LM50BIM3X/NOPB - Texas Instruments

0.100

0.750

1.750

0.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

±50 ±25 0 25 50 75 100 125 150

Output Voltage (V)

DUT Temperature (ƒC)

C001

VO = (+10 mV/°C × T °C) + 500 mV

LM50

LM50-Q1

+VS

(4.5 V to 10 V)

Output

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM50

LM50-Q1

SNIS118G –JULY 1999–REVISED JANUARY 2017

LM50 and LM50-Q1 SOT-23 Single-Supply Centigrade Temperature Sensor

1 Features

1• LM50-Q1 is AEC-Q100 Grade 1 Qualified and is

Manufactured on an Automotive Grade Flow

• Calibrated Directly in Degrees Celsius

(Centigrade)

• Linear + 10 mV/°C Scale Factor

• ±2°C Accuracy Specified at 25°C

• Specified for Full –40° to 125°C Range

• Suitable for Remote Applications

• Low Cost Due to Wafer-Level Trimming

• Operates From 4.5 V to 10 V

• Less Than 130-µA Current Drain

• Low Self-Heating: Less Than 0.2°C in Still A

• Nonlinearity Less Than 0.8°C Over Temp

• UL Recognized Component

2 Applications

• Automotive

• Computers

• Disk Drives

• Battery Management

• FAX Machines

• Printers

• Portable Medical Instruments

• HVAC

• Power Supply Modules

SPACER

3 Description

The LM50 and LM50-Q1 devices are precision

integrated-circuit temperature sensors that can sense

a –40°C to 125°C temperature range using a single

positive supply. The output voltage of the device is

linearly proportional to temperature (10 mV/°C) and

has a DC offset of 500 mV. The offset allows reading

negative temperatures without the need for a

negative supply.

The ideal output voltage of the LM50 or LM50-Q1

ranges from 100 mV to 1.75 V for a –40°C to 125°C

temperature range. The LM50 and LM50-Q1 do not

require any external calibration or trimming to provide

accuracies of ±3°C at room temperature and ±4°C

over the full –40°C to 125°C temperature range.

Trimming and calibration of the LM50 and LM50-Q1

at the wafer level assure low cost and high accuracy.

The linear output, 500 mV offset, and factory

calibration of the LM50 and LM50-Q1 simplify the

circuitry requirements in a single supply environment

where reading negative temperatures is necessary.

Because the quiescent current of the LM50 and

LM50-Q1 is less than 130 µA, self-heating is limited

to a very low 0.2°C in still air.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM50, LM50-Q1 SOT-23 (3) 2.92 mm × 1.30 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Simplified Schematic Full-Range Centigrade Temperature Sensor

(–40°C to 125°C)

LM50

LM50-Q1

SNIS118G –JULY 1999–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM50 LM50-Q1

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 3

6.1 Absolute Maximum Ratings ...................................... 3

6.2 ESD Ratings.............................................................. 3

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics: LM50B ............................. 4

6.6 Electrical Characteristics: LM50C and LM50-Q1...... 5

6.7 Typical Characteristics.............................................. 6

7 Detailed Description.............................................. 8

7.1 Overview................................................................... 8

7.2 Functional Block Diagram......................................... 8

7.3 Feature Description................................................... 8

7.4 Device Functional Modes.......................................... 8

8 Application and Implementation .......................... 9

8.1 Application Information.............................................. 9

8.2 Typical Application.................................................... 9

8.3 System Examples ................................................... 11

9 Power Supply Recommendations...................... 12

10 Layout................................................................... 12

10.1 Layout Guidelines ................................................. 12

10.2 Layout Example .................................................... 12

10.3 Thermal Considerations........................................ 13

11 Device and Documentation Support................. 14

11.1 Related Links ........................................................ 14

11.2 Receiving Notification of Documentation Updates 14

11.3 Community Resources.......................................... 14

11.4 Trademarks........................................................... 14

11.5 Electrostatic Discharge Caution............................ 14

11.6 Glossary................................................................ 14

12 Mechanical, Packaging, and Orderable

Information........................................................... 14

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (December 2016) to Revision G Page

• Changed LMT90 to LM50 in VOdescription of Equation 1 .................................................................................................... 8

Changes from Revision E (September 2013) to Revision F Page

• Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Detailed Description

section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................... 1

• Added Thermal Information table........................................................................................................................................... 4

