = 25 0C Nominal) PARAMETER TYPICAL UNITS Drain Voltage, Vd 3.5 V Drain Current, Id 60 mA Gate Voltage, Vg -0.5 to 0.0 V Small Signal Gain, S21 21 dB Input Return Loss, S11 11 dB Output Return Loss, S22 15 dB Noise Figure, NF 2.5 dB Output Power @ 1 dB Compression Gain, P1dB 10 dBm TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 3 TGA4506-SM TABLE III THERMAL INFORMATION Parameter Test Conditions Vd = 3.5V JC Thermal ID = 0.06 A Resistance Pdiss = 0.21 W (channel to backside of package) TCH (C) JC (C/W) Tm (HRS) 113 133 1.5E+6 Note: Package backside on board at 85 C. Median Lifetime (Tm) vs. Channel Temperature TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 4 TGA4506-SM Measured Data Bias Conditions: Vd = 3.5 V, Id =60 mA TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 5 TGA4506-SM Measured Data Bias Conditions: Vd = 3.5 V, Id =60 mA TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 6 TGA4506-SM Measured Data Bias Conditions: Vd = 3.5 V, Id =60 mA TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 7 TGA4506-SM Package Pinout Diagram TGA 4506 Date Code Lot code Top View Bottom View Dot indicates Pin 1 P in D e s c r ip tio n 1, 5, 6, 10, 11, 15, 16, 20, 21 G N D 2, 4, 8, 9, 12, 14, 17, 18 N C 3 R F In p u t 19 V g1 13 R F O u tp u t 7 V d1 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 8 TGA4506-SM Mechanical Drawing (Bottom Side) GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 9 TGA4506-SM Recommended Board Layout Assembly 1 uF 10 ohm Vg ~ -0.5V Adjust Vg to obtain Id=60mA 100 pF 25.0 25.0 25.0 25.0 40.0 40.0 Tuning Stub Tuning Stub 100 pF Vd = 3.5V 10 ohm 1 uF All measurements were made with the part soldered to 0.008 in thick RO4003 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 10 TGA4506-SM Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Compatible with high volume surface mount assembly processes using no-clean flux Typical Solder Reflow Profiles Reflow Profile SnPb Pb Free Ramp-up Rate 3 C/sec 3 C/sec Activation Time and Temperature 60 - 120 sec @ 140 - 160 C 60 - 180 sec @ 150 - 200 C Time above Melting Point 60 - 150 sec 60 - 150 sec Max Peak Temperature 240 C 260 C Time within 5 C of Peak Temperature 10 - 20 sec 10 - 20 sec Ramp-down Rate 4 - 6 C/sec 4 - 6 C/sec Ordering Information Part Package Style TGA4506-SM QFN 4x4 Surface Mount TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A 11