PROTECTION PRODUCTS
1www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
EClamp2378P
ESD/EMI Protection
for Color LCD Interfaces
Description Features
Package Configuration
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
The EClampTM2378P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of colorprotection of color
protection of colorprotection of color
protection of color
LCD panelsLCD panels
LCD panelsLCD panels
LCD panels in cellular phones and other portable
electronics.
The device consists of eight identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 100Ω and a capacitance value of
10pF are used to achieve 30dB minimum attenuation
from 1.8GHz to 2.5GHz. The TVS diodes provide
effective suppression of ESD voltages in excess of
±15kV (air discharge) and ±8kV (contact discharge) per
IEC 61000-4-2, level 4.
The EClamp2378P is in a 16-pin, RoHS/WEEE compli-
ant, SLP4016P16 package. It measures 4.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
Mechanical Characteristics
Circuit Diagram (Each Line)
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
SLP4016P16 16-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPdAu
Marking : Marking Code
Packaging : Tape and Reel
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 30dB minimum attenuation
1.8GHz to 2.5GHz
TVS working voltage: 5V
Resistor: 100Ω +/− 15%
Typical Capacitance: 20pF (VR = 0V)
Protection and filtering for eight lines
Solid-state technology
Device Schematic (8X)
Revision 10/26/2007
GND
IN OUT
10pF 10pF
100 Ω
4.00
1.60
0.58
0.50 BSC
12
22007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2378P
Maximum Ratings
Electrical Characteristics (T = 25oC)
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32007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2378P
Typical Characteristics
Typical Insertion Loss S21 (Each Line) Analog Crosstalk (Each Line)
START . 030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 20 dB / REF 0 dB
1
2
3 4
START
. 030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
3: -30.645 dB
1.8 GHz
4: -34.705 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB 1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
00.511.522.533.544.55
Reverse Voltage - VR (V)
CJ(VR) / CJ(VR=0)
f = 1 MHz
Note: Data is taken with a 10x attenuator Note: Data is taken with a 10x attenuator
Normalized Capacitance vs. Reverse Voltage
ESD Clamping
(+8kV Contact per IEC 61000-4-2)
ESD Clamping
(-8kV Contact per IEC 61000-4-2)
42007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2378P
Applications Information
Device Connection
The EClamp2378P is comprised of eight identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the
bottom of the device. A center tab serves as the
ground connection. The device has a flow through
design for easy layout. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces. Recommendations for the ground
connection are given below.
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
Equation 1: The Impedance of an Inductor at
Frequency XLF
L*f**2)f,L(XLF π=
Where:
L= Inductance (H)
f = Frequency (Hz)
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers sepa-
rated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
Figure 1 - Pin Identification and Configuration
(Top Side View)
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In 1
In 2
In 3
In 4
Out 1
Out 2
Out 3
Out 4
In 5
In 6
In 7
In 8
Out 5
Out 6
Out 7
Out 8
1
89
16
Gnd
Figure 2 - Inductance of Rectangular Wire Loops
Ground
Via 1
Signal Layer
Ground Layer
Layer
y
x
d
Ground
Via 2
Ground
Via 1
Signal Layer
Ground Layer
Layer
y
x
d
Ground
Via 2
[
]
[]
[
]
d
x*2
d
y*2
9ln*yln*x*10*16.10)y,x,d(LRECT += −
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
Equation 2: Inductance of Rectangular Wire Loop
52007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2378P
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 in highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configura-
tion. Figure 5 shows a typical insertion loss (S21) plot
using a similar board without the internal ground pad
vias. The result is a more inductive ground loop. Note
the “hump” at a frequency of 2.5GHz. This is the
resonant frequency of the higher ground loop induc-
tance.
Figure 3 - Recommended Layout Using Ground Vias
1
2
3
4
START
. 030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -8.9400 dB
288.002 MHz
2: -20.032 dB
900 MHz
3: -23.761 dB
1.8 GHz
4: -16.085 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB 1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
Figure 5 - Filter Characteristics Using Layout without
Internal Ground Vias
1
2
3 4
START
. 030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
3: -30.645 dB
1.8 GHz
4: -34.705 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB 1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
62007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2378P
Applications Information - Spice Model
EClamp2378P Spice Model
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Line In Line Out
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72007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2378P
Land Pattern - SLP4016P16
Outline Drawing - SLP4016P16
B .130 3.30
X
Z
P
Y
G(C)
C .060 1.52
F
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
1.
DIM
X
Y
P
G
F
MILLIMETERSINCHES
0.45
.012
.025
.035
.020
.018
0.30
0.63
0.50
0.89
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE ME
T
2.15.085Z
B
INCHES
.020 BSC
b.007
bbb
aaa
N
D1
L
e
D
.011
.122
DIM
A1
A2
A
MIN
.000
.020
0.300.20.012 0.25
.010
0.38
3.30
0.28
3.10
.004
.003
16
.013
.157
.126
.015
.130
0.08
0.10
16
0.33
3.20
0.50 BSC
MILLIMETERS
MAX
0.05
0.65
DIMENSIONS
MIN
0.00
NOM
(.005)
.023
.001
MAX
.002
.026
NOM
0.50
.003
(0.13)
0.58
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
NOTES:
2.
1.
E1 .010 .016 .020 0.25 0.40 0.50
4.00
1.60.063E
AB
A1
SEATING
C
PLANE
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12
N
PIN 1
INDICATOR
(LASER MARK)
A2
A
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1.701.50.067.059
E1
LxN E/2
D/2
D1
82007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2378P
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Marking Ordering Information
Tape and Reel Specification
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EMIClamp and EClamp are marks of Semtech Corporation
Device Orientation in Tape
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50.0±
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)400.±960.(
50.0±5.5
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mm5.4
)771.(
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)4
1.0±0.4
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mm4.0
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mm3.0+
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Pin 1 Location
User Direction of feed
PIN 1
INDICATOR
(LASER MARK)
2378P