• Changed Junction-to-ambient, RθJA, value in Thermal Information table From: 450°C/W To: 291.9°C/W ............................ 4

• Deleted the Temperature To Digital Converter (Parallel TRI-STATE Outputs for Standard Data Bus to µP Interface)

(125°C Full Scale) figure ...................................................................................................................................................... 11

Changes from Revision C (February 2013) to Revision E Page

• Added LM50-Q1 option throughout document ....................................................................................................................... 1

+VS

GND

LM50

LM50-Q1

www.ti.com

SNIS118G –JULY 1999–REVISED JANUARY 2017

Product Folder Links: LM50 LM50-Q1

5 Pin Configuration and Functions

DBZ Package

3-Pin SOT-23

Top View

Pin Functions

PIN TYPE DESCRIPTION

NO. NAME

1 +VS Power Positive power supply pin.

2 VOUT Output Temperature sensor analog output.

3 GND Ground Device ground pin, connected to power supply negative terminal.

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions(). Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Supply voltage –0.2 12 V

Output voltage –1 +VS+ 0.6 V

Output current 10 mA

Maximum junction temperature, TJ150 °C

Storage temperature, Tstg –65 150 °C

(1) The human body model is a 100-pF capacitor discharged through a 1.5-kΩresistor into each pin. Machine model is a 200-pF capacitor

discharged directly into each pin.

(2) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings VALUE UNIT

LM50

V(ESD) Electrostatic discharge Human body model (HBM)(1) ±2000 VCharged-device model (CDM) ±750

Machine model(1) ±250

LM50-Q1

V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(2) ±2000 V

Charged-device model (CDM), per AEC Q100-011 ±750

LM50

LM50-Q1

SNIS118G –JULY 1999–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM50 LM50-Q1

(1) Soldering process must comply with the Reflow Temperature Profile specifications. Reflow temperature profiles are different for lead-

free and non-lead-free packages. Refer to www.ti.com/packaging.

6.3 Recommended Operating Conditions(1)

MIN MAX UNIT

+VSSupply voltage 4.5 10 V

TMIN,

TMAX Specified temperature LM50C, LM50-Q1 –40 125 °C

LM50B –25 100

Operating temperature –40 150 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1) LM50, LM50-Q1

UNITDBZ (SOT-23)

3 PINS

RθJA Junction-to-ambient thermal resistance 291.9 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 114.3 °C/W

RθJB Junction-to-board thermal resistance 62.3 °C/W

φJT Junction-to-top characterization parameter 7.4 °C/W

φJB Junction-to-board characterization parameter 61 °C/W

(1) Limits are specified to TI's AOQL (Average Outgoing Quality Level).

(2) Accuracy is defined as the error between the output voltage and 10 mv/°C multiplied by the device's case temperature plus 500 mV, at

specified conditions of voltage, current, and temperature (expressed in °C).

(3) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's

rated temperature range.

(4) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating

effects can be computed by multiplying the internal dissipation by the thermal resistance.

(5) Quiescent current is defined in the circuit of Figure 12.

(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature

cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered;

allow time for stress relaxation to occur. The majority of the drift occurs in the first 1000 hours at elevated temperatures. The drift after

1000 hours does not continue at the first 1000 hour rate.

6.5 Electrical Characteristics: LM50B

+VS= 5 V (DC) and ILOAD = 0.5 µA, in the circuit of Figure 12, TA= TJ= 25°C (unless otherwise noted)(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Accuracy(2) TA= 25°C –2 2 °C

TA= TMAX –3 3 °C

TA= TMIN –3.5 3 °C

Nonlinearity(3) TA= TJ= TMIN to TMAX –0.8 0.8 °C

Sensor gain (average slope) TA= TJ= TMIN to TMAX 9.7 10.3 mV/°C

Output resistance TA= TJ= TMIN to TMAX 2000 4000 Ω

Line regulation(4) +VS= 4.5 V to 10 V, TA= TJ= TMIN to TMAX –1.2 1.2 mV/V

Quiescent current(5) +VS= 4.5 V to 10 V, TA= TJ= TMIN to TMAX 180 µA

Change of quiescent current +VS= 4.5 V to 10 V, TA= TJ= TMIN to TMAX 2 µA

Temperature coefficient of quiescent current TA= TJ= TMIN to TMAX 1 µA/°C

Long term stability(6) TJ= 125°C, for 1000 hours ±0.08 °C

LM50

LM50-Q1

www.ti.com

SNIS118G –JULY 1999–REVISED JANUARY 2017

Product Folder Links: LM50 LM50-Q1

(1) Limits are specified to TI's AOQL (Average Outgoing Quality Level).

(2) Accuracy is defined as the error between the output voltage and 10 mv/°C multiplied by the device's case temperature plus 500 mV, at

specified conditions of voltage, current, and temperature (expressed in °C).

(3) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's

rated temperature range.

(4) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating

effects can be computed by multiplying the internal dissipation by the thermal resistance.

(5) Quiescent current is defined in the circuit of Figure 12.

(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature

cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered;

allow time for stress relaxation to occur. The majority of the drift occurs in the first 1000 hours at elevated temperatures. The drift after

1000 hours does not continue at the first 1000 hour rate.

6.6 Electrical Characteristics: LM50C and LM50-Q1

+VS= 5 V (DC) and ILOAD = 0.5 µA, in the circuit of Figure 12. TA= TJ= 25°C, unless otherwise noted.(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Accuracy(2) TA= 25°C –3 3 °C

TA= TMAX –4 4 °C

TA= TMIN –4 4 °C

Nonlinearity(3) TA= TJ= TMIN to TMAX –0.8 0.8 °C

Sensor gain(average slope) TA= TJ= TMIN to TMAX 9.7 10.3 mV/°C

Output resistance TA= TJ= TMIN to TMAX 2000 4000 Ω

Line regulation(4) +VS= 4.5 V to 10 V, TA= TJ= TMIN to TMAX –1.2 1.2 mV/V

Quiescent current(5) +VS= 4.5 V to 10 V, TA= TJ= TMIN to TMAX 180 µA

Change of quiescent current +VS= 4.5 V to 10 V, TA= TJ= TMIN to TMAX 2 µA

Temperature coefficient of quiescent current TA= TJ= TMIN to TMAX 2 µA/°C

Long term stability(6) TJ= 125°C, for 1000 hours ±0.08 °C

LM50

LM50-Q1

SNIS118G –JULY 1999–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM50 LM50-Q1

6.7 Typical Characteristics

To generate these curves the device was mounted to a printed circuit board as shown in Figure 20.

Figure 1. Junction-to-Ambient Thermal Resistance Figure 2. Thermal Time Constant

see Figure 20

Figure 3. Thermal Response in Still Air With Heat Sink Figure 4. Thermal Response in Stirred Oil Bath

With Heat Sink

Figure 5. Start-Up Voltage vs Temperature Figure 6. Thermal Response in Still Air Without a Heat Sink

LM50

LM50-Q1

www.ti.com

SNIS118G –JULY 1999–REVISED JANUARY 2017

Product Folder Links: LM50 LM50-Q1

Typical Characteristics (continued)

To generate these curves the device was mounted to a printed circuit board as shown in Figure 20.

see Figure 12

Figure 7. Quiescent Current vs Temperature Figure 8. Accuracy vs Temperature

Figure 9. Noise Voltage Figure 10. Supply Voltage vs Supply Current

Figure 11. Start-Up Response

LM50

LM50-Q1

SNIS118G –JULY 1999–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM50 LM50-Q1

7 Detailed Description

7.1 Overview

The LM50 and LM50-Q1 devices are precision integrated-circuit temperature sensors that can sense a –40°C to

125°C temperature range using a single positive supply. The output voltage of the LM50 and LM50-Q1 has a

positive temperature slope of 10 mV/°C. A 500-mV offset is included enabling negative temperature sensing

when biased by a single supply.

The temperature-sensing element is comprised of a delta-VBE architecture. The temperature-sensing element is

then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage with

typical 2-kΩoutput impedance as shown in the Functional Block Diagram.

7.2 Functional Block Diagram

*R2 ≈2k with a typical 1300-ppm/°C drift.

7.3 Feature Description

7.3.1 LM50 and LM50-Q1 Transfer Function

The LM50 and LM50-Q1 follow a simple linear transfer function to achieve the accuracy as listed in the Electrical

Characteristics: LM50B table and the Electrical Characteristics: LM50C and LM50-Q1 table.

Use Equation 1 to calculate the value of VO.

VO= 10 mV/°C × T °C + 500 mV

where

• T is the temperature in °C

• VOis the LM50 output voltage (1)

7.4 Device Functional Modes

The only functional mode of the device has an analog output directly proportional to temperature.

LM50

LM50-Q1

+VS

(4.5 V to 10 V)

Output

LM50

LM50-Q1

www.ti.com

SNIS118G –JULY 1999–REVISED JANUARY 2017

Product Folder Links: LM50 LM50-Q1

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM50 and LM50-Q1 have a wide supply range and a 10 mV/°C output slope with a 500-mV DC offset.

Therefore, it can be easily applied in many temperature-sensing applications where a single supply is required

for positive and negative temperatures.

8.2 Typical Application

8.2.1 Full-Range Centigrade Temperature Sensor

Figure 12. Full-Range Centigrade Temperature Sensor Diagram(–40°C to 125°C)

8.2.1.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design Parameters

PARAMETER VALUE

Power supply voltage ±3°C (maximum)

Output impedance ±4°C (maximum)

Accuracy at 25°C 10 mV/°C

Accuracy over –40°C to 125°C 4.5 V to 10 V

Temperature slope 4 kΩ(maximum)

8.2.1.2 Detailed Design Procedure

The LM50 and LM50-Q1 are simple temperature sensors that provides an analog output. Therefore design

requirements related to layout are more important than other requirements. See Layout for more information.

8.2.1.2.1 Capacitive Loads

The LM50 and LM50-Q1 handle capacitive loading very well. Without any special precautions, the LM50 and

LM50-Q1 can drive any capacitive load. The device has a nominal 2-kΩoutput impedance (shown in Functional

Block Diagram). The temperature coefficient of the output resistors is around 1300 ppm/°C. Taking into account

this temperature coefficient and the initial tolerance of the resistors the output impedance of the device will not

exceed 4 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise

pickup. TI recommends adding a 0.1-µF capacitor between +VS and GND to bypass the power supply voltage,

0.100

0.750

1.750

0.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

±50 ±25 0 25 50 75 100 125 150

Output Voltage (V)

DUT Temperature (ƒC)

C001

VO = (+10 mV/°C × T °C) + 500 mV

LM50/

LM50-Q1 OUT

Heavy Capacitive Load, Wiring, Etc.

1 µF

0.1 µF Bypass

Optional

LM50/

LM50-Q1 OUT

Heavy Capacitive Load, Wiring, Etc.

To A High-

Impedance Load

LM50

LM50-Q1

SNIS118G –JULY 1999–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM50 LM50-Q1

as shown in Figure 14. It may also be necessary to add a capacitor from VOUT to ground. A 1-µF output

capacitor with the 4-kΩoutput impedance will form a 40-Hz low-pass filter. Since the thermal time constant of the

LM50 and LM50-Q1 is much slower than the 25-ms time constant formed by the RC, the overall response time of

the device will not be significantly affected. For much larger capacitors this additional time lag will increase the

overall response time of the LM50 and LM50-Q1.

Figure 13. LM50 and LM50-Q1 No Decoupling Required

for Capacitive Load

Figure 14. LM50C and LM50-Q1 with Filter for Noisy Environment

8.2.1.3 Application Curve

Figure 15. Output Transfer Function

LM50/

LM50-Q1 LM131

0.01 µF

421

1 µF 12 K

5 k

0.01 µF

100 K

GND

6 V

6.8 K 1 K

4N28

fOUT

100 K

FULL

SCALE

ADJ

LM50/

LM50-Q1

U3 0.1 µF R2

R1 VT

VOUT

4.1 V

V+

LM7101

VTemp

V+

LM4040

LM50/

LM50-Q1 ADC08031

LM4041-

ADJ

GND

OUT

100 k

10 k

1 µF

1.750 V

REF

3.9 k+

Serial

Data Output

5 V

CLOCK

GND

ENABLE

LM50

LM50-Q1

www.ti.com

SNIS118G –JULY 1999–REVISED JANUARY 2017

Product Folder Links: LM50 LM50-Q1

8.3 System Examples

Figure 16 to Figure 18 show application circuit examples using the LM50 or LM50-Q1 devices. Customers must

fully validate and test any circuit before implementing a design based on an example in this section. Unless

otherwise noted, the design procedures in Full-Range Centigrade Temperature Sensor are applicable.

Figure 16. Centigrade Thermostat or Fan

Controller

125°C full scale

Figure 17. Temperature To Digital Converter

(Serial Output)

–40°C to 125°C; 100 Hz to 1750 Hz

Figure 18. LM50 or LM50-Q1 With Voltage-To-Frequency Converter and Isolated Output

+VS

GND

Via to ground plane

Via to power plane

LM50

LM50-Q1

SNIS118G –JULY 1999–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM50 LM50-Q1

9 Power Supply Recommendations

In an extremely noisy environment, it may be necessary to add some filtering to minimize noise pickup. TI

recommends that a 0.1-µF capacitor be added from +VS to GND to bypass the power supply voltage, as shown

in Figure 14.

10 Layout

10.1 Layout Guidelines

The LM50 and LM50-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors.

The device can be glued or cemented to a surface and its temperature will be within about 0.2°C of the surface

temperature.

This presumes that the ambient air temperature is almost the same as the surface temperature; if the air

temperature were much higher or lower than the surface temperature, the actual temperature of the LM50 or

LM50-Q1 die would be at an intermediate temperature between the surface temperature and the air temperature.

To ensure good thermal conductivity the backside of the LM50 and LM50-Q1 die is directly attached to the GND

pin. The lands and traces to the device will, of course, be part of the printed-circuit board, which is the object

whose temperature is being measured. These printed-circuit board lands and traces will not cause the LM50 or

LM50-Q1's temperature to deviate from the desired temperature.

Alternatively, the LM50 and LM50-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped

into a bath or screwed into a threaded hole in a tank. As with any IC, the LM50 and LM50-Q1 and accompanying

wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the

circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes

such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the device or

its connections.

10.2 Layout Example

Figure 19. PCB Layout

LM50

LM50-Q1

www.ti.com

SNIS118G –JULY 1999–REVISED JANUARY 2017

Product Folder Links: LM50 LM50-Q1

Layout Example (continued)

(1) Part soldered to 30 gauge wire.

(2) Heat sink used is 1/2-in., square printed-circuit board with 2-oz foil; part attached as shown in Figure 20.

1/2 in., square printed-circuit board with 2-oz foil or similar

Figure 20. Printed-Circuit Board Used for Heat Sink to Generate Thermal Response Curves

10.3 Thermal Considerations

Table 2 summarizes the thermal resistance of the LM50 and LM50-Q1 for different conditions.

Table 2. Temperature Rise of LM50 and LM50-Q1 Due to Self-Heating

RθJA (°C/W)

SOT-23 No heat sink(1) Still air 450

Moving air —

Small heat fin(2) Still air 260

Moving air 180

LM50

LM50-Q1

SNIS118G –JULY 1999–REVISED JANUARY 2017

www.ti.com

Product Folder Links: LM50 LM50-Q1

11 Device and Documentation Support

11.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to order now.

Table 3. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

Click here Click here Click here Click here Click here

LM50-Q1 Click here Click here Click here Click here Click here

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM50BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 150 T5B

LM50BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5B

LM50BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5B

LM50CIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 T5C

LM50CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5C

LM50CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 150 T5C

LM50CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5C

LM50QIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5Q

LM50QIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T5Q

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2017

Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM50, LM50-Q1 :

•Catalog: LM50

•Automotive: LM50-Q1

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM50BIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM50BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM50BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM50CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM50CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM50CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM50CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM50QIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM50QIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 24-Aug-2017

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM50BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM50BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM50BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0

LM50CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM50CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM50CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0

LM50CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0

LM50QIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM50QIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 24-Aug-2017

Pack Materials-Page 2

4203227/C

www.ti.com

PACKAGE OUTLINE

TYP

0.20

0.08

0.25

2.64

2.10 1.12 MAX

TYP

0.10

0.01

3X 0.5

0.3

TYP

0.6

0.2

1.9

0.95

TYP-80

3.04

2.80

1.4

1.2

(0.95)

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

4214838/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Reference JEDEC registration TO-236, except minimum foot length.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ALL AROUND 0.07 MIN

ALL AROUND

3X (1.3)

3X (0.6)

(2.1)

2X (0.95)

(R0.05) TYP

4214838/C 04/2017

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

www.ti.com

EXAMPLE STENCIL DESIGN

(2.1)

2X(0.95)

3X (1.3)

3X (0.6)

(R0.05) TYP

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

4214838/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL

SCALE:15X

SYMM

PKG

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